CN213003432U

CN213003432U - Welding tool for IGBT module

Info

Publication number: CN213003432U
Application number: CN202021969683.9U
Authority: CN
Inventors: 邢毅; 刘爽; 杨晓菲
Original assignee: CRRC Xian Yonge Electric Co Ltd
Current assignee: CRRC Xian Yonge Electric Co Ltd
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2021-04-20
Anticipated expiration: 2030-09-10

Abstract

The utility model belongs to the technical field of the IGBT module, a welding frock of IGBT module is related to, including the frock bottom plate, the frock bottom plate is equipped with the recess that is used for placing the IGBT module bottom plate; a DBC positioning plate is arranged on a bottom plate of the IGBT module, and is provided with a first area for placing a first soldering lug and a DBC substrate; a chip positioning plate is arranged on the DBC substrate, and a second area for placing a second soldering lug and a chip is arranged on the chip positioning plate; and a tooling top plate is arranged on the chip positioning plate and provided with a positioning pin, and the positioning pin corresponds to the chip. The utility model discloses a once weld between chip and the DBC base plate, the secondary welding of the bottom plate of DBC base plate and IGBT module is integrated once to accomplish together, has improved the manufacturing efficiency of IGBT module, has reduced manufacturing cost.

Description

Welding tool for IGBT module

Technical Field

The utility model belongs to the technical field of the IGBT module, a welding frock of IGBT module is related to.

Background

At present, the key point of the manufacturing process of the IGBT module is a welding process, wherein the welding process comprises welding between a chip and a DBC substrate; and welding between the DBC substrate and the bottom plate and welding between the electrode and the DBC substrate. An IGBT module comprises a plurality of DBC substrates, and specific circuit connection is completed between the DBC substrates and chips and between the DBC substrates and the DBC substrates through bonding aluminum wires. If a bonding aluminum wire exists between the DBC substrate and the DBC substrate, the IGBT module needs to be welded by three different tools, and the final welding can be completed only by respectively carrying out three different welding processes in a welding furnace.

The three different welding processes include: welding the chip and the DBC substrate for the first time, and completing the welding process by utilizing a welding tool for the first time; secondary welding, namely welding the DBC substrate and the bottom plate, and finishing a secondary welding process by utilizing a secondary welding tool; and (4) carrying out three times of welding, namely welding the electrode and the DBC substrate, and carrying out three times of welding process by using a three times of welding tool. At present, three sets of different tools and three different welding processes are needed for completing welding, and the design and manufacture of the three tools increase the manufacturing cost of products; it takes a long time to complete three different welding processes, and each time the process is performed in the welding furnace, electric power, special gases and other auxiliary materials are consumed. Therefore, the manufacturing process of the IGBT module is long, the efficiency is low, the consumption of resources such as energy and special gas is high, and the manufacturing cost is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art's shortcoming, provide a welding frock of IGBT module, can once accomplish welding and secondary welding, improved the manufacturing efficiency of IGBT module, reduced manufacturing cost.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the welding tool for the IGBT module comprises a tool bottom plate, wherein a groove for placing the IGBT module bottom plate is formed in the tool bottom plate; a DBC positioning plate is arranged on the IGBT module bottom plate, and is provided with a first area for placing a first soldering lug and a DBC substrate; a chip positioning plate is arranged on the DBC substrate, and is provided with a second area for placing a second soldering lug and a chip; the chip positioning plate is provided with a tooling top plate, the tooling top plate is provided with a positioning pin, and the positioning pin corresponds to the chip.

Further, the shape of the groove is matched with the shape of the IGBT module bottom plate.

Further, the recess includes the rectangle recess, just the long avris symmetry of rectangle recess is provided with the draw-in groove.

Furthermore, the DBC locating plate is rectangular, and four top corners of the rectangle are provided with lugs.

Further, the DBC locating plate is provided with four first openings, first soldering lugs are placed at the first openings, and the DBC substrate is placed above the first soldering lugs.

Further, the chip positioning plate is provided with four second openings, second soldering lugs are placed at the second openings, and the chip is placed above the second soldering lugs.

Further, the center of the positioning pin corresponds to the center position of the chip.

Compared with the prior art, the utility model provides a technical scheme includes following beneficial effect: the bottom plate of the IGBT module can be fixed by a groove arranged on the bottom plate of the tool, and the first soldering lug and the DBC substrate are placed at the corresponding position of the DBC positioning plate to fix the DBC substrate on the bottom plate in a welding mode; placing a second soldering lug, a chip and an auxiliary electrode at the corresponding position of the chip positioning plate, and positioning the chip and the auxiliary electrode for welding on the DBC substrate; the positioning pin arranged on the tool top plate corresponds to the chip in position and applies a certain force to the chip; the utility model discloses, utilize frock bottom plate, DBC locating plate, chip locating plate and frock roof to fix a position bottom plate, DBC base plate and the chip of IGBT module respectively, put into the welding stove after accomplishing and weld to once accomplish the secondary welding of the bottom plate of welding, DBC base plate and IGBT module between chip and the DBC base plate together, improved the manufacturing efficiency of IGBT module, reduced manufacturing cost.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a basic structural view of an IGBT module;

fig. 2 is a general structural diagram of a welding tool for an IGBT module provided by the present invention;

fig. 3 is a structural diagram of a tooling bottom plate provided by the present invention;

fig. 4 is a structural diagram of a DBC positioning plate provided by the present invention;

FIG. 5 is a structural diagram of the chip positioning plate provided by the present invention;

fig. 6 is a structure diagram of the tooling top plate provided by the utility model.

Wherein: 1. a tooling bottom plate; 2. an IGBT module bottom plate; 3. a DBC positioning plate; 4. a first opening; 5. chip positioning plates; 6. a second opening; 7. a tooling top plate; 8. positioning pins; 9. a DBC substrate; 10. a chip; 11. a clamping groove.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of structures consistent with certain aspects of the invention, as detailed in the appended claims.

In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and the embodiments.

Referring to fig. 2, the utility model provides a welding tool for an IGBT module, which comprises a tool bottom plate 1, wherein the tool bottom plate 1 is provided with a groove for placing the IGBT module bottom plate 2; a DBC positioning plate 3 is arranged on the IGBT module bottom plate 2, and the DBC positioning plate 3 is provided with a first area for placing a first soldering lug and a DBC substrate 9; a chip positioning plate 5 is arranged on the DBC substrate 9, and the chip positioning plate 5 is provided with a second area for placing a second soldering lug and a chip 10; and a tooling top plate 7 is arranged on the chip positioning plate 5, a positioning pin 8 is arranged on the tooling top plate 7, and the positioning pin 8 corresponds to the chip 10.

Further, the shape of the groove is matched with the shape of the IGBT module bottom plate 2, and the groove with the corresponding shape can be designed on the tool bottom plate 1 according to the shape of the IGBT module bottom plate 2.

Further, the recess includes the rectangle recess, and the long avris symmetry of rectangle recess is provided with draw-in groove 11.

Further, the DBC positioning plate 3 is rectangular, and four top corners are provided with lugs.

Further, the DBC positioning plate 3 is provided with four first openings 4, first soldering lugs are placed at the first openings 4, and a DBC substrate 9 is placed above the first soldering lugs.

Further, the chip positioning plate 5 is provided with four second openings 6, second soldering lugs are placed at the second openings 6, and the chip 10 is placed above the second soldering lugs.

Further, the center of the positioning pin 8 corresponds to the center position of the chip 10.

To sum up, the utility model provides a welding frock of this kind of IGBT module, its use specifically as follows:

firstly, referring to fig. 3, placing an IGBT module base plate 2 in a groove of a tooling base plate 1 to fix the IBT module base plate 2;

secondly, as shown in fig. 4, the DBC positioning plate 3 is placed on the tooling bottom plate 1, the bottom surface of the DBC positioning plate 3 is in contact with the IGBT module bottom plate 2, the first soldering terminal and the DBC substrate 9 are respectively placed in the first area of the DBC positioning plate 3, and the DBC substrate 9 is welded on the IGBT module bottom plate 2 for positioning;

then, referring to fig. 5, the chip positioning plate 5 is placed on the DBC positioning plate 3, the bottom surface of the chip positioning plate 5 contacts with the upper surface of the DBC substrate 9, a second bonding pad, a chip 10 and an auxiliary electrode are respectively placed in a second area of the chip positioning plate 5, and the chip 10 and the auxiliary electrode are soldered on the DBC substrate 9 for positioning;

finally, as shown in fig. 6, the tooling top plate 7 is placed on the chip positioning plate 5, and the positioning pins 8 provided on the tooling top plate 7 correspond to the positions of the chips 10, so as to apply a certain force to the chips 10.

This welding frock of IGBT module utilizes frock bottom plate 1, DBC locating plate 3, chip locating plate 5 and frock roof 7 to fix a position IGBT module bottom plate 2, DBC base plate 9 and chip 10 respectively, puts into the welding furnace and welds after accomplishing to once weld between chip 10 and the DBC base plate 9, the secondary welding of DBC base plate 9 and IGBT module bottom plate 2 is integrated once accomplishing together, has improved the manufacturing efficiency of IGBT module, has reduced manufacturing cost.

The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.

It is to be understood that the present invention is not limited to what has been described above, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. The welding tool for the IGBT module is characterized by comprising a tool bottom plate (1), wherein the tool bottom plate (1) is provided with a groove for placing an IGBT module bottom plate (2); a DBC positioning plate (3) is arranged on the IGBT module bottom plate (2), and the DBC positioning plate (3) is provided with a first area for placing a first soldering lug and a DBC substrate (9); a chip positioning plate (5) is arranged on the DBC substrate (9), and a second area for placing a second soldering lug and a chip (10) is arranged on the chip positioning plate (5); the chip positioning plate is characterized in that a tooling top plate (7) is arranged on the chip positioning plate (5), a positioning pin (8) is arranged on the tooling top plate (7), and the positioning pin (8) corresponds to the position of the chip (10).

2. The welding tooling of the IGBT module as claimed in claim 1, wherein the shape of the groove is adapted to the shape of the IGBT module base plate (2).

3. The welding tool of the IGBT module as claimed in claim 2, wherein the grooves comprise rectangular grooves, and the long sides of the rectangular grooves are symmetrically provided with clamping grooves (11).

4. The welding tool of the IGBT module as claimed in claim 1, wherein the DBC positioning plate (3) is rectangular, and four top corners are provided with lugs.

5. The welding tooling for the IGBT module according to claim 4, wherein the DBC positioning plate (3) is provided with four first openings (4), the first soldering lug is placed at the first opening (4), and the DBC substrate (9) is placed above the first soldering lug.

6. The welding tool for the IGBT module according to claim 1, wherein the chip positioning plate (5) is provided with four second openings (6), the second soldering lug is placed at the second openings (6), and a chip (10) is placed above the second soldering lug.

7. The welding tooling for the IGBT module according to claim 1, characterized in that the center of the positioning pin (8) corresponds to the center position of the chip (10).