CN216902919U

CN216902919U - Lead frame for chip packaging

Info

Publication number: CN216902919U
Application number: CN202123428354.0U
Authority: CN
Inventors: 范兆军
Original assignee: Wenyu Electronic Technology Suzhou Co ltd
Current assignee: Wenyu Electronic Technology Suzhou Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-05
Anticipated expiration: 2031-12-31

Abstract

The utility model discloses a lead frame for chip packaging, which comprises a lead frame body, wherein two sides of the lead frame body are respectively connected with two clamping claws in a clamping way, the bottom ends of four clamping claws are respectively and movably provided with a supporting plate, one side of each of two supporting plates is respectively and fixedly provided with a first expansion plate, one side of the other two supporting plates is respectively and fixedly provided with a second expansion plate, and one side of each of two second expansion plates is respectively provided with a plurality of clamping grooves. Therefore, the position of the chip is prevented from being deviated when the surface of the lead frame body is welded.

Description

Lead frame for chip packaging

Technical Field

The utility model relates to the technical field of chip packaging, in particular to a lead frame for chip packaging.

Background

Chips, also known as microcircuits, microchips, integrated circuits. The integrated circuit manufactured on the surface of a semiconductor chip is also called a thin film integrated circuit, and a thick film hybrid integrated circuit is a miniaturized circuit formed by integrating independent semiconductor equipment and passive components on a substrate or a circuit board, the most advanced integrated circuit is a 'core' of a microprocessor or a multi-core processor, can control computers, mobile phones and digital microwave ovens, and a memory and an ASIC are examples of other integrated circuit families, and are very important for the modern information society.

However, the existing lead frame still has some defects:

when the surface of the frame is provided with the chip, the chip is easy to shake, so that the position where the chip is installed can deviate, the quality of the chip installation is reduced, more time is consumed to adjust the position between the chip and the frame, the stability of the lead frame during welding is poor, and the lead frame does not have a good enough structure to clamp and fix the frame.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a lead frame for chip packaging, so as to solve the problems of the prior art that the chip mounting position may be shifted, the chip mounting quality is reduced, and it takes a long time to adjust the position between the chip and the frame, and the stability of the lead frame during soldering is poor.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a lead frame for chip package, includes the lead frame body, the equal block in both sides of lead frame body is connected with two gripper jaws, four the equal movable mounting in bottom of gripper jaw has the backup pad, wherein two the equal fixed mounting in one side of backup pad has first expansion plate, two in addition the equal fixed mounting in one side of backup pad has the second expansion plate, two a plurality of draw-in grooves have all been seted up to one side of second expansion plate, two the mounting groove has all been seted up on the top of first expansion plate, two the equal slidable mounting in inside of mounting groove has a fly leaf, two the bottom of fly leaf all is equipped with the second sucking disc, four two recesses, eight have all been seted up to the opposite side of backup pad the inside of recess all is equipped with the support frame.

As a preferable technical scheme of the utility model, the bottom ends of the two movable plates are respectively and movably hinged with the top ends of the two second suckers, and the insides of the eight grooves are respectively and slidably connected with the eight supporting frames.

As a preferable technical scheme of the utility model, support shafts are respectively inserted between the inner walls of two adjacent support frames, and one end parts of the four support shafts are respectively and movably sleeved with an auxiliary sleeve.

According to a preferable technical scheme of the utility model, the bottom ends of the four auxiliary sleeves are movably hinged with connecting columns, and the bottom ends of the four connecting columns are fixedly provided with first suckers.

According to a preferable technical scheme of the utility model, the four first suction discs are arranged at equal intervals, and the height of each connecting column is greater than that of each auxiliary sleeve.

As a preferred technical scheme of the present invention, clamping blocks are inserted and connected to one side of each of the two first expansion plates, and the two clamping blocks are respectively connected to the plurality of clamping grooves in a clamping manner.

As a preferable technical scheme of the utility model, mounting frames are fixedly mounted between the inner walls of the two first expansion plates, and the two mounting frames are arranged at corresponding positions.

As a preferable technical solution of the present invention, one side of each of the two second expansion plates is movable inside each of the two first expansion plates, and the height of each of the two second expansion plates is smaller than the height of each of the two first expansion plates.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model relates to a lead frame for chip packaging, which is provided with a clamping claw, a supporting frame, an auxiliary sleeve, a connecting column, a clamping groove and a second expansion plate, simultaneously pulling two clamping claws outwards to clamp the two clamping claws to one side of the lead frame body in a clamping way, and then, the other two clamping claws are pulled in the opposite direction to clamp the two clamping claws with the other side of the lead frame body, the two second expansion plates respectively slide in the two first expansion plates, the clamping blocks are pressed inwards to be embedded into the corresponding clamping grooves for clamping, at the moment, the first expansion plates and the second expansion plates are fixed, so the distance between the four clamping claws can be adjusted by pulling the second expansion plates, the lead frame body with different widths can be clamped, so that the stability of the lead frame body is improved, and the position of the chip is prevented from being deviated when the surface of the lead frame body is welded.

2. According to the lead frame for chip packaging, the movable plate, the second suckers, the mounting frame and the first sucker are arranged, the movable plate can slide in the mounting groove, friction force between the movable plate and the second sucker is large, so that when pressure is not applied to the movable plate, the movable plate is firmly limited in the mounting groove and cannot move, the movable plate is driven to move by pressing the two movable plates downwards, the two second suckers are attached to a desktop, the first sucker and the second sucker can suck the desktop at the same time, and the stability of the lead frame body is further improved.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is an enlarged view of the utility model at A in FIG. 1;

FIG. 3 is a partial bottom view of the present invention;

FIG. 4 is a partial side view of the present invention.

In the figure: 1. a lead frame body; 2. a gripper jaw; 3. a support plate; 4. a first expansion plate; 5. a groove; 6. a support frame; 7. a support shaft; 8. an auxiliary sleeve; 9. a first suction cup; 10. a mounting frame; 11. a second expansion plate; 12. a card slot; 13. a movable plate; 14. a second suction cup; 15. connecting columns.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution of a lead frame for chip packaging:

the first embodiment is as follows:

as shown in FIGS. 1-3, a lead frame for chip packaging comprises a lead frame body 1, two clamping claws 2 are respectively clamped and connected to two sides of the lead frame body 1, support plates 3 are movably mounted at the bottom ends of the four clamping claws 2, wherein a first expansion plate 4 is fixedly mounted at one side of each of the two support plates 3, a second expansion plate 11 is fixedly mounted at one side of each of the other two support plates 3, a plurality of clamping grooves 12 are respectively formed at one side of each of the two second expansion plates 11, mounting grooves are respectively formed at the top ends of the two first expansion plates 4, movable plates 13 are respectively slidably mounted inside the two mounting grooves, second suction cups 14 are respectively arranged at the bottom ends of the two movable plates 13, two grooves 5 are respectively formed at the other side of the four support plates 3, support frames 6 are respectively arranged inside the eight grooves 5, and the bottom ends of the two movable plates 13 are respectively movably hinged with the top ends of the two second suction cups 14, the inside of eight recesses 5 respectively with eight support frames 6 sliding connection, inwards press the fixture block, carry out the block with the inside of fixture block embedding corresponding draw-in groove 12, first expansion plate 4 and second expansion plate 11 have realized fixedly this moment, consequently can adjust the distance between four gripper jaws 2 through pulling second expansion plate 11, can carry out the centre gripping to the lead frame body 1 of different widths.

Example two:

on the basis of the first embodiment, as shown in fig. 1 and 4, support shafts 7 are inserted and connected between the inner walls of two adjacent support frames 6, one end portions of the four support shafts 7 are movably sleeved with auxiliary sleeves 8, the bottom ends of the four auxiliary sleeves 8 are movably hinged with connecting columns 15, the bottom ends of the four connecting columns 15 are fixedly provided with first suction cups 9, one sides of the two first expansion plates 4 are respectively inserted and connected with clamping blocks, and the two clamping blocks are respectively clamped and connected with the clamping grooves 12.

The working principle is as follows: when a worker needs to mount a chip on the surface of the lead frame body 1, the lead frame body 1 needs to be fixed, so the lead frame body 1 should be placed at the middle position of the four clamping claws 2, then, two clamping claws 2 are pulled outwards at the same time to clamp the two clamping claws 2 to one side of the lead frame body 1, then, the other two clamping claws 2 are pulled in the opposite direction to clamp the two clamping claws 2 to the other side of the lead frame body 1, the four clamping claws 2 respectively clamp two sides of the lead frame body 1, the inner walls of the two first expansion plates 4 are connected through the mounting frame 10, so when one clamping claw 2 is pulled, the other connected clamping claw 2 is driven to move, meanwhile, the two second expansion plates 11 move inside the two first expansion plates 4, the distance between the four clamping claws 2 can be adjusted, the clamping block is pressed inwards, one end of the clamping block is embedded into the corresponding clamping groove 12, the clamping block and the clamping groove are clamped, thereby fixing and limiting the first expansion plate 4 and the second expansion plate 11, clamping the lead frame bodies 1 with different widths, increasing the stability of the lead frame bodies 1, thereby avoiding the position of the chip from deviating when the chip is welded on the surface of the lead frame body 1, the movable plate 13 can slide in the mounting groove, the friction force between the movable plate and the mounting groove is larger, therefore, when no pressure is applied to the movable plates 13, the movable plates 13 are firmly limited in the mounting groove and cannot move, and by pressing the two movable plates 13 downwards, the movable plates 13 are driven to move, thereby make two second sucking discs 14 and the laminating each other of desktop, first sucking disc 9 and second sucking disc 14 can adsorb the desktop simultaneously, have further improved lead frame body 1's stability.

In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Lead frame for chip packaging, comprising a lead frame body (1), characterized in that: two clamping claws (2) are respectively clamped and connected on two sides of the lead frame body (1), supporting plates (3) are respectively and movably arranged at the bottom ends of the four clamping claws (2), wherein one side of each of the two supporting plates (3) is fixedly provided with a first expansion plate (4), two in addition the equal fixed mounting in one side of backup pad (3) has second expansion plate (11), two a plurality of draw-in grooves (12), two have all been seted up to one side of second expansion plate (11) the mounting groove, two have all been seted up on the top of first expansion plate (4) the equal slidable mounting in inside of mounting groove has fly leaf (13), two the bottom of fly leaf (13) all is equipped with second sucking disc (14), four two recess (5), eight have all been seted up to the opposite side of backup pad (3) the inside of recess (5) all is equipped with support frame (6).

2. The lead frame for chip packaging according to claim 1, wherein: the bottom ends of the two movable plates (13) are movably hinged to the top ends of the two second suckers (14), and the insides of the eight grooves (5) are slidably connected with the eight supporting frames (6) respectively.

3. The lead frame for chip packaging according to claim 2, wherein: two adjacent all alternate between the inner wall of support frame (6) and be connected with back shaft (7), four the equal movable sleeve of a tip of back shaft (7) is equipped with auxiliary sleeve (8).

4. The lead frame for chip packaging according to claim 3, wherein: four the bottom of auxiliary sleeve (8) is all movable articulated to have spliced pole (15), four the equal fixed mounting in bottom of spliced pole (15) has first sucking disc (9).

5. The lead frame for chip packaging according to claim 4, wherein: the four first suckers (9) are arranged at equal intervals, and the heights of the four connecting columns (15) are all larger than the heights of the four auxiliary sleeves (8).

6. The lead frame for chip packaging according to claim 1, wherein: one side of each of the two first expansion plates (4) is provided with a clamping block in an inserting mode, and the clamping blocks are connected with the clamping grooves (12) in a clamping mode respectively.

7. The lead frame for chip packaging according to claim 6, wherein: two equal fixed mounting has mounting bracket (10) between the inner wall of first expansion plate (4), two the position that mounting bracket (10) set up is corresponding.

8. The lead frame for chip packaging according to claim 1, wherein: one side of each of the two second expansion plates (11) moves in the corresponding first expansion plate (4), and the height of each of the two second expansion plates (11) is smaller than that of each of the two first expansion plates (4).