CN210666269U - Heat dissipation structure of backlight driving power supply of liquid crystal display television - Google Patents
Heat dissipation structure of backlight driving power supply of liquid crystal display television Download PDFInfo
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- CN210666269U CN210666269U CN201921605175.XU CN201921605175U CN210666269U CN 210666269 U CN210666269 U CN 210666269U CN 201921605175 U CN201921605175 U CN 201921605175U CN 210666269 U CN210666269 U CN 210666269U
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- power supply
- backlight
- heat
- backlight driving
- conducting piece
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Abstract
The utility model discloses a LCD TV drive power supply heat radiation structure in a poor light belongs to LCD TV product field, provides a new LCD TV drive power supply heat radiation structure in a poor light, including backlight drive circuit subassembly and mounting substrate, including backlight drive circuit board and backlight drive switch MOS pipe in the backlight drive circuit subassembly, still include the switching heat-conducting piece, a side surface of switching heat-conducting piece is connected with a side surface laminating of backlight drive switch MOS pipe, another side surface of switching heat-conducting piece with a side wall laminating of mounting substrate is connected. The utility model discloses in through setting up the switching heat-conducting piece, be shaded through the switching heat-conducting piece and drive switch MOS pipe and mounting substrate be connected the heat conduction, but make full use of mounting substrate dispels the heat, consequently can improve the radiating effect to the drive switch MOS pipe in a poor light effectively, solved the heat dissipation problem of the high-power drive power supply in a poor light more than 200W.
Description
Technical Field
The utility model relates to a LCD TV product field especially relates to a LCD TV drive power supply heat radiation structure that is shaded.
Background
The LED backlight is the mainstream backlight module of the liquid crystal display television at present, and the driving power of the backlight module is different according to the different sizes of liquid crystal screens. Especially, the mass production of the large-screen liquid crystal television with size more than 75 inches increases the backlight power from the current liquid crystal television generally less than 150W to more than 200W. Due to the increase of the backlight power, the heat loss of the backlight driving power supply switch MOS tube is correspondingly increased, so that the operation temperature of the driving power supply is effectively reduced, and the normal work of the power supply is ensured.
At present, two methods are generally adopted for heat dissipation of a backlight driving power switch MOS tube: one is to use the copper foil of the double-sided PCB of the driving power supply to dissipate heat (see figure 2), which is suitable for the driving power supply with the power consumption below 80W, and the other is to use a special aluminum profile radiator to dissipate heat, which is suitable for the driving power supply with the power consumption below 150W (see figure 3). If the aluminum profile radiator is used for radiating the high-power backlight driving power supply of more than 200W, the area and the volume of the radiator need to be increased, but the length and the height of the radiator are limited by the internal space of the liquid crystal television, so that the aluminum profile radiator with the increased area and the increased volume cannot be effectively applied to the installation of the backlight driving circuit system in the liquid crystal television.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a new LCD TV drive power supply heat radiation structure in a poor light, can improve the radiating effect to the drive power supply switch MOS pipe in a poor light effectively.
The utility model provides a technical scheme that its technical problem adopted is: the liquid crystal display television backlight driving power supply heat dissipation structure comprises a backlight driving circuit assembly and a mounting substrate, wherein the backlight driving circuit assembly is mounted on the mounting substrate, the backlight driving circuit assembly comprises a backlight driving circuit board and a backlight driving power supply switch MOS tube, the backlight driving power supply switch MOS tube is mounted on the backlight driving circuit board through pins, the liquid crystal display television backlight driving power supply heat dissipation structure further comprises a switching heat-conducting piece, one side surface of the switching heat-conducting piece is attached and connected with one side surface of the backlight driving power supply switch MOS tube, the other side surface of the switching heat-conducting piece is attached and connected with one side wall surface of the mounting substrate, and the wall surface of the mounting substrate attached to the switching heat-conducting piece is made of metal materials.
Further, the method comprises the following steps: the mounting base plate is a box bottom plate of the backlight driving circuit component mounting box, and one side surface of the switching heat-conducting piece is attached and connected with the inner wall surface of the box bottom plate of the backlight driving circuit component mounting box; the backlight driving circuit component mounting box is a metal box body.
Further, the method comprises the following steps: the backlight driving circuit component mounting box is made of a metal aluminum material.
Further, the method comprises the following steps: the mounting substrate is directly molded by a face frame of the liquid crystal television, and the face frame of the liquid crystal television corresponding to the mounting substrate area is made of a metal material.
Further, the method comprises the following steps: the switching heat-conducting piece is a metal aluminum plate.
Further, the method comprises the following steps: the dimensions of the aluminum metal plate are 60X 22X 3 mm.
Further, the method comprises the following steps: the backlight driving power supply switch MOS tube is fixedly connected with the switching heat-conducting piece through a fastening screw.
Further, the method comprises the following steps: a first heat conduction silica gel layer is coated on a binding face between the backlight driving power switch MOS tube and the transfer heat conducting piece.
Further, the method comprises the following steps: and a second heat conduction silica gel layer is coated on the joint surface between the adapting heat conduction piece and the inner wall surface of the mounting substrate.
Further, the method comprises the following steps: the switching heat-conducting piece is arranged on the backlight power supply driving circuit board through a connecting column; the mounting substrate is fixedly provided with a mounting column, the backlight power supply driving circuit board is mounted on the mounting column through an adjusting screw, and the switching heat-conducting piece and the backlight driving power supply switch MOS tube are clamped between the corresponding side wall surfaces of the backlight power supply driving circuit board and the mounting substrate.
The utility model has the advantages that: the utility model discloses in through setting up the switching heat-conducting piece, be shaded drive power switch MOS pipe and mounting substrate through the switching heat-conducting piece and be connected the heat conduction, keep away face or whole mounting substrate through setting up corresponding side on the mounting substrate and adopt metal material to make simultaneously, but make full use of mounting substrate dispels the heat, consequently can mention the radiating effect to the drive power switch MOS pipe in a poor light effectively, solved the heat dissipation problem of the high-power drive power supply in a poor light more than 200W.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention;
FIG. 2 is a schematic view of a copper foil of a double-sided PCB using a driving power supply for heat dissipation in the prior art;
FIG. 3 is a schematic diagram of a heat sink made of a special aluminum profile in the prior art;
labeled as: backlight power drive circuit board 1, backlight drive power switch MOS pipe 2, switching heat-conducting piece 3, wall 4, first heat conduction silica gel layer 5, second heat conduction silica gel layer 6, spliced pole 7, erection column 8, fastening screw 9, adjusting screw 10, mounting substrate 11, copper foil layer 12, aluminium alloy radiator 13.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
As shown in fig. 1, LCD TV drive power supply heat radiation structure in a poor light, including back of the body drive circuit subassembly and mounting substrate 11, back of the body drive circuit subassembly install in on mounting substrate 11, including back of the body drive circuit board 1 and the drive power switch MOS pipe 2 in a poor light in the back of the body drive circuit subassembly, drive power switch MOS pipe 2 in a poor light passes through the pin and installs on back of the body drive circuit board 1, still include switching heat-conducting piece 3, a side surface of switching heat-conducting piece 3 is connected with a side surface laminating of drive power switch MOS pipe 2 in a poor light, another side surface of switching heat-conducting piece 3 with a side wall 4 laminating of mounting substrate 11 is connected to the wall 4 of mounting substrate 11 with switching heat-conducting piece 3 laminating mutually is metal material.
Wherein, mounting substrate 11 is the installation basis of installing corresponding backlight drive circuit subassembly in LCD TV, and is different according to specific installation, the utility model provides a mounting substrate 11 has following two kinds of structural style at least:
firstly, a backlight driving circuit component mounting box is further arranged and is specially used for mounting the backlight driving circuit component, and then the mounting box is mounted in a liquid crystal television to realize the fixed mounting of the backlight driving circuit component; at this time, the mounting substrate 11 is a box bottom plate of the backlight driving circuit component mounting box, and one side surface of the corresponding switching heat-conducting piece 3 is in fit connection with the inner wall surface of the box bottom plate of the backlight driving circuit component mounting box; the backlight driving circuit component mounting box is a metal box body. Thus, the whole mounting box can be used for heat dissipation, and the heat dissipation effect of the backlight driving power switch MOS tube 2 can be ensured. Furthermore, the mounting box of the backlight driving circuit assembly can be made of a metal aluminum material to further improve the heat conduction and heat dissipation effects.
In the second method, the mounting substrate 11 is directly molded from the bezel of the lcd tv, and the bezel of the lcd tv corresponding to the region of the mounting substrate 11 is made of a metal material. That is, the mounting substrate 11 itself is a part of the face frame of the lcd tv, and at this time, at least the part of the face frame of the lcd tv serving as the mounting substrate 11 should be made of a metal material to ensure the heat dissipation effect. Of course, without loss of generality, the whole face frame of the lcd tv can be made of metal material, and can be preferably made of metal aluminum material, so as to reduce the weight of the face frame of the lcd tv and improve the heat conduction and heat dissipation effects.
The utility model provides a switching heat-conducting member 3 is for being used for connecting drive power switch MOS pipe 2 and mounting substrate 11 in a poor light and realizing heat-conduction between the two to drive power switch MOS pipe 2's in a poor light heat transfer gives mounting substrate 11 and dispels the heat. Specifically, the switching heat-conducting piece 3 can be a metal aluminum plate; on the one hand, the surfaces of two sides of the aluminum plate can be conveniently attached to the corresponding surfaces of the backlight driving power switch MOS tube 2 and the mounting substrate 11, and on the other hand, the heat conduction efficiency is high. Specifically, to the size of switching heat-conducting piece 3, can rationally set up according to the size of a dimension and the required heat isoparametric of transmitting of drive switch MOS pipe 2 in a poor light, for example the utility model discloses in can set up the size of above-mentioned metallic aluminum plate and be 60 x 22 x 3 mm.
In addition, in order to ensure the effective connection between the driving power switch MOS tube 2 that is shaded and the switching heat-conducting member 3, as shown in the attached drawing 1, consider that the conventional driving power switch MOS tube 2 that is shaded can reserve and use corresponding mounting hole structure, consequently the utility model discloses well optional use has the driving power switch MOS tube 2 that is shaded of corresponding mounting hole structure to through fastening screw 9 with its and switching heat-conducting member 3 fastening connection.
In addition, for further improvement heat transfer effect, the utility model discloses in can be in a poor light the first heat conduction silica gel layer of one deck 5 of binding face department coating between drive power switch MOS pipe 2 and the switching heat-conducting member 3. Similarly, a second heat conductive silicone layer 6 may be further coated on the joint surface between the adapter heat conductor 3 and the inner wall surface 4 of the mounting substrate 11.
In addition, in order to ensure the effective clamping and installation effect of the switching heat-conducting piece 3 and the contact effect between the switching heat-conducting piece 3 and the backlight driving power switch MOS tube 2 and the mounting substrate 11, the utility model is further provided with the switching heat-conducting piece 3 which is installed on the backlight driving circuit board 1 through the connecting column 7; the mounting column 8 is fixedly arranged on the mounting substrate 11, the backlight power supply driving circuit board 1 is mounted on the mounting column 8 through an adjusting screw 10, and the switching heat-conducting piece 3 and the backlight driving power supply switch MOS tube 2 are arranged between the backlight power supply driving circuit board 1 and the corresponding side wall surface 4 of the mounting substrate 11 in a clamped manner. Wherein, spliced pole 7 can one end fixed mounting on switching heat-conducting member 3, and the other end is then riveted, joint or interference fit ground and is installed on backlight source drive circuit board 1. And the erection column 8 then can one end fixed mounting on mounting substrate 11, and the other end sets up corresponding screw hole in order to with adjusting screw 10 screw-thread fit, during the installation with the help of adjusting screw 10 and 8 screw-thread fit of erection column to the whole clamp force that exerts after backlight power drive circuit board 1 and switching heat-conducting piece 3 are connected, in order to ensure the contact effect. Without loss of generality, in order to ensure the clamping force after installation, the height H of the mounting column 8 should be lower than the thickness H of the backlight power driving circuit board 1 and the adapter heat-conducting member 3 after installation, which can be specifically referred to the labeled dimension in fig. 1.
In addition, fig. 2 is a schematic diagram of the prior art that uses the copper foil of the double-sided PCB of the driving power supply to dissipate heat, in which the backlight driving power supply switch MOS transistor 2 is attached to the copper foil layer 12 pre-disposed on the double-sided PCB of the driving power supply to use the copper foil layer 12 to dissipate heat, and the heat dissipation efficiency is poor, and usually, the heat dissipation of the driving power supply can only satisfy about 80W or less. Fig. 3 is a schematic diagram of heat dissipation by using a dedicated aluminum profile heat sink in the prior art, which is a structure in which an aluminum profile heat sink 13 is directly attached to the backlight driving power switch MOS transistor 2, and although the heat dissipation effect can be improved, the size of the aluminum profile heat sink 13 is often set to be small due to the limitation of the internal installation space of the lcd tv, so that the heat dissipation effect is limited to only satisfy the heat dissipation of the driving power supply below about 150W. In the utility model, then dispel the heat with the help of mounting substrate 11, and mounting substrate 11's size can be done bigger for the condition of above-mentioned two kinds of prior art, consequently can improve the radiating effect effectively, make heat radiation structure can be applicable to the drive power supply heat dissipation of higher power, if can be applicable to 200W rank drive power supply heat dissipation.
Claims (10)
1. Liquid crystal TV drive power supply heat radiation structure in a poor light, including backlight drive circuit subassembly and mounting substrate (11), backlight drive circuit subassembly install in on mounting substrate (11), including backlight drive circuit board (1) and backlight drive power switch MOS pipe (2) in the backlight drive circuit subassembly, backlight drive power switch MOS pipe (2) are installed on backlight drive circuit board (1) through the pin, its characterized in that: the LED backlight driving circuit is characterized by further comprising a switching heat-conducting piece (3), one side surface of the switching heat-conducting piece (3) is attached to one side surface of the backlight driving power switch MOS tube (2), the other side surface of the switching heat-conducting piece (3) is attached to one side wall surface (4) of the mounting substrate (11) and is made of metal materials, and the wall surface (4) of the mounting substrate (11) attached to the switching heat-conducting piece (3) is made of metal materials.
2. The liquid crystal television backlight driving power supply heat dissipation structure of claim 1, wherein: the mounting base plate (11) is a box bottom plate of the backlight driving circuit component mounting box, and one side surface of the switching heat-conducting piece (3) is attached and connected with the inner wall surface of the box bottom plate of the backlight driving circuit component mounting box; the backlight driving circuit component mounting box is a metal box body.
3. The liquid crystal television backlight driving power supply heat dissipation structure of claim 2, wherein: the backlight driving circuit component mounting box is made of a metal aluminum material.
4. The liquid crystal television backlight driving power supply heat dissipation structure of claim 1, wherein: the mounting substrate (11) is directly molded by a face frame of the liquid crystal television, and the face frame of the liquid crystal television corresponding to the region of the mounting substrate (11) is made of a metal material.
5. The liquid crystal television backlight driving power supply heat dissipation structure of claim 1, wherein: the switching heat-conducting piece (3) is a metal aluminum plate.
6. The liquid crystal television backlight driving power supply heat dissipation structure of claim 5, wherein: the dimensions of the aluminum metal plate are 60X 22X 3 mm.
7. The liquid crystal television backlight driving power supply heat dissipation structure of claim 1, wherein: the backlight driving power switch MOS tube (2) is fixedly connected with the switching heat-conducting piece (3) through a fastening screw (9).
8. The liquid crystal television backlight driving power supply heat dissipation structure of claim 1, wherein: a first heat-conducting silica gel layer (5) is coated on a joint surface between the backlight driving power switch MOS tube (2) and the transfer heat-conducting piece (3).
9. The liquid crystal television backlight driving power supply heat dissipation structure of claim 1, wherein: and a second heat-conducting silica gel layer (6) is coated on the joint surface between the switching heat-conducting piece (3) and the inner wall surface (4) of the mounting substrate (11).
10. The lcd tv backlight driving power supply heat dissipation structure of any one of claims 1 to 9, wherein: the switching heat-conducting piece (3) is arranged on the backlight power supply driving circuit board (1) through a connecting column (7); the mounting base plate (11) is fixedly provided with a mounting column (8), the backlight power supply driving circuit board (1) is mounted on the mounting column (8) through an adjusting screw (10), and the switching heat-conducting piece (3) and the backlight driving power supply switch MOS tube (2) are arranged between the backlight power supply driving circuit board (1) and the corresponding side wall surface (4) of the mounting base plate (11) in a clamped mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921605175.XU CN210666269U (en) | 2019-09-25 | 2019-09-25 | Heat dissipation structure of backlight driving power supply of liquid crystal display television |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921605175.XU CN210666269U (en) | 2019-09-25 | 2019-09-25 | Heat dissipation structure of backlight driving power supply of liquid crystal display television |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210666269U true CN210666269U (en) | 2020-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921605175.XU Active CN210666269U (en) | 2019-09-25 | 2019-09-25 | Heat dissipation structure of backlight driving power supply of liquid crystal display television |
Country Status (1)
| Country | Link |
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| CN (1) | CN210666269U (en) |
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- 2019-09-25 CN CN201921605175.XU patent/CN210666269U/en active Active
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