CN221226217U

CN221226217U - Protective structure for multi-chip parallel high-power silicon carbide module

Info

Publication number: CN221226217U
Application number: CN202322573427.8U
Authority: CN
Inventors: 赵小俊; 陈春波; 马欢
Original assignee: Shenzhen Changlian Semiconductor Technology Co ltd
Current assignee: Shenzhen Changlian Semiconductor Technology Co ltd
Priority date: 2023-09-21
Filing date: 2023-09-21
Publication date: 2024-06-25
Anticipated expiration: 2033-09-21

Abstract

The utility model discloses a protection structure for a multi-chip parallel high-power silicon carbide module, which belongs to the technical field of silicon carbide modules and comprises a conductive substrate, wherein L-shaped clamping plates are arranged on two sides of the top of the conductive substrate, a U-shaped mounting frame is arranged on the top of the conductive substrate, and a protection mechanism is arranged above the inside of the U-shaped mounting frame.

Description

Protective structure for multi-chip parallel high-power silicon carbide module

Technical Field

The utility model relates to the technical field of silicon carbide modules, in particular to a protection structure for a multi-chip parallel high-power silicon carbide module.

Background

Silicon carbide is a third generation compound semiconductor material, a basic stone of the semiconductor industry is a chip, and core materials for manufacturing the chip are divided into: first generation semiconductor materials, second generation compound semiconductor materials, third generation compound semiconductor materials, silicon carbide due to its superior physical properties: the material has high forbidden bandwidth, high electrical conductivity and high thermal conductivity, and is the most widely used base material for manufacturing semiconductor chips in the future.

The existing protection structure of the multi-chip parallel high-power silicon carbide module has the following defects: when the multi-chip parallel high-power silicon carbide module is arranged on the circuit board, high heat is easy to generate in long-time operation of the multi-chip parallel high-power silicon carbide module, heat dissipation is not timely or the heat dissipation effect is poor, on one hand, damage or faults are easy to occur due to the fact that the multi-chip parallel high-power silicon carbide module is damaged, on the other hand, the multi-chip parallel high-power silicon carbide module is severely heated, the situation that the operation efficiency of the multi-chip parallel high-power silicon carbide module is low is caused, and further stable output of the multi-chip parallel high-power silicon carbide module is reduced, and durability of the multi-chip parallel high-power silicon carbide module is also affected.

There is a need to develop a protective structure for multi-chip parallel high power silicon carbide modules.

Disclosure of utility model

The utility model aims to provide a protection structure for a multi-chip parallel high-power silicon carbide module, which is provided with a protection mechanism, wherein the protection mechanism is arranged on a U-shaped mounting frame, the U-shaped mounting frame is arranged on a conductive substrate in a sliding manner, the protection mechanism has a heat dissipation effect, and is matched with a heat dissipation fan on the U-shaped mounting frame, so that a plurality of chips and the high-power silicon carbide module can be effectively subjected to heat dissipation treatment in operation, the condition that the operation stability is affected due to untimely heat dissipation or poor heat dissipation effect is avoided, the stability of the multi-chip parallel high-power silicon carbide module is effectively improved, and the problem that the operation stability is affected due to the fact that the multi-chip parallel high-power silicon carbide module is easily subjected to insufficient heat dissipation is solved in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a protective structure for high-power carborundum module of multicore piece parallel connection, includes conductive substrate, L type cardboard is all installed to conductive substrate's top both sides, U type mounting bracket is installed at conductive substrate's top, protection machanism is installed to the inside top of U type mounting bracket;

the protection mechanism comprises a mounting part and a protection part, wherein the mounting part is connected with the U-shaped mounting frame, and the protection part is connected with the mounting part.

Preferably, a circuit board is installed at the top center position of the conductive substrate, chips are arranged on one side of the top of the circuit board, and silicon carbide modules are installed on the other side of the top of the circuit board.

Preferably, the both sides outer wall below of U type mounting bracket all is provided with the slider, the outer wall and the inner wall sliding connection of L type cardboard of slider, the mounting groove has been seted up to the upper surface central point of U type mounting bracket.

Preferably, the frame is all installed to the top both sides of U type mounting bracket, the internally mounted of frame has radiator fan.

Preferably, the installation component is the mounting panel, the spout has all been seted up to the upper surface both sides of mounting panel, the through-hole has been seted up to the upper surface central point of mounting panel put, the connecting rod is all installed to the top both sides of mounting panel, the top of connecting rod and the inside top fixed connection of U type mounting bracket, the protection component is the screw rod, the screw rod is established to two sets of, two sets of the screw rod is installed respectively in the inside of spout, the outer wall of screw rod and the inner wall sliding connection of spout.

Preferably, lock nut A and lock nut B are arranged above the outer wall of the screw rod respectively, lock nut A and lock nut B are located above and below the mounting plate, the inner walls of lock nut A and lock nut B are in threaded connection with the outer wall of the screw rod, a heat conducting aluminum plate is arranged at the bottom end of the screw rod, cooling fins are arranged at the top of the heat conducting aluminum plate, and a silicone grease layer is arranged at the bottom of the heat conducting aluminum plate.

Compared with the prior art, the utility model has the beneficial effects that:

through being equipped with protection machanism, install protection machanism at U type mounting bracket to install U type mounting bracket on electrically conductive base plate with gliding mode, utilize protection machanism to have the radiating effect, the radiator fan on the collocation U type mounting bracket makes a plurality of chips and high-power carborundum module in operation, can carry out effectual heat dissipation and handle, avoids appearing radiating untimely or the poor condition emergence that influences the operation stability of radiating effect, the effectual stability that has improved the parallel high-power carborundum module of multichip.

Drawings

FIG. 1 is a front cross-sectional view of the present utility model;

FIG. 2 is a top view of a U-shaped mounting bracket provided by the utility model;

FIG. 3 is a front cross-sectional view of the guard mechanism provided by the present utility model;

fig. 4 is a perspective view of a structure of a protection mechanism provided by the utility model.

In the figure: 1. a conductive substrate; 101. an L-shaped clamping plate; 102. a circuit board; 103. a chip; 104. a silicon carbide module; 2. u-shaped mounting rack; 201. a slide block; 202. a frame; 203. a heat radiation fan; 301. a mounting plate; 302. a chute; 303. a through hole; 304. a connecting rod; 305. a screw; 306. a lock nut A; 307. a lock nut B; 308. a heat conducting aluminum plate; 309. a heat sink; 310. and a silicone grease layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Please refer to fig. 1-4;

The utility model relates to a protection structure for a multi-chip parallel high-power silicon carbide module, which comprises a conductive substrate 1, wherein L-shaped clamping plates 101 are arranged on two sides of the top of the conductive substrate 1, a circuit board 102 is arranged in the center of the top of the conductive substrate 1, a chip 103 is arranged on one side of the top of the circuit board 102, a silicon carbide module 104 is arranged on the other side of the top of the circuit board 102, a U-shaped mounting frame 2 is arranged on the top of the conductive substrate 1, sliding blocks 201 are arranged below the outer walls of the two sides of the U-shaped mounting frame 2, the outer walls of the sliding blocks 201 are in sliding connection with the inner walls of the L-shaped clamping plates 101, the U-shaped mounting frame 2 is arranged on the conductive substrate 1 in a push-pull mode, so that the U-shaped mounting frame 2 is dismounted, racks 202 are arranged on two sides of the top of the U-shaped mounting frame 2, a cooling fan 203 is arranged in the rack 202, the cooling fan 203 is used for cooling the inside of the U-shaped mounting frame 2, after the U-shaped mounting frame 2 is prevented from influencing the heat dissipation of the circuit board 102 arranged on the conductive substrate 1, and a protection mechanism is arranged above the inside of the U-shaped mounting frame 2;

The protection mechanism comprises a mounting part and a protection part, wherein the mounting part is connected with the U-shaped mounting frame 2, the protection part is connected with the mounting part, the mounting part is a mounting plate 301, sliding grooves 302 are formed in two sides of the upper surface of the mounting plate 301, through holes 303 are formed in the center of the upper surface of the mounting plate 301, connecting rods 304 are arranged on two sides of the top of each mounting plate 301, the top ends of the connecting rods 304 are fixedly connected with the inner top end of the U-shaped mounting frame 2, the protection part is screw rods 305, the screw rods 305 are arranged in two groups, the two groups of screw rods 305 are respectively arranged in the sliding grooves 302, the outer walls of the screw rods 305 are in sliding connection with the inner walls of the sliding grooves 302, the screw rods 305 can slide back and forth on the mounting plate 301 in a sliding manner, locking nuts A306 and locking nuts B307 are respectively arranged above the outer walls of the screw rods 305, the lock nut A306 and the lock nut B307 are positioned above and below the mounting plate 301, the inner walls of the lock nut A306 and the lock nut B307 are in threaded connection with the outer wall of the screw 305, after the position of the screw 305 is adjusted, the lock nut A306 and the lock nut B307 can be used for locking the screw 305, so that the screw 305 is locked and fixed, the bottom end of the screw 305 is provided with the heat conducting aluminum plate 308, the top of the heat conducting aluminum plate 308 is provided with the radiating fins 309, the bottom of the heat conducting aluminum plate 308 is provided with the silicone grease layer 310, the lower surface of the heat conducting aluminum plate 308 is attached to the upper surfaces of the chips 103 and the silicon carbide modules 104, and the silicone grease layer 310 is coated on the silicone grease layer, and is matched with the radiating fan 203 and the radiating fins 309, so that the heat dissipation treatment of a plurality of groups of chips 103 and the silicon carbide modules 104 is achieved, and the situation that the operation stability is influenced due to untimely heat dissipation or poor heat dissipation effect is avoided.

Working principle: in the utility model, the U-shaped mounting frame 2 is arranged in the L-shaped clamping plate 101 on the conductive substrate 1 by the sliding block 201, the U-shaped mounting frame 2 is arranged on the conductive substrate 1 in a push-pull way, so as to realize the dismounting treatment of the U-shaped mounting frame 2, four groups of racks 202 are arranged at the top of the U-shaped mounting frame 2, and four groups of cooling fans 203 are correspondingly arranged in the racks 202, so that the cooling fans 203 perform cooling treatment on the inside of the U-shaped mounting frame 2, the heat dissipation of the circuit board 102 arranged on the conductive substrate 1 is prevented from being influenced after the U-shaped mounting frame 2 is arranged, the mounting plate 301 on the protection mechanism is fixed at the top end of the inside of the U-shaped mounting frame 2 by the connecting rod 304, two groups of screw rods 305 are arranged in the sliding grooves 302 on the mounting plate 301 in a sliding way, the screw rods 305 can slide back and forth on the mounting plate 301, through set up lock nut A306 and lock nut B307 on the outer wall with screw 305 to with its threaded connection, make screw 305 position adjustment back, can carry out locking treatment by lock nut A306 and lock nut B307, thereby reach and lock fixedly to screw 305, through setting up heat conduction aluminum plate 308 with the bottom of screw 305, and set up multiunit chip 103 and carborundum module 104 on the circuit board 102, make heat conduction aluminum plate 308 lower surface laminating chip 103 and carborundum module 104's upper surface, scribble to the silicone grease on the silicone grease layer 310 again, match radiator fan 203 and fin 309, thereby reach carrying out the heat dissipation to multiunit chip 103 and carborundum module 104 and handle, avoid appearing the untimely or the poor condition of radiating effect and influence the stable condition of operation and take place, the effectual stability that improves the multicore piece and connects high-power carborundum module.

Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner so long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of brevity and resource saving. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a protective structure for high-power carborundum module of multicore piece parallel connection, includes conductive substrate (1), L type cardboard (101) are all installed to conductive substrate's (1) top both sides, U type mounting bracket (2) are installed at conductive substrate's (1) top, its characterized in that: a protection mechanism is arranged above the inside of the U-shaped mounting frame (2);

The protection mechanism comprises a mounting part and a protection part, wherein the mounting part is connected with the U-shaped mounting frame (2), and the protection part is connected with the mounting part.

2. The protective structure for a multi-chip parallel high power silicon carbide module according to claim 1, wherein: the silicon carbide chip is characterized in that a circuit board (102) is arranged at the center of the top of the conductive substrate (1), chips (103) are arranged on one side of the top of the circuit board (102), and silicon carbide modules (104) are arranged on the other side of the top of the circuit board (102).

3. The protective structure for a multi-chip parallel high power silicon carbide module according to claim 1, wherein: the U-shaped mounting frame is characterized in that sliding blocks (201) are arranged below the outer walls of the two sides of the U-shaped mounting frame (2), and the outer walls of the sliding blocks (201) are slidably connected with the inner walls of the L-shaped clamping plates (101).

4. The protective structure for a multi-chip parallel high power silicon carbide module according to claim 1, wherein: the cooling device is characterized in that racks (202) are arranged on two sides of the top of the U-shaped mounting frame (2), and a cooling fan (203) is arranged in the racks (202).

5. The protective structure for a multi-chip parallel high power silicon carbide module according to claim 1, wherein: the mounting component is a mounting plate (301), sliding grooves (302) are formed in two sides of the upper surface of the mounting plate (301), through holes (303) are formed in the center of the upper surface of the mounting plate (301), connecting rods (304) are arranged on two sides of the top of the mounting plate (301), the top ends of the connecting rods (304) are fixedly connected with the inner top ends of the U-shaped mounting frames (2), the protection component is a screw (305), the screw (305) is arranged into two groups, the two groups of screw (305) are respectively arranged in the sliding grooves (302), and the outer walls of the screw (305) are in sliding connection with the inner walls of the sliding grooves (302).

6. The protective structure for a multi-chip parallel high power silicon carbide module according to claim 5, wherein: the screw rod (305) outer wall top is provided with lock nut A (306) and lock nut B (307) respectively, lock nut A (306) and lock nut B (307) are located the top and the below of mounting panel (301), lock nut A (306) and lock nut B (307)'s inner wall and screw rod (305) outer wall threaded connection, heat conduction aluminum plate (308) are installed to screw rod (305)'s bottom, heat conduction aluminum plate (308)'s top all is provided with fin (309), heat conduction aluminum plate (308) bottom is provided with silicone grease layer (310).