CN220895490U - Chip packaging structure convenient to it is dustproof - Google Patents
Chip packaging structure convenient to it is dustproof Download PDFInfo
- Publication number
- CN220895490U CN220895490U CN202322271565.0U CN202322271565U CN220895490U CN 220895490 U CN220895490 U CN 220895490U CN 202322271565 U CN202322271565 U CN 202322271565U CN 220895490 U CN220895490 U CN 220895490U
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- grooves
- chip
- mounting
- packaging structure
- mounting frame
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000000428 dust Substances 0.000 claims abstract description 20
- 230000002265 prevention Effects 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims abstract description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 29
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009434 installation Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 230000002411 adverse Effects 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Filtering Of Dispersed Particles In Gases (AREA)
Abstract
The utility model discloses a chip packaging structure convenient for dust prevention, which comprises a packaging plate, wherein the top surface of the packaging plate is fixedly provided with a mounting groove, and the inner surface of the mounting groove is detachably provided with a chip body; further comprises: the filter mechanism is fixedly arranged on the top surface of the packaging plate, one end, far away from the packaging plate, of the filter mechanism is fixedly provided with a mounting frame, a filter is detachably mounted on the inner surface of the mounting frame along the horizontal direction, support columns are fixedly arranged on the bottom surface of the mounting frame, close to three corners, of the support columns, and one end, far away from the mounting frame, of the three support columns is fixedly connected with the top surface of the packaging plate. This chip packaging structure convenient to it is dustproof can utilize fixture to carry out the centre gripping fixedly to the filter screen conveniently to utilize the filter screen of filter mechanism installation can play dustproof effect to the chip encapsulation, thereby reduce the adverse effect of dust to chip transmission.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a chip packaging structure convenient to prevent dust.
Background
The package is a housing for mounting a semiconductor integrated circuit chip, plays roles of placing, fixing, sealing, protecting the chip and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chip with external circuits.
A chip package as disclosed in publication number CN206893609U, which passes through the die pad; one or more die supports; and a die mounted on the die pad and the one or more die supports, the die having at least one surface with an area greater than the area of the at least one surface of the die pad, an improved chip package may be obtained, but the chip package may accumulate more dust during long-term use, the accumulated dust may reduce a chip transfer effect, and certain use defects may exist.
We have therefore proposed a chip package structure that facilitates dust prevention so as to solve the above-mentioned problems.
Disclosure of utility model
The utility model aims to provide a chip packaging structure convenient for dust prevention, which solves the problems that more dust can be accumulated in the long-time use process of the chip packaging in the current market, and the transmission effect of the chip can be reduced due to the accumulated dust.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the chip packaging structure comprises a packaging plate, wherein the top surface of the packaging plate is fixedly provided with a mounting groove, and the inner surface of the mounting groove is detachably provided with a chip body;
Further comprises: the filter mechanism is fixedly arranged on the top surface of the packaging plate, one end, far away from the packaging plate, of the filter mechanism is fixedly provided with a mounting frame, a filter is detachably mounted on the inner surface of the mounting frame along the horizontal direction, support columns are fixedly arranged on the bottom surface of the mounting frame, close to three corners, of the support columns, and one end, far away from the mounting frame, of the three support columns is fixedly connected with the top surface of the packaging plate.
Preferably, the filtering mechanism comprises a mounting column, two grooves are formed in the outer surface of one side of the mounting column, the two grooves are identical, limit grooves are formed in the inner surfaces of two sides of the grooves, and guide strips are fixedly arranged on the inner surfaces of two sides of the grooves.
Through adopting above-mentioned technical scheme for conveniently place stabilizing mean and fixture through the recess, the uniformity is strong.
Preferably, the inner surface of recess slides and is provided with stabilizing mean, one side external surface fixed of stabilizing mean is provided with the fixed plate, and a plurality of screw thread groove has been seted up to one side external surface of fixed plate, one side external surface of stabilizing mean is provided with fixture, and fixture and a plurality of screw thread groove all adapt.
Through adopting above-mentioned technical scheme for through screw groove and fixture easy to assemble or dismantle the filter screen.
Preferably, the stabilizing mechanism comprises a stabilizing block, guide grooves are formed in the outer surfaces of two sides of the stabilizing block, and the two guide grooves are respectively matched with the two guide strips.
By adopting the technical scheme, the stabilizing mechanism is convenient to install directionally through the guide groove and the guide strip.
Preferably, two sliding grooves are formed in the outer surfaces of two sides of the stabilizing block, a reset spring is fixedly arranged on the inner surface of one side of each sliding groove, one end of each reset spring is fixedly connected with a sliding block, and the two sliding blocks are respectively matched with the two limiting grooves.
Through adopting above-mentioned technical scheme for through slider and spacing groove cooperation, the firm mechanism of convenient firm installation, thereby the filter screen of convenient firm installation.
Preferably, the fixture comprises a mounting plate, clamping lines are arranged on the outer surface of one side of the mounting plate, a plurality of screw holes are formed in the outer surface of one side of the mounting plate, fixing screws are arranged on the inner surfaces of the screw holes, and the fixing screws are matched with the thread grooves.
By adopting the technical scheme, the stability of the filter screen is conveniently enhanced through the clamping lines.
Compared with the prior art, the utility model has the beneficial effects that: this chip packaging structure convenient to it is dustproof can be convenient carry out the centre gripping to the filter screen fixedly to the filter screen can have dustproof effect to the chip encapsulation, and the concrete content is as follows:
1. The filter screen is characterized in that the filter screen comprises a clamping mechanism, a stabilizing mechanism and a filtering mechanism, wherein when the filter screen is used, two ends of the filter screen are respectively placed between two fixing plates and a mounting plate, a fixing screw is rotated by using external force and is fixedly connected with a screw hole through the filter screen, after the filter screen is installed, one stabilizing mechanism is pushed to be inserted into a groove, and the other stabilizing mechanism is pulled to wind the outer sides of three support columns for one circle, finally the other stabilizing mechanism is inserted into the other groove, so that the filter screen is convenient to install, and the filter screen and the filter are matched to prevent dust from contacting a chip under the condition of normal heat dissipation, so that adverse effects of dust on chip transmission are reduced conveniently;
2. Be provided with firm mechanism, when utilizing external force to insert firm mechanism in the recess, the surface of installing column is contacted to the slider, will promote the slider and advance the spout inside to the slider will promote reset spring and produce elasticity, when the slider removes to the spacing groove position, reset spring's elasticity will promote the slider and insert in the spacing groove, thereby conveniently install the filter screen, improve work efficiency.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic diagram of a split structure of the filtering mechanism of the present utility model;
FIG. 3 is a schematic perspective view of a mounting post according to the present utility model;
FIG. 4 is a schematic view of a three-dimensional cross-sectional structure of a stabilization mechanism of the present utility model;
fig. 5 is a schematic perspective view of a clamping mechanism according to the present utility model.
In the figure: 1. a package plate; 2. a filtering mechanism; 3. a stabilizing mechanism; 4. a clamping mechanism; 10. a mounting groove; 11. a chip body; 12. a support column; 13. a mounting frame; 14. a filter; 20. a mounting column; 21. a groove; 22. a limit groove; 23. a guide bar; 24. a fixing plate; 25. a thread groove; 30. a stabilizing block; 31. a guide groove; 32. a chute; 33. a return spring; 34. a slide block; 40. a mounting plate; 41. clamping lines; 42. screw holes; 43. and (5) fixing a screw.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution: the chip packaging structure convenient to prevent dust comprises a packaging plate 1, wherein a mounting groove 10 is fixedly formed in the top surface of the packaging plate 1, and a chip body 11 is detachably arranged on the inner surface of the mounting groove 10;
Further comprises: the filter mechanism 2, the fixed top surface that sets up in package board 1, the fixed mounting frame 13 that is provided with of one end that package board 1 was kept away from to filter mechanism 2, and the internal surface of mounting frame 13 is along horizontal direction demountable installation filter 14, the bottom surface that is close to three corner of mounting frame 13 is all fixed and is provided with support column 12, and the one end that the mounting frame 13 was kept away from to three support column 12 all with the top surface fixed connection of package board 1, filter mechanism 2 contains erection column 20, two recesses 21 have been seted up to one side surface of erection column 20, and two recesses 21 are all the same, spacing groove 22 has all been seted up to recess 21's both sides internal surface, recess 21's both sides internal surface fixed is provided with gib 23, recess 21's internal surface slip is provided with stabilizing mechanism 3, one side external surface fixed plate 24 is provided with, and a plurality of screw thread groove 25 has been seted up to one side surface of fixed plate 24, one side external surface of stabilizing mechanism 3 is provided with fixture 4, and fixture 4 and a plurality of screw thread groove 25 all adapt, as shown in fig. 1 and 2, during the use, install through fixture 4, promote a stabilizing mechanism 21 internal groove 21, then insert 3, then the filter screen is not set up at another recess 3, the inside diameter of another filter screen is convenient for the chip is contacted to another and the chip is 3, the filter screen is convenient for the chip is set up under the another and the filter screen is contacted to the filter screen is cooled down to the another and the filter screen is convenient to the inside the chip is set up under the another and is contacted to the another side 3 to the inside the filter chip to the inside the chip is 3 to the inside the chip to be cooled down.
The stabilizing mechanism 3 comprises a stabilizing block 30, guide grooves 31 are respectively formed on the outer surfaces of two sides of the stabilizing block 30, the two guide grooves 31 are respectively matched with the two guide strips 23, two sliding grooves 32 are respectively formed on the outer surfaces of two sides of the stabilizing block 30, return springs 33 are fixedly arranged on one inner surface of one side of each of the two sliding grooves 32, one ends of the two return springs 33 are fixedly connected with sliding blocks 34, the two sliding blocks 34 are respectively matched with the two limiting grooves 22, the clamping mechanism 4 comprises a mounting plate 40, clamping lines 41 are arranged on one outer surface of the mounting plate 40, a plurality of screw holes 42 are formed on one outer surface of the mounting plate 40, fixing screws 43 are respectively arranged on the inner surfaces of the screw holes 42, and a plurality of set screws 43 are all adapted with a plurality of thread grooves 25, as shown in fig. 3-5, during the use, the both ends of the filter screen are respectively placed between two fixed plates 24 and the mounting plate 40, and the set screws 43 are rotated by using external force, the filter screen is firmly connected with the screw holes 42 by penetrating through the filter screen, after the installation is finished, the fixing mechanism 3 is inserted into the grooves 21 by using external force, when the sliding block 34 contacts with the outer surface of the mounting post 20, the sliding block 34 is pushed to retract into the sliding groove 32, and the sliding block 34 is pushed to push the reset spring 33 to generate elastic force, and when the sliding block 34 moves to the position of the limiting groove 22, the elastic force of the reset spring 33 is pushed to push the sliding block 34 to be inserted into the limiting groove 22, so that the filter screen is convenient to install, and the working efficiency is improved.
Working principle: when the chip packaging structure convenient for dust prevention is used, firstly, as shown in fig. 1-5, during use, two ends of a filter screen are respectively placed between two fixing plates 24 and a mounting plate 40, a fixing screw 43 is rotated by using external force, the fixing screw 43 penetrates through the filter screen to be firmly connected with a screw hole 42, after the installation is finished, the fixing screw 3 is inserted into a groove 21 by using external force, when a sliding block 34 contacts with the outer surface of a mounting column 20, the sliding block 34 is pushed to retract into the sliding groove 32, and the sliding block 34 pushes a return spring 33 to generate elastic force, when the sliding block 34 moves to the position of a limit groove 22, the elastic force of the return spring 33 pushes the sliding block 34 to be inserted into the limit groove 22, so that the fixing mechanism 3 is convenient to install, after one fixing mechanism 3 is installed, the other fixing mechanism 3 is pulled to wind a circle outside three support columns 12, finally the other fixing mechanism 3 is inserted into the other groove 21, the filter screen is convenient to install, and the filter screen and the filter 14 are matched to prevent dust from contacting with a chip under the condition of normal heat dissipation, so that adverse effects on chip transmission of dust are convenient to be reduced.
What is not described in detail in this specification is prior art known to those skilled in the art.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (6)
1. The utility model provides a chip packaging structure convenient to dustproof, includes encapsulation board (1), the fixed mounting groove (10) that is provided with of top surface of encapsulation board (1), and the interior surface dismantlement of mounting groove (10) is installed chip body (11);
Characterized by further comprising:
The filter mechanism (2) is fixedly arranged on the top surface of Feng Zhuangban (1), one end of the filter mechanism (2) away from the packaging plate (1) is fixedly provided with a mounting frame (13), the filter (14) is detachably arranged on the inner surface of the mounting frame (13) along the horizontal direction, support columns (12) are fixedly arranged on the bottom surface of the mounting frame (13) close to three corners, and one ends of the three support columns (12) away from the mounting frame (13) are fixedly connected with the top surface of the packaging plate (1).
2. The chip packaging structure facilitating dust prevention according to claim 1, wherein: the filter mechanism (2) comprises a mounting column (20), two grooves (21) are formed in the outer surface of one side of the mounting column (20), the two grooves (21) are all formed in the same mode, limit grooves (22) are formed in the inner surfaces of two sides of the grooves (21), and guide strips (23) are fixedly arranged on the inner surfaces of two sides of the grooves (21).
3. The chip packaging structure facilitating dust prevention according to claim 2, wherein: the inner surface of recess (21) slides and is provided with stabilizing mean (3), one side surface fixed of stabilizing mean (3) is provided with fixed plate (24), and one side surface of fixed plate (24) has seted up a plurality of screw groove (25), one side surface of stabilizing mean (3) is provided with fixture (4), and fixture (4) all adapt with a plurality of screw groove (25).
4. A chip package structure for facilitating dust prevention according to claim 3, wherein: the stabilizing mechanism (3) comprises a stabilizing block (30), guide grooves (31) are formed in the outer surfaces of two sides of the stabilizing block (30), and the two guide grooves (31) are respectively matched with the two guide strips (23).
5. The chip packaging structure for facilitating dust prevention according to claim 4, wherein: two sliding grooves (32) are formed in the outer surfaces of two sides of the stabilizing block (30), reset springs (33) are fixedly arranged on the inner surfaces of one sides of the two sliding grooves (32), one ends of the two reset springs (33) are fixedly connected with sliding blocks (34), and the two sliding blocks (34) are respectively matched with the two limiting grooves (22).
6. The chip packaging structure for facilitating dust prevention according to claim 5, wherein: the clamping mechanism (4) comprises a mounting plate (40), clamping lines (41) are arranged on the outer surface of one side of the mounting plate (40), a plurality of screw holes (42) are formed in the outer surface of one side of the mounting plate (40), fixing screws (43) are arranged on the inner surface of each screw hole (42), and the fixing screws (43) are matched with the screw grooves (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322271565.0U CN220895490U (en) | 2023-08-22 | 2023-08-22 | Chip packaging structure convenient to it is dustproof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322271565.0U CN220895490U (en) | 2023-08-22 | 2023-08-22 | Chip packaging structure convenient to it is dustproof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220895490U true CN220895490U (en) | 2024-05-03 |
Family
ID=90839185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322271565.0U Active CN220895490U (en) | 2023-08-22 | 2023-08-22 | Chip packaging structure convenient to it is dustproof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220895490U (en) |
-
2023
- 2023-08-22 CN CN202322271565.0U patent/CN220895490U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant |