JP2022109662A - board module - Google Patents

Abstract

To provide a board module which radiates, via a heat radiator, heat generated by a heating component, and is capable of improving working efficiency and heat radiation efficiency.SOLUTION: A board module 100 includes: a positioning holder 40 which holds a semiconductor element 30 while exposing a heat radiating face of the semiconductor element 30; a projection 41 which positions the positioning holder 40 to a rear face 20B side of a board 20; a press metal fitting 70 which is accommodated in the positioning holder 40, and presses the semiconductor element 30 toward a heat radiator 200 side; a through hole 25 which penetrates through front and rear faces of the board 20; a through hole 45 formed in the positioning holder 40 and which communicates with the through hole 25; and a fixing screw 90 which is coupled to the heat radiator 200 from a front face 20A side of the board 20 via the through hole 25 and the through hole 45. The press metal fixture 70 presses the semiconductor element 30 held by the positioning holder 40 to the heat radiator 200 by being coupled to the heat radiator 200 with the fixing screw 90.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a board module, and more particularly to a board module on which a heat-generating component such as a power semiconductor element is mounted.

2. Description of the Related Art Conventionally, when using a photovoltaic power generation system or a household fuel cell, there is a power conditioner that converts the generated electricity so that it can be used in a household environment. In power converters such as power conditioners of this type, it is required to efficiently dissipate heat generated by semiconductor elements used for power conversion to a radiator.

In order to improve the efficiency of heat radiation, a structure has been proposed in which a semiconductor element is directly fixed to a heat sink. (See Patent Document 1).

Also, a configuration has been proposed in which a semiconductor element is sandwiched between substrates in advance by flat heat sinks and then attached to a heat sink (see Patent Document 2).

JP 2013-243264 A Japanese Patent Application Laid-Open No. 2015-228400

However, in the configuration described in Patent Document 1, after fixing the semiconductor element to the heat sink, it is necessary to mount the substrate from above the semiconductor element in alignment with the position of the semiconductor element and solder it, which makes the positioning and soldering operations difficult. I had a problem.

In addition, as in Patent Document 2, in a configuration in which a semiconductor element is sandwiched on a substrate in advance by a flat heat sink and then attached to a heat sink, a flat heat sink separate from the heat sink is used, and the semiconductor element There is a problem that heat radiation efficiency deteriorates because thermal resistance is generated between the heat sink and the heat sink.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a substrate module that can be mounted on a heat radiator and that can improve work efficiency and heat radiation efficiency.

A substrate module according to the present invention is a substrate module in which a heat-generating component is mounted on the back side of a substrate and heat generated from the heat-generating component is dissipated through a radiator, and the heat-radiating surface of the heat-generating component is exposed and held. a positioning member that positions the positioning member on the back side of the substrate; a pressing member that is housed in the positioning member and presses the heat-generating component toward the radiator; a first through portion; a second through portion provided in the positioning member and communicating with the first through portion; a fastening member that is fastened to the radiator from the surface side, and the pressing member is fastened to the radiator by the fastening member so that the heat-dissipating surface of the heat-generating component held by the positioning member is pressed against the It is characterized by being pressed toward a radiator.

According to this configuration, after the heat-generating component held by the positioning member is mounted on the back side of the board, the fastening member is fastened to the radiator from the front side of the board via the first and second penetrating portions. Since the heat sink can be attached to the rear surface side of the substrate, the work efficiency can be improved. Further, by pressing the heat radiating surface of the heat generating component toward the radiator using the pressing member housed in the positioning member, heat radiation efficiency can be improved.

Further, the substrate module of the present invention is characterized in that, in the configuration described above, a fixing member is provided for fixing the positioning member holding the heat-generating component to the back surface side of the substrate.

According to this configuration, the soldering work or the like can be easily performed while the heat-generating component is positioned by the positioning member.

Further, in the substrate module of the present invention, the positioning member and the fixing member are integrated so that the positioning member functions as the fixing member.

With this configuration, the number of parts can be reduced as compared with the case where the positioning member and the holding member are separate members.

According to the present invention, it is possible to realize a substrate module that radiates heat generated from a heat-generating component via a radiator, which can improve work efficiency and heat radiation efficiency.

FIG. 4 is an exploded perspective view for explaining a step of mounting a semiconductor element using the board module according to the first embodiment of the present invention; 1 is an exploded perspective view for explaining a substrate module according to a first embodiment of the invention; FIG. 1 is a perspective view showing the configuration of a board module according to a first embodiment of the present invention; FIG. FIG. 4 is a cross-sectional view for explaining a method of attaching the board module to the radiator according to the first embodiment of the present invention; 1 is a perspective view showing a substrate module according to a first embodiment of the invention; FIG. 1 is a perspective view showing a substrate module according to a first embodiment of the invention; FIG. FIG. 10 is an exploded perspective view for explaining a step of mounting a semiconductor element using the board module according to the second embodiment of the present invention; FIG. 11 is a perspective view showing a positioning holder used in the board module according to the second embodiment of the present invention; FIG. 10 is a cross-sectional view for explaining a method of attaching the board module to the radiator according to the second embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings.
(First embodiment)
As shown in FIGS. 1 and 2, the board module 100 mounted with the power semiconductor element (semiconductor element 30) according to the present embodiment is directed toward a main radiator 200 arranged on the rear surface of the power conditioner housing (not shown). The heat dissipation surface of the semiconductor element 30, which is a heat-generating component, is pressed, and the semiconductor element 30 is brought into uniform contact with the main heat radiator 200 via a heat transfer sheet as necessary, thereby increasing heat generation efficiency. It is.

In this board module 100, a manufacturing method in which the semiconductor element 30 is mounted on the board 20 and then assembled to the main heat radiator 200 can be adopted. As a result, work efficiency can be improved. In order to realize such a manufacturing method, in the substrate module 100 of the present embodiment, the positioning holder 40 functioning as the "positioning member" of the present invention and the hook holder 50 functioning as the "fixing member" of the present invention are used. It is configured to fix the semiconductor element 30 to the mounting position of the substrate 20 .

The board module 100 will be described in detail below.
As shown in FIG. 1, the board module 100 is positioned by a board 20 such as a printed board, a positioning holder 40 for positioning a semiconductor element 30 at a mounting position on the rear surface 20B of the board 20, and a positioning holder 40. and a holder 50 with hooks for holding the leads 31 of the semiconductor element 30 inserted into the insertion holes 21 of the substrate 20 .

The semiconductor element 30 has leads 31 that are bent at 90 degrees, and the leads 31 are inserted into the insertion holes 21 from the back surface 20B of the substrate 20 and soldered to attach the semiconductor element 30 to the back surface 20B of the substrate 20. is set to run.

As described above, the mounting position of the semiconductor element 30 on the substrate 20 is a position where the leads 31 can be inserted into the insertion holes 21, and accurate positioning accuracy is required. position horizontally and vertically.

Specifically, the positioning holder 40 is provided with two protrusions 41 (corresponding to the "positioning portion" of the present invention) on a substrate contact surface 43 that contacts the back surface 20B of the substrate 20. By inserting the protrusion into the positioning hole 23 of the substrate 20, the horizontal positioning of the positioning holder 40 (positioning on the back surface 20B of the substrate 20) can be performed. The materials of the positioning holder 40 and the holder 50 with hooks (described later) include PPS (polyphenylene sulfide: high-performance engineering plastic (glass-filled) thermoplastic resin called super engineering plastic), high heat-resistant PA (glass-filled heat-resistant nylon ) and highly heat-resistant PC (glass-filled polycarbonate) are used.

In addition, as shown in FIG. 2, a recessed holding portion 42 opening toward the main radiator 200 is provided on the back side of the substrate contact surface 43 of the positioning holder 40 (that is, on the side of the main radiator 200). The package portion 32 of the semiconductor element 30 can be inserted into the holding portion 42 and held with the surface (heat radiation surface) of the package portion 32 exposed. When the semiconductor element 30 is housed in the holding portion 42 , a pressing metal fitting 70 (described later) is inserted between the package portion 32 of the semiconductor element 30 and the holding portion 42 with an insulating sheet 80 interposed therebetween.

The leads 31 of the semiconductor element 30 held by the holding portion 42 are pulled out to the side of the positioning holder 40 from the side edge cutout portions 44 of the holding portion 42 , and their 90° bent tip portions are attached to the substrate 20 . It is designed to be inserted into the insertion hole 21 .

With the semiconductor element 30 held in the holding portion 42 of the positioning holder 40, the projections 41 of the positioning holder 40 are inserted into the positioning holes 23 of the substrate 20 while the tips of the leads 31 are inserted into the insertion holes 21 of the substrate 20. Thus, the positioning holder 40 is positioned at a predetermined position on the rear surface 20B of the substrate 20. As shown in FIG.

As shown in FIG. 2, the positioning holder 40 is positioned on the back surface 20B of the substrate 20, and the holder 50 with the hook is attached to the substrate 20 with the pressing metal fitting 70, the insulating sheet 80 and the semiconductor element 30 placed on the holding portion 42. By attaching it to the rear surface 20B side of the substrate, it is possible to temporarily hold the positioning holder 40 having the presser fitting 70, the insulating sheet 80 and the semiconductor element 30 therein.

Specifically, the hooked holder 50 includes a ladder-shaped main body 51, mounting legs 54 projecting from the main body 51 toward the substrate 20 to be mounted, and hooks 55 provided at the ends of the mounting legs 54. and The body portion 51 also includes two parallel struts 52 and horizontal beams 53A, 53B, 53C and 53D that span between the struts 52 .

In a state in which the positioning holder 40 having the presser fitting 70, the insulating sheet 80, and the semiconductor element 30 placed inside is positioned on the substrate 20, the holder 50 with hooks is placed so as to cover the positioning holder 40, and its mounting legs 54 are attached to the substrate. By inserting it into the mounting hole 22 of 20, the holder 50 with the hook can be fixed to the substrate 20 with the positioning holder 40 sandwiched therebetween, as shown in FIG.

In this state, the lateral beams 53A and 53D of the holder 50 with hooks press the root portions of the leads 31 of the semiconductor element 30 toward the substrate 20, thereby preventing the leads 31 inserted into the insertion holes 21 of the substrate 20 from floating. can do.

In this way, the leads 31 of the semiconductor element 30 inserted into the insertion holes 21 of the substrate 20 are positioned and held at predetermined positions on the back surface 20B of the substrate 20 by the holder 40 for positioning and the holder 50 with hooks. is soldered to the substrate 20, the substrate module 100 (FIG. 3) is completed.

The hooked holder 50 has a first opening 56A surrounded by the support 52 and cross beams 53A and 53B, a second opening 56B surrounded by the support 52 and cross beams 53B and 53C, and a support 52 and cross beams. A third opening 56C surrounded by 53C and 53D is provided. The package portions 32 of the semiconductor elements 30 are exposed respectively. Also, the presser fitting 70 in the positioning holder 40 is exposed through the second opening 56B.

Such a board module 100 is attached to the main radiator 200 . A structure for attaching the substrate module 100 to the main radiator 200 will be described below.

The presser fitting 70 held in the positioning holder 40 is formed by bending a strip-shaped metal plate, and is a flat plate that contacts the main radiator 200 via the heat transfer sheet 60 (FIG. 1). abutting portion 71, standing portions 73 standing from both sides of the abutting portion 71, and pressing portions 74 extending left and right from the tip of the standing portion 73 at a predetermined angle. The tip of the pressing portion 74 contacts the package portion 32 of the semiconductor element 30 via the insulating sheet 80 .

When the abutting portion 71 is screwed to the main radiator 200 with a fixing screw 90 (corresponding to the “fastening member” of the present invention), the pressing portion 74 acts like a leaf spring due to the elasticity of the metal plate, The package portion 32 of the semiconductor element 30 is pressed against the main heat radiator 200 by the . Thus, in this embodiment, the presser fitting 70 functions as the "pressing member" of the present invention.

Specifically, a through hole 45 is provided in the central portion of the positioning holder 40, and a through hole 25 is also provided at a predetermined position of the substrate 20 corresponding thereto. The pressing metal fitting 70 placed on the positioning holder 40 is held at a position where the pressing portion 74 is positioned by the notch portion 46 ( FIG. 2 ) and the contact portion 71 faces the through holes 45 and 25 . As a result, the screw hole 72 provided in the contact portion 71 of the presser fitting 70 is inserted through the through hole 25 of the substrate 20 and the through hole 45 of the positioning holder 40 communicating with the through hole 25 . It will be exposed on the 20A side. Thus, in this embodiment, the through hole 25 of the substrate 20 corresponds to the "first through portion" of the invention, and the through hole 45 of the positioning holder 40 corresponds to the "second through portion" of the invention. do.

Therefore, when mounting the substrate module 100 to the main heat radiator 200 , the package portion 32 of the semiconductor element 30 held by the positioning holder 40 is brought into contact with the main heat radiator 200 , and the screw hole 202 of the main heat radiator 200 is pressed against the screw hole 202 of the main heat radiator 200 . By aligning the through hole 65 of the heat transfer sheet 60 with the screw hole 72 of the presser fitting 70, the screw hole 202 of the main radiator 200, the through hole 65 of the heat transfer sheet 60, and the screw hole 72 of the presser fitting 70 are aligned. , the through hole 45 of the positioning holder 40 and the through hole 25 of the substrate 20 communicate with each other.

In this state, as shown in FIG. 4(a), the fixing screw 90 is screwed into the screw hole 202 of the main radiator 200 from the surface 20A side of the substrate 20, and further the fixing screw 90 is screwed in the arrow A direction. As shown in FIG. 4(b), the pressing metal fitting 70 can be fastened in a state in which the contact portion 71 is brought into contact with the main radiator 200. As shown in FIG. In this state, the pressing portion 74 of the pressing metal 70 can press the package portion 32 of the semiconductor chip 30 against the main radiator 200 with a force of 100 to 200N due to the biasing force of the spring.

The force with which the holder 50 with hooks holds the semiconductor element 30 and the like is about 1 to 5 N, which allows the hooks 55 to be manually inserted into and removed from the mounting holes 22 of the substrate 20. When the metal fitting 70 is fastened to the main radiator 200, the semiconductor element 30 urged toward the main radiator 200 by the pressing portion 74 simultaneously urges the substrate 20 to which the lead 31 is soldered toward the main radiator 200. However, even in this case, the force with which the hook 55 is inserted into and removed from the mounting hole 25 is much smaller than the pressing force of the pressing portion 74 on the package portion 32, so that the holder 50 with the hook holds the semiconductor element. The holding of the semiconductor element 30 does not interfere with fastening of the semiconductor element 30 to the main radiator 200 by the pressing metal fitting 70 .

After the board module 100 is attached to the main radiator 200 in this manner, the board 20 is screwed to a housing (not shown), thereby completing the attachment to equipment such as a power conditioner.

In the above configuration, the semiconductor element 30 is held by the holder 50 with hooks in a state where the semiconductor element 30 is positioned at the mounting position on the mounting surface (back surface 20B) of the substrate 20 by the positioning holder 40, and the leads 31 of the semiconductor element 30 are held in this state. By soldering to the substrate 20, the substrate module 100 (FIG. 3) on which the semiconductor element 30 is mounted can be manufactured.

In this state, when the back surface 20B side of the substrate 20 on which the semiconductor element 30 is mounted is directed toward the main radiator 200, the package portion 32 serving as the main heat radiation portion of the semiconductor element 30 mounted on the back surface 20B is exposed. .

In this state, the through hole 72 of the presser fitting 70 and the screw hole 202 of the main radiator 200 are aligned. In this case, the fixing screw 90 can be screwed into the screw hole 202 from the surface 20A side of the substrate 20 via the through hole 25 of the substrate 20 . That is, after assembling the board module 100 on which the semiconductor element 30 is mounted, the fixing screw 90 is screwed into the main radiator 200 from the front surface 20A side of the board 20 via the pressing metal fitting 70, and the pressing metal fitting 70 is tightened. , the semiconductor element 30 can be pressed against the main radiator 200 by the biasing force of the spring of the presser fitting 70 .

In this way, after the substrate module 100 is completed, the work of pressing the semiconductor element 30 against the main radiator 200 from the front surface 20A side of the substrate 20 through the through hole 25 formed in the substrate 20 can be performed. Therefore, compared to the conventional configuration in which the leads of the semiconductor element are fixed to the substrate after the semiconductor element is fixed to the heat sink, it is necessary to position the semiconductor element 30 mounted on the back surface 20B from the front surface 20A side of the substrate 20. is eliminated, and workability can be remarkably improved.

In addition, since the semiconductor element 30 can be pressed against the main radiator 200 by the biasing force of the spring of the presser fitting 70, even if the height of the semiconductor element 30 varies, the main radiator can be pressurized with a uniform pressing force. 200, the heat radiation efficiency can be made uniform.

Further, since the semiconductor element 30 can be brought into direct contact with the main radiator 200 via the heat transfer sheet 60, the heat radiation efficiency can be improved, and for example, after the semiconductor element is mounted on the substrate, the main radiator 200 can be mounted. Compared to the conventional configuration in which a flat heat sink separate from the heat sink 200 is placed, the absence of the flat heat sink prevents the occurrence of thermal resistance between the semiconductor element 30 and the main heat sink 200. can be obtained, and the decrease in heat radiation efficiency can be suppressed by this amount.

In addition, when it is necessary to divide the module for repair or the like, the substrate module 100 can be removed from the main radiator 200 simply by removing the fixing screw 90. This eliminates the need for the conventional complicated disassembly process of melting solder. becomes.

In the above-described embodiment, the substrate module 100 in which one positioning holder 40 is attached to the substrate 20 has been described. However, as shown in FIG. be able to. In this case, various elements 110 such as capacitors can be mounted on the surface 20A of the substrate 20 as shown in FIG.

As described above, in the board module 100 having a plurality of positioning holders 40 mounted thereon, the leads 31 of the plurality of semiconductor elements 30 are positioned on the board 20 and soldered. If the substrate 20 is covered after the fixing step, the positioning operation becomes difficult. Since it can be performed before the step of attaching to the body, work efficiency can be significantly improved.

Further, after assembling a substrate module in which various elements 110 (FIG. 6) such as capacitors are mounted on the surface 20A of the substrate 20, it can be attached to the main radiator 200. The post-process of mounting various elements 110 after mounting is no longer necessary, and the working efficiency of the manufacturing process as a whole can be improved.

(Second embodiment)
7 to 11, in which parts corresponding to those in FIGS. 1 to 6 are denoted by the same reference numerals, are diagrams for explaining the board module 300 according to the second embodiment.

The board module 300 according to the second embodiment integrates the positioning holder 40 and the hook holder 50 in the board module 100 according to the first embodiment, and provides a spacer 401 on the main radiator 200. The difference is that the height of the contact portion 71 of the presser fitting 370 is positioned. A threaded hole 202 is formed at the top of the spacer 401 to the extent that the fixing screw 90 is screwed thereon. The hold down fitting 370 of the second embodiment has a different shape than the hold down fitting 70 of the first embodiment to accommodate these configurations. Specifically, the presser fitting 370 has a contact portion that receives the fixing screw 90 and that contacts the spacer 401 provided on the main radiator 200 by screwing the fixing screw 90 into the screw hole 202 of the main radiator 200 . 71 and pressing portions 74 extending from the contact portion 71 to the left and right. The abutting portion 71 is provided with a standing portion 377 that is bent upward. Positioned. As a result, the presser fitting 370 that is only placed in the inner space of the positioning holder 340 and is not fixed to the positioning holder 340 is placed against the substrate 20 with the positioning holder 340 attached to the substrate 20 . Positioned.

As shown in FIGS. 7 and 8, the positioning holder 340 is entirely formed in an annular shape by a frame 342, which is different from the positioning holder 40 of the first embodiment. The through holes 45 provided between the holding portions 42 communicate with each other to form one through portion.

An insulating sheet 380 is provided to maintain electrical insulation between the semiconductor element 30 held by the holding portion 42 and the back surface 20B of the substrate 20 .

The positioning holder 340 is provided with a mounting leg 54 having a hook 55 at the tip thereof. The positioning holder 340 can be attached to the back surface 20B of the substrate 20 by means of.

Positioning of the positioning holder 340 to the substrate 20 is performed by inserting the protrusion 41 of the positioning holder 340 into the positioning hole 23 of the substrate 20 through the through hole 381 of the insulating sheet 380 in the same manner as in the first embodiment. However, in the case of the second embodiment, since the mounting legs 54 are directly provided on the positioning holder 340, the mounting legs 54 are positioned by inserting the mounting legs 54 into the mounting holes 22 of the substrate 20. 41 (and positioning hole 23) can also be omitted. Thus, in the second embodiment, the positioning holder 340 corresponds to the "positioning member" of the invention and also functions as the "fixing member", and the mounting legs 54 and the hooks 55 function as the "positioning part" of the invention. do.

With the insulating sheet 380, the presser fitting 370, the positioning holder 340, and the insulating sheet 80 attached to the back surface 20B of the substrate 20, the semiconductor element 30 is inserted into the holding portion 42 of the positioning holder 340, and the semiconductor element 30 is are inserted into the insertion holes 21 of the substrate 20 and soldered to the substrate 20, the substrate module 300 having the semiconductor element 30 mounted at a predetermined position on the rear surface 20B of the substrate 20 can be completed. .

In this manner, the semiconductor element 30 can be mounted using the positioning holder 340 on the back surface 20B of the substrate 20 before being attached to the main heat radiator 200 .

When the substrate module 300 is attached to the main radiator 200 , the package portion 32 of the semiconductor element 30 , which is positioned by the positioning holder 340 and whose leads 31 are soldered to the substrate 20 , is brought into contact with the main radiator 200 via the heat transfer sheet 60 . By aligning the through hole 65 of the heat transfer sheet 60 and the screw hole 72 of the pressing bracket 370 with the screw hole 202 of the main radiator 200, the screw hole 202 of the main radiator 200 and the heat transfer The through hole 65 of the sheet 60, the screw hole 72 of the presser fitting 370, the through hole 45 of the positioning holder 340, and the through hole 25 of the substrate 20 communicate with each other.

In this state, as shown in FIG. 9A, the fixing screw 90 is screwed into the screw hole 202 of the main radiator 200 from the surface 20A side of the substrate 20, and the fixing screw 90 is further screwed in the direction of arrow A. 9(b), the contact portion 71 of the presser fitting 370 can be fastened in a state of contact with the spacer 401 provided on the main radiator 200. As shown in FIG. In this state, the pressing portion 74 of the pressing metal fitting 370 can press the package portion 32 of the semiconductor chip 30 against the main radiator 200 with a predetermined pressing force due to the biasing force of the spring according to the height H of the spacer 401 . Thus, in this embodiment, the spacer 401 is used, and the semiconductor chip 30 can be pressed against the main radiator 200 with a pressing force corresponding to the height of the spacer 401 .

After the board module 300 is attached to the main radiator 200 in this manner, the board 20 is screwed to a housing (not shown), thereby completing the attachment to equipment such as a power conditioner.

In the above configuration, by attaching the positioning holder 340 to the back surface 20B of the substrate 20, the semiconductor element 30 held by the positioning holder 340 is mounted on the substrate 20, and the substrate module 300 is completed. That is, the substrate module 300 with the semiconductor device 30 mounted thereon can be completed before the substrate module 300 is attached to the main radiator 200 .

In the completed board module 300 , the abutment portion 71 (screw hole 72 ) of the presser fitting 370 is exposed on the front surface 20A side of the board 20 through the through hole 25 of the board 20 . The fixing screw 90 can be inserted from the surface 20A side of the substrate 20 with respect to. Under the abutment portion 71 (screw hole 72), by positioning the screw hole 202 formed in the top portion of the spacer 401 in a communicating state, the main radiator 200 is mounted on the back surface 20B side on which the semiconductor element 30 is mounted. can be installed.

That is, the substrate module 300 with the semiconductor element 30 mounted thereon can be attached to the main radiator 200 from the back surface 20B side on which the semiconductor element 30 is mounted.

A plurality of semiconductor chips 30 positioned on the positioning holder 340 and mounted on the substrate 20 are evenly brought into contact with the main radiator 200 with a predetermined pressing force by the pressing portion 74 of the pressing metal fitting 370 .

As described above, in the substrate module 300 of the present embodiment, after the semiconductor element 30 is mounted on the back surface 20B side of the substrate 20, the substrate module 300 can be attached to the main heat radiator 200, so that the semiconductor element can be mounted on the heat radiator. Compared to the conventional configuration in which the leads of the semiconductor element are fixed to the substrate after being fixed to the substrate, it is no longer necessary to position the semiconductor element 30 mounted on the back surface 20B from the front surface 20A side of the substrate 20, which greatly improves workability. can be improved to

In addition, since the semiconductor element 30 can be pressed against the main radiator 200 by the biasing force of the spring of the presser fitting 370, even if the height of the semiconductor element 30 varies, the main radiator can be pressed with a uniform pressing force. 200, the heat radiation efficiency can be made uniform.

In addition, since the semiconductor element 30 can be brought into direct contact with the main heat radiator 200 via the heat transfer sheet 60, the heat radiation efficiency can be improved, and for example, after the semiconductor element is mounted on the substrate, the main heat radiator is mounted. Compared to the conventional configuration in which a flat heat sink separate from the heat sink 200 is placed, the absence of the flat heat sink prevents the occurrence of thermal resistance between the semiconductor element 30 and the main heat sink 200. can be obtained, and the decrease in heat radiation efficiency can be suppressed by this amount.

In addition, when it is necessary to divide the module for repair or the like, the substrate module 300 can be removed from the main radiator 200 simply by removing the fixing screw 90. This eliminates the need for a conventional complicated disassembly process such as melting solder. becomes.

In the above-described embodiment, the substrate module 300 in which one positioning holder 340 is attached to the substrate 20 has been described. holder can be attached. In this case, various elements 110 such as capacitors can be mounted on the front surface 20A of the substrate 20, as shown in FIG.

Further, after assembling a substrate module in which various elements 110 (FIG. 6) such as capacitors are mounted on the surface 20A of the substrate 20, it can be attached to the main radiator 200. After mounting, the post-process of mounting various elements 110 (FIG. 6) becomes unnecessary, and the working efficiency of the manufacturing process as a whole can be improved.

(Other embodiments)
In the above-described embodiment, the fixing screw 90 is used as a fastening member for fastening the pressing metal fitting 70 to the main radiator 200, but the present invention is not limited to this. Other fastening members can be applied, such as press-fitting into holes in the radiator 200 .

Further, in the above-described embodiments, the substrate modules 100 and 300 in which semiconductor elements are mounted on the substrate 20 have been described, but the present invention is not limited to this, and can be applied to substrate modules in which various other electronic components are mounted. can do.

20 substrate 20A front surface 20B rear surface 21 insertion hole 25 through hole (first through portion)
30 semiconductor element (heat generating part)
31 leads 40, 340 positioning holder (positioning member)
41 projection (positioning part)
45 through-hole (second through-hole)
50 holder with hook (fixing member)
54 Mounting leg (positioning part)
55 hook (positioning part)
60 Heat transfer sheet 70 Pressing fitting (pressing member)
71 contact portion 74 pressing portion 80 insulating sheets 100, 300 board module 200 main radiator 202 screw hole 401 spacer

Claims (3)

A substrate module in which heat-generating components are mounted on the back side of a substrate and heat generated from the heat-generating components is radiated through a radiator,
a positioning member that exposes and holds the heat dissipation surface of the heat generating component;
a positioning portion that positions the positioning member on the back surface side of the substrate;
a pressing member that is accommodated in the positioning member and presses the heat-generating component toward the radiator;
a first penetrating portion that penetrates the front and back surfaces of the substrate;
a second through portion provided in the positioning member and communicating with the first through portion;
a fastening member that is fastened to the radiator from the front surface side of the substrate via the first penetration portion and the second penetration portion;
The substrate module, wherein the pressing member is fastened to the heat radiator by the fastening member to press the heat radiation surface of the heat generating component held by the positioning member toward the heat radiator. 2. The board module according to claim 1, further comprising a fixing member for fixing said positioning member holding said heat-generating component to the back side of said board. 3. The substrate module according to claim 2, wherein said positioning member and said fixing member are integrated so that said positioning member functions as said fixing member.

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