CN215525581U - Auxiliary detection jig - Google Patents
Auxiliary detection jig Download PDFInfo
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- CN215525581U CN215525581U CN202122392835.4U CN202122392835U CN215525581U CN 215525581 U CN215525581 U CN 215525581U CN 202122392835 U CN202122392835 U CN 202122392835U CN 215525581 U CN215525581 U CN 215525581U
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- base
- upper cover
- chip
- detection
- substrate
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Abstract
The utility model discloses an auxiliary detection jig which comprises a mounting substrate, a base, an upper cover and a detection substrate, wherein a plurality of groups of mounting positioning columns are arranged on the mounting substrate, a group of mounting positioning holes are correspondingly arranged on the base, each group of mounting positioning columns are matched with the mounting positioning holes, a chip placing table is arranged in the center of the base, the positions of the mounting positioning holes are arranged around the chip placing table, connecting columns are respectively arranged at four corners on the base, connecting holes matched with the connecting columns are correspondingly arranged at four corners on the upper cover, the chip placing table is correspondingly arranged in the center of the upper cover, a placing groove is arranged on the detection substrate, and the side ends of the base and the upper cover after clamping a wafer chip are matched and spliced with the placing groove. The auxiliary detection jig is convenient for detecting the clamped wafer chip and can be recycled; the measurement data is accurate, the error is small, the product is well fixed, and the product is not easy to incline; the method is convenient for detection personnel to operate, replaces the original complex and disorderly detection method, and saves a large amount of operation time.
Description
Technical Field
The utility model belongs to the technical field of wafer chips, and particularly relates to an auxiliary detection jig for assisting a microscope in detecting the collapse degree of a wafer chip.
Background
The side edge breakage of the existing wafer chip needs to be observed and detected through a microscope, the thickness of the wafer chip is small and easy to damage, and the side surface of the product needs to be vertically detected when the side surface of the product is detected through the microscope. The method has the disadvantages that the contact area of the side face is small, the side face is unstable and easy to incline, the film is elastic, the product is forcibly adhered to the film to cause the film to generate tension and deform, the measured value of the product can be influenced, the side face of the chip has four faces, the four faces are required to be measured, therefore, after one face is measured, the chip needs to be taken out of the film, the other face is adhered to the film, the film can generate tension in the process, deformation is generated, and the measurement error of the product can be increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model designs an auxiliary detection jig for assisting a microscope in detecting the collapse degree of a wafer chip.
The utility model adopts the following technical scheme:
the utility model provides an auxiliary detection tool, including mounting substrate, a pedestal, upper cover and detection substrate, the last multiunit installation reference column that is provided with of mounting substrate, it is provided with a set of installation locating hole to correspond on the base, every group installation reference column and installation locating hole cooperation, the base center is provided with the chip arrangement platform, the installation locating hole position is around the setting of chip arrangement platform, four corners punishment do not is provided with the spliced pole on the base, four corners punishment on the upper cover correspond be provided with spliced pole complex connecting hole, the upper cover center corresponds and is provided with the chip arrangement platform, be provided with the arrangement groove on the detection substrate, the side behind base and the tight wafer chip of upper cover clamp is pegged graft with the arrangement groove cooperation.
Preferably, the length of the mounting positioning column is 3mm greater than the thickness of the base and the chip placement table.
Preferably, the four corners of the placement groove are provided with circular arc openings.
Preferably, the mounting substrate, the base, the upper cover and the detection substrate are formed by cutting an ESD board respectively.
Preferably, each group of the mounting positioning columns is distributed in the shape of a diamond four-corner position.
The utility model has the beneficial effects that: the auxiliary detection jig is convenient for detecting the clamped wafer chip and can be recycled; the measurement data is accurate, the error is small, the product is well fixed, and the product is not easy to incline; the method is convenient for detection personnel to operate, replaces the original complex and disorderly detection method, and saves a large amount of operation time.
Drawings
FIG. 1 is a schematic view of a structure of a mounting substrate according to the present invention;
FIG. 2 is a schematic view of a base according to the present invention;
FIG. 3 is a schematic view of a structure of the upper cover of the present invention;
FIG. 4 is a schematic view of a structure of a detection substrate according to the present invention;
FIG. 5 is a front view of the base, lid and wafer chip assembled and mounted on a test substrate in accordance with the present invention;
FIG. 6 is a top view of FIG. 5;
in the figure: 1. the wafer chip mounting device comprises a mounting substrate, 2, a mounting positioning column, 3, a base, 4, a mounting positioning hole, 5, a chip mounting table, 6, a connecting column, 7, an upper cover, 8, a connecting hole, 9, a detection substrate, 10, a mounting groove, 11 and a wafer chip.
Detailed Description
The technical scheme of the utility model is further described in detail by the following specific embodiments in combination with the attached drawings:
example (b): as shown in fig. 1-6, an auxiliary detection jig comprises a mounting substrate 1, a base 3, an upper cover 7 and a detection substrate 9, wherein a plurality of groups of mounting positioning columns 2 are arranged on the mounting substrate, a group of mounting positioning holes 4 are correspondingly arranged on the base, each group of mounting positioning columns is matched with the mounting positioning holes, a chip placing table 5 is arranged at the center of the base, the mounting positioning holes are arranged around the chip placing table, connecting columns 6 are respectively arranged at four corners of the base, connecting holes 8 matched with the connecting columns are correspondingly arranged at the four corners of the upper cover, the chip placing table is correspondingly arranged at the center of the upper cover, a placing groove 10 is arranged on the detection substrate, and the side ends of the base and the upper cover after clamping a wafer chip 11 are matched and spliced with the placing groove.
The length of installation reference column is greater than base and chip arrangement platform thickness 3 mm. The four corners of the placing groove are provided with circular arc openings. The mounting substrate, the base, the upper cover and the detection substrate are formed by cutting ESD plates respectively. Each group of mounting positioning columns are distributed in the shape of a diamond four-corner position.
When the auxiliary detection jig is used, the base installation positioning hole is installed corresponding to the installation positioning column of the installation substrate, the installation positioning column is inserted into the installation positioning hole and protrudes, the protruding part surrounds the chip installation table and is just used for installing and positioning the wafer chip, the wafer chip is placed into the back, the upper cover is covered, the upper cover clamps the wafer chip, the base, the upper cover and the wafer chip which are installed and completed are taken out simultaneously, the side edge is placed in the placing groove of the detection substrate in a vertical state, and the detection substrate is placed below the microscope to observe and detect the collapse degree of the wafer chip.
The above-described embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the spirit of the utility model as set forth in the claims.
Claims (5)
1. The utility model provides an auxiliary detection tool, characterized by, it includes mounting substrate, a pedestal, upper cover and detection substrate, the last multiunit installation reference column that is provided with of mounting substrate, it is provided with a set of installation locating hole to correspond on the base, every group installation reference column and installation locating hole cooperation, the base center is provided with the chip arrangement platform, the installation locating hole position is around the setting of chip arrangement platform, four corners punishment do not is provided with the spliced pole on the base, four corners punishment correspond on the upper cover and are provided with the connecting hole with spliced pole complex, the upper cover center corresponds and is provided with the chip arrangement platform, be provided with the resettlement groove on the detection substrate, the side behind base and the tight wafer chip of upper cover clamp is pegged graft with the resettlement groove cooperation.
2. The auxiliary inspection tool of claim 1, wherein the length of the positioning posts is greater than the thickness of the base and the chip placement platform by 3 mm.
3. The auxiliary detection jig as claimed in claim 1, wherein the four corners of the placement groove are provided with circular arc openings.
4. The auxiliary detection tool of claim 1, wherein the mounting substrate, the base, the upper cover and the detection substrate are formed by cutting ESD plates respectively.
5. The auxiliary inspection tool of claim 1, wherein each set of positioning posts is disposed at four corners of a diamond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122392835.4U CN215525581U (en) | 2021-09-30 | 2021-09-30 | Auxiliary detection jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122392835.4U CN215525581U (en) | 2021-09-30 | 2021-09-30 | Auxiliary detection jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215525581U true CN215525581U (en) | 2022-01-14 |
Family
ID=79798165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122392835.4U Active CN215525581U (en) | 2021-09-30 | 2021-09-30 | Auxiliary detection jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215525581U (en) |
-
2021
- 2021-09-30 CN CN202122392835.4U patent/CN215525581U/en active Active
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