CN216450019U

CN216450019U - A CPU radiator that takes into account the ventilation of memory

Info

Publication number: CN216450019U
Application number: CN202123254574.6U
Authority: CN
Inventors: 王青; 张宇川
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Metabrain Intelligent Technology Co Ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-05-06
Anticipated expiration: 2031-12-22

Abstract

The utility model discloses a CPU radiator that takes into account the air guiding of memory, comprising a radiator body, a base and a first cover plate. The radiator body is mounted on the base, a first heat pipe is mounted on the base, and a radiator The two sides of the body are installed with expansion radiators, the radiator body is installed with a second heat pipe, the second heat pipe is connected with the expansion radiator, and the first cover plate is installed on the radiator body and the expansion radiator , a second cover plate is installed on the expansion heat sink, and the second cover plate is installed at the bottom of one end of the expansion heat sink. The utility model can dissipate heat to the memory while dissipating the heat of the CPU, without using an air guide cover in the whole process, saving the production cost, expanding the size of the CPU heat sink due to the arrangement of the heat sink, and making full use of the space above the memory , improve the heat dissipation efficiency and ensure the normal operation of the server.

Description

CPU radiator with internal storage air guide function

Technical Field

The utility model belongs to the technical field of radiators, and particularly relates to a CPU radiator with internal storage air guide.

Background

Along with the gradual increase of the power consumption of a CPU and a memory, the requirement on the heat dissipation technology is more and more strict, in the prior art, a general wind scooper of the CPU and the memory is adopted for heat dissipation of the CPU and the memory, the size of a CPU radiator is limited by adopting the wind scooper for heat dissipation, the space above the memory cannot be utilized more efficiently, the heat dissipation effect is reduced, and the condition of shutdown caused by higher temperature of the CPU or the memory is serious.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art and provide the CPU radiator with the function of guiding air for the memory, the device can radiate the heat of the memory while radiating the heat of the CPU, an air guide cover is not needed in the whole process, the production cost is saved, the size of the CPU radiator increased by arranging the heat radiating piece is expanded, the space above the memory is fully utilized, the heat radiating efficiency is improved, and the normal work of the server is ensured.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a compromise CPU radiator of memory wind-guiding, includes radiator body, base, first apron, the radiator body is installed on the base, installs first heat pipe on the base, installs the expansion radiating piece in the both sides of radiator body, install the second heat pipe on the radiator body, the second heat pipe is connected with the expansion radiating piece, first apron is installed on the radiator body and is expanded the radiating piece, installs the second apron on expanding the radiating piece, the second apron is installed in the bottom of expanding radiating piece one end.

Preferably, the first heat pipe and the second heat pipe have the same structure, the second heat pipe is provided with a plurality of second heat pipes, the plurality of second heat pipes are uniformly distributed on the radiator body and the extended radiating piece, the first heat pipe and the second heat pipe have the same structure and are convenient to maintain and replace in a later period, the first heat pipe and the second heat pipe are convenient to conduct heat, heat dissipation is accelerated, and radiating efficiency is improved.

Preferably, the base is provided with a sinking groove, a threaded hole convenient for fixing the radiator is formed in the sinking groove, and the sinking groove is used for protecting the safety of the screw.

Preferably, the cross section of the expanded radiating piece is of a trapezoidal structure, the expanded radiating piece increases the radiating area of the radiator body, radiating efficiency is improved, and cooling air horizontally entering the expanded radiating piece can be vertically blown into the memory by matching with the first cover plate and the second cover plate, so that the purpose of radiating the memory is achieved.

Preferably, the first cover plate comprises a cover plate body and inclined plates arranged on two sides of the cover plate body, the inclined plates are matched with the inclined planes of the expanded radiating pieces, and the inclined plates are arranged to blow cooling air horizontally entering the expanded radiating pieces into the memory in a vertical mode so as to achieve the purpose of heat dissipation of the memory.

Preferably, the radiator body and the extended radiating piece are made of aluminum, so that the radiating efficiency is guaranteed.

Preferably, the first cover plate and the second cover plate are made of the same material.

The utility model has the beneficial effects that:

1) the device can radiate the heat of the CPU while radiating the heat of the CPU, an air guide cover is not needed in the whole process, the production cost is saved, the size of the CPU radiator added by the arrangement of the heat radiating piece is expanded, the space above the memory is fully utilized, the heat radiating efficiency is improved, and the normal work of the server is ensured.

2) The same maintenance and the change in the later stage of being convenient for of the structure of this device first heat pipe and second heat pipe, the thermal conduction of being convenient for realize of setting up of first heat pipe and second heat pipe for thermal giving off improves radiating efficiency.

3) A sunken groove is formed in the base of the device, a threaded hole convenient for fixing a radiator is formed in the sunken groove, and the sunken groove is used for protecting the safety of screws.

4) The device expands the heat dissipation piece, increases the heat dissipation area of the heat dissipation piece body, improves the heat dissipation efficiency, and can blow cooling air horizontally entering the expanded heat dissipation piece into the memory vertically by matching with the first cover plate and the second cover plate, so that the purpose of heat dissipation of the memory is realized.

5) The first cover plate of this device includes the apron body and installs the hang plate in apron body both sides, the hang plate cooperatees with the inclined plane that extends the radiating piece, and the setting of hang plate is convenient for with the level get into on the cooling air vertically blows in the memory that extends the radiating piece, realizes the radiating purpose to the memory.

6) This device radiator body and expansion radiating piece all adopt the aluminium material, have guaranteed the radiating efficiency.

Drawings

FIG. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of the bottom structure of the present invention.

Fig. 3 is a schematic structural view of a base in the present invention.

Fig. 4 is a schematic structural view of the first cover plate of the present invention.

In the figure: 1. a base; 2. a heat sink body; 3. a first cover plate; 301. an inclined plate; 302. a cover plate body; 4. a first heat pipe; 5. a second heat pipe; 6. the heat dissipation part is expanded.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1 to 4, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

The utility model provides a compromise CPU radiator of memory wind-guiding, includes radiator body 2, base 1, first apron 3, radiator body 2 installs on base 1, installs first heat pipe 4 on base 1, installs the expansion radiating piece 6 in radiator body 2's both sides, install second heat pipe 5 on radiator body 2, second heat pipe 5 is connected with the expansion radiating piece 6, first apron 3 is installed on radiator body 2 and expansion radiating piece 6, installs the second apron on expanding radiating piece 6, the bottom at expansion radiating piece 6 one end is installed to the second apron.

The arrangement of the expanded radiating piece 6 improves the radiating efficiency of the radiator body 2, increases the radiating area of the radiator body 2, and ensures the normal work of the CPU and the memory.

The structure of first heat pipe 4 and second heat pipe 5 is the same, second heat pipe 5 is equipped with many, and many second heat pipes 5 evenly distributed are on radiator body 2 and expand radiating piece 6, and the same maintenance and the change of the later stage of being convenient for of structure of first heat pipe 4 and second heat pipe 5, and the thermal conduction of being convenient for realize that setting up of first heat pipe 4 and second heat pipe 5 for thermal giving off improves radiating efficiency.

The base 1 is provided with a sinking groove, a threaded hole convenient for fixing a radiator is formed in the sinking groove, and the sinking groove is used for protecting the safety of screws.

The cross section of the expanded radiating piece 6 is of a trapezoidal structure, the expanded radiating piece 6 increases the radiating area of the radiator body 2, radiating efficiency is improved, and cooling air horizontally entering the expanded radiating piece 6 can be vertically blown into the memory by matching with the first cover plate 3 and the second cover plate, so that the purpose of radiating the memory is achieved.

The first cover plate 3 comprises a cover plate body 302 and inclined plates 301 arranged on two sides of the cover plate body 302, the inclined plates 301 are matched with inclined planes of the expanded radiating pieces 6, the inclined plates 301 are arranged to facilitate the horizontal entering of the cooling air which expands the radiating pieces 6 to blow into the memory vertically, and the purpose of heat dissipation of the memory is achieved.

The radiator body 2 and the extended radiating piece 6 are made of aluminum materials, and radiating efficiency is guaranteed.

The radiator body 2 and the extended radiating piece 6 can be made of copper materials and materials with fast heat dissipation, so that heat can be conveniently and timely dissipated.

First apron 3, second apron adopt the same material to make, adopt the radiating metal material of being convenient for, are convenient for absorb the heat and give off, have improved the radiating efficiency.

The working process is as follows: the cooling air blows from the right side to the left side, the first heat pipe 4 absorbs the heat generated by the CPU and conducts the heat to the radiator body 2, when the cooling air passes through the radiator body 2, the radiator body 2 can be cooled, when the cooling air enters the extended radiating piece 6 from one side of the extended radiating piece 6, the cooling air blown horizontally can be blown vertically onto the memory under the cooperation of the first cover plate 3, the memory is cooled, and the memory is cooled while the CPU is cooled.

The foregoing is merely illustrative and explanatory of the present invention and various modifications, additions or substitutions may be made to the specific embodiments described by those skilled in the art without departing from the scope of the utility model as defined in the accompanying claims.

Claims

1. A CPU radiator that takes into account the air guiding of memory, comprising a radiator body, a base, and a first cover plate, the radiator body is mounted on the base, and a first heat pipe is installed on the base, characterized in that, in the heat dissipation Expansion heat sinks are installed on both sides of the radiator body, a second heat pipe is installed on the radiator body, the second heat pipe is connected with the expansion heat sink, and the first cover plate is installed on the radiator body and the expansion heat sink On the top, a second cover plate is installed on the expansion heat sink, and the second cover plate is installed at the bottom of one end of the expansion heat sink.

2 . The CPU radiator of claim 1 , wherein the first heat pipe and the second heat pipe have the same structure, and the second heat pipe is provided with a plurality of first heat pipes, and a plurality of first heat pipes are provided. 3 . The two heat pipes are evenly distributed on the radiator body and the extended heat sink.

3 . The CPU radiator of claim 1 , wherein a sinking groove is formed on the base, and a threaded hole is formed in the sinking groove to facilitate fixing the radiator. 4 .

4 . The CPU heat sink as claimed in claim 2 , wherein the extended heat sink adopts a trapezoidal structure in cross section. 5 .

5 . The CPU heat sink of claim 4 , wherein the first cover plate comprises a cover plate body and inclined plates installed on both sides of the cover plate body, and the inclined plates Matches with the inclined surface of the extended heat sink.

6 . The CPU radiator of claim 2 , wherein the radiator body and the extended heat sink are made of aluminum plate material. 7 .

7 . The CPU heat sink of claim 5 , wherein the first cover plate and the second cover plate are made of the same material. 8 .