CN220155500U

CN220155500U - Anti-drop carrying device for semiconductor device

Info

Publication number: CN220155500U
Application number: CN202321637679.6U
Authority: CN
Inventors: 张璐璐; 周炳
Original assignee: ZHANGJIAGANG EVER POWER SEMICONDUCTOR CO Ltd
Current assignee: ZHANGJIAGANG EVER POWER SEMICONDUCTOR CO Ltd
Priority date: 2023-06-27
Filing date: 2023-06-27
Publication date: 2023-12-08
Anticipated expiration: 2033-06-27

Abstract

The utility model discloses an anti-drop carrying device of a semiconductor device, which comprises: carry dish, elastic clamping piece and locating plate, locating plate parallel arrangement is on carrying the dish, the indent is provided with a plurality of constant head tanks on the locating plate, locating plate bottom interval is provided with the jack that extends to the locating plate bottom surface, the indent is provided with the embedded groove that is located the jack below on carrying the dish, elastic clamping piece includes bottom plate and splint, embedded groove bottom indent is provided with the draw-in groove that corresponds with the bottom plate, the bottom plate sets up in the draw-in groove, splint setting are in the bottom plate both sides and upwards extend. According to the anti-drop carrying device for the semiconductor device, the semiconductor device is positioned on the positioning plate through the positioning groove, and the elastic clamping piece is used for elastically clamping the pins at the bottom of the semiconductor device, so that the problem of drop in the carrying process is avoided.

Description

Anti-drop carrying device for semiconductor device

Technical Field

The utility model relates to the field of semiconductor device carrying equipment, in particular to an anti-drop carrying device for semiconductor devices.

Background

In the production process of semiconductor devices, a large number of processing and inspection steps are required, and the semiconductor devices are loaded by a carrier, and are circulated between processing and inspection devices.

The carrier is usually provided with a positioning groove corresponding to the semiconductor device, and the semiconductor device is placed in the positioning groove for positioning. In order to facilitate taking and placing, the depth of the positioning groove is usually not large, and the semiconductor device is in risk of falling out of the positioning groove due to vibration, inertia and other problems in the circulation process.

Disclosure of Invention

The utility model aims to provide an anti-drop carrying device for semiconductor devices, which is used for positioning the semiconductor devices and improving the stability of a carrying process.

To achieve the purpose, the utility model adopts the following technical scheme:

a semiconductor device drop-out prevention carrying device comprising: carry dish, elastic clamping piece and locating plate, locating plate parallel arrangement is on carrying the dish, the indent is provided with a plurality of constant head tanks on the locating plate, locating plate bottom interval is provided with the jack that extends to the locating plate bottom surface, the indent is provided with the embedded groove that is located the jack below on carrying the dish, elastic clamping piece includes bottom plate and splint, embedded groove bottom indent is provided with the draw-in groove that corresponds with the bottom plate, the bottom plate sets up in the draw-in groove, splint setting are in the bottom plate both sides and upwards extend.

Wherein, the constant head tank top edge is provided with the chamfer.

Wherein, the bottom plate is located under the corresponding jack.

The top of the clamping plate is respectively provided with a guide plate extending obliquely above the outer side, and the top of the guide plate is provided with a limiting plate pointing to the side wall of the embedded groove.

Wherein, bottom plate, splint, guide plate and limiting plate adopt integrated metal structure.

The side wall of the embedded groove is concavely provided with a positioning hole, and a spring extending to the outer side face of the clamping plate is arranged in the positioning hole.

The lower parts of two sides of the positioning plate are provided with fixing plates, and screws connected with the carrying disc are arranged on the fixing plates.

The fixing plate is provided with through holes corresponding to the screws one by one, and the carrying disc is provided with threaded holes corresponding to the screws one by one.

The utility model has the beneficial effects that: the utility model provides a semiconductor device anticreep carrying device carries out the location of semiconductor device on the locating plate through the constant head tank, utilizes elastic clamping piece to carry out the elasticity centre gripping of semiconductor device bottom pin, has avoided the problem of flying off in the delivery process, has promoted the delivery stability.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

fig. 2 is a top view of the locating plate of fig. 1.

Detailed Description

The technical solution of the present utility model will be further described with reference to fig. 1 to 2 by means of specific embodiments.

The semiconductor device anti-drop carrier apparatus shown in fig. 1 includes: the support plate 1, the elastic clamping piece 3 and the locating plate 2, the locating plate 2 is arranged on the support plate 1 in parallel, and flows along with the support plate 1. In this embodiment, fixing plates 23 are disposed at the lower parts of two sides of the positioning plate 2, and screws 7 connected with the carrier plate 1 are disposed on the fixing plates 23, so that the structure is stable.

As shown in fig. 2, the fixing plate 23 is provided with through holes 25 corresponding to the screws 7 one by one, and the carrying plate is provided with threaded holes 14 corresponding to the screws 7 one by one, so that the assembly and the disassembly are convenient.

In this embodiment, the positioning plate 2 is concavely provided with a plurality of positioning grooves 21, and the plurality of positioning grooves 21 are distributed in an array to position a plurality of semiconductor devices 5, as shown in fig. 2, and the top edge of the positioning groove 21 is provided with a chamfer 24, which is beneficial to the placement of the semiconductor devices 5.

As shown in fig. 1, the bottom of the positioning slot 21 is provided with a plurality of jacks 22 extending to the bottom surface of the positioning plate 2 at intervals, and the number of the jacks 22 corresponds to the number of the pins 6 at the bottom of the semiconductor device 5 one by one, so that the pins 6 at the bottom of the semiconductor device 5 can be conveniently inserted.

The carrier plate 1 is concavely provided with an embedded groove 11 positioned below the jack 22, and the pin 6 is elastically clamped by the elastic clamping piece 3 in the embedded groove 11, so that the stability is improved. The elastic clamping piece 3 comprises a bottom plate 31 and a clamping plate 32, a clamping groove 12 corresponding to the bottom plate is concavely arranged at the bottom of the embedded groove 11, the bottom plate 31 is arranged in the clamping groove 12, and in the embodiment, the bottom plate 31 is located right below the corresponding jack 22, and the bottom plate 31 is positioned through the clamping groove 12.

The clamping plates 32 are arranged on two sides of the bottom plate 31 and extend upwards, and the elastic clamping of the pins 6 is performed through the clamping plates 32 on two sides. Guide pieces 33 extending obliquely above the outer sides are respectively arranged at the tops of the clamping plates 32, and guide pins 6 when the pins are inserted into the clamping plates 32 at the two sides is performed. The top of the guide plate 33 is provided with a limiting plate 34 pointing to the side wall of the embedded groove 11, so as to limit the outward movement of the guide plate 33, and maintain the elastic clamping force of the clamping plate 32 on the pins 6.

In this embodiment, the bottom plate 31, the clamping plate 32, the guide piece 33 and the limiting plate 34 adopt an integrated metal structure, and may be formed by bending a copper sheet, so that the bottom plate has a certain elasticity. In this embodiment, the indent of embedded groove 11 lateral wall is provided with locating hole 13, be provided with in the locating hole 13 and extend to the spring 4 of splint 32 lateral surface, carry out the elastic support of splint 32, after pin 6 inserts between the splint 32 of both sides, can utilize spring 4 to promote clamping force, it is more stable, avoided the problem of flying off in the delivery process.

The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.

Claims

1. A semiconductor device drop-off prevention carrying device, characterized by comprising: carry dish, elastic clamping piece and locating plate, locating plate parallel arrangement is on carrying the dish, the indent is provided with a plurality of constant head tanks on the locating plate, locating plate bottom interval is provided with the jack that extends to the locating plate bottom surface, the indent is provided with the embedded groove that is located the jack below on carrying the dish, elastic clamping piece includes bottom plate and splint, embedded groove bottom indent is provided with the draw-in groove that corresponds with the bottom plate, the bottom plate sets up in the draw-in groove, splint setting are in the bottom plate both sides and upwards extend.

2. The semiconductor device drop-out prevention carrier of claim 1, wherein the detent top edge is provided with a chamfer.

3. The semiconductor device drop-out carrier of claim 1, wherein the bottom plate is located directly below a corresponding socket.

4. The semiconductor device drop-out prevention carrier device according to claim 1, wherein the clip plate tops are respectively provided with guide pieces extending obliquely outward upward, and the guide piece tops are provided with limit plates directed toward the side walls of the embedded grooves.

5. The semiconductor device drop-out prevention carrier of claim 4, wherein the base plate, clamping plate, guide plate and limiting plate are of an integrated metal structure.

6. The semiconductor device drop-out prevention carrier of claim 1, wherein the embedded groove side wall is concavely provided with a positioning hole, and a spring extending to the outer side surface of the clamping plate is arranged in the positioning hole.

7. The anti-drop carrier for semiconductor devices according to claim 1, wherein fixing plates are arranged at lower portions of two sides of the positioning plate, and screws connected with the carrier plate are arranged on the fixing plates.

8. The anti-drop carrier for semiconductor devices according to claim 7, wherein the fixing plate is provided with through holes corresponding to the screws one by one, and the carrier plate is provided with threaded holes corresponding to the screws one by one.