CN213437922U

CN213437922U - Tool module assembly for electronic component

Info

Publication number: CN213437922U
Application number: CN202021661539.9U
Authority: CN
Inventors: 吴亚萍; 丁国杰; 马英矫; 刘福兴
Original assignee: Beijing Sylincom Technology Co ltd
Current assignee: Beijing Sylincom Technology Co ltd
Priority date: 2020-08-11
Filing date: 2020-08-11
Publication date: 2021-06-15
Anticipated expiration: 2030-08-11

Abstract

The utility model provides a frock module subassembly for electronic components, include: the first U-shaped tooling module comprises a first limiting plate, a second limiting plate and a first clamping piece, wherein the first limiting plate and the second limiting plate are oppositely arranged, the first clamping piece is positioned at the end parts of the first limiting plate and the second limiting plate, and the first clamping piece is used for clamping a first side edge of a circuit board; the second tool module is used for being matched and connected with the first limiting plate, and the second tool module and the first limiting plate limit one or more first grooves capable of accommodating the electronic components; and the third tool module is used for being matched and connected with the second limiting plate, and the third tool module and the second limiting plate limit one or more second grooves for accommodating the electronic component. The utility model discloses a frock module subassembly can be fast, accurately install and weld electronic components, has improved the installation effectiveness.

Description

Tool module assembly for electronic component

Technical Field

The utility model relates to a tooling module, concretely relates to tooling module subassembly for electronic components.

Background

The circuit board or the circuit board is used for supporting and electrically connecting electronic components, and the circuit board not only simplifies the assembly and welding work of electronic products, but also reduces the volume and the cost of the electronic products. At present, circuit boards are widely used in the production and manufacture of various electronic products.

The rapid development and rapid change of electronic products have led to a rapid increase in the demand of circuit boards, which requires shorter and shorter production cycles of circuit boards, which puts higher demands on the rapid installation of circuit boards and electronic components thereon.

A Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is a field effect transistor that is widely used in analog circuits and digital circuits, and when the MOSFET is mounted on a circuit board, on one hand, a heat dissipation surface of the MOSFET and a heat sink need to be closely attached together, and on the other hand, a pin of the MOSFET needs to be accurately soldered to the circuit board.

The prior art typically mounts MOSFETs on a circuit board in several ways as follows. The first installation mode is as follows: firstly, a plurality of MOSFETs are welded on a circuit board one by one, and then each MOSFET is tightly attached and connected with a heat dissipation plate. The disadvantages of this mounting are: the installation efficiency is lower, can't guarantee that MOSFET's surface and the surface of heating panel are closely laminated, therefore the radiating effect is relatively poor. The second mounting mode is as follows: a plurality of MOSFETs are closely attached to the surface of the heat dissipation plate, and then the pins of each MOSFET are soldered to the circuit board. The disadvantages of this mounting are: each MOSFET has three pins, and it is difficult to solder the pins to a circuit board without fail. The third installation mode is as follows: and closely attaching each MOSFET to the surface of the heat dissipation plate, welding the pins of the MOSFETs to the circuit board, and sequentially mounting other MOSFETs. This mounting has the disadvantage of being inefficient.

Therefore, in order to reduce the production cost of electronic products, it is necessary to accurately and rapidly mount and solder electronic components on a circuit board while closely attaching the heat dissipation surfaces of the electronic components to the heat dissipation device.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned technical problem that prior art exists, the utility model provides a frock module subassembly for electronic components, include:

the first U-shaped tooling module comprises a first limiting plate, a second limiting plate and a first clamping piece, wherein the first limiting plate and the second limiting plate are oppositely arranged, the first clamping piece is positioned at the end parts of the first limiting plate and the second limiting plate, and the first clamping piece is used for clamping a first side edge of a circuit board;

the second tool module is used for being matched and connected with the first limiting plate, and the second tool module and the first limiting plate limit one or more first grooves capable of accommodating the electronic components; and

and the third tool module is used for being matched and connected with the second limiting plate, and the third tool module and the second limiting plate limit one or more second grooves for accommodating the electronic components.

Preferably, the first clamping member includes: the first clamping plate, the first limiting plate and the second limiting plate are positioned on the same plane, and two ends of the first clamping plate are fixedly connected with the end part of the first limiting plate and the end part of the second limiting plate; the second clamping plate is fixedly connected with the first clamping plate and is arranged oppositely; the first clamping plate, the second clamping plate, the end part of the first limiting plate and the end part of the second limiting plate limit an accommodating space.

Preferably, the first limiting plate comprises a first supporting surface and a first circuit board contact surface which are opposite, and the first supporting surface is provided with a plurality of first guide grooves which are sequentially arranged; the second limiting plate comprises a second supporting surface and a second circuit board contact surface which are opposite, and a plurality of second guide grooves which are sequentially arranged are formed in the second supporting surface.

Preferably, the first circuit board contact surface and the second circuit board contact surface are located on the same plane.

Preferably, the first limiting plate and the second limiting plate have the same structure.

Preferably, the second tooling module includes: the second clamping piece is used for clamping a second side edge of the circuit board; the first bosses are fixed on the side surface of the second clamping piece and are used for being embedded into the first guide grooves; the third frock module includes: the third clamping piece is used for clamping a third side edge of the circuit board; and a plurality of second bosses fixed to a side surface of the third clamping member, the plurality of second bosses being adapted to be fitted into the plurality of second guide grooves; wherein the first plurality of bosses, the second retaining member, and the first bearing surface define the first recess, and the second plurality of bosses, the third retaining member, and the second bearing surface define the second recess.

Preferably, the second clamping member includes a third clamping plate and a fourth clamping plate which are oppositely arranged and fixedly connected, the third clamping plate and the fourth clamping plate define an accommodating space, the plurality of first bosses are fixed on a side surface of the third clamping plate, and an extending direction of the plurality of first bosses is perpendicular to the side surface of the third clamping plate; the third holder includes relative setting and fixed connection's fifth splint and sixth splint, a accommodation space is injectd to fifth splint and sixth splint, a plurality of second bosss are fixed on the side of fifth splint, the extending direction perpendicular to of a plurality of second bosss the side of fifth splint.

Preferably, the second clamping member further includes two first limiting members fixed to opposite ends of the side surface of the third clamping plate, and the two first limiting members are used for abutting against opposite ends of the first limiting plate; the third clamping piece further comprises two second limiting pieces fixed at two opposite ends of the side face of the fifth clamping plate, and the two second limiting pieces are used for abutting against two opposite ends of the second limiting plate.

Preferably, each of the two first locating parts comprises a first limiting surface in contact with the first limiting plate, the distance between the side surface of the first limiting surface and the third clamping plate is less than the distance between the end of each of the first bosses and the side surface of the third clamping plate, each of the two second locating parts comprises a second limiting surface in contact with the second limiting plate, and the distance between the side surface of the second limiting surface and the fifth clamping plate is less than the distance between the end of each of the second bosses and the side surface of the fifth clamping plate.

Preferably, the second tool module and the third tool module are symmetrically arranged.

The utility model discloses a frock module subassembly can be fast, accurately install and weld electronic components, has improved the installation effectiveness, can be in the same place a plurality of electronic components's cooling surface and heat abstractor close laminating simultaneously.

Drawings

Embodiments of the invention are further described below with reference to the accompanying drawings, in which:

fig. 1 is a schematic perspective view of a tooling module assembly for mounting electronic components according to a preferred embodiment of the present invention.

Figure 2 is an exploded view of the tooling module assembly shown in figure 1.

Fig. 3 is a perspective view of the first tooling module in the tooling module assembly shown in fig. 2 rotated 180 degrees about its length.

Fig. 4 is a schematic plan view of the first tooling module shown in fig. 3, viewed in the direction indicated by arrow a 1.

Fig. 5 is a perspective view of the second tooling module in the tooling module assembly shown in fig. 2 rotated 90 ° about its length.

Fig. 6 is a schematic plan view of the second tooling module shown in fig. 2, viewed from the top down direction.

Fig. 7 is a perspective view of a circuit board for soldering a plurality of MOSFETs.

Fig. 8 is a schematic perspective view of the first tooling module and the circuit board shown in fig. 7 assembled together.

Fig. 9 is a perspective view of the tooling module assembly shown in fig. 1 assembled with the circuit board shown in fig. 7.

Fig. 10 is a schematic perspective view of a MOSFET placed in a recess defined by the tooling module assembly shown in fig. 9.

Fig. 11 is a perspective view of a heat sink mounted on the heat dissipation surfaces of the twelve MOSFETs shown in fig. 10.

Fig. 12 is a perspective view illustrating the detachment of the second tooling module and the third tooling module from the circuit board shown in fig. 11.

Fig. 13 is a perspective view of the first tooling module removed from the circuit board shown in fig. 12.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly apparent, the present invention is further described in detail by the following embodiments with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a tooling module assembly for mounting electronic components according to a preferred embodiment of the present invention. As shown in fig. 1, the tooling module assembly 1 includes a U-shaped first tooling module 11, which includes a limiting plate 111, a limiting plate 112 and a clamping member 113 fixedly connected to the ends of the limiting

plates

111 and 112; the second tool module 12 is connected with the limiting plate 111 in a matched manner; and a third tool module 13 which is connected with the limit plate 112 in a matching manner.

Figure 2 is an exploded view of the tooling module assembly shown in figure 1. As shown in fig. 2, the limiting

plates

111 and 112 are located on the same plane and have the same structure, and only the limiting plate 111 is taken as an example for description. The stopper plate 111 has a rectangular plate shape or a plate shape, and includes a supporting surface 1110 and a circuit board contact surface 1110' facing each other, the supporting surface 1110 having a plurality of guide grooves 1111 arranged in sequence along a longitudinal direction thereof, and fig. 2 shows 7 guide grooves.

Fig. 3 is a schematic perspective view of the first tooling module of the tooling module assembly shown in fig. 2 rotated 180 ° about its length, and fig. 4 is a schematic plan view of the first tooling module shown in fig. 3 viewed along the direction indicated by arrow a 1. As shown in fig. 3 and 4, the clamping member 113 includes a clamping plate 1131 and a clamping plate 1132 which are oppositely arranged and parallel, the clamping plate 1131 is on the same plane with the limiting

plates

111 and 112, and two opposite ends of the clamping plate 1131 are fixedly connected with the ends of the limiting

plates

111 and 112. The

clamping plates

1131 and 1132 are fixedly connected at their sides, so that the

clamping plates

1131 and 1132 and the ends of the

limit plates

111 and 112 define a plate-shaped or rectangular-shaped receiving space 1133. The accommodating space 1133 has an opening for allowing a plate-shaped circuit board (described below with reference to fig. 7) to be inserted into the accommodating space 1133 in a direction parallel to the position restricting plate 111, whereby the clamping members 113 can clamp or snap on the side edges of the circuit board.

The circuit board contact surface 1110 'of the limiting plate 111 and the circuit board contact surface 1120' of the limiting plate 112 are smooth or substantially smooth planes, and both are located on the same plane, and are suitable for being tightly attached to the surface of the circuit board.

Referring again to fig. 2, the second tooling module 12 and the third tooling module 13 are arranged in a plane-symmetric manner, and only the second tooling module 12 will be described as an example. The second tooling module 12 includes a clamping member 121 and a plurality of bosses 122, 7 shown in fig. 2, having a rectangular parallelepiped shape fixed to a side surface of the clamping member 121. Each boss 122 is adapted to the shape of the corresponding guide groove 1111 of the limit plate 111, and is adapted to be inserted into the corresponding guide groove 1111.

Fig. 5 is a perspective view of the second tooling module in the tooling module assembly shown in fig. 2 rotated 90 ° about its length. As shown in fig. 5, the clamping member 121 includes a clamping plate 1211 and a clamping plate 1212 which are oppositely disposed and parallel, wherein the clamping plate 1211 and the clamping plate 1212 are fixedly connected at a side away from the plurality of bosses 122, and both define a receiving space 1213 which is plate-shaped or rectangular parallelepiped-shaped. The receiving space 1213 has an opening for allowing the circuit board to be inserted into the receiving space 1213 in a direction parallel to the

clamping plates

1211, 1212, whereby the clamping member 121 can be clamped or snapped onto the side edge of the circuit board. A plurality of bosses 122 are secured to side 12111 of the splint 1211 and are arranged in parallel.

The second tooling module 12 further includes a limiting member 1231 and a limiting member 1232 fixed to opposite ends of the side surface 12111 of the clamping plate 1211, wherein the limiting

members

1231 and 1232 are rectangular and extend in a direction perpendicular to the side surface 12111 of the clamping plate 1211. The position-limiting

members

1231 and 1232 have position-limiting

surfaces

12311 and 12321, respectively, wherein the position-limiting

surfaces

12311 and 12321 are located on the same plane and parallel to the side surface 12111 of the splint 1211.

Fig. 6 is a schematic plan view of the second tooling module shown in fig. 2, viewed in a top-down direction. As shown in fig. 6, the second tooling module 12 is substantially interdigitated, with the extension of each boss 122 being perpendicular to the side 12111 of the clamp 1211, and the end of each boss 122 being spaced from the side 12111 of the clamp 1211 by a distance d 2. The spacing surface 12311 of the spacing member 1231 is spaced apart from the side surface 12111 of the splint 1211 by a distance d1, wherein d1 is smaller than d 2.

The use of the tooling module assembly 1 will now be described with reference to figures 7 to 13.

Step 1, selecting a circuit board for welding a plurality of MOSFETs. Fig. 7 is a perspective view of a circuit board for soldering a plurality of MOSFETs. As shown in fig. 7, the circuit board 2 includes oppositely disposed side edges 21, 22; oppositely arranged side edges 23, 24; a first row 25 and a second row 26 of fixing holes parallel to the lateral edges 21, 22; and MOSFET solder pin holes 27 between the first row of fastening holes 25 and the second row of fastening holes 26.

And 2, clamping the first tool module 11 on one side edge of the circuit board 2. Fig. 8 is a schematic perspective view of the first tooling module and the circuit board shown in fig. 7 assembled together. As shown in fig. 8, the clamping member 113 of the first tooling module 11 is clamped or clipped on the side 23 of the circuit board 2, and the circuit board contact surface 1110 'of the limiting plate 111 and the circuit board contact surface 1120' of the limiting plate 112 are in contact with or attached to the circuit board 2, and at this time, a part of the side 23 of the circuit board 2 is located in the accommodating space 1133 defined by the clamping member 113. The stopper plate 111 and the stopper plate 112 are located between the first row 25 and the second row 26, and the MOSFET bonding pin hole 27 is located between the stopper plate 111 and the stopper plate 112.

And 3, clamping the second tool module 12 and the third tool module 13 on two opposite side edges 21 and 22 of the circuit board 2. Fig. 9 is a perspective view of the tooling module assembly shown in fig. 1 assembled with the circuit board shown in fig. 7. As shown in fig. 9, the clamping member 121 of the second tooling module 12 is clamped or snapped onto the side 21 of the circuit board 2, i.e. a portion of the side 21 of the circuit board 2 is located in the receiving space 1213 defined by the clamping member 121. Each boss 122 of the second tooling module 12 is located in the corresponding guide groove 1111 of the limiting plate 111, and the limiting

members

1231 and 1232 of the second tooling module 12 respectively abut against or contact with two opposite ends of the limiting plate 111. Wherein any adjacent two of the bosses 122, the clamp 1211 and the support surface 1110 of the stopper plate 111 define one recess 141 for receiving the MOSFET, whereby the first tooling module 11 and the second tooling module 12 define six recesses 141 for receiving the MOSFET. The third tooling module 13 is arranged symmetrically to the second tooling module 12 so that the first tooling module 11 and the third tooling module 13 also define six recesses 151 for receiving MOSFETs.

Step 4, the MOSFETs are placed in the

recesses

141, 151. Fig. 10 is a schematic perspective view of a MOSFET placed in a recess defined by the tooling module assembly shown in fig. 9. As shown in fig. 10, the MOSFET 3 is adapted to the accommodation space defined by the

grooves

141, 151, and is configured to be embedded in the

grooves

141, 151. The MOSFETs 3 include positioning holes 31 and heat dissipating surfaces 32, the relative positions of the MOSFETs 3 and the tooling module assembly 1 are maintained when the MOSFETs 3 are inserted into the

recesses

141 and 151, the heat dissipating surfaces 32 of a plurality (12 shown in fig. 10) of the MOSFETs 3 are located on the same plane, and the positioning holes 31 of the MOSFETs 3 are aligned with corresponding fixing holes in the first row of fixing holes 25 and the second row of fixing holes 26 of the circuit board 2.

And 5, mounting the heat dissipation device 4 on the heat dissipation surfaces of the twelve MOSFETs. Fig. 11 is a perspective view of a heat sink mounted on the heat dissipation surfaces of the twelve MOSFETs shown in fig. 10. As shown in fig. 11, the heat dissipation device 4 covers the heat dissipation surfaces 32 of the twelve MOSFETs 3, and closely adheres to the heat dissipation surface 32 of each MOSFET 3. Screws (not shown in fig. 11) are sequentially inserted through the fixing holes of the circuit board 2 and the aligned positioning holes 31 and then fixed on the heat dissipation device 4, so that the heat dissipation device 4, the MOSFETs 3 and the circuit board 2 are fixed together, and the heat dissipation device 4 is ensured to be closely attached to the heat dissipation surfaces of all the MOSFETs 3. Then, twelve pins of the MOSFET 3 are accurately and quickly soldered on the circuit board 2 at one time.

And 6, detaching the second tool module 12 and the third tool module 13 from the circuit board 2. Fig. 12 shows a perspective view of the second tool module 12 and the third tool module 13 removed from the circuit board 2 shown in fig. 11. As shown in fig. 12, the second tooling module 12 is pulled out in a direction pointing from the side edge 22 of the circuit board 2 to the side edge 21 (i.e., the direction indicated by the arrow A3 in fig. 12), and the third tooling module 13 is also pulled out in a direction pointing from the side edge 21 of the circuit board 2 to the side edge 22 (i.e., the direction indicated by the arrow a4 in fig. 12).

And 7, detaching the first tool module 11 from the circuit board 2. Fig. 13 shows a perspective view of the first tooling module 11 removed from the circuit board 2 shown in fig. 12. As shown in fig. 13, the first tooling module 11 is pulled out in a direction pointing from the side edge 24 to the side edge 23 of the circuit board 2 (i.e., in a direction indicated by an arrow a5 in fig. 13). Finally, the whole disassembling process of the tool module assembly 1 is realized.

First frock module 11 centre gripping is at the side of circuit board 2, and second frock module 12 and limiting plate 111 looks adaptation are connected and rather than having injectd the recess 141 that is used for holding electronic components, third frock module 13 and limiting plate 112 looks adaptation are connected and rather than having injectd the recess 151 that is used for holding electronic components simultaneously, place back in recess 141 and recess 151 with a plurality of MOSFET 3, can make the relative position of a plurality of MOSFET 3 and circuit board 2 keep unchangeable, and can make the cooling surface of a plurality of MOSFET 3 be located the coplanar, thereby realize fast, accurately weld the pin of a plurality of MOSFET on circuit board 2, thereby realized quick installation and the welding of a plurality of MOSFET. Meanwhile, the heat dissipation device 4 can be closely attached to the heat dissipation surfaces of the MOSFETs 3, so that the heat dissipation effect is improved.

The tooling module assembly 1 can be quickly installed on the circuit board 2 and can be quickly disassembled from the circuit board 2, the operation is simple and convenient, and the installation speed and the welding efficiency of the MOSFETs are improved.

The clamp 113 of the first tooling module 11 defines a receiving space in a plate or rectangular parallelepiped shape capable of tightly clamping the circuit board 2 and making a distance between the pin of the MOSFET 3 and the MOSFET soldering pin hole 27 of the circuit board 2 constant in a direction perpendicular to the circuit board 2. The circuit board contact surface of the limiting plate 111 and the circuit board contact surface of the limiting plate 112 are located on the same plane and can be closely attached to the circuit board 2.

The guide grooves 1111 of the limiting plate 111 and the guide grooves of the limiting plate 112 have guiding, precise positioning and detachable connection functions, so that the bosses 122 of the second tooling module 12 and the bosses of the third tooling module 13 are precisely embedded into the corresponding guide grooves, respectively, and the first tooling module 11 is limited to move along the direction of being pulled out from the circuit board 2.

The clamping member 121 of the second tooling module 12 and the clamping member of the third tooling module 13 define a receiving space in the shape of a plate or a rectangle for the opposite two sides of the circuit board 2 to be embedded into the clamping members of the second tooling module 12 and the third tooling module 13. Further, the tool module assembly 1 is precisely clamped on the side edge of the circuit board 2.

The limiting

members

1231 and 1232 of the second tooling module 12 abut against the end of the limiting plate 111, and the limiting member of the third tooling module 13 abuts against the end of the limiting plate 112, so that the relative positions of the first tooling module 11 and the second tooling module 12 and the third tooling module 13 are kept unchanged, and therefore the MOSFET 3 can be accurately placed on the circuit board 2, and the pins of the MOSFET 3 can be accurately inserted into the MOSFET welding pin holes 27 of the circuit board 2.

The utility model discloses a frock module subassembly 1 is not limited to installation, fixed and the welding of being applied to a plurality of MOSFET, can also be used to have other electronic components of level and smooth cooling surface.

In another embodiment of the present invention, the supporting surface of the limiting

plate

111 or 112 of the first tooling module 11 has a protrusion thereon, and the bosses of the second tooling module 12 and the third tooling module 13 have a guiding groove adapted to the protrusion on the supporting surface of the limiting

plate

111 or 112, so as to realize the adaptive connection between the second tooling module 12 and the third tooling module 13 and the limiting

plate

111 or 112 respectively.

The utility model discloses do not intend to inject quantity, the size of the guide way of limiting plate 111 and limiting plate 112 of first frock module 11 to and the interval isoparametric of two adjacent guide ways. Also, the present invention is not intended to be limited to the number, size, and spacing isoparametric of the bosses of the second tooling module 12 and the third tooling module 13, and the adjacent two bosses.

In other embodiments of the present invention, the limiting plate 111 and the limiting plate 112 may not be identical, for example, the number and size of the grooves thereon may not be identical. The second tooling module 12 and the third tooling module 13 may be arranged asymmetrically, and the number and size of the bosses thereon may not be equal.

Although the present invention has been described in connection with the preferred embodiments, it is not intended to limit the invention to the embodiments described herein, but rather, to include various changes and modifications without departing from the scope of the invention.

Claims

1. The utility model provides a frock module subassembly for electronic components which characterized in that includes:

2. The tool module assembly of claim 1 wherein the first clamp member comprises:

the first clamping plate, the first limiting plate and the second limiting plate are positioned on the same plane, and two ends of the first clamping plate are fixedly connected with the end part of the first limiting plate and the end part of the second limiting plate; and

the second clamping plate is fixedly connected with the first clamping plate and is arranged oppositely;

the first clamping plate, the second clamping plate, the end part of the first limiting plate and the end part of the second limiting plate limit an accommodating space.

3. The tool module assembly of claim 1 wherein the first retainer plate includes a first support surface and a first circuit board contact surface that are opposite, the first support surface having a plurality of first guide slots arranged in series; the second limiting plate comprises a second supporting surface and a second circuit board contact surface which are opposite, and a plurality of second guide grooves which are sequentially arranged are formed in the second supporting surface.

4. The tooling module assembly of claim 3 wherein the first circuit board contact surface and the second circuit board contact surface are located on the same plane.

5. The tool module assembly of claim 1 wherein the first and second retainer plates are of identical construction.

6. The tool module assembly of claim 3,

the second tooling module includes:

the second clamping piece is used for clamping a second side edge of the circuit board; and

a plurality of first bosses fixed to a side surface of the second clamping member, the plurality of first bosses being adapted to be fitted into the plurality of first guide grooves;

the third frock module includes:

the third clamping piece is used for clamping a third side edge of the circuit board; and

a plurality of second bosses fixed to a side surface of the third clamping member, the plurality of second bosses being adapted to be fitted into the plurality of second guide grooves;

wherein the first plurality of bosses, the second retaining member, and the first bearing surface define the first recess, and the second plurality of bosses, the third retaining member, and the second bearing surface define the second recess.

7. The tool module assembly of claim 6,

the second clamping piece comprises a third clamping plate and a fourth clamping plate which are oppositely arranged and fixedly connected, the third clamping plate and the fourth clamping plate define an accommodating space, the plurality of first bosses are fixed on the side surface of the third clamping plate, and the extending directions of the plurality of first bosses are perpendicular to the side surface of the third clamping plate;

the third holder includes relative setting and fixed connection's fifth splint and sixth splint, a accommodation space is injectd to fifth splint and sixth splint, a plurality of second bosss are fixed on the side of fifth splint, the extending direction perpendicular to of a plurality of second bosss the side of fifth splint.

8. The tool module assembly of claim 7 wherein the second clamping member further comprises two first retaining members fixed to opposite ends of the side surface of the third clamping plate, the two first retaining members being configured to abut against opposite ends of the first retaining plate; the third clamping piece further comprises two second limiting pieces fixed at two opposite ends of the side face of the fifth clamping plate, and the two second limiting pieces are used for abutting against two opposite ends of the second limiting plate.

9. The tool module assembly of claim 8 wherein each of the two first stops includes a first stop face in contact with the first stop plate, the first stop face being spaced from the side of the third clamp plate by a distance less than a distance between an end of each of the plurality of first bosses and the side of the third clamp plate, each of the two second stops includes a second stop face in contact with the second stop plate, the second stop face being spaced from the side of the fifth clamp plate by a distance less than a distance between an end of each of the plurality of second bosses and the side of the fifth clamp plate.

10. The tooling module assembly of claim 1 wherein the second tooling module and the third tooling module are symmetrically arranged.