CN210924481U - Tower radiator for computer motherboard - Google Patents
Tower radiator for computer motherboard Download PDFInfo
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- CN210924481U CN210924481U CN202020182737.0U CN202020182737U CN210924481U CN 210924481 U CN210924481 U CN 210924481U CN 202020182737 U CN202020182737 U CN 202020182737U CN 210924481 U CN210924481 U CN 210924481U
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- heat
- heat dissipation
- pipe
- fixing
- tower
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Abstract
The utility model relates to a radiator technical field specifically is a tower radiator for computer motherboard, including fixed establishment, the first heat pipe of one side fixedly connected with and the second heat pipe of fixed establishment, the surface of first heat pipe and second heat pipe is pegged graft and is had heat dissipation mechanism, the equal threaded connection of tip of first heat pipe and second heat pipe has fastening nut, one side joint of heat dissipation mechanism has coupling mechanism. This tower radiator for computer motherboard, ejector pin are located between two adjacent heat radiation fins, provide the holding power to heat radiation fins to avoid two adjacent heat radiation fins edges to guarantee good ventilation because of the external force laminating is in the same place, thereby guarantee good heat dissipation efficiency, improved the reliability, separate a section of thick bamboo and make two adjacent heat radiation fins keep certain distance, be convenient for ventilate, and increase the area of contact of heat dissipation mechanism and first heat pipe and second heat pipe, improve heat radiation fins's heat conduction efficiency.
Description
Technical Field
The utility model relates to a radiator technical field specifically is a tower radiator for computer motherboard.
Background
A heat sink is a generic term for a series of devices used to conduct and release heat. Integrated circuits are heavily used in computer components. It is known that high temperature is a big enemy of integrated circuits, and the high temperature not only causes unstable operation of the system, shortens the service life, but also may burn some parts, resulting in high temperature heat not coming from the outside of the computer, but also from the inside of the computer, or the inside of the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the computer components is ensured to be normal.
The tower type radiator is quite common, and simple in structure, namely, the heat-conducting pipes are vertically inserted into the plurality of heat-radiating fins, so that the computer mainboard transmits heat to the heat-conducting pipes, then the heat-conducting pipes conduct the heat to the heat-radiating fins, and finally the heat is blown away through the gaps between the two adjacent heat-radiating fins by the heat-radiating fans, so that the heat radiation of the mainboard is completed. However, the existing tower-type heat sink for computer motherboard has the following disadvantages:
the tower type radiator for the computer mainboard is provided with no supporting device between the radiating fins, so that the edges of the radiating fins can be bent under the influence of external force in the installation process, two adjacent radiating fins are attached together, ventilation is not smooth, and radiating efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a tower radiator for computer motherboard sets up the ejector pin through the edge at heat radiation fins, provides the holding power to heat radiation fins, has solved the problem of proposing among the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a tower type radiator for a computer mainboard comprises a fixing mechanism, wherein one side of the fixing mechanism is fixedly connected with a first heat conduction pipe and a second heat conduction pipe, the outer surfaces of the first heat conduction pipe and the second heat conduction pipe are inserted with a radiating mechanism, the end parts of the first heat conduction pipe and the second heat conduction pipe are both in threaded connection with fastening nuts, one side of the radiating mechanism is clamped with a connecting mechanism, the radiating mechanism is fixedly installed with a radiating fan through the connecting mechanism arranged on one side of the radiating mechanism, and a supporting mechanism is fixedly installed on one side of the fixing mechanism;
the fixing mechanism comprises a fixing plate, a fixing groove, a groove and a through hole, wherein the fixing groove is formed in one side of the fixing plate, the groove is formed in the edge of one side, close to the fixing groove, of the fixing plate, and the through hole is formed in the groove;
the radiating mechanism comprises radiating fins, a sleeve hole, a separating cylinder, an ejector rod and clamping grooves, wherein the sleeve hole is formed in one side of each radiating fin, the separating cylinder is fixedly connected to one side of each radiating fin, the ejector rod is fixedly connected to the edge of one side, far away from the separating cylinder, of each radiating fin, and the clamping grooves are formed in the two sides of each radiating fin.
Optionally, the end portions of the first heat pipe and the second heat pipe are both provided with threads.
Optionally, the fixing plate is fixedly connected to the first heat pipe and the second heat pipe through a fixing groove formed in one side of the fixing plate.
Optionally, the heat dissipation fins are inserted into the first heat conduction pipe and the second heat conduction pipe through a sleeve hole and a separation cylinder arranged on one side of the heat dissipation fins.
Optionally, the heat dissipation fins are clamped with the connecting mechanism through clamping grooves formed in two sides of the heat dissipation fins.
Optionally, the connecting mechanism comprises a U-shaped rod and a threaded cylinder, and both ends of the U-shaped rod are fixedly connected with the threaded cylinder.
Optionally, the supporting mechanism comprises a connecting plate, a threaded hole, a supporting rod, a supporting plate and a fixing hole, the threaded hole is formed in the top of the connecting plate, the supporting rod is fixedly connected to one side of the connecting plate, the supporting rod is far away from the supporting plate, and the fixing hole is formed in the top of the supporting plate.
(III) advantageous effects
The utility model provides a tower radiator for computer motherboard possesses following beneficial effect:
1. this tower radiator for computer motherboard sets up the ejector pin through the edge at heat radiation fins, and when heat radiation fins's edge received external force extrusion, the ejector pin was located between two adjacent heat radiation fins, provides the holding power to heat radiation fins to avoid two adjacent heat radiation fins edges to lead to the not smooth problem of ventilation because of the external force laminating is in the same place, guarantee good ventilation, thereby guarantee good heat dissipation efficiency, improved the reliability.
2. This tower radiator for computer motherboard, through setting up a separating section of thick bamboo, when heat radiation fins is pegged graft to first heat pipe and second heat pipe surface, separate a section of thick bamboo and can make two adjacent heat radiation fins keep certain distance, be convenient for ventilate, and separate the outer surface laminating of the inner wall of a section of thick bamboo and first heat pipe and second heat pipe, the area of contact of heat dissipation mechanism with first heat pipe and second heat pipe has been increased, make the heat of first heat pipe and second heat pipe fully give off heat radiation fins surface, heat conduction efficiency of heat radiation fins is improved.
Drawings
Fig. 1 is a schematic view of a first view structure of the present invention;
fig. 2 is a schematic view of a second perspective structure of the present invention;
fig. 3 is a schematic structural view of the fixing mechanism of the present invention;
fig. 4 is a schematic structural view of the first heat pipe of the present invention;
fig. 5 is a schematic structural view of a second heat pipe of the present invention;
fig. 6 is a schematic view of a first view angle structure of the heat dissipation mechanism of the present invention;
fig. 7 is a second view structural diagram of the heat dissipation mechanism of the present invention;
fig. 8 is a schematic structural view of the connection mechanism of the present invention;
fig. 9 is a schematic structural diagram of the supporting mechanism of the present invention.
In the figure: 1-fixing mechanism, 101-fixing plate, 102-fixing groove, 103-groove, 104-through hole, 2-first heat conduction pipe, 3-second heat conduction pipe, 4-heat dissipation mechanism, 401-heat dissipation fin, 402-trepanning, 403-separating cylinder, 404-ejector pin, 405-clamping groove, 5-fastening nut, 6-connecting mechanism, 601-U-shaped rod, 602-threaded cylinder, 7-heat dissipation fan, 8-supporting mechanism, 801-connecting plate, 802-threaded hole, 803-supporting rod, 804-supporting plate, 805-fixing hole and 9-thread.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1 to 9, the present invention provides a technical solution: a tower type radiator for a computer mainboard comprises a fixing mechanism 1, wherein one side of the fixing mechanism 1 is fixedly connected with a first heat conduction pipe 2 and a second heat conduction pipe 3, the width of the first heat conduction pipe 2 is smaller than that of the second heat conduction pipe 3, so that the first heat conduction pipe 2 and the second heat conduction pipe 3 are inserted in the radiating mechanism 4 in a staggered mode, the heat on the surfaces of the first heat conduction pipe 2 and the second heat conduction pipe 3 is favorably and uniformly dispersed to the surface of a radiating fin 401, the outer surfaces of the first heat conduction pipe 2 and the second heat conduction pipe 3 are inserted with a radiating mechanism 4, the end parts of the first heat conduction pipe 2 and the second heat conduction pipe 3 are both in threaded connection with a fastening nut 5, the fastening nut 5 is fixed at the end parts of the first heat conduction pipe 2 and the second heat conduction pipe 3, the problem that the radiating mechanism 4 slides off from the first heat conduction pipe 2 and the, the heat dissipation mechanism 4 is fixedly installed with a heat dissipation fan 7 through a connecting mechanism 6 arranged on one side of the heat dissipation mechanism, a supporting mechanism 8 is fixedly installed on one side of the fixing mechanism 1, the fixing mechanism 1 is attached to a heating part on the mainboard, the first heat conduction pipe 2 and the second heat conduction pipe 3 are attached to the heating part, and then the fixing mechanism 1 is fixed on the mainboard through the supporting mechanism 8, so that the purpose of fixing the tower-type heat sink is achieved;
the fixing mechanism 1 comprises a fixing plate 101, a fixing groove 102, a groove 103 and a through hole 104, wherein the fixing groove 102 is formed in one side of the fixing plate 101, the groove 103 is formed in the edge, close to the fixing groove 102, of one side of the fixing plate 101, the through hole 104 is formed in the groove 103, a bolt penetrates through the through hole 104 to be connected with the supporting mechanism 8, the head of the bolt is inserted into the groove 103, and therefore the problem that the head of the bolt protrudes out of the fixing plate 101 is solved;
the heat dissipation mechanism 4 includes heat dissipation fins 401, a sleeve hole 402, a partition 403, a pin 404 and a slot 405, the sleeve hole 402 is opened on one side of the heat dissipation fins 401, the partition 403 is fixedly connected on one side of the heat dissipation fins 401, the position of the partition 403 corresponds to the position of the sleeve hole 402, and the inner diameter of the partition 403 is equal to the diameter of the sleeve hole 402, by providing the partition 403, when the heat dissipation fins 401 are inserted on the outer surfaces of the first heat conduction pipe 2 and the second heat conduction pipe 3, the partition 403 can keep a certain distance between the two adjacent heat dissipation fins 401 for ventilation, and the inner wall of the partition 403 is attached to the outer surfaces of the first heat conduction pipe 2 and the second heat conduction pipe 3, so as to increase the contact area between the heat dissipation mechanism 4 and the first heat conduction pipe 2 and the second heat conduction pipe 3, so that the heat of the first heat conduction pipe 2 and the second heat conduction pipe 3 is fully dissipated to the surface of the, an ejector rod 404 is fixedly connected to one side edge of the heat dissipation fin 401 far away from the separating cylinder 403, the edge of the heat dissipation fin 401 is provided with the ejector rod 404, when the edge of the heat dissipation fin 401 is extruded by external force, the ejector rod 404 is located between two adjacent heat dissipation fins 401, supporting force is provided for the heat dissipation fin 401, the problem that ventilation is not smooth due to the fact that the edges of the two adjacent heat dissipation fins 401 are attached together through the external force is avoided, good ventilation is guaranteed, good heat dissipation efficiency is guaranteed, reliability is improved, and clamping grooves 405 are formed in two sides of the heat dissipation fin 401.
The end parts of the first heat conduction pipe 2 and the second heat conduction pipe 3 are both provided with threads 9, the first heat conduction pipe 2 and the second heat conduction pipe 3 are in threaded connection with a fastening nut 5 through the threads 9 arranged at the end parts thereof, the fixing plate 101 is fixedly connected with the first heat conduction pipe 2 and the second heat conduction pipe 3 through a fixing groove 102 arranged at one side thereof, the heat dissipation fin 401 is inserted into the first heat conduction pipe 2 and the second heat conduction pipe 3 through a sleeve hole 402 and a separating cylinder 403 arranged at one side thereof, the heat dissipation fin 401 is clamped with the connecting mechanism 6 through clamping grooves 405 arranged at both sides thereof, the connecting mechanism 6 comprises a U-shaped rod 601 and a threaded cylinder 602, both ends of the U-shaped rod 601 are both fixedly connected with the threaded cylinder 602, the U-shaped rod 601 is clamped in the clamping groove 405 at one side of the heat dissipation fin 401, then the heat dissipation fan 7 is fixed at one side of the threaded cylinder 602 by using bolts, supporting plate 804 and fixed orifices 805, screw hole 802 has been seted up at the top of connecting plate 801, make the bolt run through recess 103 and through-hole 104 in proper order and the screw hole 802 threaded connection on the connecting plate 801 to fix supporting mechanism 8 on fixed plate 101, one side fixedly connected with bracing piece 803 of connecting plate 801, the one end fixedly connected with supporting plate 804 that the bracing piece 803 kept away from connecting plate 801, fixed orifices 805 has been seted up at the top of supporting plate 804, use the bolt to run through fixed orifices 805 and be connected with the mainboard, thereby fix this tower radiator on the mainboard.
When the heat dissipation fan is used, the fixing mechanism 1 is attached to a heating part on a mainboard, the first heat conduction pipe 2 and the second heat conduction pipe 3 are attached to the heating part, then the fixing mechanism 1 is fixed on the mainboard through the supporting mechanism 8, the mainboard works to generate heat, the first heat conduction pipe 2 and the second heat conduction pipe 3 absorb the heat, the heat is conducted to the heat dissipation fins 401, the heat dissipation fan 7 is started, the heat dissipation fan 7 blows air to gaps of the heat dissipation fins 401, air is made to circulate, the heat on the heat dissipation fins 401 is taken away, and therefore the purpose of heat dissipation is achieved.
In summary, when the tower heat sink for a computer motherboard is used, the top bar 404 is disposed at the edge of the heat dissipating fins 401, when the edge of the heat dissipating fins 401 is pressed by an external force, the top bar 404 is located between two adjacent heat dissipating fins 401 to provide a supporting force for the heat dissipating fins 401, thereby avoiding the problem of unsmooth ventilation at the edge of two adjacent heat dissipating fins 401 due to the external force, ensuring good ventilation, thereby ensuring good heat dissipating efficiency, and improving reliability, by disposing the separating cylinder 403, when the heat dissipating fins 401 are inserted into the outer surfaces of the first heat conducting pipe 2 and the second heat conducting pipe 3, the separating cylinder 403 can keep a certain distance between two adjacent heat dissipating fins 401, facilitating ventilation, and the inner wall of the separating cylinder 403 is attached to the outer surfaces of the first heat conducting pipe 2 and the second heat conducting pipe 3, increasing the contact area between the heat dissipating mechanism 4 and the first heat conducting pipe 2 and the second heat conducting pipe 3, so that the heat of the first heat pipe 2 and the second heat pipe 3 is fully dissipated to the surface of the heat dissipation fins 401, and the heat conduction efficiency of the heat dissipation fins 401 is improved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a tower radiator for computer motherboard, includes fixed establishment (1), its characterized in that: a first heat pipe (2) and a second heat pipe (3) are fixedly connected to one side of the fixing mechanism (1), a heat dissipation mechanism (4) is inserted into the outer surfaces of the first heat pipe (2) and the second heat pipe (3), the end portions of the first heat pipe (2) and the second heat pipe (3) are in threaded connection with fastening nuts (5), a connecting mechanism (6) is clamped to one side of the heat dissipation mechanism (4), the heat dissipation mechanism (4) is fixedly installed with a heat dissipation fan (7) through the connecting mechanism (6) arranged on one side of the heat dissipation mechanism, and a supporting mechanism (8) is fixedly installed on one side of the fixing mechanism (1);
the fixing mechanism (1) comprises a fixing plate (101), a fixing groove (102), a groove (103) and a through hole (104), wherein the fixing groove (102) is formed in one side of the fixing plate (101), the groove (103) is formed in the edge of one side, close to the fixing groove (102), of the fixing plate (101), and the through hole (104) is formed in the groove (103);
the heat dissipation mechanism (4) comprises heat dissipation fins (401), trepanning (402), a separating cylinder (403), a push rod (404) and a clamping groove (405), the trepanning (402) is formed in one side of the heat dissipation fins (401), the separating cylinder (403) is fixedly connected to one side of the heat dissipation fins (401), the push rod (404) is fixedly connected to one side edge of the heat dissipation fins (401) far away from the separating cylinder (403), and the clamping groove (405) is formed in two sides of the heat dissipation fins (401).
2. The tower-type heat sink for the computer motherboard according to claim 1, wherein: the end parts of the first heat conduction pipe (2) and the second heat conduction pipe (3) are both provided with threads (9).
3. The tower-type heat sink for the computer motherboard according to claim 1, wherein: the fixing plate (101) is fixedly connected with the first heat conduction pipe (2) and the second heat conduction pipe (3) through a fixing groove (102) arranged on one side of the fixing plate.
4. The tower-type heat sink for the computer motherboard according to claim 1, wherein: the heat dissipation fins (401) are inserted into the first heat conduction pipe (2) and the second heat conduction pipe (3) through trepanning (402) and separating cylinders (403) arranged on one side of the heat dissipation fins.
5. The tower-type heat sink for the computer motherboard according to claim 1, wherein: the heat radiating fins (401) are clamped with the connecting mechanism (6) through clamping grooves (405) arranged on two sides of the heat radiating fins.
6. The tower-type heat sink for the computer motherboard according to claim 1, wherein: the connecting mechanism (6) comprises a U-shaped rod (601) and a threaded cylinder (602), and the two ends of the U-shaped rod (601) are fixedly connected with the threaded cylinder (602).
7. The tower-type heat sink for the computer motherboard according to claim 1, wherein: the supporting mechanism (8) comprises a connecting plate (801), a threaded hole (802), a supporting rod (803), a supporting plate (804) and a fixing hole (805), the threaded hole (802) is formed in the top of the connecting plate (801), the supporting rod (803) is fixedly connected to one side of the connecting plate (801), the supporting plate (804) is fixedly connected to one end, far away from the connecting plate (801), of the supporting rod (803), and the fixing hole (805) is formed in the top of the supporting plate (804).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020182737.0U CN210924481U (en) | 2020-02-18 | 2020-02-18 | Tower radiator for computer motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020182737.0U CN210924481U (en) | 2020-02-18 | 2020-02-18 | Tower radiator for computer motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210924481U true CN210924481U (en) | 2020-07-03 |
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ID=71369290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020182737.0U Expired - Fee Related CN210924481U (en) | 2020-02-18 | 2020-02-18 | Tower radiator for computer motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210924481U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022056911A1 (en) * | 2020-09-17 | 2022-03-24 | 北京市鑫全盛科技有限公司 | Heat pipe arrangement method for heat dissipation and transfer device |
-
2020
- 2020-02-18 CN CN202020182737.0U patent/CN210924481U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022056911A1 (en) * | 2020-09-17 | 2022-03-24 | 北京市鑫全盛科技有限公司 | Heat pipe arrangement method for heat dissipation and transfer device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200703 Termination date: 20210218 |
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| CF01 | Termination of patent right due to non-payment of annual fee |