CN220106496U - Heat dissipation insulation device for high-power MOS tube - Google Patents
Heat dissipation insulation device for high-power MOS tube Download PDFInfo
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- CN220106496U CN220106496U CN202321711853.7U CN202321711853U CN220106496U CN 220106496 U CN220106496 U CN 220106496U CN 202321711853 U CN202321711853 U CN 202321711853U CN 220106496 U CN220106496 U CN 220106496U
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- heat dissipation
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- plate
- accommodating groove
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 35
- 238000009413 insulation Methods 0.000 title claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of MOS (metal oxide semiconductor) tubes, and discloses a heat dissipation insulating device for a high-power MOS tube, which comprises a support frame, wherein the upper end face of the support frame is provided with a containing groove for containing the MOS tube, the lower end face of the support frame is provided with a second groove, the inner bottom of the containing groove is provided with a first heat-conducting plate, and the upper end face of the first heat-conducting plate is provided with an insulating plate; the retaining plate is arranged in the accommodating groove and moves in the accommodating groove through a moving structure, so that the size of the space for accommodating the MOS tube in the accommodating groove is adjustable; the heat dissipation assembly is detachably arranged in the second groove, the retaining plate and the moving structure are arranged, the retaining plate is moved by the moving structure, MOS tubes with different specifications in the accommodating groove can be abutted against according to requirements, in addition, after the retaining plate is changed in position and the high-power MOS tube is abutted against, the jackscrew can be screwed through the moving strip, so that the inner end of the jackscrew is abutted against the shallow groove, and the position of the retaining plate can be limited.
Description
Technical Field
The utility model belongs to the technical field of MOS (metal oxide semiconductor) tubes, and particularly relates to a heat dissipation insulating device for a high-power MOS tube.
Background
High-power MOS transistors are often used in large-scale and ultra-large-scale integrated circuits, and generate more heat when the high-power MOS transistors are used, so that auxiliary installation is often required by utilizing a heat dissipation device.
In the patent of 201720693400.4, a heat dissipation insulating device for high-power MOS pipe is disclosed, it is described in this patent that "MOS pipe mounting panel is including conduction supporting bottom plate and L type conduction backup pad, and L type conduction backup pad sets up in conduction supporting bottom plate's top, be provided with MOS pipe draw-in groove" between L type conduction backup pad and the conduction supporting bottom plate, this heat dissipation insulating device is when installing the MOS pipe, MOS pipe can be arranged in on the conduction supporting bottom plate, and the card is in the MOS pipe draw-in groove, although can guarantee the stability of MOS pipe, but MOS pipe draw-in groove interval is fixed, make only lay the MOS pipe of fixed specification on the conduction supporting bottom plate, just need produce different heat dissipation insulating device to the MOS pipe of different specifications, it is comparatively troublesome.
Disclosure of Invention
The utility model aims to provide a heat dissipation insulating device for a high-power MOS tube, which aims to solve the problems that the prior heat dissipation insulating device provided in the background art is fixed in the position for installing the MOS tube, only the MOS tube with fixed specification can be placed, and different heat dissipation insulating devices are required to be produced for MOS tubes with different specifications.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat dissipation and insulation device for a high power MOS transistor, comprising:
the support frame is provided with an accommodating groove for accommodating the MOS tube on the upper end face of the support frame, a second groove is formed in the lower end face of the support frame, a first heat-conducting plate is arranged at the bottom of the inner part of the accommodating groove, and an insulating plate is arranged on the upper end face of the first heat-conducting plate;
the retaining plate is arranged in the accommodating groove and moves in the accommodating groove through a moving structure, so that the size of the space for accommodating the MOS tube in the accommodating groove is adjustable;
the heat dissipation assembly is detachably arranged in the second groove and at least partially attached to the first heat conducting plate.
Preferably, the moving structure includes:
the first grooves are formed in the upper end face of the support frame and are positioned on two sides of the accommodating groove;
and the first end of the moving strip is connected with the resisting plate, and the second section of the moving strip extends into the first groove.
Preferably, the moving structure further comprises:
a jackscrew rotatable through the travel bar;
the shallow slot is formed in the bottom end of the first groove, the inner end of the jackscrew can be screwed into the shallow slot, and anti-skid patterns are arranged in the shallow slot.
Preferably, the two sides of the inside of the accommodating groove are provided with caulking grooves, and the retaining plates can be embedded into the caulking grooves.
Preferably, the heat dissipation assembly comprises a second heat conduction plate and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are inserted on the second heat conduction plate.
Preferably, slots are formed in two sides of the second groove, the end parts of the second heat-conducting plates can be inserted into the slots, screw holes are formed in two ends of the outer wall of the second heat-conducting plates, and fastening screws capable of screwing into the screw holes are arranged on the support frame.
Compared with the prior art, the utility model has the beneficial effects that:
(1) According to the MOS tube accommodating groove, the retaining plate and the moving structure are arranged, and the moving structure is utilized to move the retaining plate, so that MOS tubes with different specifications in the accommodating groove can be abutted as required.
(2) According to the movable abutting plate, the jackscrews and the shallow grooves are arranged, and after the abutting plate is changed in position to abut against the high-power MOS tube, the jackscrews can be screwed through the moving strips, so that the inner ends of the jackscrews abut against the shallow grooves, and the position of the abutting plate can be limited.
Drawings
FIG. 1 is a top view of the present utility model;
FIG. 2 is a schematic diagram of the structure of the present utility model;
FIG. 3 is a front view of the present utility model;
in the figure: 1. a support frame; 2. a first heat-conducting plate; 3. an insulating plate; 4. a retaining plate; 5. a first groove; 6. moving the bar; 7. shallow grooves; 8. a jackscrew; 9. a second groove; 10. a second heat-conducting plate; 11. a heat radiation fin; 12. a slot; 13. a screw hole; 14. a caulking groove; 15. and (5) fastening a screw.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Fig. 2 is a schematic structural diagram of the present utility model, as can be seen from the figure, the heat dissipation insulating device for MOS tubes mainly includes a supporting frame 1 and a heat dissipation component, the upper end surface of the supporting frame 1 is provided with a containing groove for containing the MOS tubes, when the high-power MOS tubes are installed, the supporting frame can be placed in the containing groove for installation, a retaining plate 4 is arranged in the containing groove, the retaining plate 4 moves in the containing groove through a moving structure, so that the space size of the MOS tubes in the containing groove can be adjusted, the containing groove with adjustable space size can clamp and fix the high-power MOS tubes with various specifications, the inner bottom of the containing groove is provided with a first heat conducting plate 2, and the upper end surface of the first heat conducting plate 2 is provided with an insulating plate 3;
in addition, the lower terminal surface of holding in palm frame 1 is equipped with second recess 9, and radiating component demountable installation is in second recess 9, and radiating component laminating in first heat-conducting plate 2 at least partially, and first heat-conducting plate 2 is used for exporting the heat of MOS pipe.
In one embodiment of the present utility model, referring to fig. 1-2, the moving structure comprises:
the first grooves 5 are formed in the upper end face of the supporting frame 1, and the first grooves 5 are located on two sides of the accommodating groove;
the moving strip 6, the first end of the moving strip 6 is connected with the resisting plate 4, and the second section of the moving strip 6 extends into the first groove 5.
By last, pulling is in the removal strip 6 one end in first recess 5, can realize the removal of butt plate 4, and the usable butt plate 4 supports it tightly fixedly from the side of high-power MOS pipe, and is comparatively convenient.
Referring to fig. 1, the moving structure further includes:
a jackscrew 8, the jackscrew 8 can be screwed through the movable strip 6;
the shallow groove 7 is formed in the bottom end of the first groove 5, the inner end of the jackscrew 8 can be screwed into the shallow groove 7, and anti-skidding patterns are arranged in the shallow groove 7.
By the above, after the position of the abutment plate 4 is changed to abut against the high-power MOS tube, the jackscrew 8 can be screwed through the moving strip 6, so that the inner end of the jackscrew 8 abuts against the shallow groove 7, and the position of the abutment plate 4 can be limited. The anti-skid threads arranged in the shallow grooves 7 can increase friction force and improve stability of the jackscrews 8 against the shallow grooves 7.
Further, referring to fig. 1, both sides of the interior of the accommodating groove are provided with the caulking groove 14, the retaining plate 4 can be embedded into the caulking groove 14, and the retaining plate 4 can be moved outwards into the caulking groove 14, so that the accommodating groove is completely exposed.
Referring to fig. 2-3, the heat dissipation assembly includes a second heat conductive plate 10 and a plurality of heat dissipation fins 11, wherein the plurality of heat dissipation fins 11 are inserted on the second heat conductive plate 10, and the inserted heat dissipation fins 11 can be pulled out for replacement after being damaged.
Specifically, the top ends of part of the radiating fins 11 are contacted with the lower end face of the first heat-conducting plate 2, and the heat generated by the MOS tube in the accommodating groove is guided to the radiating fins 11 through the first heat-conducting plate 2, so that the heat can be rapidly dissipated through the radiating fins 11 and the second heat-conducting plate 10, and the heat dissipation effect is good.
Next, referring to fig. 2-3, slots 12 are formed on both sides of the second groove 9, the end of the second heat-conducting plate 10 can be inserted into the slots 12, screw holes 13 are formed on both ends of the outer wall of the second heat-conducting plate 10, and fastening screws 15 capable of screwing into the screw holes 13 are arranged on the supporting frame 1.
Through the technical scheme:
when the heat radiation assembly is used, two ends of the second heat conduction plate 10 can be inserted along the slots 12 when the heat radiation assembly is installed, the accuracy of the installation of the heat radiation assembly can be ensured, the skew occurrence is reduced, after the top ends of the heat radiation fins 11 are abutted against the inside of the second grooves 9 and the lower end face of the first heat conduction plate 2, the fastening screws 15 can be screwed, and the fastening screws 15 are screwed through the screw holes 13 to limit.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A heat dissipation insulating device for high-power MOS pipe, characterized by comprising:
the MOS tube support comprises a support frame (1), wherein an accommodating groove for accommodating the MOS tube is formed in the upper end face of the support frame (1), a second groove (9) is formed in the lower end face of the support frame (1), a first heat-conducting plate (2) is arranged at the bottom of the interior of the accommodating groove, and an insulating plate (3) is arranged on the upper end face of the first heat-conducting plate (2);
the retaining plate (4) is arranged in the accommodating groove, and the retaining plate (4) moves in the accommodating groove through a moving structure so that the size of a space for accommodating the MOS tube in the accommodating groove can be adjusted;
the heat dissipation assembly is detachably arranged in the second groove (9), and at least part of the heat dissipation assembly is attached to the first heat conduction plate (2).
2. The heat dissipation and insulation device for a high-power MOS transistor of claim 1, wherein: the moving structure includes:
the first grooves (5) are formed in the upper end face of the supporting frame (1), and the first grooves (5) are located on two sides of the accommodating groove;
and the first end of the moving strip (6) is connected with the retaining plate (4), and the second section of the moving strip (6) extends into the first groove (5).
3. The heat dissipation and insulation device for a high-power MOS transistor according to claim 2, wherein: the moving structure further includes:
a jackscrew (8), the jackscrew (8) being rotatable through the moving bar (6);
shallow slot (7), shallow slot (7) are seted up in the bottom of first recess (5), the inner of jackscrew (8) can spin to shallow slot (7) in, just be equipped with the anti-skidding line in shallow slot (7).
4. The heat dissipation and insulation device for a high-power MOS transistor according to claim 2, wherein: the embedded grooves (14) are formed in two sides of the inner portion of the accommodating groove, and the retaining plates (4) can be embedded into the embedded grooves (14).
5. The heat dissipation and insulation device for a high-power MOS transistor of claim 1, wherein: the heat dissipation assembly comprises a second heat conduction plate (10) and a plurality of heat dissipation fins (11), and the heat dissipation fins (11) are inserted on the second heat conduction plate (10).
6. The heat dissipation and insulation device for a high-power MOS transistor as claimed in claim 5, wherein: the two sides of the second groove (9) are provided with slots (12), the end parts of the second heat-conducting plates (10) can be inserted into the slots (12), the two ends of the outer wall of the second heat-conducting plates (10) are provided with screw holes (13), and the support frame (1) is provided with fastening screws (15) which can be screwed into the screw holes (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321711853.7U CN220106496U (en) | 2023-07-03 | 2023-07-03 | Heat dissipation insulation device for high-power MOS tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321711853.7U CN220106496U (en) | 2023-07-03 | 2023-07-03 | Heat dissipation insulation device for high-power MOS tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106496U true CN220106496U (en) | 2023-11-28 |
Family
ID=88842174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321711853.7U Active CN220106496U (en) | 2023-07-03 | 2023-07-03 | Heat dissipation insulation device for high-power MOS tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106496U (en) |
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2023
- 2023-07-03 CN CN202321711853.7U patent/CN220106496U/en active Active
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