CN216905722U - Heat dissipation device for circuit board and case - Google Patents
Heat dissipation device for circuit board and case Download PDFInfo
- Publication number
- CN216905722U CN216905722U CN202122949727.2U CN202122949727U CN216905722U CN 216905722 U CN216905722 U CN 216905722U CN 202122949727 U CN202122949727 U CN 202122949727U CN 216905722 U CN216905722 U CN 216905722U
- Authority
- CN
- China
- Prior art keywords
- heat
- plate
- sides
- heat dissipation
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device for a circuit board and a chassis include: the circuit board is arranged between the two supporting frames; two radiators respectively installed at the outer sides of the support frame; a heat dissipation plate disposed on the circuit board; two heat-conducting plates, the first side of each heat-conducting plate being arranged at the inner side of the corresponding support frame; and a plurality of elastic mechanisms disposed between second sides of the two heat conductive plates opposite to the first sides to elastically press the two heat conductive plates so that the first sides of the two heat conductive plates abut against the inner sides of the support frame, respectively. The heat dissipation device of the utility model connects the heat conducting plate with the radiator by arranging the elastic mechanism, increases the transverse heat dissipation contact area and the heat dissipation path, and effectively solves the heat dissipation problem of the high-power circuit board when in use.
Description
Technical Field
At least one embodiment of the present invention relates to a heat sink, and more particularly, to a heat sink for a circuit board.
Background
With the rapid development of computer technology, low-power and low-power processors have been unable to meet the use requirements. In contrast, the faster the processor speed, the more power, and the more heat energy is generated. When the temperature of the processor is too high, the operation efficiency of the control system is greatly reduced. Therefore, in order to maintain the operating efficiency of the processor or the control system, the heat generated by the processor must be transferred out of the processor in time, and the conventional heat dissipation apparatus cannot meet the heat dissipation requirement of the high-power processor. Therefore, design and improvement efforts based on high power control systems and processor heat sinks are necessary.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a heat dissipation device for a circuit board and a chassis, which at least partially solve at least one of the above and other technical problems.
As an embodiment of an aspect of the present invention, there is provided a heat dissipating device for a circuit board, including:
two parallel supporting frames, the circuit board is arranged between the two supporting frames;
two radiators mounted on the outer sides of the support frame, respectively;
a heat dissipation plate disposed on the circuit board;
two heat-conducting plates, the first side of each heat-conducting plate being arranged inside a corresponding support frame; and
and a plurality of elastic mechanisms arranged between the second sides of the two heat-conducting plates opposite to the first sides to elastically press the two heat-conducting plates so that the first sides of the two heat-conducting plates respectively abut against the inner sides of the supporting frame.
According to an embodiment of the present invention, each of the above-described elastic mechanisms includes:
the first mounting part and the second mounting part are respectively arranged on the second sides of the two heat-conducting plates;
the two ends of the connecting column are respectively arranged on the first mounting part and the second mounting part; and
and an elastic member mounted on the connection post and elastically pressing the first and second mounting parts in opposite directions.
According to the embodiment of the utility model, the first end of the connecting column passes through the first mounting part, and the second end passes through the second mounting part;
each of the above elastic mechanisms further includes:
the first blocking piece is fixedly sleeved at the first end of the connecting column and is positioned on the inner side of the first mounting part;
a nut screwed to the first end of the connection post at an outer side of the first mounting portion;
the second blocking piece is movably sleeved at the second end of the connecting column and is positioned on the inner side of the second mounting part, and the elastic part elastically abuts against the inner sides of the first blocking piece and the second blocking piece.
According to an embodiment of the present invention, the second mounting part is provided with a first through hole opened toward a periphery of the second mounting part, and the second end of the connecting post moves into the first through hole through the opening.
According to an embodiment of the present invention, a plurality of second through holes are formed in each of the heat conductive plates, and a plurality of screws are respectively screwed to the heat dissipation plate through the second through holes.
According to an embodiment of the present invention, each of the above-described second through holes is formed as an elongated hole elongated in the lateral direction.
According to the embodiment of the utility model, one side of each heat conducting plate, which is opposite to the heat dissipation plate, is provided with a groove, and the grooves are matched with the heat conducting pipes arranged on the heat dissipation plate.
According to an embodiment of the present invention, a heat conductive silicone grease is coated between the heat conductive plate and the heat dissipation plate, and both sides of the heat conductive silicone grease are in contact with the heat conductive plate and the heat dissipation plate, respectively.
According to an embodiment of the utility model, the inner side of each of the above-mentioned support frames is provided with a support step extending in the longitudinal direction,
the first side of each heat-conducting plate is formed with a bent portion which is engaged with the supporting step so that at least one portion of the heat-conducting plate is supported on the supporting step and at least another portion of the heat-conducting plate is abutted against the inner side of the supporting frame.
As another aspect of the present invention, the present invention also provides a chassis, including:
a housing;
the above-mentioned circuit board; and
the heat dissipation device adopting the structure is arranged in the shell.
According to the heat dissipation device of the embodiment of the utility model, the heat conduction plate is contacted with the reliable heat dissipater by arranging the elastic mechanism, so that the transverse heat dissipation contact area and the heat dissipation path are increased.
Drawings
Fig. 1 is a perspective view of a heat dissipation device according to an embodiment of the present invention;
fig. 2 is a perspective view of a heat sink according to an embodiment of the present invention;
fig. 3 is a perspective view of another heat dissipation plate according to an embodiment of the present invention;
FIG. 4 is an enlarged view of portion A of FIG. 1;
FIG. 5 is a front view of a heat dissipation device according to one embodiment of the present invention;
FIG. 6 is a cross-sectional view taken along line B-B of FIG. 5;
FIG. 7 is an enlarged view of portion C of FIG. 6;
FIG. 8 is a schematic perspective view of a connecting stud according to one embodiment of the present invention;
fig. 9 is a perspective view of the back surface of a heat radiating plate according to an embodiment of the present invention.
Description of the reference numerals
1: a support frame;
2: a heat sink;
3: a heat dissipation plate;
4: a heat conducting plate;
5: an elastic mechanism;
6: a first mounting portion;
7: a second mounting portion;
8: connecting columns;
9: an elastic member;
10: a first baffle plate;
11: a nut;
12: a second baffle plate;
13: a first through hole;
14: a second through hole;
15: a groove;
16: supporting a step;
17: a bending section;
18: and (4) screws.
Detailed Description
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments.
Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the utility model. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.
According to the general inventive concept of an aspect of the present invention, there is provided a heat dissipating device including: two parallel supporting frames, the circuit board is arranged between the two supporting frames; the two radiators are respectively arranged on the outer sides of the supporting frames and are symmetrically arranged, so that the heat concentration on one side can be effectively avoided, and the radiating efficiency is improved; a heat dissipation plate disposed on the circuit board; two heat-conducting plates, the first side of each heat-conducting plate being arranged inside a corresponding support frame; and a plurality of elastic mechanisms disposed between second sides of the two heat-conducting plates opposite to the first sides to elastically press the two heat-conducting plates so that the first sides of the two heat-conducting plates respectively abut against the inner sides of the support frame.
Fig. 1 is a perspective view of a heat dissipation device according to an embodiment of the utility model.
The present invention provides a heat dissipating device for a circuit board, as shown in fig. 1, including: two support frames 1 arranged in parallel, the circuit board is installed between the two support frames 1; the two radiators 2 are respectively arranged on the outer sides of the supporting frame 1, and the radiators 2 are symmetrically arranged, so that the heat concentration on one side can be effectively avoided, and the heat dissipation efficiency is improved; a heat dissipation plate 3 disposed on the circuit board; two heat-conducting plates 4, a first side of each heat-conducting plate 4 being arranged inside a corresponding support frame 1; and a plurality of elastic means 5 disposed between second sides of the two heat-conducting plates 4 opposite to the first sides to elastically press the two heat-conducting plates 4 such that the first sides of the two heat-conducting plates 4 abut against the inner sides of the support frame 1, respectively.
According to the heat dissipation device of the embodiment of the utility model, the heat conduction plate is contacted with the reliable heat dissipater by arranging the elastic mechanism, so that the transverse heat dissipation contact area and the heat dissipation path are increased.
Fig. 4 is an enlarged schematic view of a portion a of fig. 1.
FIG. 8 is a perspective view of a connecting stud according to one embodiment of the present invention.
In one embodiment of the present invention, as shown in fig. 4, each elastic mechanism 5 includes: a first mounting part 6 and a second mounting part 7 respectively disposed on the second sides of the two heat conductive plates 4; a connection post 8, both ends of the connection post 8 being mounted on the first mounting part 6 and the second mounting part 7, respectively; and an elastic component 9, the elastic component 9 includes but is not limited to a spring, install on the above-mentioned spliced pole 8 and extrude above-mentioned first installation department 6 and second installation department 7 elastically in opposite direction, the spring is when replying elastic deformation, can drive its heat-conducting plate 4 that connects through first installation department 6 and second installation department 7, make two heat-conducting plates 4 to the direction of keeping away from each other and advance the short distance, thereby make the first side of heat-conducting plate 4 support at the inboard of above-mentioned braced frame 1 elastically, the heat conduction efficiency from heat-conducting plate 4 to radiator 2 has been improved.
Fig. 2 is a schematic view of a heat sink plate according to an embodiment of the present invention; fig. 3 is a schematic view of another heat dissipation plate according to an embodiment of the present invention.
In an embodiment of the present invention, as shown in fig. 2 to 4, a first end of the connecting column 8 passes through the first mounting portion 6, and a second end passes through the second mounting portion 7. Each of the above-described elastic mechanisms 5 further includes: a first blocking piece 10 fixedly sleeved at the first end of the connecting column 8 and positioned at the inner side of the first mounting part 6; a nut 11 screwed to the first end of the connection post 8 at the outer side of the first mounting part 6; and a second blocking piece 12 movably sleeved at the second end of the connecting column 8 and located at the inner side of the second mounting part 7, wherein the elastic part 9 elastically abuts against the inner sides of the first blocking piece 10 and the second blocking piece 12.
In an embodiment of the present invention, as shown in fig. 3 to 4, the second mounting portion 7 is provided with a first through hole 13 opening toward the periphery of the second mounting portion 7, the periphery of the first through hole 13 can be opened from various directions, and the opening can facilitate the detachment of the elastic mechanism 5. The second end of the connecting post 8 is moved into the first through hole 13 through the opening.
The connection of the elastic mechanism can be specifically as follows: penetrate first separation blade 10 with screwed one end of spliced pole 8 earlier, fix first separation blade 10 in spliced pole 8 one end near the screw through the welding, with spliced pole 8 one end penetrates from the inboard of first installation department 6, and the outside is worn out to fix with nut 11 screw in screw thread, the nut is not screwed up this moment. Then the other end of the connecting column 8 penetrates through the spring 9 and the second baffle 12, and the second baffle 12 is not welded and fixed, so that the second baffle can slide on the connecting column. The spring 9 is pressed towards the first blocking piece 10 through the second blocking piece 12, so that the end, without threads, of the connecting column 8 is exposed and slides into the first through hole 13 through the peripheral opening of the second mounting part 7.
FIG. 5 is a front view of a heat dissipation device according to one embodiment of the present invention; FIG. 6 is a cross-sectional view taken along line B-B of FIG. 5; fig. 7 is an enlarged schematic view of portion C of fig. 6.
In an embodiment of the present invention, as shown in fig. 5 to 7, a plurality of second through holes 14 are formed in each of the heat conducting plates 4, a plurality of screws 18 are respectively threaded through the second through holes 14 to the heat dissipating plate 3 for fixing the longitudinal position of the heat conducting plate 4 with respect to the heat dissipating plate 3, the plurality of screws 18 are not tightened before the heat conducting plate 3 is mounted, and the plurality of screws 18 are tightened after the elastic mechanism 5 is connected to the heat conducting plate 4.
In an embodiment of the present invention, as shown in fig. 2 to 3, each of the second through holes 14 is formed as an elongated hole extending in the transverse direction, and the elongated hole is provided to allow the heat conductive plate 4 to be adjusted in a small range of movement by the elastic mechanism 5.
Fig. 9 is a perspective view of the back surface of a heat radiating plate according to an embodiment of the present invention.
In an embodiment of the present invention, as shown in fig. 7 and 9, a groove 15 is formed on a side of each of the heat conducting plates 4 opposite to the heat dissipating plate 3, and the groove 15 is engaged with a heat conducting pipe disposed on the heat dissipating plate 3, so as to enhance heat transfer efficiency of the heat conducting pipe.
In an embodiment of the present invention, a heat conductive silicone grease having high thermal conductivity and excellent thermal conductivity is coated between the heat conductive plate 4 and the heat dissipating plate 3, so that heat of the heat dissipating plate 3 can be sufficiently conducted to the heat conductive plate 4, and both sides of the heat conductive silicone grease are in contact with the heat conductive plate 4 and the heat dissipating plate 3, respectively.
In an embodiment of the present invention, as shown in fig. 1 to 2, a supporting step 16 extending in a longitudinal direction is provided on an inner side of each of the supporting frames 1, and a bent portion 17 engaged with the supporting step 16 is formed on a first side of each of the heat conductive plates 4, such that at least a portion of the heat conductive plate 4 is supported on the supporting step 16 and at least another portion of the heat conductive plate 4 abuts against the inner side of the supporting frame 1. The arrangement of the supporting step 16 can increase the heat dissipation contact area of the heat conducting plate 4 and the heat conducting plate 4, and can limit the heat conducting plate 4.
In an embodiment of the present invention, the present invention further provides a chassis, including: a housing; the above-mentioned circuit board; and the heat radiator adopting the structure is arranged in the shell.
According to the heat dissipation device of the embodiment of the utility model, aiming at the heat dissipation problem of the high-power circuit board, the heat conduction plate, the heat radiator and the elastic mechanism are arranged, the heat conduction plate is connected with the heat dissipation plate through the heat conduction silicone grease, and the heat dissipation contact area and the heat dissipation path are longitudinally increased; the elastic mechanism is arranged to enable the heat conducting plate to be in contact with the reliable radiator, so that the transverse radiating contact area and the radiating path are increased; in addition, through filling the metal structure, reduced the fill area of air (bad conductor), effectual solved the not good problem of heat dissipation of high-power circuit board when using.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat dissipation device for a circuit board, comprising:
two parallel supporting frames (1), wherein the circuit board is arranged between the two supporting frames (1);
two radiators (2) respectively mounted on the outer sides of the support frame (1);
a heat dissipation plate (3) provided on the circuit board;
two heat-conducting plates (4), the first side of each heat-conducting plate (4) being arranged inside a corresponding support frame (1); and
a plurality of elastic mechanisms (5) disposed between second sides of the two heat-conducting plates (4) opposite to the first sides to elastically press the two heat-conducting plates (4) so that the first sides of the two heat-conducting plates (4) are respectively abutted against the inner sides of the support frame (1).
2. The heat sink as recited in claim 1, wherein each of the elastic mechanisms (5) comprises:
the first mounting part (6) and the second mounting part (7) are respectively arranged on the second sides of the two heat-conducting plates (4);
the two ends of the connecting column (8) are respectively arranged on the first installation part (6) and the second installation part (7); and
an elastic member (9) mounted on the connection post (8) and elastically pressing the first and second mounting parts (6, 7) in opposite directions.
3. The heat sink as claimed in claim 2, characterised in that the connecting column (8) has a first end which passes through the first mounting part (6) and a second end which passes through the second mounting part (7);
each of said elastic means (5) further comprises:
the first blocking piece (10) is fixedly sleeved at the first end of the connecting column (8) and is positioned on the inner side of the first mounting part (6);
the nut (11) is in threaded connection with the first end of the connecting column (8) at the outer side of the first mounting part (6);
and the second blocking piece (12) is movably sleeved at the second end of the connecting column (8) and is positioned at the inner side of the second mounting part (7), and the elastic part (9) elastically abuts against the inner sides of the first blocking piece (10) and the second blocking piece (12).
4. The heat sink as claimed in claim 3, characterised in that the second mounting part (7) is provided with a first through hole (13) opening towards the periphery of the second mounting part (7), through which opening the second end of the connecting stud (8) is moved into the first through hole (13).
5. The heat dissipating device according to any one of claims 1 to 4, wherein a plurality of second through holes (14) are formed on each of the heat conductive plates (4), and a plurality of screws (18) are respectively screw-coupled to the heat dissipating plate (3) through the second through holes (14).
6. The heat sink as recited in claim 5, wherein each of the second through holes (14) is formed as an elongated hole elongated in the lateral direction.
7. A heat sink according to any one of claims 1-4, characterised in that each heat conducting plate (4) has a recess (15) on the side opposite the heat distribution plate (3), which recesses (15) cooperate with heat conducting tubes provided on the heat distribution plate (3).
8. The heat sink according to any one of claims 1-4, wherein a heat conductive silicone grease is applied between the heat conductive plate (4) and the heat sink plate (3), both sides of the heat conductive silicone grease being in contact with the heat conductive plate (4) and the heat sink plate (3), respectively.
9. The heat sink according to any of claims 1-4, characterised in that the inner side of each support frame (1) is provided with a support step (16) extending in the longitudinal direction,
the first side of each heat-conducting plate (4) forms a bending part (17) matched with the supporting step (16), so that at least one part of each heat-conducting plate (4) is supported on the supporting step (16) and at least another part of each heat-conducting plate (4) is abutted against the inner side of the supporting frame (1).
10. A chassis, comprising:
a housing;
the circuit board; and
the heat dissipation device of any of claims 1-9, mounted within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122949727.2U CN216905722U (en) | 2021-11-29 | 2021-11-29 | Heat dissipation device for circuit board and case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122949727.2U CN216905722U (en) | 2021-11-29 | 2021-11-29 | Heat dissipation device for circuit board and case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216905722U true CN216905722U (en) | 2022-07-05 |
Family
ID=82203642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122949727.2U Active CN216905722U (en) | 2021-11-29 | 2021-11-29 | Heat dissipation device for circuit board and case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216905722U (en) |
-
2021
- 2021-11-29 CN CN202122949727.2U patent/CN216905722U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212906119U (en) | Server | |
| US20130291368A1 (en) | Cooled Part for Expansion Circuit Board Cooling | |
| CN111787752B (en) | Split type heat conductor and electronic device with heat dissipation structure | |
| CN216905722U (en) | Heat dissipation device for circuit board and case | |
| CN210130059U (en) | Heat dissipation device and electronic equipment | |
| CN210895329U (en) | Module structure for radiating in board | |
| CN209845602U (en) | Elastic heat conducting structure | |
| CN219202287U (en) | Heat dissipation device | |
| CN214155222U (en) | Heat dissipation device for low-voltage cabinet circuit board | |
| CN213241061U (en) | Notebook cooling fin mechanism | |
| JP3225642U (en) | Heat sink assembly for printed circuit board | |
| CN210924481U (en) | Tower radiator for computer motherboard | |
| JPS60171751A (en) | Heat dissipating construction of ic | |
| CN219644407U (en) | Circuit board heat abstractor and computer server | |
| CN210143212U (en) | Heat radiation assembly | |
| CN219437446U (en) | Circuit board assembly | |
| CN213069726U (en) | Novel passive radiator structure of machine treasure | |
| CN218548419U (en) | Heat radiation assembly | |
| CN219269159U (en) | Circuit board assembly and electronic equipment | |
| CN219741124U (en) | Radiating fin for heat exchanger | |
| KR200407615Y1 (en) | RAM Module with Cooling System | |
| CN218888884U (en) | Electronic product radiator and electronic product provided with same | |
| CN220773539U (en) | Heat radiation structure for computer | |
| CN220569137U (en) | Vacuum cavity radiator | |
| CN210042687U (en) | Fan type heat radiation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |