CN218977126U

CN218977126U - Radiator mounting device

Info

Publication number: CN218977126U
Application number: CN202222809712.0U
Authority: CN
Inventors: 黄汉武; 谢伟枫
Original assignee: Shenzhen Sofarsolar Co Ltd
Current assignee: Shenzhen Sofarsolar Co Ltd
Priority date: 2022-10-25
Filing date: 2022-10-25
Publication date: 2023-05-05
Anticipated expiration: 2032-10-25

Abstract

Embodiments of the present utility model provide a mounting device for a heat sink and a heat sink, including: the base is provided with an accommodating space for accommodating the radiating body, the base is provided with a first positioning plate cover, and the first positioning plate is provided with a first accommodating part for positioning the electronic device. The electronic device can be directly abutted with the heat dissipation body in a preset direction when the electronic device is placed in the first accommodating part, so that the connection precision of the heat dissipation body and the electronic device caused by manual operation is greatly reduced, the installation step can be simplified, the electronic device is placed only by aligning the first accommodating part, and finally, the electronic device and the heat dissipation body are directly connected through connecting pieces such as screws.

Description

Radiator mounting device

Technical Field

The utility model belongs to the technical field of radiators, and particularly relates to a radiator mounting device.

Background

Currently, a heat sink is required to be mounted on the PCB, and the heat sink is required to be assembled in advance.

The heat sink assembly is to sequentially fix ceramic chips and electronic devices (such as MOST tubes) to the heat sink body. The pins of the electronic device are used for being matched and connected with the welding holes on the PCB, and after the pins of the electronic device are matched and connected with the welding holes on the PCB, the radiator and the PCB can be kept connected by utilizing a welding means.

In the prior art, ceramic plates and electronic devices are placed on a radiator for installation manually, and pins of the electronic devices cannot be guaranteed to be installed on a radiating body in a preset direction due to lower manual assembly precision, so that the pins of the electronic devices cannot be inserted into welding holes on a PCB.

Disclosure of Invention

An object of the embodiments of the present application is to provide a mounting device for a heat sink, which can mount an electronic device on a heat dissipation body in a predetermined direction.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows:

in a first aspect, the present utility model provides a mounting apparatus for a heat sink for mounting an electronic device on a heat dissipation body, including:

a base provided with an accommodating space for accommodating the heat dissipation body; and

the first locating plate is covered on the base and is provided with a first containing part for locating the electronic device, and the first containing part is communicated with the containing space.

In an embodiment, the first accommodating portion includes a limiting groove and a pin positioning groove, and the limiting groove is communicated with the pin positioning groove.

In an embodiment, the pin positioning grooves are provided in plurality, and the pin positioning grooves are arranged at intervals and are communicated with the limiting grooves.

In an embodiment, the first positioning plate is further provided with an avoidance groove, the avoidance groove is arranged at intervals with the limiting groove, and the avoidance groove is communicated with the accommodating space.

In an embodiment, the mounting device of the heat sink further includes a second positioning plate, the second positioning plate is disposed between the first positioning plate and the base, and a second accommodating portion is disposed on the second positioning plate and is respectively communicated with the first accommodating portion and the accommodating space.

In an embodiment, the base is further provided with a first picking and placing groove, and the first picking and placing groove is communicated with the accommodating space.

In an embodiment, a second picking and placing groove is further formed in the base, the second picking and placing groove is formed in the edge of the base, and the second picking and placing groove and the first picking and placing groove are sequentially arranged in the length direction of the base.

In an embodiment, the base further comprises a guiding inclined plane, wherein the guiding inclined plane is connected with the inner wall of the accommodating space, and the guiding inclined plane is used for guiding and installing the heat dissipation body.

In an embodiment, the base is provided with a positioning column, the first positioning plate is provided with a first connecting hole, the second positioning plate is provided with a second connecting hole, and the positioning column sequentially penetrates through the first connecting hole and the second connecting hole.

In a second aspect, the present utility model provides a heat sink assembled by a mounting device of a heat sink as described in the first aspect.

The beneficial effects of this application lie in: embodiments of the present utility model provide a mounting device for a heat sink and a heat sink, including: the base is provided with an accommodating space for accommodating the radiating body, the base is provided with a first positioning plate cover, and the first positioning plate is provided with a first accommodating part for positioning the electronic device. The electronic device can be directly abutted with the heat dissipation body in a preset direction when the electronic device is placed in the first accommodating part, so that the connection precision of the heat dissipation body and the electronic device caused by manual operation is greatly reduced, the installation step can be simplified, the electronic device is placed only by aligning the first accommodating part, and finally, the electronic device and the heat dissipation body are directly connected through connecting pieces such as screws.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required for the description of the embodiments or exemplary techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a perspective view of a mounting device of a radiator according to an embodiment of the present utility model;

fig. 2 is a schematic exploded view of a mounting device of a radiator according to an embodiment of the present utility model.

Wherein, each reference sign in the figure:

100. a base; 110. an accommodation space; 120. a first pick-and-place tank; 130. a second pick-and-place tank; 140. a guide slope; 150. positioning columns;

200. a first positioning plate; 210. a first housing part; 220. a limit groove; 230. pin positioning grooves; 240. an avoidance groove; 250. a first connection hole;

300. a second positioning plate; 310. a second accommodating portion; 320. and a second connection hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, are for convenience of description only, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application, and the specific meaning of the terms described above may be understood by those of ordinary skill in the art as appropriate. The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.

Referring to fig. 1-2, in a first aspect, an embodiment of the present utility model provides a mounting apparatus (also referred to as the present apparatus) for a heat sink for mounting an electronic device on a heat dissipating body.

The mounting device of the radiator comprises: the base 100 and the first positioning plate 200.

The base 100 is provided with an accommodation space 110 for accommodating a heat dissipating body (also referred to as a radiator base). Illustratively, the accommodating space 110 may be set according to the shapes of different heat dissipating bodies, and the size of the accommodating space 110 may be larger than that of the heat dissipating body, so that the heat dissipating body is prevented from being unable to be taken out after being placed in the accommodating space 110, and friction between the side wall of the accommodating space 110 and the heat dissipating body can be reduced. Illustratively, the circumferential side wall of the accommodating space 110 has a certain gap with the circumferential side of the heat dissipating body, the gap being 0.2mm.

Illustratively, the base 100 may be a rectangular parallelepiped, and any two opposing faces of the base 100 may serve as a plane for connecting the table and the heat dissipating body, respectively. The base 100 may also be provided with a connection area adapted to the shape of the first positioning plate 200, for example, the base 100 is provided with a concave structure adapted to the outline of the first positioning plate 200, so that the first positioning plate 200 may be partially inserted into the base 100, thereby playing a positioning role and facilitating placement of the first positioning plate 200.

The first positioning plate 200 is disposed on the base 100. As an example, the first positioning plate 200 is screwed to the base 100 to facilitate the detachment from the base 100.

The first positioning plate 200 is provided with a first receiving portion 210 for positioning the electronic device, and the first receiving portion 210 communicates with the receiving space 110. The shape and direction of the first housing portion 210 are set in advance, and the first housing portion 210 matches the shape of the electronic device. That is, when the electronic device is placed in the first receiving portion 210, the electronic device maintains a predetermined posture, thereby improving the positioning accuracy of the electronic device.

In this embodiment, after the heat dissipation body is placed in the accommodating space 110, the first positioning plate 200 is covered on the base 100, and since the first accommodating portion 210 is communicated with the accommodating space 110, when the electronic device is placed in the first accommodating portion 210, the electronic device will be directly abutted to the heat dissipation body in a predetermined direction, so that the connection precision between the heat dissipation body and the electronic device caused by manual operation is greatly reduced, the installation procedure can be simplified, only the electronic device needs to be placed in alignment with the first accommodating portion 210, and finally the electronic device and the heat dissipation body need to be directly connected through a connecting piece such as a screw, so that the operation is convenient, and the installation efficiency is high.

Referring to fig. 2, in an embodiment, since the electronic device includes a main body and a pin, if the first accommodating portion 210 only includes one portion, the main body and the pin are limited by the one portion, the positioning accuracy of the pin is not fully improved, and in order to further improve the positioning accuracy of the pin, the first accommodating portion 210 includes a limiting groove 220 and a pin positioning groove 230, and the limiting groove 220 is communicated with the pin positioning groove 230. The main body and the pins are respectively limited by the limiting grooves 220 and the pin positioning grooves 230, so that the pins can be ensured to be arranged towards a preset direction, and the pins can be smoothly inserted into the welding holes when the radiator is connected with the circuit board.

Referring to fig. 2, in an embodiment, in order to locate a multi-pin electronic device, a plurality of pin locating slots 230 are provided, and the plurality of pin locating slots 230 are spaced apart and all communicate with the limiting slot 220.

Referring to fig. 2, in an embodiment, since some heat dissipation bodies are not in regular shapes, when the heat dissipation bodies are placed in the accommodating space 110, the protruding portions of the heat dissipation bodies are abutted against the first positioning plate 200, so that the first positioning plate 200 cannot be covered on the base 100, in order to solve the problem, the first positioning plate 200 is further provided with an avoidance groove 240, the avoidance groove 240 is arranged at intervals with the limiting groove 220, and the avoidance groove 240 is communicated with the accommodating space 110, so that the protruding portions of the heat dissipation bodies can be avoided through the avoidance groove 240, and furthermore, the avoidance groove 240 and the protruding portions of the heat dissipation bodies cooperate to perform secondary positioning on the heat dissipation bodies, so that the connection precision of the electronic device and the radiator is further ensured.

Referring to fig. 2, in an embodiment, since some heat sinks need to install a pad (e.g. a ceramic plate) between the electronic device and the heat dissipation body, the installation device of the heat sink further includes a second positioning plate 300, the second positioning plate 300 is disposed between the first positioning plate 200 and the base 100, and a second accommodating portion 310 is disposed on the second positioning plate 300, and the second accommodating portion 310 is respectively communicated with the first accommodating portion 210 and the accommodating space 110.

Referring to fig. 2, as an example, the thickness of the second positioning plate 300 is equal to the thickness of the ceramic sheet to be mounted, and the shape of the second receiving portion 310 is a shape of a stepped shaft cross section along the axial direction, so that the ceramic board can be conveniently placed and taken out from the second receiving portion 310.

Referring to fig. 2, in an embodiment, the second positioning plate 300 is also provided with an avoidance groove 240, and the function of the avoidance groove 240 is consistent with that of the avoidance groove 240 on the first positioning plate 200, which is not described herein.

Referring to fig. 2, in an embodiment, in order to facilitate taking out the heat dissipation body from the accommodating space 110 after installation, the base 100 is further provided with a first taking and placing groove 120, the first taking and placing groove 120 is communicated with the accommodating space 110, and by setting the first taking and placing groove 120, the exposed area of the side wall of the heat dissipation body can be enlarged, the operation space of a hand or a manipulator can be increased by the taking and placing groove, and the friction force between the hand or the manipulator and the heat dissipation body can be enlarged when the grabbing action is performed.

Referring to fig. 2, in an embodiment, in order to facilitate moving the device, a second picking and placing slot 130 is further provided on the base 100, the second picking and placing slot 130 is provided on an edge of the base 100, when the first positioning plate 200 is connected with the base 100, a hand can be inserted between the first positioning plate 200 and the base 100 through the second picking and placing slot 130, so that the device is convenient to carry, and the second picking and placing slot 130 and the first picking and placing slot 120 are sequentially provided in a length direction of the base 100, so that the communication between the first picking and placing slot 120 and the second picking and placing slot 130 can be avoided, and foreign matters are prevented from entering the first picking and placing slot 120 from the second picking and placing slot 130 during carrying.

Referring to fig. 2, in an embodiment, in order to facilitate the placement of the heat dissipating body into the accommodating space 110, the base 100 further includes a guiding inclined plane 140, the guiding inclined plane 140 has a certain inclination angle with respect to the first positioning plate 200, the guiding inclined plane 140 is connected to an inner wall of the accommodating space 110, and the guiding inclined plane 140 is used for guiding and installing the heat dissipating body.

Referring to fig. 2, in an embodiment, in order to facilitate quick positioning connection between the base 100 and the first positioning plate 200 and the second positioning plate 300, the base 100 is provided with a positioning column 150, the front end of the positioning column 150 may be a conical head or a round head, etc., the first positioning plate 200 is provided with a first connecting hole 250, the second positioning plate 300 is provided with a second connecting hole 320, and the positioning column 150 sequentially passes through the first connecting hole 250 and the second connecting hole 320, so that the operation is convenient.

Illustratively, the base 100, the first positioning plate 200 and the second positioning plate 300 may be made of fiberglass bakelite, steel, aluminum alloy, and the like. The material has low cost and light weight, and can better protect products and prevent the products from scratching.

The device can solve the problems that the ceramic plate of the radiator lacks limit and is easy to shake when the screw is locked due to purely manual installation, and the ceramic plate is likely to crack due to contact with the screw, so that the quality of the radiator is abnormal. The device can respectively position the radiator, the ceramic chip and the electronic device, can avoid quality problems caused by cracking of the ceramic chip, and can accurately orient pins of the electronic device, so that the pins are convenient to be inserted into welding holes on a PCB (printed circuit board), the time of inserting the pins is shortened, the production efficiency is improved, and the device is simple to operate and convenient to use.

In a second aspect, the utility model also proposes a radiator assembled by the assembly of the mounting device of the radiator as described in the first aspect. The specific structure of the installation device of the radiator refers to the above embodiments, and because all the technical schemes of all the embodiments are adopted, the installation device also has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted herein.

In one embodiment, the installation process of the radiator is as follows:

placing the heat dissipation body in the accommodation space 110 of the base 100;

placing the second positioning plate 300 on the base 100 such that the positioning column 150 passes through the second connection hole 320;

placing the ceramic board in the second receiving portion 310;

placing the first positioning plate 200 on the ceramic wafer positioning plate such that the positioning posts 150 pass through the first connection holes 250;

placing the electronic device in the first accommodating part 210, then placing a gasket and a screw, and fixedly connecting the electronic device, the ceramic plate and the heat dissipation body through an electric screw driving machine;

after the screw fixing is completed, the first and

second positioning plates

200 and 300 are sequentially taken out, and then the assembled radiator is taken out;

repeating the steps until the batch product is assembled.

The foregoing is merely an alternative embodiment of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the scope of the claims of the present application.

Claims

1. A mounting apparatus for a heat sink for mounting an electronic device on a heat dissipating body, comprising:

2. The heat sink mounting apparatus of claim 1, wherein: the first accommodating part comprises a limit groove and a pin positioning groove, and the limit groove is communicated with the pin positioning groove.

3. The mounting device for a heat sink as claimed in claim 2, wherein: the pin positioning grooves are formed in a plurality of positions, and the pin positioning grooves are arranged at intervals and are communicated with the limiting grooves.

4. The mounting device for a heat sink as claimed in claim 2, wherein: the first positioning plate is further provided with an avoidance groove, the avoidance groove is arranged at intervals with the limiting groove, and the avoidance groove is communicated with the accommodating space.

5. The heat sink mounting apparatus of claim 1, wherein: the mounting device of the radiator further comprises a second positioning plate, wherein the second positioning plate is arranged between the first positioning plate and the base, a second accommodating part is arranged on the second positioning plate, and the second accommodating part is respectively communicated with the first accommodating part and the accommodating space.

6. The heat sink mounting apparatus of claim 1, wherein: the base is also provided with a first taking and placing groove which is communicated with the accommodating space.

7. The heat sink mounting apparatus as set forth in claim 6, wherein: the base is also provided with a second picking and placing groove, the second picking and placing groove is arranged at the edge of the base, and the second picking and placing groove and the first picking and placing groove are sequentially arranged in the length direction of the base.

8. The heat sink mounting apparatus of claim 1, wherein: the base also comprises a guide inclined plane, wherein the guide inclined plane is connected with the inner wall of the accommodating space, and the guide inclined plane is used for guiding and installing the heat dissipation body.

9. The heat sink mounting apparatus as set forth in claim 5, wherein: the base is provided with a positioning column, the first positioning plate is provided with a first connecting hole, the second positioning plate is provided with a second connecting hole, and the positioning column sequentially penetrates through the first connecting hole and the second connecting hole.

10. A heat sink, characterized by: the heat sink is assembled by a mounting device of the heat sink as claimed in any one of claims 1-9.