CN218123369U

CN218123369U - IC chip arranging machine counterpoint mechanism

Info

Publication number: CN218123369U
Application number: CN202123320127.6U
Authority: CN
Inventors: 刘德强
Original assignee: Shenzhen Shengyuan Semiconductors Co ltd
Current assignee: Shenzhen Shengyuan Semiconductors Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-12-23
Anticipated expiration: 2031-12-27

Abstract

The application relates to an IC chip arranging machine aligning mechanism, which belongs to the field of chip product packaging, and comprises an operating platform, an arranging plate arranged on the operating platform, a plurality of positioning pins arranged on the arranging plate, a support frame and a laser range finder arranged on the support frame; the positioning pins are mutually parallel and vertically arranged, the laser range finder is arranged above the positioning pins, the detection end of the laser range finder faces the sheet arranging plate, and the laser range finder is used for detecting the distance between the laser range finder and the plane where the sheet arranging plate is located; the operation panel is provided with a data processing module and an alarm electrically connected with the data processing module, the data processing module is used for receiving, processing and outputting the measuring result of the laser range finder, and the laser range finder is electrically connected with the data processing module. This application has and avoids as far as possible because the dowel does not peg graft in the locating hole accurately, leads to the effect that can crush the problem of product at subsequent in-process of moulding plastics close the membrane.

Description

IC chip arranging machine aligning mechanism

Technical Field

The application relates to the field of chip product packaging, in particular to an alignment mechanism of an IC chip arranging machine.

Background

At present, the normal packaging and testing process of an IC chip is to weld the chip on a plastic substrate on a metal lead frame, then wire bonding, plastic packaging, electroplating, rib cutting, testing, packaging and obtaining a finished product. The production and processing of the related chip plastic base are that a plurality of large samples of the plastic base are punched on the metal lead frame through a punching die, and a lead with a small connecting surface is reserved between the plastic base and the metal lead frame, so that the plastic base is conveniently cut off from the metal lead frame at the later stage while being connected onto the metal lead frame, the plurality of plastic bases on the metal lead frame are sequentially and uniformly distributed at intervals, and the plastic base is conveniently processed in batches at the later stage;

the IC chip arranging machine is an important part for realizing chip plastic package, the main processes of the IC chip plastic package comprise the processes of feeding, chip arranging, preheating, anti-oxidation glue coating and injection molding, and the chip arranging machine plays a role in bearing a metal lead frame in the processes of chip arranging, preheating, glue coating and injection molding; the sheet arranging machine is provided with a plurality of positioning pins, and a plurality of positioning holes for inserting the positioning pins are formed in two ends of the surface of the metal lead frame; the mechanical arm places the metal lead frame on the sheet arranging machine, and the positioning pins on the sheet arranging machine are correspondingly inserted into the corresponding positioning holes on the metal lead frame, so that the position of the metal lead frame is conveniently fixed during subsequent processing of the plastic substrate on the metal lead frame, and the processing stability is improved; when the metal lead frame is placed on the sheet arranging machine by the mechanical arm, the positioning pin and the positioning hole cannot be accurately positioned inevitably, and the positioning pin is not accurately inserted into the positioning hole.

In view of the above related technologies, the inventor believes that if the positioning pin is not precisely inserted into the positioning hole, the positioning pin will jack up the metal lead frame, and the product will be crushed in the subsequent injection molding and film laminating process.

SUMMERY OF THE UTILITY MODEL

In order to avoid as far as possible because the dowel does not peg graft in the locating hole accurately, lead to the problem that the in-process of subsequent mould plastics close the membrane can crush the product, this application provides an IC chip arranging machine counterpoint mechanism.

The application provides a chip machine counterpoint mechanism is arranged to IC chip adopts following technical scheme:

an alignment mechanism of an IC chip arranging machine comprises an operation table, an arranging plate arranged on the operation table, a plurality of positioning pins arranged on the arranging plate, a support frame and a laser range finder arranged on the support frame; the laser range finder is used for detecting the distance between the laser range finder and the plane where the sheet arranging plate is located;

the laser range finder comprises an operating table and is characterized in that the operating table is provided with a data processing module and an alarm electrically connected with the data processing module, the data processing module is used for receiving, processing and outputting a measuring result of the laser range finder, and the laser range finder is electrically connected with the data processing module.

By adopting the technical scheme, a metal lead frame is placed on the sheet arranging plate, the positioning pins on the sheet arranging plate are correspondingly inserted into the positioning holes on the metal lead frame, the distance between the laser range finder and the metal lead frame is measured as a by the laser range finder, and the data processing module records the distance a; after the metal lead frame is placed on the sheet arranging plate by the mechanical arm, the laser range finder measures the distance between the laser range finder and the metal lead frame, the measured distance value is transmitted to the data processing module, if the positioning pins on the sheet arranging plate are not correspondingly inserted into the positioning holes on the metal lead frame, the metal lead frame is jacked up by the positioning pins, the distance value transmitted to the data processing module by the laser range finder is smaller than a, an alarm electrically connected with the data processing module gives an alarm for prompting, the inaccurate metal lead frame can be timely found and the position of the inaccurate metal lead frame can be adjusted, and the problem that the inaccurate metal lead frame is crushed in the subsequent injection molding film combining process is avoided as much as possible.

Optionally, the sheet arranging plate comprises a plate body, a first supporting piece arranged on the plate body, and a second supporting piece arranged on the plate body; the first support and the second support are used for placing a metal lead frame; the first supporting piece and the second supporting piece are arranged on the same side surface of the plate arranging plate, the first supporting piece and the second supporting piece are arranged oppositely, and a gap is formed between the first supporting piece and the second supporting piece.

Through adopting above-mentioned technical scheme, place a metal lead frame on first support piece and second support piece for mould the base on the metal lead frame and be located the clearance department between first support piece and the second support piece, can make the base of moulding on the metal lead frame be in unsettled state, and then make when preheating the base to moulding on the metal lead frame and add man-hour, mould the positive and negative of base and easily realize the thermally equivalent.

Optionally, the sheet arranging plate further includes a first baffle plate disposed opposite to the first support and a second baffle plate disposed opposite to the second support, and the first baffle plate and the second baffle plate are respectively used for abutting against two ends of the metal lead frame away from each other; the first supporting piece and the second supporting piece are arranged between the first baffle and the second supporting piece, and the height of one end, away from the plate body, of the first supporting piece is smaller than that of one end, away from the plate body, of the first baffle; the height of one end, far away from the plate body, of the second supporting piece is smaller than the height of one end, far away from the plate body, of the second baffle.

By adopting the technical scheme, because the height of the first baffle is higher than that of the first supporting piece, and the height of the second baffle is larger than that of the second supporting piece, when the metal lead frame is placed on the first supporting piece and the second supporting piece for processing, the first baffle limits the metal lead frame to move towards the direction close to the first baffle, and the second baffle limits the metal lead frame to move towards the direction close to the second baffle, so that the stability of the metal lead frame placed on the first supporting piece and the second supporting piece for processing is improved.

Optionally, a gap is provided between the first support and the first baffle, and a gap is provided between the second support and the second baffle; the positioning pins are arranged between the first supporting piece and the first baffle.

By adopting the technical scheme, in the actual processing process, the positioning holes formed in the two ends of the metal lead frame are difficult to avoid glue inflow in the gluing processing process, and the glue flowing into the holes is easy to block the positioning holes after being solidified and dried, so that the positioning and fixing of the metal lead frame in other processing procedures are influenced; the setting in space between first support piece and the first baffle and the space between second support piece and the second baffle for glue in the inflow locating hole leaks to the clearance between first support piece and the first shelves and the clearance between second support piece and the second baffle down under the action of gravity, and then glues and be difficult for depositing and remain in the locating hole and solidify and lead to the locating hole to block up, has improved above-mentioned problem.

Optionally, the upper surface of the first baffle plate is provided with a plurality of through grooves, the side walls of two opposite sides of each through groove are arranged in a through manner, and the through grooves are communicated with the gap between the first baffle plate and the second baffle plate through openings of the through side walls;

the sheet arranging plate further comprises a plurality of positioning pieces detachably connected to the plate body, the positioning pieces penetrate through the through grooves and extend into gaps between the first baffle and the first supporting piece baffle, one side face of the plate body is far away from the positioning pieces, the first supporting piece is far away from one side face of the plate body, and the positioning pins are arranged on the positioning pieces.

By adopting the technical scheme, in the actual gluing process, glue residue is difficult to avoid and solidifies on the surface of the positioning pin on the positioning piece, so that the fixing of the metal lead frame of the positioning pin is influenced, and therefore sundries on the surface of the positioning pin need to be cleaned frequently; the setting element is detachable to be set up on the plate body, conveniently pulls down the setting element from the plate body and clears up the dowel.

Optionally, the sheet arranging plate further includes a third supporting member disposed on the plate body, the third supporting member is disposed between the first supporting member and the second supporting member, and distances from one side surface of the first supporting member, one side surface of the second supporting member, and one side surface of the third supporting member, which are far away from the plate body, to the plate body are the same.

Through adopting above-mentioned technical scheme, when carrying out brush glue or plastic envelope operation to moulding the base on the metal lead frame, can exert certain pressure to moulding the base, the third support piece of setting between first support piece and second support piece can play the supporting role to the middle part of metal lead frame for metal lead frame is difficult for taking place bending deformation man-hour, influences processingquality.

Optionally, a first guide surface is arranged at a side edge of the first baffle close to the second baffle, and a second guide surface is arranged at a side edge of the second baffle close to the first baffle.

Through adopting above-mentioned technical scheme, the setting of first spigot surface and second spigot surface is conveniently inserted the metal lead frame between first baffle and the second baffle.

Optionally, a handheld rod is arranged on the sheet arranging plate.

Through adopting above-mentioned technical scheme, arrange the convenient back of accomplishing in processing of setting up of handheld pole on the piece board, will arrange the piece board and take off from the operation panel and shift to other workstations on and process.

Drawings

Fig. 1 is a schematic structural view of a metal lead frame in the related art.

Fig. 2 is a schematic structural diagram of an alignment mechanism of an IC chip arranging machine according to the present application.

Fig. 3 is an enlarged schematic structural diagram of a position of a chip arrangement assembly in an alignment mechanism of an IC chip arranging machine according to the present application.

Description of reference numerals: 1. an operation table; 2. arranging the sheet plates; 21. a plate body; 22. a containing groove; 23. a sheet arrangement component; 231. a first support; 232. a second support member; 233. a third support member; 234. a first baffle plate; 2341. a first guide surface; 2342. a through groove; 235. a second baffle; 2351. a second guide surface; 24. a positioning assembly; 241. a mounting ring; 242. a positioning member; 2421. positioning a pin; 3. a bolt; 4. a mounting frame; 5. a laser range finder; 6. a data processing module; 7. an alarm; 8. a stopper; 9. the rod is held in the hand.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

Referring to fig. 1, in the related art, a metal lead frame is a rectangular plate, two rows of plastic bases parallel to each other are stamped on the metal lead frame along the length direction of the metal lead frame, the two rows of plastic bases are arranged at intervals, each row is provided with a plurality of plastic bases uniformly arranged at intervals, and mounting holes for mounting electronic elements are stamped on the plastic bases; the long edge of metal lead frame has arranged the locating hole along metal lead frame's length direction, and the locating hole is used for pegging graft the locating pin.

The embodiment of the application discloses IC chip arranging machine counterpoint mechanism. Referring to fig. 2, the alignment mechanism of the ic chip arranging machine comprises an operation table 1 and an arranging plate 2 placed on the operation table 1, wherein the arranging plate 2 comprises a plate body 21, four accommodating grooves 22 with rectangular cross sections are formed in the plate body 21, and the four accommodating grooves 22 are arranged in a rectangular shape; the sheet arranging plate 2 further comprises sheet arranging assemblies 23 arranged in the accommodating grooves 22, two sheet arranging assemblies 23 are arranged in each accommodating groove 22, the two sheet arranging assemblies 23 in each accommodating groove 22 are parallel to each other, and the two sheet arranging assemblies 23 are symmetrically arranged by taking the central line of the accommodating groove 22 in the length direction as a symmetry axis; arrange piece subassembly 23 and be used for placing and spacing metal lead frame, the setting of storage tank 22 makes row's the holistic thickness of piece board 2 less, and weight reduction when practicing thrift the space makes things convenient for the transfer.

Referring to fig. 2 and 3, the blade arrangement assembly 23 includes a first support 231 and a second support 232 welded and fixed on the board body 21 for placing the metal lead frame, and the first support 231 and the second support 232 are long rods with rectangular cross sections; a gap is formed between the first support 231 and the second support 232, and the first support 231 and the second support 232 are both parallel to the straight line of the length direction of the accommodating groove 22, so that when the metal lead frame placed on the first support 231 and the second support 232 is preheated, the plastic base on the metal lead frame is suspended between the first support 231 and the second support 232, and the front and back surfaces of the plastic base are easily uniformly heated; the first support 231 and the second support 232 have the same height and width, the length of the first support 231 is slightly longer than that of the second support 232, and one ends of the first support 231 and the second support 232, which are close to the middle of the board body 21, are flush with each other, so that when the metal lead frame is horizontally placed on the first support 231 and the second support 232, one end of the metal lead frame, which is located at the second support 232 and away from the middle of the board body 21, is in a suspended state; an operator can grasp the hanging part of the metal lead frame, and then the metal lead frame can be conveniently taken down from the first support 231 and the second support 232.

Referring to fig. 2 and 3, the blade row assembly 23 further includes a third support 233 welded and fixed to the bottom of the receiving groove 22, the third support 233 is disposed between the first support 231 and the second support 232, the third support 233 is a long rod with a rectangular cross-section, and the height of the third support 233 is the same as the height of the first support 231 and the height of the second support 232; when the metal lead frame is horizontally placed on the first supporting member 231 and the second supporting member 232, the third supporting member 233 is supported between the two rows of plastic bases, and in the process of gluing or plastic packaging the plastic bases, the metal lead frame is not easy to bend due to pressure and the processing quality is not affected by the supporting effect of the third supporting member 233.

Referring to fig. 2 and 3, the film arranging assembly 23 further includes a first baffle 234 and a second baffle 235 welded and fixed to the bottom of the accommodating groove 22, the first baffle 234 is disposed opposite to the first support 231, the second baffle 235 is disposed opposite to the second support 232, and the first support 231 and the second support 232 are located between the first baffle 234 and the second baffle 235; the first baffle 234 and the first support 231 have the same length and are parallel to each other, the height of the first baffle 234 is higher than that of the first support 231, and a gap is formed between the first baffle 234 and the first support 231; the second baffle 235 and the second support 232 have the same length and are parallel to each other, the height of the second baffle 235 is higher than that of the second support 232, and a gap is formed between the second baffle 235 and the second support 232; the first blocking plate 234 is provided with a first guide surface 2341 near a side edge of the second blocking plate 235, and the second blocking plate 235 is provided with a second guide surface 2351 near a side edge of the first blocking plate 234, so that a metal lead frame can be conveniently inserted between the first blocking plate 234 and the second blocking plate 235.

When the metal lead frame is horizontally placed on the first support 231 and the second support 232 and is subjected to glue coating processing, two side edges of the metal lead frame in the length direction are respectively abutted against the first baffle 234 and the second baffle 235, so that the metal lead frame is not easy to slide laterally; the positioning holes on two sides of the metal lead frame are located in the gap between the first baffle plate 234 and the first support 231 and the gap between the second baffle plate 235 and the second support 232, the glue flowing into the positioning holes on the metal lead frame leaks into the gap under the action of gravity, and the glue is not easy to remain in the positioning holes and is blocked by the solidification guide positioning holes.

Referring to fig. 3, the sheet-arranging plate 2 further includes a positioning assembly 24 disposed in the accommodating groove 22, the positioning assembly 24 includes a rectangular mounting ring 241 and positioning members 242 welded on an inner wall of the mounting ring 241, an outer peripheral side surface of the mounting ring 241 is correspondingly abutted to a groove wall of the accommodating groove 22, four positioning members 242 are disposed on two side walls of the mounting ring 241 parallel to the length direction thereof, one end of the positioning member 242 away from the mounting ring 241 is fixedly provided with a positioning pin 2421, and one end of the positioning member 242 away from the mounting ring 241 extends toward the middle of the accommodating groove 22; four through grooves 2342 are formed in the upper surface of the first baffle plate 234, the side walls on two opposite sides of the through grooves 2342 are arranged in a penetrating mode, the through grooves 2342 are communicated with the gap between the first baffle plate 234 and the second baffle plate 235 through openings of the through side walls, and the four positioning pieces 242 correspondingly penetrate through the four through grooves 2342 and extend into the gap between the first baffle plate 234 and the second baffle plate 235; when the metal lead frame is horizontally placed on the first support 231 and the second support 232, the positioning pin 2421 may be correspondingly inserted into one positioning hole on the metal lead frame, so as to achieve positioning and fixing of the metal lead frame.

Referring to fig. 2 and 3, one end of the mounting ring 241 close to the notch of the receiving groove 22 is flush with the notch of the receiving groove 22, a bolt 3 is fixedly arranged on the upper surface of the plate body 21 at the edge of the notch of the receiving groove 22, and a nut of the bolt 3 is abutted against one end of the mounting ring 241 close to the notch of the receiving groove 22, so that the positioning assembly 24 is limited in the receiving groove 22; the bolt 3 is removed to remove the restriction on the positioning assembly 24, so that the positioning assembly 24 can be taken out from the accommodating groove 22 to clean or replace and repair the positioning member 242.

Referring to fig. 2 and 3, a mounting frame 4 is fixedly arranged at the bottom of the accommodating groove 22 through a bolt 3, the mounting frame 4 is arranged between the two sheet-arranging assemblies 23, two laser range finders 5 are fixedly arranged on the mounting frame 4 through the bolt 3, the detection ends of the two laser range finders 5 respectively face the upper surfaces of the second supporting pieces 232 in the two sheet-arranging assemblies 23 in the accommodating groove 22, a data processing module 6 which is simultaneously and electrically connected with the eight laser range finders 5 is fixedly arranged on the side surface of the operating platform 1, and in the application, the data processing module 6 is a tablet computer and is used for receiving, processing and outputting measurement data information of the laser range finders 5; four corners of the upper surface of the operating platform 1 are respectively provided with an alarm 7 electrically connected with the data processing module 6, and each alarm 7 corresponds to two laser range finders 5 in the accommodating groove closest to the alarm 7; in this embodiment, the alarm 7 is an alarm lamp, and in other embodiments, the alarm 7 may also be an alarm bell or a display screen, so as to implement alarm.

Referring to fig. 2 and 3, a metal lead frame is placed on the first support 231 and the second support 232, the positioning pin 2421 on the positioning piece 242 is correspondingly inserted into the positioning hole on the metal lead frame, the laser range finder 5 measures that the distance between the laser range finder 5 and the metal lead frame is a, and the data processing module 6 records the distance a; after the metal lead frame is placed on the sheet arranging plate 2 by the mechanical arm, the laser range finder 5 measures the distance between the laser range finder and the metal lead frame and transmits the measured distance value to the data processing module 6; if the positioning pin 2421 on the positioning element 242 is not inserted into the positioning hole on the metal lead frame correspondingly, one end of the metal lead frame close to the first support element 231 is jacked up by the positioning pin 2421, the distance value transmitted to the data processing module 6 by the laser range finder 5 is smaller than a, the alarm lamp closest to the metal lead frame flickers to prompt, the metal lead frame which is not accurately positioned can be found in time, the position of the metal lead frame can be adjusted, and the problem that the metal lead frame which is not accurately positioned is crushed in the subsequent injection molding film combining process is avoided as much as possible.

Referring to fig. 2, six limiting members 8 are fixedly welded on the operating table 1, two limiting members 8 are respectively abutted against the plate body 21 on three adjacent side surfaces of the sheet arranging plate 2, the limiting members 8 are arranged to limit the sheet arranging plate 2 to slide on the operating table 1 in the machining process, and the stability is improved; two handheld rods 9 are fixedly welded on the side face, which is not abutted to the limiting part, of the plate body 21, so that the sheet arranging plate 2 can be conveniently taken down from the operating table 1.

The implementation principle of the IC chip arranging machine aligning mechanism in the embodiment of the application is as follows: the metal lead frame to be processed is placed on the first support 231 and the second support 232 through an external mechanical arm, and if the positioning pin is not correspondingly inserted into the positioning hole on the metal lead frame, the alarm closest to the positioning pin can give an alarm.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a IC chip wafer arranging machine counterpoint mechanism which characterized in that: the device comprises an operation table (1), a piece arranging plate (2) arranged on the operation table (1), a plurality of positioning pins (2421) arranged on the piece arranging plate (2), a support frame and a laser range finder (5) arranged on the support frame; the positioning pins (2421) are mutually parallel and vertically arranged, the laser range finder (5) is arranged above the positioning pins (2421), the detection end of the laser range finder (5) faces the piece arranging plate (2), and the laser range finder (5) is used for detecting the distance between the laser range finder and the plane where the piece arranging plate (2) is located;

the laser range finder is characterized in that a data processing module (6) and an alarm (7) electrically connected with the data processing module (6) are arranged on the operating platform (1), the data processing module (6) is used for receiving, processing and outputting a measuring result of the laser range finder (5), and the laser range finder (5) is electrically connected with the data processing module (6).

2. The IC chip arranging machine aligning mechanism of claim 1, wherein: the sheet arranging plate (2) comprises a plate body (21), a first supporting piece (231) arranged on the plate body (21) and a second supporting piece (232) arranged on the plate body (21); the first support (231) and the second support (232) are used for placing a metal lead frame; the first supporting piece (231) and the second supporting piece (232) are arranged on the same side surface of the sheet arranging plate (2), the first supporting piece (231) and the second supporting piece (232) are arranged oppositely, and a gap is formed between the first supporting piece (231) and the second supporting piece (232).

3. The aligning mechanism of claim 2, wherein: the sheet arranging plate (2) further comprises a first baffle plate (234) arranged opposite to the first support (231) and a second baffle plate (235) arranged opposite to the second support (232), and the first baffle plate (234) and the second baffle plate (235) are respectively used for being abutted to two ends, far away from each other, of the metal lead frame; the first support (231) and the second support (232) are arranged between the first baffle (234) and the second support (232), and the height of one end, away from the plate body (21), of the first support (231) is smaller than that of one end, away from the plate body (21), of the first baffle (234); the height of one end, far away from the plate body (21), of the second supporting piece (232) is smaller than the height of one end, far away from the plate body (21), of the second baffle (235).

4. The aligning mechanism of claim 3 for IC chip arranging machine, wherein: a gap is arranged between the first support (231) and the first baffle (234), and a gap is arranged between the second support (232) and the second baffle (235).

5. The IC chip arranging machine aligning mechanism of claim 4, wherein: the upper surface of the first baffle plate (234) is provided with a plurality of through grooves (2342), the side walls of two opposite sides of each through groove (2342) are arranged in a penetrating mode, and the through grooves (2342) are communicated with a gap between the first baffle plate (234) and the second baffle plate (235) through penetrating side wall openings;

arrange piece board (2) and still include detachable connection a plurality of setting elements (242) on plate body (21), setting element (242) run through logical groove (2342) extend to in the clearance between first baffle (234) and second baffle (235), and one side of plate body (21) is kept away from to setting element (242) with first support piece (231) keep away from one side parallel and level of plate body (21), dowel (2421) sets up on setting element (242).

6. The IC chip arranging machine aligning mechanism of claim 2, wherein: the sheet arranging plate (2) further comprises a third supporting piece (233) arranged on the plate body (21), the third supporting piece (233) is arranged between the first supporting piece (231) and the second supporting piece (232), and the distances from one side surface of the plate body (21) far away from the first supporting piece (231), the second supporting piece (232) and the third supporting piece (233) to the plate body (21) are the same.

7. The aligning mechanism of claim 3 for IC chip arranging machine, wherein: the first baffle plate (234) is provided with a first guide surface (2341) near the side edge of the second baffle plate (235), and the second baffle plate is provided with a second guide surface (2351) near the side edge of the first baffle plate (234).

8. The IC chip arranging machine aligning mechanism of claim 1, wherein: and a handheld rod (9) is arranged on the sheet arranging plate (2).