CN220105653U

CN220105653U - Cold plate attaching structure for reducing CPU contact thermal resistance

Info

Publication number: CN220105653U
Application number: CN202321557101.XU
Authority: CN
Inventors: 王亚君
Original assignee: Shanghai Repu Electronic Technology Co ltd
Current assignee: Shanghai Repu Electronic Technology Co ltd
Priority date: 2023-06-19
Filing date: 2023-06-19
Publication date: 2023-11-28
Anticipated expiration: 2033-06-19

Abstract

The utility model discloses a cold plate attaching structure for reducing CPU contact thermal resistance, and particularly relates to the technical field of cold plate attaching. According to the utility model, twelve copper pipes are arranged between the first copper plate and the aluminum alloy plate, so that the heat dissipation speed of the CPU is greatly increased, the heat conduction silica gel is coated in the caulking groove at the bottom of the first copper plate and is contacted with the top surface of the CPU, and the contact thermal resistance between the CPU and the first copper plate is reduced, so that the heat conduction speed is increased, the structure is simple, and the installation is very convenient.

Description

Cold plate attaching structure for reducing CPU contact thermal resistance

Technical Field

The utility model relates to the technical field of cold plate bonding, in particular to a cold plate bonding structure for reducing CPU contact thermal resistance.

Background

In order to effectively protect a circuit board of a core device in a computer, a fully-closed chassis is a common design mode. The heat generated by the computer during operation needs to be timely conducted out and dissipated under the closed space, and the device is especially similar to a CPU high-power-consumption component. For example, the whole machine structures such as CPEX and VPX are provided, key components on the circuit board are attached to the cold plate, the cold plate is attached to the side wall of the case, and the side wall dissipates heat in a natural convection or forced convection mode. For example, in the cold plate attaching structure for reducing the contact thermal resistance of a CPU (Central processing Unit) disclosed by the prior art with the publication number of CN217484817U, the CPU is attached to a copper block, the heat conduction paste with larger contact thermal resistance is not used for filling, the heat conduction silicone grease with smaller contact thermal resistance is used for filling, so that the contact thermal resistance is effectively reduced, the heat of the CPU can be more rapidly led out of the aluminum guide plate through a heat pipe on the copper block, and the temperature equalizing effect of the cold plate can be better achieved.

However, the above prior art has the following problems when in use: after long-time use, copper pipe outer wall can adhesion dust, need clear up regularly, avoid these dust impurity to influence the transmission of heat, because all be in the same place between a plurality of heat pipes and copper piece and the copper to copper pipe and aluminium alloy plate weld together equally, very inconvenient when clearing up the copper pipe, and also inconvenient change after the copper pipe damages.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model provides the cold plate attaching structure for reducing the contact thermal resistance of the CPU, which is characterized in that twelve copper pipes are arranged between the first copper plate and the aluminum alloy plate, so that the heat dissipation speed of the CPU is greatly accelerated, heat conducting silica gel is coated in the caulking groove at the bottom of the first copper plate and is contacted with the top surface of the CPU, the contact thermal resistance between the CPU and the first copper plate is reduced, the heat conduction speed is improved, the structure is simple, and the installation is very convenient, so that the problems in the background art are solved.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a reduce cold plate laminating structure of CPU contact thermal resistance, includes the aluminium alloy plate, the mounting groove has been seted up at the aluminium alloy plate top, placed the CPU in the mounting groove, the aluminium alloy plate top is equipped with first copper, first copper top is seted up flutedly, be equipped with the second copper in the recess, be equipped with four sets of heat conduction components between first copper and the aluminium alloy plate for improve CPU's heat conduction rate, every heat conduction component of group all includes three copper pipe, twelve first semicircle grooves have been seted up on first copper outer wall surface, and every copper pipe is established respectively in every first semicircle groove, twelve second semicircle grooves have been seted up at the aluminium alloy plate top for placement of copper pipe.

In a preferred embodiment, a caulking groove is formed in the bottom of the first copper plate, heat-conducting silica gel is filled in the caulking groove, and the bottom of the heat-conducting silica gel is in contact with the top of the CPU and is used for reducing the contact thermal resistance between the CPU and the first copper plate.

In a preferred embodiment, four positioning blocks are fixedly arranged at the top of the aluminum alloy plate, four positioning grooves are formed in the bottom of the first copper plate, and the four positioning blocks are respectively arranged in the four positioning grooves, so that the first copper plate can be positioned quickly.

In a preferred embodiment, four clamping plates are arranged at the top of the aluminum alloy plate, three third semicircular grooves are formed in the bottom of each clamping plate, the inner walls of the three third semicircular grooves are respectively contacted with the tops of the three copper pipes, and the stability of the copper pipes is improved.

In a preferred embodiment, the two sides of each clamping plate are fixed with the aluminum alloy plates through screws, so that the clamping plates can be conveniently installed and detached.

In a preferred embodiment, two fixing grooves are formed in two sides of the top of the first copper plate, first screws are connected in each fixing groove in a threaded mode, and the bottoms of the first screws are connected with aluminum alloy plates in a threaded mode, so that the first copper plate is convenient to install and detach.

In a preferred embodiment, the second copper plate and the first copper plate are fixed through four second screws, so that the second copper plate is convenient to mount and dismount.

The utility model has the technical effects and advantages that:

1. according to the utility model, twelve copper pipes are arranged between the first copper plate and the aluminum alloy plate, so that the heat dissipation speed of the CPU is greatly increased, the heat conduction silica gel is coated in the caulking groove at the bottom of the first copper plate and is contacted with the top surface of the CPU, and the contact thermal resistance between the CPU and the first copper plate is reduced, so that the heat conduction speed is increased, the structure is simple, and the installation is very convenient.

2. Through four splint of installation at aluminium alloy plate top, utilize splint to carry out spacingly to three copper pipes, improve the stability of copper pipe in the semicircle inslot of second, after long-time use, the staff can loosen the second copper earlier, then loosens four splint, can pull down twelve copper pipes and clear up the change, unpack apart simultaneously and change the heat conduction silica gel in the caulking groove of first copper, avoid heat conduction silica gel to reduce after long-term use heat conductivility, influence the heat conduction speed to CPU.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a top plan view of the overall structure of the present utility model;

FIG. 3 is a view showing a structure of a first copper plate and an aluminum alloy plate according to the present utility model;

FIG. 4 is a bottom view of FIG. 3 of the present utility model;

fig. 5 is a schematic view of a first copper plate according to the present utility model.

The reference numerals are: 1. aluminum alloy plate; 2. a mounting groove; 3. a CPU; 4. a first copper plate; 5. a groove; 6. a second copper plate; 7. a heat conducting component; 8. a caulking groove; 9. thermally conductive silica gel; 10. a positioning block; 11. a positioning groove; 12. a clamping plate; 13. a third semicircular groove; 14. a screw; 15. a fixing groove; 16. a first screw; 17. a second screw;

701. copper pipe; 702. a first semicircular groove; 703. a second semicircular groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to the accompanying drawings 1-5 of the specification, the utility model provides a cold plate attaching structure for reducing CPU contact thermal resistance, which comprises an aluminum alloy plate 1, wherein the top of the aluminum alloy plate 1 is provided with a mounting groove 2, a CPU3 is placed in the mounting groove 2, the top of the aluminum alloy plate 1 is provided with a first copper plate 4, the top of the first copper plate 4 is provided with a groove 5, the groove 5 is internally provided with a second copper plate 6, four groups of heat conducting components 7 are arranged between the first copper plate 4 and the aluminum alloy plate 1 and are used for improving the heat conducting speed of the CPU3, each group of heat conducting components 7 comprises three copper pipes 701, the outer wall surface of the first copper plate 4 is provided with twelve first semicircular grooves 702, each copper pipe 701 is respectively arranged in each first semicircular groove 702, and the top of the aluminum alloy plate 1 is provided with twelve second semicircular grooves 703 used for placing copper pipes 701;

and caulking groove 8 has been seted up to first copper 4 bottom, the intussuseption of caulking groove 8 is filled with heat conduction silica gel 9, heat conduction silica gel 9 bottom and CPU3 top contact for reduce the thermal contact resistance between CPU3 and the first copper 4, aluminum alloy plate 1 top is fixed to be equipped with four locating pieces 10, four constant head tanks 11 have been seted up to first copper 4 bottom, and four locating pieces 10 are established respectively in four constant head tanks 11, are convenient for fix a position first copper 4 fast.

Through setting up first copper 4 at CPU3 top and conducting heat, heat is conducted to twelve copper pipes 701 in through first copper 4, then by copper pipe 701 with heat dispersion conduction to aluminium alloy plate 1 on, accelerate CPU 3's radiating rate greatly, utilize four locating pieces 10 and four constant head tank 11 cooperation, the locating piece 10 top flushes with CPU3 top surface, during installation first copper 4, the staff only need with four locating pieces 11 with four locating pieces 10 align insert can, it is very convenient to install, and the locating piece 10 can improve the steadiness between first copper 4 and the aluminium alloy plate 1, avoid first copper 4 to rock the influence to the spacing of CPU3, it has heat conduction silica gel 9 to scribble in first copper 4 bottom caulking groove 8, heat conduction silica gel 9 contacts with CPU3 top surface, reduce the contact thermal resistance between CPU3 and the first copper 4, thereby improve the speed of heat conduction, the structure is simple, it is very convenient to use.

Referring to the attached drawings 1-5 of the specification, the utility model provides a cold plate attaching structure for reducing CPU contact thermal resistance, the top of the aluminum alloy plate 1 is provided with four clamping plates 12, the bottom of each clamping plate 12 is provided with three third semicircular grooves 13, the inner walls of the three third semicircular grooves 13 are respectively contacted with the top of three copper pipes 701, the stability of the copper pipes 701 is improved, and the two sides of each clamping plate 12 are fixed with the aluminum alloy plate 1 through screws 14, so that the clamping plates 12 are convenient to mount and dismount;

and two fixed slots 15 have all been seted up to first copper 4 top both sides, and equal threaded connection has first screw 16 in every fixed slot 15, first screw 16 bottom and aluminium alloy plate 1 threaded connection, the convenient to mount and dismantles first copper 4, it is fixed through four second screws 17 between second copper 6 and the first copper 4, the convenient to mount and dismantles second copper 6.

Through four splint 12 of installation at aluminium alloy plate 1 top, utilize splint 12 to carry out spacingly to three copper pipe 701, improve the stability of copper pipe 701 in second semicircle groove 703, after long-time use, the staff unclamps first copper 4 earlier, then unclamps four splint 12, can tear down twelve copper pipes 701 and clear up the change, unpack apart simultaneously first copper 4 and change the heat conduction silica gel 9 in the caulking groove 8, avoid heat conduction silica gel 9 to use after a long time heat conduction performance reduction, influence the heat conduction speed to CPU 3.

Finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.

Claims

1. The utility model provides a reduce cold plate laminating structure of CPU contact thermal resistance, includes aluminium alloy plate (1), its characterized in that: the aluminum alloy plate (1) is characterized in that an installation groove (2) is formed in the top of the aluminum alloy plate (1), a CPU (Central processing Unit) is placed in the installation groove (2), a first copper plate (4) is arranged at the top of the aluminum alloy plate (1), a groove (5) is formed in the top of the first copper plate (4), and a second copper plate (6) is arranged in the groove (5);

four groups of heat conduction assemblies (7) are arranged between the first copper plate (4) and the aluminum alloy plate (1) and used for improving the heat conduction speed of the CPU (3);

every group heat conduction subassembly (7) all include three copper pipe (701), twelve first semicircle grooves (702) have been seted up to first copper (4) outer wall surface, and every copper pipe (701) are established respectively in every first semicircle groove (702), twelve second semicircle grooves (703) have been seted up at aluminium alloy plate (1) top for placing of copper pipe (701).

2. The cold plate attaching structure for reducing contact thermal resistance of a CPU according to claim 1, wherein: the embedded groove (8) is formed in the bottom of the first copper plate (4), heat conduction silica gel (9) is filled in the embedded groove (8), and the bottom of the heat conduction silica gel (9) is in contact with the top of the CPU (3) and used for reducing contact thermal resistance between the CPU (3) and the first copper plate (4).

3. The cold plate attaching structure for reducing contact thermal resistance of a CPU according to claim 1, wherein: four locating blocks (10) are fixedly arranged at the top of the aluminum alloy plate (1), four locating grooves (11) are formed in the bottom of the first copper plate (4), and the four locating blocks (10) are respectively arranged in the four locating grooves (11) so as to be convenient for rapidly locating the first copper plate (4).

4. The cold plate attaching structure for reducing contact thermal resistance of a CPU according to claim 1, wherein: four clamping plates (12) are arranged at the top of the aluminum alloy plate (1), three third semicircular grooves (13) are formed in the bottom of each clamping plate (12), the inner walls of the three third semicircular grooves (13) are respectively contacted with the tops of the three copper pipes (701), and the stability of the copper pipes (701) is improved.

5. The cold plate attaching structure for reducing contact thermal resistance of a CPU according to claim 1, wherein: the two sides of each clamping plate (12) are fixed with the aluminum alloy plate (1) through screws (14), so that the clamping plates (12) are convenient to install and detach.

6. The cold plate attaching structure for reducing contact thermal resistance of a CPU according to claim 1, wherein: two fixing grooves (15) are formed in two sides of the top of the first copper plate (4), first screws (16) are connected in each fixing groove (15) in a threaded mode, the bottoms of the first screws (16) are connected with the aluminum alloy plate (1) in a threaded mode, and the first copper plate (4) is convenient to install and detach.

7. The cold plate attaching structure for reducing contact thermal resistance of a CPU according to claim 1, wherein: the second copper plate (6) and the first copper plate (4) are fixed through four second screws (17), so that the second copper plate (6) is convenient to install and detach.