CN113825308B - Heating chip fixing structure, vehicle-mounted navigation host and assembling method thereof - Google Patents

Abstract

The invention provides a heating chip fixing structure, a vehicle-mounted navigation host and an assembling method thereof, wherein the heating chip fixing structure comprises a fixing frame and a fixing support, the fixing frame comprises a radiating fin, fixing components which are mutually matched are formed between the transverse two ends of a chip mounting area of the fixing support and the radiating fin, the fixing component fixes the fixing support on the radiating fin, a chip accommodating cavity for accommodating the heating chip is formed between the fixing support and the radiating fin, the distance between the transverse two ends of the chip accommodating cavity is greater than the length of the corresponding position of the heating chip, accurate alignment is not needed when the heating chip is mounted, the fixing support is prevented from being fixed on the radiating fin when an error is assembled, the fixing support is ensured to be fixed on the radiating fin to ensure that the heating chip is attached to the radiating fin, the heating chip has good radiating effect, and damage to the heating chip caused by the fixing support being fixed on a circuit board when the circuit board is scratched and the error is assembled can be avoided And (7) a pin.

Description

Heating chip fixing structure, vehicle-mounted navigation host and assembling method thereof

Technical Field

The invention relates to the technical field of heat dissipation of heating chips, in particular to a heating chip fixing structure, a vehicle-mounted navigation host and an assembling method thereof.

Background

As vehicle navigation technology matures, drivers often use navigation hosts for positioning and navigation while driving. In the navigation host computer, the power amplifier chip that generates heat is essential electronic component, and the power amplifier chip that generates heat can produce a large amount of heats at the operation in-process, needs the fin to carry out heat conduction, heat dissipation, and the power amplifier chip that generates heat only hugs closely the fin and just can better heat dissipation, consequently need set up the power amplifier support and guarantee that the power amplifier chip that generates heat hugs closely with the fin reliably for a long time.

In the prior art, a power amplifier heating chip and a power amplifier support are generally assembled together and then welded to a circuit board, the circuit board is placed inside a casing of a navigation host, then the circuit board is locked on the casing of the navigation host through screws, and then the power amplifier support and a radiating fin are locked through screws. Because the circuit board is fixed on the shell and the position of the power amplifier heating chip is fixed, when the power amplifier bracket and the radiating fin are locked and fixed, the following conditions may be caused:

1. the screw holes on the radiating fins and the screw holes on the power amplifier support are staggered, so that the power amplifier support and the radiating fins are difficult to lock, and pins of the power amplifier heating chip are broken when the power amplifier support and the radiating fins are forcibly locked.

2. There is the clearance between fin and the power amplifier chip that generates heat, leads to the power amplifier chip that generates heat's that generates heat radiating effect not good.

Therefore, a new fixing structure of the heat generating chip capable of solving the above problems is urgently needed.

Disclosure of Invention

The invention aims to provide a heating chip fixing structure which does not need to be accurately aligned, can avoid the damage of pins of a heating chip and has good heat dissipation effect.

Another objective of the present invention is to provide a vehicle-mounted navigation host, which does not need to precisely align a heat-generating chip, can avoid the damage of pins of the heat-generating chip, and has a good heat dissipation effect.

Another objective of the present invention is to provide an assembling method for a car navigation host, which does not need to precisely align a heat-generating chip and can avoid the damage of the pins of the heat-generating chip.

In order to achieve the above object, the present invention provides a fixing structure of a heat generating chip, including:

a fixed frame including a heat sink;

the fixed bolster, the chip installation region has on the fixed bolster, the fixed bolster in the horizontal both ends of chip installation region with be formed with the fixed subassembly of mutually supporting between the fin, fixed subassembly will the fixed bolster is fixed in on the fin, and the fixed bolster with form between the fin and hold the chip holding chamber of the chip that generates heat, the chip quilt that generates heat the fixed bolster with the fin centre gripping in the chip holding chamber and make the rear side of the chip that generates heat with the fin laminating, the interval at the horizontal both ends in chip holding chamber is greater than the length that the chip that generates heat corresponds the position.

Compared with the prior art, in the heating chip fixing structure, the fixing support is fixed on the radiating fin through the fixing assembly, the chip accommodating cavity for accommodating the heating chip is formed between the fixing support and the radiating fin, the heating chip is clamped in the chip accommodating cavity by the fixing support and the radiating fin, the rear side of the heating chip is attached to the radiating fin, and the distance between the two transverse ends of the chip accommodating cavity is greater than the length of the corresponding position of the heating chip, so that the heating chip is not required to be accurately aligned when being installed, and the problem that the fixing support is difficult to fix on the radiating fin when an error is assembled can be avoided. Therefore, in the heating chip fixing structure, even if the assembly error of the heating chip is caused, the fixing support can be fixed on the radiating fin to ensure that the rear side of the heating chip is attached to the radiating fin, so that the radiating effect of the heating chip is good, and the fixing support is fixed on the radiating fin but not fixed with the circuit board, so that the circuit board can be prevented from being scratched and the pins of the heating chip can be prevented from being damaged because the fixing support is fixed on the circuit board when the assembly error is caused.

Optionally, the fixing assembly includes a first mounting hole formed in the fixing support, a second mounting hole formed in the heat sink and corresponding to the first mounting hole, and a fixing screw, the first mounting hole is formed in each of two ends of the fixing support, the second mounting hole is formed in the heat sink corresponding to the first mounting hole, and the fixing screw is fixed to the heat sink through the first mounting hole and the second mounting hole.

Optionally, the fixing component forms a boundary of two lateral sides of the chip accommodating cavity.

Optionally, the fixing frame further comprises a blocking wall, and the blocking wall and the radiating fin are oppositely arranged at a certain interval;

the fixing support comprises a fixing body, at least two elastic arms are convexly arranged on the front side of the fixing body far away from the heating chip, and when the fixing support is connected with the fixing frame, the elastic arms are abutted against the retaining wall and provide forward elastic force for the retaining wall so that the rear side of the heating chip is tightly attached to the radiating fin.

Optionally, the fixed frame is provided with two of the blocking walls, the two blocking walls are arranged at a transverse interval, and the elastic arm is arranged corresponding to the blocking walls and is respectively abutted against the blocking walls.

Optionally, the blocking wall is a straight wall and parallel to the heat sink, and an opening is formed between two blocking walls arranged at an interval.

Optionally, the fixing frame further includes a first connecting wall and a second connecting wall, the first connecting wall and the second connecting wall are formed by bending and extending the two transverse ends of the heat sink forward, and the front side edges of the first connecting wall and the second connecting wall are connected to the blocking wall respectively.

Optionally, the elastic arm includes link and the elastic part that can produce elastic deformation, the link is connected fixed body with the elastic part, the elastic part is buckled and is the arc and forms convex arc face, convex arc face orientation and butt in the wall of keeping off.

Optionally, the elastic arm further includes a free end, an end of the elastic portion away from the connecting end is the free end, and the free end extends toward a direction opposite to the connecting end.

Optionally, the upper end of the fixed support is bent back to the direction of the chip accommodating cavity to form a foldable edge which can be held by hand.

Optionally, the fixing bracket includes a main body portion and a reinforcing edge formed by bending four sides of the main body portion outwards or inwards, one side of the main body portion adjacent to the heat-generating chip is a flat interference surface, and the chip mounting region is formed on the interference surface.

In order to achieve another object, the present invention further provides a vehicle-mounted navigation host, including:

a housing;

the circuit board is arranged in the shell, and a heating chip is welded on a chip welding position of the circuit board;

the heating chip fixing structure is as described above.

Compared with the prior art, in the vehicle-mounted navigation host, the fixing component of the heating chip fixing structure fixes the fixing support on the radiating fin, the chip accommodating cavity is formed between the fixing support and the radiating fin, the heating chip is clamped in the chip accommodating cavity by the fixing support and the radiating fin, the rear side of the heating chip is attached to the radiating fin, and the distance between the two transverse ends of the chip accommodating cavity is greater than the length of the corresponding position of the heating chip, so that the heating chip is not required to be accurately aligned when being installed, and the problem that the fixing support is difficult to fix on the radiating fin when an error is assembled can be avoided. Therefore, in the vehicle-mounted navigation host, even if the assembly error of the heating chip exists, the fixing support can be fixed on the radiating fin, so that the rear side of the heating chip is attached to the radiating fin, the radiating effect of the heating chip is good, the fixing support is fixed on the radiating fin and is not fixed with the circuit board, and the circuit board can be prevented from being scratched, and the pins of the heating chip can be prevented from being damaged due to the fact that the fixing support is fixed on the circuit board when the assembly error exists.

Optionally, the heat generating chip is vertically soldered on the circuit board.

Optionally, the circuit board is fixed on the bottom wall of the housing, and the fixing frame and the housing are of an integrated structure.

In order to achieve another object, the present invention further provides an assembling method of the vehicle-mounted navigation host, including:

welding the heating chip on the circuit board;

placing the circuit board in the shell, and enabling the heating chip to enter the chip accommodating cavity;

fixedly mounting the circuit board in the housing;

the fixing support is fixed on the radiating fin through the fixing component, and then the heating chip is clamped in the chip accommodating cavity.

Compared with the prior art, in the assembling method of the vehicle-mounted navigation host, the fixing support is fixed on the radiating fin by the fixing component of the heating chip fixing structure of the vehicle-mounted navigation host, the chip accommodating cavity is formed between the fixing support and the radiating fin, the heating chip is clamped in the chip accommodating cavity by the fixing support and the radiating fin, the rear side of the heating chip is attached to the radiating fin, the distance between the two transverse ends of the chip accommodating cavity is greater than the length of the corresponding position of the heating chip, a certain space is reserved, so that accurate alignment is not needed when the heating chip is installed, and the problem that the fixing support is difficult to fix on the radiating fin when an assembling error is caused can be avoided. Therefore, in the assembling method of the vehicle-mounted navigation host, even if the assembling error of the heating chip exists, the fixing support can be fixed on the radiating fin, so that the rear side of the heating chip is attached to the radiating fin, the radiating effect of the heating chip is good, the fixing support is fixed on the radiating fin and is not fixed with the circuit board, and the circuit board can be prevented from being scratched, and the pins of the heating chip can be prevented from being damaged due to the fact that the fixing support is fixed on the circuit board when the assembling error exists.

Drawings

Fig. 1 is a schematic structural view of a fixing structure of a heat-generating chip according to an embodiment of the present invention.

Fig. 2 is an exploded view of a fixing structure of a heat generating chip according to an embodiment of the present invention.

Fig. 3 is an enlarged schematic view of a portion a in fig. 1.

Fig. 4 is a schematic structural diagram of a fixing bracket according to an embodiment of the invention.

Fig. 5 is a schematic view of another view angle of the fixing structure of the heat-generating chip according to the embodiment of the invention.

Detailed Description

In order to explain technical contents, structural features, and effects of the present invention in detail, the following detailed description is given with reference to the embodiments and the accompanying drawings.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and thus should not be construed as limiting the contents of the present invention.

Referring to fig. 1 to 5, the present invention discloses a vehicle-mounted navigation host (not shown), which includes a housing 3, a circuit board 2 disposed in the housing 3, and a heating chip fixing structure 1, wherein a chip soldering position of the circuit board 2 is soldered with a heating chip 40, the chip soldering position is accommodated in a chip accommodating cavity 50 of the heating chip fixing structure 1, and the heating chip 40 is attached to a heat sink 11 through the heating chip fixing structure 1 to dissipate heat of the heating chip 40, so as to prevent an internal temperature of the vehicle-mounted navigation host from being too high.

In the present invention, the heat generating chip 40 is vertically soldered on the circuit board 2, and the heat generating chip 40 can be any chip element with a large heat value on the circuit board 2. Of course, the vehicle-mounted navigation host of the present invention does not limit the number of the heating chip fixing structures 1, and may only set one heating chip fixing structure 1 corresponding to the power amplifier chip with a large heating value, or may set one heating chip fixing structure 1 corresponding to each chip element with a large heating value if a plurality of chips with a large heating value are welded in the circuit board. In this embodiment, the heating chip 40 is an audio power amplifier chip.

Referring to fig. 1 to 5, a heat-generating chip fixing structure 1 includes a fixing frame 10 and a fixing bracket 20, the fixing frame 10 includes a heat sink 11, a chip mounting region is disposed on the fixing bracket 20, fixing components which are matched with each other are formed between both lateral ends of the chip mounting region and the heat sink 11 of the fixing bracket 20, the fixing components fix the fixing bracket 20 on the heat sink 11, a chip accommodating cavity 50 for accommodating a heat-generating chip 40 is formed between the fixing bracket 20 and the heat sink 11, the heat-generating chip 40 is held in the chip accommodating cavity 50 by the fixing bracket 20 and the heat sink 11, and the rear side of the heat-generating chip 40 is attached to the heat sink 11, and the distance between both lateral ends of the chip accommodating cavity 50 is greater than the length of the heat-generating chip 40 at the corresponding position.

In the heating chip fixing structure 1 of the invention, the fixing component fixes the fixing support 20 on the radiating fin 11, the chip accommodating cavity 50 is formed between the fixing support 20 and the radiating fin 11, the heating chip 40 is clamped in the chip accommodating cavity 50 by the fixing support 20 and the radiating fin 11, the rear side of the heating chip 40 is attached to the radiating fin 11, the distance between the two transverse ends of the chip accommodating cavity 50 is greater than the length of the corresponding position of the heating chip 40, so that the heating chip 40 is not required to be accurately aligned when being installed, and the fixing support 20 can be prevented from being difficult to be fixed on the radiating fin 11 when assembling errors. Therefore, in the heating chip fixing structure 1 of the present invention, even if the heating chip 40 is assembled with an error, the fixing bracket 20 can be fixed on the heat sink 11, so that the rear side of the heating chip 40 is attached to the heat sink 11, and the heat dissipation effect of the heating chip 40 is good; the fixing bracket 20 fixed to the heat sink 11 without being fixed to the circuit board 2 can also prevent the circuit board 2 from being scratched and the pins of the heat generating chip 40 from being damaged by the fixing bracket 20 being fixed to the circuit board 2 when an error is made in assembly.

In this embodiment, the main portion of the fixing bracket 20 abutting against the heating chip 40 is a plate that is not easily deformed, such as a metal sheet or a plastic sheet with a certain thickness. In this embodiment, the fixing bracket 20 includes a main body and a reinforcing edge formed by bending the four sides of the main body outwards or inwards, the reinforcing edge includes a first reinforcing edge formed by bending the lower side of the main body outwards or inwards, a second reinforcing edge formed by bending the two lateral sides of the main body outwards or inwards, and a folded edge 23 formed by bending the upper side of the main body outwards or inwards, the first reinforcing edge, the second reinforcing edge, and the folded edge 23 are formed around the main body to prevent the main body from deforming when colliding with the heat generating chip 40. In this embodiment, a side of the main body of the fixing bracket 20 adjacent to the heat generating chip 40 is a flat abutting surface. Specifically, the fixing bracket 20 is a flat plate. The reinforcing edges on the upper side and the lower side of the main body part are opposite to the bending direction of the reinforcing edges on the transverse sides of the main body part.

The distance between the two lateral ends of the chip accommodating cavity 50 is greater than the length of the corresponding position of the heat generating chip 40 by a preset value, for example, the preset value is preferably 1mm to 3mm, and in this embodiment, the preset value is 2 mm.

In some embodiments, the fixing assembly includes a first mounting hole 31 formed on the fixing bracket 20, a second mounting hole 32 formed on the heat sink 11 and corresponding to the first mounting hole 31, and a fixing screw 30, the fixing bracket 20 has first mounting holes 31 formed at both ends thereof, the heat sink 11 has second mounting holes 32 formed therein corresponding to the first mounting holes 31, and the fixing screw 30 fixes the fixing bracket 20 to the heat sink 11 through the first mounting holes 31 and the second mounting holes 32. Of course, the fixing component is not limited to this embodiment, and other fixing structures with adjustable fixing dimensions may also be provided, such as mutually engageable protruding members or engaging grooves, and the engaging grooves are provided with a plurality of adjustable engaging grooves along the direction of the fixing bracket 20 holding the heat-generating chip, and the protruding members may extend into the engaging grooves and engage with any adjustable engaging groove in the engaging grooves. Wherein, the rear side of the fixing bracket 20 is convexly provided with a boss surrounding the first mounting hole 31 to prevent the peripheral deformation of the first mounting hole 31 when the fixing screw 30 is fixed, and increase the length of the thread in the first mounting hole 31, and increase the fixing stability of the first mounting hole 31 and the fixing screw 30.

In some embodiments, the securing assembly defines lateral sides of the chip-receiving cavity 50. For example, the first mounting holes 31 at the two ends of the fixing bracket and the second mounting holes 32 at the two ends of the heat sink 11 form the limits of the two lateral sides of the chip-accommodating chamber 50.

Specifically, referring to fig. 2, the distance H between the first mounting holes 31 at the two ends of the fixing bracket 20 and the second mounting holes 32 at the two ends of the heat sink 11 is greater than the distance S between the left ear and the right ear of the heat-generating chip 40, so that the fixing screws 30 do not fasten the heat-generating chip 40, and the fixing bracket 20 is not difficult to be fixed on the heat sink 11 due to the dislocation of the first mounting holes 31 and the second mounting holes 32 caused by the position limitation of the circuit board 2. Of course, the structure of the heat generating chip 40 of the present invention is not limited to the specific structure of fig. 2, and therefore, the distance between the first mounting hole 31 and the second mounting hole 32 of the present invention is not limited to be larger than the distance between the left ear and the right ear of the heat generating chip 40, and may be set according to the specific structure of the heat generating chip 40.

In some embodiments, referring to fig. 1, 3 and 4, the fixing frame 10 further includes a blocking wall 12, and the blocking wall 12 is disposed opposite to the heat sink 11 at a certain distance. The fixing bracket 20 includes a fixing body 21, at least two elastic arms 22 are convexly disposed on the front side of the fixing body 21 away from the heat-generating chip 40, and when the fixing bracket 20 is connected to the fixing frame 10, the elastic arms 22 abut against the abutting wall 12 and provide a forward elastic force to the abutting wall 12, so that the rear side of the heat-generating chip 40 is tightly attached to the heat sink 11. In the present embodiment, the elastic arm 22 provides a forward elastic force to the blocking wall 12, so that the blocking wall 12 generates a backward pushing force to the fixing bracket 20, so that the rear side of the heat generating chip 40 can be tightly attached to the heat sink 11, and the heat dissipation effect of the heat generating chip 40 is further improved.

Further, the fixed frame 10 is provided with two abutting walls 12, the two abutting walls 12 are arranged along the transverse direction at intervals, and the elastic arms 22 are arranged corresponding to the abutting walls 12 and abut against the abutting walls 12 respectively. In the present embodiment, during assembly, the chip soldering position on the circuit board 2 can enter the chip accommodating cavity 50 from the gap between the two blocking walls 12, so that the heat generating chip 40 enters the chip accommodating cavity 50, thereby facilitating the assembly of the heat generating chip fixing structure 1.

Further, the abutting walls 12 are straight walls and parallel to the heat sink 11, and an opening is formed between two abutting walls 12 arranged at an interval. Specifically, the opening penetrates upward from the bottom wall of the housing 3, so that the chip bonding position of the circuit board 2 extends into the chip accommodating cavity 50 from top to bottom. In this embodiment, the two blocking walls 12 parallel to the heat sink 11 can make the stress directions of the fixing brackets 20 consistent, so that the heat generating chip 40 is attached to the heat sink 11 more stably. Of course, the resisting wall 12 of the present invention is not limited to the above specific structure, and may be disposed at a certain angle with respect to the heat sink 11, or disposed corresponding to the shape of the elastic arm 22, which is not limited by the present invention.

In this embodiment, the blocking wall 12 is a straight wall, but the blocking wall 12 may also be a concave arc wall to prevent the fixing bracket 20 from sliding off and shifting during assembly.

The number of the blocking walls 12 is not limited, and only one blocking wall 12 may be provided, and a space for the chip bonding site of the circuit board 2 to enter the chip accommodating cavity 50 is reserved between the blocking wall 12 and the bottom wall of the housing 3, as long as the elastic arm 22 is abutted to enable the rear side of the heat generating chip 40 to be tightly attached to the heat sink 11.

In some embodiments, as shown in fig. 3 and 5, the fixing frame 10 further includes a first connecting wall 13 and a second connecting wall 14, the first connecting wall 13 and the second connecting wall 14 are formed by bending and extending the two transverse ends of the heat sink 11 forward, and the front side edges of the first connecting wall 13 and the second connecting wall 14 are respectively connected with the resisting wall 12. In this embodiment, the first connecting wall 13 and the second connecting wall 14 are provided to connect the heat sink 11 and the blocking wall 12, so that the structure of the fixing frame 10 can be more stable and reliable. Of course, the fixing frame 10 of the present invention may be provided with other structures to make the structure of the fixing frame 10 more stable and reliable.

Specifically, the first connecting wall 13 and the second connecting wall 14 may connect both ends of the same abutment wall 12, respectively, or may connect both abutment walls 12, respectively.

In some embodiments, referring to fig. 3 and 4, the elastic arm 22 includes a connecting end 220 and an elastic portion 221 capable of generating elastic deformation, the connecting end 220 connects the fixing body 21 and the elastic portion 221, and the elastic portion 221 is bent into an arc shape and forms a convex arc surface facing and abutting against the abutting wall 12. The convex arc surface formed by the elastic portion 221 abuts against the retaining wall 12 to elastically deform the elastic portion 221, so as to provide a forward elastic force to the retaining wall 12, and further to generate a backward pushing force to the fixing bracket 20 by the retaining wall 12, so that the rear side of the heat generating chip 40 can be tightly attached to the heat sink 11.

Further, as shown in fig. 4, the elastic arm 22 further includes a free end 222, an end of the elastic portion 221 away from the connecting end 220 is the free end 222, and the free end 222 extends toward a direction opposite to the connecting end 220. The free end 222 of the elastic portion 221 extends in a direction opposite to the connecting end 220, so that the elastic arm 22 is of a non-closed structure, which can increase the amount of deformation of the elastic portion 221, and further, the elastic portion 221 provides a greater elastic force to the retaining wall 12, so that the heat sink 11 and the heat generating chip 40 are attached more tightly.

In other embodiments, the elastic arm 22 may be provided as a closed structure, and both ends of the elastic portion 221 are connected to the fixing body 21 through the connecting end 220.

Of course, the elastic arm 22 of the present invention is not limited to the above-described specific structure, and may abut against the abutting wall 12 and provide a forward elastic force to the abutting wall 12.

Specifically, as shown in fig. 4, the four elastic arms 22 are protruded from the front side of the fixing body 21 and symmetrically distributed at four corners of the fixing body 21, so that the fixing body 21 is stressed in a balanced manner, thereby better fixing the heat generating chip 40. Of course, the present invention is not limited to the number of resilient arms 22.

More specifically, in the embodiment, as shown in fig. 3, the elastic arms 22 at the two longitudinal ends of the fixing body 21 are bent pieces bent in opposite directions, wherein the free ends 222 of the two elastic arms 22 at the upper end of the fixing body 21 extend upward, and the free ends 222 of the two elastic arms 22 at the lower end of the fixing body 21 extend downward.

In some embodiments, as shown in fig. 2 to 3, the upper end of the fixing bracket 20 is bent away from the heat sink 11 to form a foldable edge 23 that can be held by hand, that is, the upper end of the fixing bracket 20 is bent toward the side of the circuit board 2 to form the foldable edge 23, and by means of the foldable edge 23, the fixing bracket 20 can be held by hand during assembly, which facilitates the assembly of the fixing bracket 20.

Of course, the heat generating chip fixing structure 1 of the present invention is not limited to be disposed on a car navigation host, and is also applicable to other electronic devices requiring heat dissipation of the heat generating chip 40.

In some embodiments, as shown in fig. 1 and fig. 3, the circuit board 2 is provided with a clearance structure 60 corresponding to the fixing frame 10, the clearance structure 60 is formed at two ends of a chip soldering position of the circuit board 2, the chip soldering position of the circuit board 2 extends into the chip accommodating cavity 50 from an opening of the fixing frame 10, the first connecting wall 13 and the blocking wall 12 connected thereto are provided in one clearance structure 60, and the second connecting wall 14 and the blocking wall 12 connected thereto are provided in the other clearance structure 60, so as to prevent the free ends 222 of the two elastic arms 22 at the lower end of the fixing body 21 from contacting the circuit board 2 and scratching the circuit board 2 when moving downward.

In some embodiments, the fixing frame 10 is integrated with the housing 3, and the circuit board 2 is fixed on the bottom wall of the housing 3. In this embodiment, the fixing frame 10 and the housing 3 are integrated, so that the assembly is convenient, and the heat generated by the heating chip 40 can be quickly guided to the housing 3, and then the heat is conducted to the external environment through the housing 3 with a large surface area, so that the heat dissipation effect of the heating chip 40 can be further improved.

Specifically, the heat sink 11 of the fixing frame 10 is fixedly connected to or integrally formed with the housing 3, the blocking wall 12, the first connecting wall 13, and the second connecting wall 14 of the fixing frame 10 are fixedly connected to or integrally formed with the bottom wall of the housing 3, and the blocking wall 12, the first connecting wall 13, and the second connecting wall 14 extend upward from the bottom wall of the housing 3.

In some embodiments, as shown in fig. 5, four screw holes 70 are correspondingly formed at four corners of the bottom wall of the housing 3 and the circuit board 2, and housing screws (not shown) are respectively locked in the screw holes 70 of the bottom wall of the housing 3 and the circuit board 2 to fix the circuit board 2 on the bottom wall of the housing 3.

In summary, in the car navigation host of the present invention, the fixing component of the heat-generating chip fixing structure 1 fixes the fixing bracket 20 to the heat sink 11, a chip accommodating cavity 50 is formed between the fixing bracket 20 and the heat sink 11, the heat-generating chip 40 is clamped in the chip accommodating cavity 50 by the fixing bracket 20 and the heat sink 11, and the rear side of the heat-generating chip 40 is attached to the heat sink 11, the distance between the two transverse ends of the chip accommodating cavity 50 (the distance between the first screw holes 31 disposed at the two ends of the chip mounting region of the fixing bracket 20) is greater than the length of the corresponding position of the heat-generating chip 40, so that precise alignment is not required when the heat-generating chip 40 is mounted, and it is possible to avoid that the fixing bracket 20 is difficult to be fixed to the heat sink 11 when an assembly error occurs. Therefore, in the car navigation host of the present invention, even if the assembly error of the heat-generating chip 40 occurs, the fixing bracket 20 can be fixed on the heat sink 11, so that the rear side of the heat-generating chip 40 is attached to the heat sink 11, and the heat-generating chip has a good heat dissipation effect, and the fixing bracket 20 is fixed on the heat sink 11 without being fixed to the circuit board 2, so that the damage to the circuit board 2 and the damage to the pins of the heat-generating chip 40 due to the fixing bracket 20 being fixed on the circuit board 2 during the assembly error can be avoided.

The invention also discloses an assembly method of the vehicle-mounted navigation host, which comprises the following steps:

(1) the heat generating chip 40 is soldered to the chip soldering site of the circuit board 2.

(2) The circuit board 2 is placed in the housing 3, and the heat-generating chip 40 enters the chip accommodating cavity 50.

(3) The circuit board 2 is fixedly mounted in the housing 3. In this embodiment, screws pass through the screw holes 70 at the four corners of the circuit board 2 to fix the circuit board 2 on the housing 3.

(4) The fixing bracket 20 is fixed on the heat sink 11 by the fixing component, so as to clamp the heat-generating chip 40 in the chip accommodating cavity 50.

Specifically, the method for assembling the vehicle-mounted navigation host comprises the following steps: welding the heating chip 40 on the chip welding position of the circuit board 2, placing the circuit board 2 in the shell 3, and then enabling the heating chip 40 to enter the fixed frame 10; the circuit board 2 is fixed to the bottom wall of the housing 3 by screws. The fixing bracket 20 is inserted between the blocking wall 12 and the front side of the heat generating chip 40 from above, and at this time, the elastic arm 22 is elastically supported between the blocking wall 12 and the fixing body 21 of the fixing bracket 20, and provides a pushing force against the front side of the heat generating chip 40 to the fixing body 21, so as to clamp the heat generating chip 40 between the fixing body 21 and the heat sink 11. The first mounting hole 31 and the second mounting hole 32 are aligned, the first mounting hole 31 and the second mounting hole 32 are located on two opposite lateral outer sides of the heat-generating chip 40, the fixing screw 30 sequentially penetrates through the second mounting hole 32 and the first mounting hole 31 which are opposite in position, the fixing screw 30 is fastened on the first mounting hole 31, a chip accommodating cavity 50 for fixing the heat-generating chip 40 is formed between the fixing support 20 and the heat sink 11, and the heat-generating chip 40 is positioned by the fixing screw 30, and the rear side of the heat-generating chip 40 is ensured to be tightly attached to the heat sink 11 under the elastic force of the elastic arm 22 to the heat-generating chip 40. The elastic arm 22 not only pre-positions and aligns the fixing bracket 20 before the fixing screw 30 is fixed during assembly, thereby facilitating screw fixation, but also further ensuring the mounting stability of the heating chip 40 during use, and preventing the mounting stability of the heating chip 40 from being affected by the looseness of the fixing screw 30.

The above disclosure is only a preferred embodiment of the present invention, which is convenient for those skilled in the art to understand and implement, and certainly not to limit the scope of the present invention, therefore, the present invention is equally applicable to other embodiments, which are equivalent to the scope of the present invention.

Claims (14)

1. The utility model provides a chip fixed knot that generates heat constructs for to welding the chip that generates heat on the circuit board fixes, its characterized in that includes:

a fixed frame including a heat sink;

the fixed bolster, the last chip fixing area that has of fixed bolster, the fixed bolster in the horizontal both ends of chip fixing area with be formed with the fixed subassembly of mutually supporting between the fin, fixed subassembly will the fixed bolster is fixed in on the fin, and the fixed bolster with form between the fin and hold the chip holding chamber of the chip that generates heat, the chip quilt that generates heat the fixed bolster with the fin centre gripping in the chip holding chamber and make the rear side of the chip that generates heat with the fin laminating, fixed subassembly forms the limit of the horizontal both sides in chip holding chamber, the interval at the horizontal both ends in chip holding chamber is greater than the length that the chip that generates heat corresponds the position so that the chip that generates heat has movable space in the chip holding chamber.

2. A heat-generating chip fixing structure as claimed in claim 1, wherein the fixing member includes a first mounting hole provided in the fixing bracket, a second mounting hole provided in the heat sink and corresponding to the first mounting hole, and a fixing screw, the first mounting hole is provided at each of two ends of the fixing bracket, the second mounting hole is provided in the heat sink corresponding to the first mounting hole, and the fixing screw fixes the fixing bracket to the heat sink through the first mounting hole and the second mounting hole.

3. A heat-generating chip fixing structure according to claim 1, wherein the fixing frame further includes a stopper wall disposed opposite to the heat sink at a distance;

the fixing support comprises a fixing body, at least two elastic arms are convexly arranged on the front side of the fixing body far away from the heating chip, and when the fixing support is connected with the fixing frame, the elastic arms are abutted against the retaining wall and provide forward elastic force for the retaining wall so that the rear side of the heating chip is tightly attached to the radiating fin.

4. A heat-generating chip fixing structure as recited in claim 3, wherein said fixing frame is provided with two said abutment walls, said two abutment walls are arranged at a spacing in a lateral direction, and said elastic arms are arranged corresponding to said abutment walls and abut against said abutment walls, respectively.

5. A heat-generating chip fixing structure according to claim 4, wherein the abutting walls are straight walls and parallel to the heat sink, and an opening is formed between two of the abutting walls arranged at an interval.

6. A heat-generating chip fixing structure as claimed in claim 4, wherein the fixing frame further includes a first connecting wall and a second connecting wall, the first connecting wall and the second connecting wall are formed by bending and extending the two transverse ends of the heat sink forward, and the front side edges of the first connecting wall and the second connecting wall are respectively connected to the blocking wall.

7. The heating chip fixing structure according to claim 4, wherein the elastic arm includes a connection end and an elastic portion capable of generating elastic deformation, the connection end connects the fixing body and the elastic portion, the elastic portion is bent into an arc shape and forms a convex arc surface, and the convex arc surface faces and abuts against the abutment wall.

8. A heat-generating chip fixing structure according to claim 7, wherein the elastic arm further includes a free end, an end of the elastic portion remote from the connection end being the free end, the free end extending in a direction opposite to the connection end.

9. A heat-generating chip fixing structure as claimed in claim 1, wherein the upper end of the fixing bracket is bent in a direction away from the chip accommodating cavity to form a foldable edge that can be held by hand.

10. A heat generating chip fixing structure as defined in claim 1, wherein the fixing bracket includes a main body portion and a reinforcing portion formed by bending the four sides of the main body portion outwardly or inwardly, one side of the main body portion adjacent to the heat generating chip is a flat contact surface, and the chip mounting region is formed on the contact surface.

11. A vehicle navigation host, comprising:

a housing;

the circuit board is arranged in the shell, and a heating chip is welded on a chip welding position of the circuit board;

a heat-generating chip fixing structure as recited in any one of claims 1 to 10.

12. The vehicle-mounted navigation host according to claim 11, wherein the heat-generating chip is vertically soldered on the circuit board.

13. The host vehicle of claim 11, wherein the circuit board is fixed to a bottom wall of the housing, and the fixing frame and the housing are integrated.

14. A method for assembling a car navigation host according to claim 11, comprising:

welding the heating chip on a chip welding position of the circuit board;

placing the circuit board in the shell, and enabling the heating chip to enter the chip accommodating cavity along with the circuit board;

fixedly mounting the circuit board in the housing;

the fixing support is fixed on the radiating fin through the fixing component, and then the heating chip is clamped in the chip accommodating cavity.

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