CN216566898U - Packaging clamp for improving packaging efficiency of IGBT module - Google Patents
Packaging clamp for improving packaging efficiency of IGBT module Download PDFInfo
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- CN216566898U CN216566898U CN202123437138.2U CN202123437138U CN216566898U CN 216566898 U CN216566898 U CN 216566898U CN 202123437138 U CN202123437138 U CN 202123437138U CN 216566898 U CN216566898 U CN 216566898U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model relates to a packaging clamp for improving the packaging efficiency of an IGBT module. The packaging support positioning base is arranged on the chip positioning frame plate; a copper-clad ceramic body positioning groove matched with the copper-clad ceramic body is formed in the radiating substrate positioning frame plate, and when the copper-clad ceramic body is embedded in the copper-clad ceramic body positioning groove, the copper-clad ceramic body can be opposite to and in contact with a radiating substrate on the packaging supporting and positioning base; the chip positioning frame plate is provided with chip positioning holes matched with the chip unit bodies, the chip unit bodies can correspond to the copper-clad ceramic bodies corresponding to the positions under the chip positioning frame plate after being arranged in the chip positioning frame plate through the chip positioning holes, and the chip unit bodies can be welded on the copper-clad ceramic bodies when the copper-clad ceramic bodies are welded on the radiating substrate. The utility model can effectively improve the packaging efficiency, reduce the packaging cost and is safe and reliable.
Description
Technical Field
The utility model relates to a packaging clamp, in particular to a packaging clamp for improving the packaging efficiency of an IGBT module.
Background
An Insulated Gate Bipolar Transistor (IGBT) module is a module product with a standard size, and is widely applied to the fields of motor driving, induction heating, wind power generation, photovoltaic and the like due to the excellent switching performance of the IGBT module. Because the IGBT module is a product with a relatively complex internal structure, the manufacturing process is complicated, the existing IGBT module is low in efficiency during packaging, the packaging cost is high, the packaging yield is poor, and the requirement of actual production is difficult to meet.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art, and provides the packaging clamp for improving the packaging efficiency of the IGBT module, which has a compact structure, can effectively improve the packaging efficiency, reduces the packaging cost, and is safe and reliable.
According to the technical scheme provided by the utility model, the packaging fixture for improving the packaging efficiency of the IGBT module comprises a packaging supporting and positioning base, and a heat dissipation substrate positioning frame plate and a chip positioning frame plate which are sequentially arranged on the packaging supporting and positioning base;
a copper-clad ceramic body positioning groove group matched with the copper-clad ceramic body is arranged on the radiating substrate positioning frame plate, and when the copper-clad ceramic body is embedded in the copper-clad ceramic body positioning group, the copper-clad ceramic body can be opposite to and contacted with a radiating substrate on the packaging supporting positioning base;
the chip positioning frame plate is provided with chip positioning holes matched with the chip unit bodies, the chip unit bodies can correspond to the copper-clad ceramic bodies corresponding to the positions under the chip positioning frame plate after being arranged in the chip positioning frame plate through the chip positioning holes, and the chip unit bodies can be welded on the copper-clad ceramic bodies when the copper-clad ceramic bodies are welded on the radiating substrate.
The packaging supporting and positioning base is provided with a plurality of base positioning columns, the base positioning columns are vertically distributed on the packaging supporting and positioning base, and the heat dissipation substrate, the heat dissipation substrate positioning frame plate and the chip positioning frame plate can be sleeved with the corresponding base positioning columns on the packaging supporting and positioning base and are sequentially positioned and supported on the packaging supporting and positioning base.
The end part of the heat-radiating substrate positioning frame plate is provided with a heat-radiating substrate positioning frame plate hole which can be matched with the base positioning column, and the heat-radiating substrate positioning frame plate can be sleeved on the corresponding base positioning column through the heat-radiating substrate positioning frame plate hole; the copper-clad ceramic body positioning groove group comprises a copper-clad ceramic body main positioning groove arranged in the middle area of the radiating substrate positioning frame plate and a copper-clad ceramic body positioning end groove arranged at one end of the radiating substrate positioning frame plate, and the copper-clad ceramic body main positioning groove and the copper-clad ceramic body positioning end groove are all communicated with the radiating substrate positioning frame plate.
The chip unit body comprises an IGBT device unit and an FRD device unit, and the chip positioning hole comprises an IGBT device unit positioning hole matched with the IGBT device unit and an FRD device unit positioning hole matched with the FRD device unit.
The chip positioning frame plate comprises a chip positioning outer frame plate and a plurality of chip positioning seats, the chip positioning outer frame plate is matched with the heat dissipation substrate positioning frame plate, the chip positioning outer frame plate is arranged in the chip positioning outer frame plate, a chip positioning outer frame plate hole is formed in the end portion of the chip positioning outer frame plate, the chip positioning outer frame plate can be sleeved on the base positioning column through the chip positioning outer frame plate hole, and the chip positioning holes are formed in the chip positioning seats.
The chip positioning outer frame plate is provided with a chip positioning seat groove matched with the chip positioning seat, and the chip positioning seat can be embedded in the chip positioning seat groove and can be separated from the chip positioning outer frame plate.
And a plurality of power terminal pre-tinning positioning holes are formed in the chip positioning seat, the power terminal pre-tinning positioning holes penetrate through the chip positioning seat, and the power terminal to-be-welded areas on the copper-coated ceramic body can be pre-tinned by the power terminal pre-tinning positioning holes.
When a plurality of chip positioning seat grooves are arranged in the chip positioning outer frame plate, the chip positioning seat grooves are parallel to each other, a chip positioning seat positioning support plate is arranged at the end part of the chip positioning seat, and when the chip positioning seat is arranged in the chip positioning seat groove, the chip positioning seat is in adaptive connection with the chip positioning seat groove through the chip positioning seat positioning support plate at the end part.
The signal terminal pre-tinning positioning structure is used for pre-tinning the signal terminal soldering tin on a signal terminal to-be-welded area on the radiating substrate;
the signal terminal pre-tinning positioning structure comprises a chip positioning outer frame plate signal terminal pre-tinning positioning seat arranged at one end of a chip positioning outer frame plate, wherein the chip positioning outer frame plate signal terminal pre-tinning positioning seat is in positive correspondence with a copper-clad ceramic body positioning end groove at one end of a radiating substrate positioning frame plate, so that signal terminal soldering tin is pre-tinned on the copper-clad ceramic body through the chip positioning outer frame plate signal terminal pre-tinning positioning seat and the copper-clad ceramic body positioning end groove to treat a welding area of the signal terminal.
The method comprises the steps that a chip positioning outer frame plate signal terminal pre-tinning positioning hole allowing a chip positioning outer frame plate signal terminal to be embedded with a pre-tinning positioning seat is arranged at one end of a chip positioning outer frame plate, a chip positioning outer frame plate signal terminal pre-tinning positioning seat hole is formed in the chip positioning outer frame plate signal terminal pre-tinning positioning seat, and the chip positioning outer frame plate signal terminal pre-tinning positioning seat hole penetrates through the chip positioning outer frame plate signal terminal pre-tinning positioning seat.
The utility model has the advantages that: the radiating substrate can be corresponding to the copper-clad ceramic body through the radiating substrate positioning frame plate, the chip unit bodies can be corresponding to the copper-clad ceramic body through the chip positioning frame plate, and when the copper-clad ceramic body is welded on the radiating substrate, the chip unit bodies can be welded on the copper-clad ceramic body at the same time, so that the packaging efficiency can be effectively improved, and the packaging cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic view of a package support positioning base according to the present invention.
Fig. 3 is an exploded view of the present invention in use.
Fig. 4 is a schematic view of a positioning frame plate of a heat-dissipating substrate according to the present invention.
FIG. 5 is a schematic view of the outer frame plate for positioning the chip according to the present invention.
Fig. 6 is a schematic view of the chip positioning base of the present invention.
Fig. 7 is a schematic view of the pre-tinning positioning seat of the chip positioning outer frame plate signal terminal of the utility model.
Description of reference numerals: 1-packaging supporting and positioning base, 2-chip positioning frame plate, 3-base positioning column, 4-chip positioning seat, 5-chip positioning outer frame plate signal terminal pre-tinning positioning seat, 6-radiating substrate, 7-radiating substrate hole, 8-radiating substrate positioning frame plate, 9-copper-coated ceramic body, 10-radiating substrate positioning frame plate hole, 11-chip positioning outer frame plate hole, 12-IGBT device unit, 13-FRD device unit, 14-chip positioning outer frame plate, 15-copper-coated ceramic body main positioning groove, 16-copper-coated ceramic body positioning end groove, 17-chip positioning groove, 18-chip positioning outer frame plate signal terminal pre-tinning positioning hole, 19-chip positioning seat positioning support plate, 20-IGBT device unit positioning hole, 21-FRD device unit positioning hole, 22-power terminal pre-tinning positioning hole and 23-chip positioning outer frame plate signal terminal pre-tinning positioning seat hole.
Detailed Description
The utility model is further illustrated by the following specific figures and examples.
As shown in fig. 1 and 3: in order to effectively improve the packaging efficiency and reduce the packaging cost, the utility model comprises a packaging supporting and positioning base 1, and a heat dissipation substrate positioning frame plate 8 and a chip positioning frame plate 2 which are sequentially arranged on the packaging supporting and positioning base 1;
a copper-clad ceramic body positioning groove group matched with the copper-clad ceramic body 9 is arranged on the radiating substrate positioning frame plate 8, and when the copper-clad ceramic body 9 is embedded in the copper-clad ceramic body positioning group, the copper-clad ceramic body 9 can be in opposite correspondence and contact with a radiating substrate 6 on the packaging supporting positioning base 1;
the chip positioning frame plate 2 is provided with chip positioning holes matched with the chip unit bodies, the chip unit bodies can be just corresponding to the corresponding copper-coated ceramic bodies 9 under the chip positioning frame plate 2 after being arranged in the chip positioning frame plate 2 through the chip positioning holes, and the chip unit bodies can be welded on the copper-coated ceramic bodies 9 when the copper-coated ceramic bodies 9 are welded on the radiating substrate 6.
Specifically, the whole packaging process can be positioned and supported by the packaging supporting and positioning base 1, the heat dissipation substrate positioning frame plate 8 and the chip positioning frame plate 2 can be arranged on the packaging supporting and positioning base 1, wherein the heat dissipation substrate positioning frame plate 8 is positioned below the chip positioning frame plate 2, and the chip positioning frame plate 2 is supported on the heat dissipation substrate positioning frame plate 8. In specific implementation, when the IGBT is packaged, that is, a chip unit body is assembled on a DBC (direct Bonding coater) board, generally, the chip unit body includes an IGBT device unit 12 and an frd (fast Recovery diode) device unit 13, the DBC board may include a heat dissipation substrate 6 and a copper-clad ceramic body 9 disposed on the heat dissipation substrate 6, a specific form of the copper-clad ceramic body 9 may generally be determined according to an electrical connection form of an actual IGBT package, and a specific form of the chip unit body and a position on the copper-clad ceramic body 9 and the like may be selected according to actual needs, so as to meet specific package requirements.
In specific implementation, in order to realize fast packaging, the heat dissipation substrate 6 needs to be placed on the packaging supporting and positioning base 1, the heat dissipation substrate 6 is located between the packaging supporting and positioning base 1 and the heat dissipation substrate positioning frame plate 8, and the heat dissipation substrate positioning frame plate 8 is pressed on the heat dissipation substrate 6. In order to realize the welding between the copper-clad ceramic body 9 and the heat dissipation substrate 6, a copper-clad ceramic body positioning groove group is arranged on the heat dissipation substrate positioning frame plate 8, the copper-clad ceramic body positioning groove group penetrates through the heat dissipation substrate positioning frame plate 8, and the copper-clad ceramic body positioning groove group is matched with the copper-clad ceramic body 9. The copper-clad ceramic positioning groove group can allow the copper-clad ceramic 9 to be embedded, and when the copper-clad ceramic 9 and the radiating substrate 6 are welded and the radiating substrate positioning frame plate 8 is pulled, the copper-clad ceramic 9 and the radiating substrate 6 are not affected.
The chip positioning frame plate 2 is provided with chip positioning holes matched with the chip unit bodies, and the chip unit bodies can be just corresponding to the corresponding copper-coated ceramic bodies 9 under the chip positioning frame plate 2 after being arranged in the chip positioning frame plate 2 through the chip positioning holes.
When the copper-clad ceramic packaging structure is used specifically, soldering tin for welding with the copper-clad ceramic body 9 needs to be arranged on the heat dissipation substrate 6, and soldering tin for welding with the chip unit bodies is arranged on the copper-clad ceramic body 9, so that the copper-clad ceramic body 9 is in contact with the heat dissipation substrate 6 through the copper-clad ceramic body positioning groove group, after the chip unit bodies are in corresponding contact with the copper-clad ceramic body 9 through the chip positioning holes, when the copper-clad ceramic body 9 is welded on the heat dissipation substrate 6, the chip unit bodies can be welded on the copper-clad ceramic body 9 at the same time, the packaging efficiency can be effectively improved, and the packaging cost is reduced.
As shown in fig. 2, a plurality of base positioning columns 3 are arranged on the packaging supporting and positioning base 1, the base positioning columns 3 are vertically distributed on the packaging supporting and positioning base 1, and the heat dissipation substrate 6, the heat dissipation substrate positioning frame plate 8 and the chip positioning frame plate 2 can be sleeved on the corresponding base positioning columns 3 on the packaging supporting and positioning base 1 and are sequentially positioned and supported on the packaging supporting and positioning base 1.
Specifically, a plurality of base positioning columns 3 can be arranged on the packaging supporting and positioning base 1, the number of the base positioning columns 3 can be selected according to actual needs, and fig. 2 shows a situation that four base positioning columns 3 are arranged on the packaging supporting and positioning base 1. Generally, the heat dissipation substrate 6 is smaller than the package supporting and positioning base 1, and when the package supporting and positioning base 1 is provided with four base positioning pillars 3, two heat dissipation substrates 6 can be simultaneously arranged on the package supporting and positioning base 1, i.e. the package of two IGBT modules can be simultaneously realized.
Set up heat dissipation substrate hole 7 at the both ends of heat dissipation substrate 6, heat dissipation substrate hole 7 link up heat dissipation substrate 6, and heat dissipation substrate 6 overlaps on two corresponding base reference columns 3 in heat dissipation substrate 6 both ends through heat dissipation substrate hole 7. When the IGBT module is packaged, the heat dissipation substrate 6, the heat dissipation substrate positioning frame plate 8, and the chip positioning frame plate 2 need to be sleeved on the corresponding base positioning columns 3 on the packaging supporting and positioning base 1, so that the height of the base positioning columns 3 needs to be greater than the sum of the thicknesses of the heat dissipation substrate 6, the heat dissipation substrate positioning frame plate 8, and the chip positioning frame plate 2, and at this time, the heat dissipation substrate 6, the heat dissipation substrate positioning frame plate 8, and the chip positioning frame plate 2 are sequentially supported on the packaging supporting and positioning base 1 from bottom to top.
As shown in fig. 4, a heat-dissipating substrate positioning frame hole 10 capable of being matched with the base positioning column 3 is disposed at an end of the heat-dissipating substrate positioning frame plate 8, and the heat-dissipating substrate positioning frame plate 8 can be sleeved on the corresponding base positioning column 3 through the heat-dissipating substrate positioning frame hole 10.
The copper-clad ceramic body positioning groove group comprises a copper-clad ceramic body main positioning groove 15 arranged in the middle area of the radiating substrate positioning frame plate 8 and a copper-clad ceramic body positioning end groove 16 arranged at one end of the radiating substrate positioning frame plate 8, wherein the copper-clad ceramic body main positioning groove 15 and the copper-clad ceramic body positioning end groove 16 are all communicated with the radiating substrate positioning frame plate 8.
In the embodiment of the present invention, the heat-dissipating substrate positioning frame plate 8 is rectangular, two heat-dissipating substrate positioning frame plate holes 10 are respectively disposed at two ends of the heat-dissipating substrate positioning frame plate 8, and the heat-dissipating substrate positioning frame plate 8 can be sleeved on the corresponding base positioning posts 3 through the heat-dissipating substrate positioning frame plate holes 10, that is, the heat-dissipating substrate positioning frame plate holes 10 on the heat-dissipating substrate positioning frame plate 8 correspond to the base positioning posts 3 on the package support positioning base 1 one by one. The number of the copper-clad ceramic body main positioning grooves 15 and the copper-clad ceramic body positioning end grooves 16 in the heat dissipation substrate positioning frame plate 8 is in one-to-one correspondence with the heat dissipation substrates 6 on the packaging supporting and positioning base 1, and in fig. 4, two sets of copper-clad ceramic body main positioning grooves 15 and copper-clad ceramic body positioning end grooves 16 are arranged on the heat dissipation substrate positioning frame plate 8, so that the two sets of copper-clad ceramic body main positioning grooves and the copper-clad ceramic body positioning end grooves can respectively correspond to the two heat dissipation substrates 6. Of course, in the specific implementation, the copper-clad ceramic body 9 to be welded on the heat dissipation substrate 6 needs to correspond to the copper-clad ceramic body main positioning groove 15 and the copper-clad ceramic body positioning end groove 16, respectively.
As shown in fig. 3, 5 and 6, the chip positioning frame plate 2 includes a chip positioning outer frame plate 14 adapted to the heat dissipation substrate positioning frame plate 8 and a plurality of chip positioning seats 4 disposed in the chip positioning outer frame plate 14, a chip positioning outer frame plate hole 11 is disposed at an end of the chip positioning outer frame plate 14, the chip positioning outer frame plate 14 can be sleeved on the base positioning column 3 through the chip positioning outer frame plate hole 11, and the chip positioning holes are disposed on the chip positioning seats 4.
In the embodiment of the present invention, the chip positioning frame 2 includes the chip positioning outer frame 14 and the chip positioning seat 4, wherein the chip positioning outer frame 14 is oriented, generally, the chip positioning outer frame 14 is right corresponding to the heat dissipation substrate positioning frame 8, and the chip positioning outer frame 14 can be supported on the heat dissipation substrate positioning frame 8. The chip positioning seat 4 can be disposed in the chip positioning outer frame plate 14, and when the chip positioning outer frame plate 14 is supported on the heat dissipation substrate positioning frame plate 8, the chip positioning seat 4 can be in positive correspondence with the copper-clad ceramic body 9 of the copper-clad ceramic body positioning groove 15.
In order to realize the stability of the chip positioning outer frame plate 14 during packaging, four chip positioning outer frame plate holes 11 are arranged on the chip positioning outer frame plate 14, the chip positioning outer frame plate holes 11 can be in one-to-one correspondence with the base positioning columns 3 on the packaging supporting and positioning base 1, namely, the chip positioning outer frame plate 14 is sleeved on the base positioning columns 3 and can be in positive correspondence with the heat dissipation substrate positioning frame plate 8 and pressed on the heat dissipation substrate positioning frame plate 8.
In specific implementation, the chip positioning holes include an IGBT device unit positioning hole 20 adapted to the IGBT device unit 12 and an FRD device unit positioning hole 21 adapted to the FRD device unit 13. Fig. 6 shows the situation that two sets of chip positioning holes are formed in the chip positioning seat 4, that is, two IGBT device units 12 and two FRD device units 13 can be placed in the chip positioning seat 4 at the same time, and the specific situations of the IGBT device units 12 and the FRD device units 13 can be consistent with the existing situation, which is well known to those skilled in the art.
The IGBT device unit positioning hole 20 is matched with the IGBT device unit 12, specifically, the IGBT device unit positioning hole 20 can allow the IGBT device unit 12 to be embedded, and the IGBT device unit positioning hole 20 is slightly larger than the IGBT device unit 12, so that after the IGBT device unit 12 is welded on the copper-clad ceramic body 9, the chip positioning seat 4 is not influenced to be separated from the IGBT device unit 12, the specific condition of the FRD device unit positioning hole 12 matched with the FRD device unit 13 is consistent with the condition of the IGBT device unit positioning hole 20 matched with the IGBT device unit 12, and the details are not repeated here.
Further, a chip positioning seat groove 17 matched with the chip positioning seat 4 is formed in the chip positioning outer frame plate 14, and the chip positioning seat 4 can be embedded in the chip positioning seat groove 17 and can be separated from the chip positioning outer frame plate 14.
In the embodiment of the present invention, in order to facilitate the matching with the chip positioning seat 4, a chip positioning seat groove 17 is provided in the chip positioning outer frame plate 14, and fig. 5 shows a case where two chip positioning seat grooves 17 are provided in the chip positioning outer frame plate 14. After the chip positioning seat 4 is placed in the chip positioning seat groove 17, the chip positioning seat 4 can be separated from the chip positioning outer frame plate 4.
Specifically, when a plurality of chip positioning seat grooves 17 are formed in the chip positioning outer frame plate 14, the chip positioning seat grooves 17 are parallel to each other, a chip positioning seat positioning support plate 19 is arranged at the end portion of the chip positioning seat 4, and when the chip positioning seat 4 is arranged in the chip positioning seat groove 17, the chip positioning seat 4 is in adaptive connection with the chip positioning seat grooves 17 through the chip positioning seat positioning support plate 19 at the end portion.
In the embodiment of the present invention, the chip positioning seat 4 is rectangular, the chip positioning seat grooves 17 are also rectangular, and when a plurality of chip positioning seat grooves 17 are provided in the chip positioning outer frame plate 14, the chip positioning seat grooves 17 are parallel to each other. The end part of the chip positioning seat 4 is provided with a chip positioning seat positioning support plate 19, and the chip positioning seat 4 is connected with the chip positioning seat groove 17 through the chip positioning seat positioning support plate 19 at the end part, namely can be positioned and supported in the chip positioning groove 17. Of course, other connection and matching forms can be adopted between the chip positioning seat 4 and the chip positioning seat slot 17 in the chip positioning outer frame plate 14, and the connection and matching forms can be specifically selected according to needs, and are not described herein again.
Furthermore, a plurality of power terminal pre-tinning positioning holes 22 are formed in the chip positioning seat 4, the power terminal pre-tinning positioning holes 22 penetrate through the chip positioning seat 4, and power terminals to be soldered on the copper-clad ceramic body 9 can be pre-tinned through the power terminal pre-tinning positioning holes 22.
In the embodiment of the present invention, the position of the power terminal pre-tinning positioning hole 22 on the chip positioning seat 4 can be selected as required so as to be matched with the power terminal to-be-soldered area on the copper-clad ceramic body 9, and fig. 5 shows a case where a plurality of power terminal pre-tinning positioning holes 22 are provided on the chip positioning seat 4. As can be seen from the above description, when the chip positioning outer frame plate 14 is supported on the heat dissipation substrate positioning frame plate 8, the chip positioning seat 4 can correspond to the copper-clad ceramic body 9 in the heat dissipation substrate positioning frame plate 8, so that the power terminal to-be-welded area on the copper-clad ceramic body 9 can be pre-soldered through the power terminal pre-soldering positioning hole 22, and the power terminal to-be-welded area is pre-soldered, specifically, the power terminal solder is disposed on the power terminal to-be-welded area, so that the power terminal is subsequently welded and fixed with the copper-clad ceramic body 9 through the pre-soldered power terminal solder.
Furthermore, the device also comprises a signal terminal pre-tinning positioning structure which is used for pre-tinning signal terminal soldering tin on a signal terminal to-be-soldered area on the heat dissipation substrate 6;
the signal terminal pre-tinning positioning structure comprises a chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 arranged at one end of a chip positioning outer frame plate 14, wherein the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 is in positive correspondence with a copper-clad ceramic body positioning end groove 16 at one end of a radiating substrate positioning frame plate 8, so that signal terminal soldering tin is pre-coated on a copper-clad ceramic body 9 through the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 and the copper-clad ceramic body positioning end groove 16 to treat a welding area of the signal terminal.
In the embodiment of the present invention, signal terminal solder can be disposed on the signal terminal to-be-soldered area on the heat dissipation substrate 6 through the signal terminal pre-tinning positioning structure, and the specific function of disposing the signal terminal solder can refer to the description of the power terminal solder, and the specific relationship between the signal terminal, the power terminal, and the IGBT module is consistent with the prior art, which is well known to those skilled in the art, and is not described herein again.
During specific implementation, the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 at one end of the chip positioning outer frame plate 14 is in positive correspondence with the copper-clad ceramic body positioning end groove 16 right below the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5, so that the signal terminal soldering tin is pre-coated on the signal terminal to-be-welded area which is opposite to the copper-clad ceramic body positioning end groove 16 and corresponds to the copper-clad ceramic body 9 through the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 and the copper-clad ceramic body positioning end groove 16.
In fig. 4, four copper-clad ceramic positioning end slots 16 are simultaneously disposed at one end of the heat-dissipating substrate positioning frame plate 8, and the two copper-clad ceramic positioning end slots 16 can correspond to one heat-dissipating substrate 6, so that signal terminals to be soldered on the signal terminals on the heat-dissipating substrate 6 can be soldered on the signal terminals to be soldered.
As shown in fig. 5 and 7, a chip positioning outer frame plate signal terminal pre-tinning positioning hole 18 allowing the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 to be embedded is formed at one end of the chip positioning outer frame plate 14, a chip positioning outer frame plate signal terminal pre-tinning positioning seat hole 23 is formed in the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5, and the chip positioning outer frame plate signal terminal pre-tinning positioning seat hole 23 penetrates through the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5.
In the embodiment of the utility model, the chip positioning outer frame plate signal terminal pre-tinning positioning seat 5 is internally provided with the chip positioning outer frame plate signal terminal pre-tinning positioning seat hole 23, and the size and the position of the chip positioning outer frame plate signal terminal pre-tinning positioning seat hole 23 are based on convenience in tinning.
In specific implementation, when the copper-clad ceramic body 9 is welded on the radiating substrate 6, the chip unit bodies can be welded on the copper-clad ceramic body 9 at the same time; after the power terminal soldering tin is pre-applied to the power terminal to-be-welded area on the copper-clad ceramic body 9 through the power terminal pre-soldering positioning hole 22 and the signal terminal pre-soldering positioning structure is pre-soldered to the signal terminal to-be-welded area of the corresponding copper-clad ceramic body 9, the IGBT chip unit 12 can be packaged by utilizing the clamp. After packaging, the chip positioning frame plate 2 and the heat dissipation substrate positioning frame plate 8 are separated from the packaging supporting and positioning base 1 in sequence, so that a primary packaging body comprising the heat dissipation substrate 6, the copper-clad ceramic body 9 and the chip unit bodies can be obtained, and after a power terminal, a signal terminal and the like are welded on the primary packaging body, the complete packaging of the IGBT module is realized.
Claims (10)
1. The utility model provides an improve packaging jig of IGBT module encapsulation efficiency which characterized by: the packaging structure comprises a packaging supporting and positioning base (1), and a heat dissipation substrate positioning frame plate (8) and a chip positioning frame plate (2) which are sequentially arranged on the packaging supporting and positioning base (1);
a copper-clad ceramic body positioning groove group matched with a copper-clad ceramic body (9) is arranged on the radiating substrate positioning frame plate (8), and when the copper-clad ceramic body (9) is embedded in the copper-clad ceramic body positioning group, the copper-clad ceramic body (9) can be in opposite correspondence and contact with a radiating substrate (6) on the packaging supporting positioning base (1);
the chip locating holes matched with the chip unit bodies are formed in the chip locating frame plate (2), the chip unit bodies can be in direct correspondence with the copper-clad ceramic bodies (9) corresponding to the positions under the chip locating frame plate (2) after being arranged in the chip locating frame plate (2) through the chip locating holes, and when the copper-clad ceramic bodies (9) are welded on the radiating substrate (6), the chip unit bodies can be welded on the copper-clad ceramic bodies (9) at the same time.
2. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 1, wherein: the packaging supporting and positioning base (1) is provided with a plurality of base positioning columns (3), the base positioning columns (3) are vertically distributed on the packaging supporting and positioning base (1), and the heat dissipation substrate (6), the heat dissipation substrate positioning frame plate (8) and the chip positioning frame plate (2) can be sleeved with the corresponding base positioning columns (3) on the packaging supporting and positioning base (1) and are sequentially positioned and supported on the packaging supporting and positioning base (1).
3. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 2, wherein: the end part of the heat-radiating substrate positioning frame plate (8) is provided with a heat-radiating substrate positioning frame plate hole (10) which can be matched with the base positioning column (3), and the heat-radiating substrate positioning frame plate (8) can be sleeved on the corresponding base positioning column (3) through the heat-radiating substrate positioning frame plate hole (10); the copper-clad ceramic body positioning groove group comprises a copper-clad ceramic body main positioning groove (15) arranged in the middle area of the radiating substrate positioning frame plate (8) and a copper-clad ceramic body positioning end groove (16) arranged at one end of the radiating substrate positioning frame plate (8), wherein the copper-clad ceramic body main positioning groove (15) and the copper-clad ceramic body positioning end groove (16) are communicated with the radiating substrate positioning frame plate (8).
4. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 2 or 3, wherein: the chip unit body comprises an IGBT device unit (12) and an FRD device unit (13), and the chip positioning hole comprises an IGBT device unit positioning hole (20) matched with the IGBT device unit (12) and an FRD device unit positioning hole (21) matched with the FRD device unit (13).
5. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 4, wherein: chip location framed panel (2) include with chip location outline border (14) of heat dissipation base plate location framed panel (8) adaptation and a plurality of chip positioning seat (4) of arranging chip location outline border (14) in the tip of chip location outline border (14) sets up chip location outline border hole (11), and chip location outline border (14) can overlap through chip location outline border hole (11) and put on base reference column (3), the chip positioning hole set up in on chip positioning seat (4).
6. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 5, wherein: a chip positioning seat groove (17) matched with the chip positioning seat (4) is formed in the chip positioning outer frame plate (14), and the chip positioning seat (4) can be embedded in the chip positioning seat groove (17) and can be separated from the chip positioning outer frame plate (14).
7. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 5, wherein: the chip positioning seat (4) is provided with a plurality of power terminal pre-tinning positioning holes (22), the power terminal pre-tinning positioning holes (22) penetrate through the chip positioning seat (4), and power terminal tin soldering can be performed on power terminals to-be-welded areas on the copper-coated ceramic body (9) through the power terminal pre-tinning positioning holes (22).
8. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 6, wherein: when setting up a plurality of chip location seat grooves (17) in chip location outline border (14), chip location seat groove (17) are parallel to each other, set up chip location seat location backup pad (19) at the tip of chip location seat (4), and when chip location seat groove (17) was arranged in to chip location seat (4), chip location seat (4) passed through the chip location seat location backup pad (19) and chip location seat groove (17) adaptation connection of tip.
9. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 5, wherein: the signal terminal pre-tinning positioning structure is used for pre-tinning signal terminal soldering tin on a signal terminal to-be-soldered area on the heat dissipation substrate (6);
the signal terminal pre-tinning positioning structure comprises a chip positioning outer frame plate signal terminal pre-tinning positioning seat (5) arranged at one end of a chip positioning outer frame plate (14), wherein the chip positioning outer frame plate signal terminal pre-tinning positioning seat (5) is in positive correspondence with a copper-clad ceramic body positioning end groove (16) at one end of a radiating substrate positioning frame plate (8), so that signal terminal soldering tin is pre-tinned on a copper-clad ceramic body (9) through the chip positioning outer frame plate signal terminal pre-tinning positioning seat (5) and the copper-clad ceramic body positioning end groove (16) to treat a welding area of the signal terminal.
10. The packaging clamp for improving the packaging efficiency of the IGBT module as claimed in claim 9, wherein: the method is characterized in that a chip positioning outer frame plate signal terminal pre-tinning positioning hole (18) allowing the chip positioning outer frame plate signal terminal pre-tinning positioning seat (5) to be embedded is arranged at one end of a chip positioning outer frame plate (14), a chip positioning outer frame plate signal terminal pre-tinning positioning seat hole (23) is formed in the chip positioning outer frame plate signal terminal pre-tinning positioning seat (5), and the chip positioning outer frame plate signal terminal pre-tinning positioning seat hole (23) penetrates through the chip positioning outer frame plate signal terminal pre-tinning positioning seat (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123437138.2U CN216566898U (en) | 2021-12-30 | 2021-12-30 | Packaging clamp for improving packaging efficiency of IGBT module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123437138.2U CN216566898U (en) | 2021-12-30 | 2021-12-30 | Packaging clamp for improving packaging efficiency of IGBT module |
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| Publication Number | Publication Date |
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| CN216566898U true CN216566898U (en) | 2022-05-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116944626A (en) * | 2023-08-08 | 2023-10-27 | 合肥工业大学 | Discrete fixture suitable for multi-chip series-parallel power module terminal reflow soldering |
-
2021
- 2021-12-30 CN CN202123437138.2U patent/CN216566898U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116944626A (en) * | 2023-08-08 | 2023-10-27 | 合肥工业大学 | Discrete fixture suitable for multi-chip series-parallel power module terminal reflow soldering |
| CN116944626B (en) * | 2023-08-08 | 2024-02-06 | 合肥工业大学 | Discrete fixture suitable for multi-chip series-parallel power module terminal reflow soldering |
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