CN210666654U

CN210666654U - Notebook computer mainboard heat dissipation mechanism

Info

Publication number: CN210666654U
Application number: CN201921846073.7U
Authority: CN
Inventors: 吴建雄
Original assignee: Jiangsu Jixiangxing Intelligent Technology Co ltd
Current assignee: Jiangsu Jixiangxing Intelligent Technology Co ltd
Priority date: 2019-10-30
Filing date: 2019-10-30
Publication date: 2020-06-02
Anticipated expiration: 2029-10-30

Abstract

The utility model discloses a notebook computer mainboard heat dissipation mechanism, including box body, heat conduction copper pipe and radiator fan, the box body is inside to have radiator fan and the inside one end of box body to have an aluminium system fin through the bolt fastening, the inside one end of box body is installed pole setting and pole setting one side through the mounting groove and is connected with the guide vane through the bearing, box body one side is provided with heat conduction copper pipe and heat conduction copper pipe one end and welds inside the aluminium system fin, the welding of heat conduction copper pipe one end has No. two heat-conducting plates of heat conduction copper pipe and the other end welding of heat conduction copper pipe, heat conduction copper pipe outside cover is equipped with the heat insulating. The utility model discloses a set up the loss in insulating layer and the radiation shield can effectively avoid heat conduction, inside the reentrant notebook computer, have the air-out simultaneously and transfer to the function, be fit for being extensively promoted and used.

Description

Notebook computer mainboard heat dissipation mechanism

Technical Field

The utility model relates to a heat dissipation mechanism technical field, in particular to notebook computer mainboard heat dissipation mechanism.

Background

The notebook computer has the biggest characteristic that the body is small and exquisite, is more convenient to carry than a PC, is a small-sized and portable personal computer, has the current development trend that the size is smaller and smaller, the weight is lighter and lighter, the function is stronger and stronger, the heat dissipation of the notebook computer mainly depends on a heat conduction device to absorb heat, and then the heat is blown out by a cooling fan, and the existing notebook computer mainboard cooling device has the defects that: 1. the heat dissipation performance is not high, heat in the heat absorption and heat conduction processes of the heat conduction device can be lost, the heat conduction and heat dissipation efficiency is reduced when the heat conduction device enters the notebook computer mainboard again, 2, the air outlet is not adjustable, and heat blown out by the heat dissipation fan can be pumped into the notebook computer again for heat dissipation, so that the heat dissipation efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a heat dissipation mechanism for notebook computer motherboard, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a notebook computer mainboard heat dissipation mechanism, includes box body, heat conduction copper pipe and radiator fan, the box body is inside to have radiator fan and the inside one end of box body through the bolt fastening and to have aluminium system fin, pole setting and pole setting one side are installed through the mounting groove to the inside one end of box body and are connected with the guide vane through the bearing, box body one side is provided with heat conduction copper pipe and heat conduction copper pipe one end and welds inside aluminium system fin, the welding of heat conduction copper pipe one end has heat conduction plate and the welding of the heat conduction copper pipe other end has No. two heat conduction plates, heat conduction copper pipe outside cover is equipped with the radiation shield.

Furthermore, the bottom of the box body is provided with an air inlet.

Further, the heat insulation layer is made of glass fiber cotton materials and the heat insulation sleeve is made of ceramic fiber materials.

Furthermore, the bottoms of the first heat conducting plate and the second heat conducting plate are both glued with heat conducting pads made of silicon rubber materials, and a plurality of mounting blocks are welded on the outer sides of the first heat conducting plate and the second heat conducting plate.

Furthermore, the number of the guide pieces is multiple, and the support rods are arranged between the guide pieces through bearings.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. through setting up insulating layer, radiation shield and heat conduction pad, personnel use the screw to install on the notebook mainboard through installation piece a heat-conducting plate and No. two heat-conducting plates, and the heat conduction pad can be fast with the heat absorption on the mainboard by heat conduction copper pipe conduction, and the radiation shield in the heat conduction copper pipe outside can prevent effectively that the heat transfer in-process from running off, and the insulating layer can prevent the inside heat outflow of box body.

2. Through setting up direction piece and bracing piece, a plurality of direction pieces are supported by the bracing piece and are connected, and direction piece one side is connected in dead lever one side through the pivot, make the direction piece can rotate, adjust the air-out, avoid radiator fan to blow off hot-blast being taken out to notebook computer inside once more.

Drawings

Fig. 1 is a schematic view of the overall structure of the heat dissipation mechanism for the motherboard of the notebook computer of the present invention.

Fig. 2 is a schematic diagram of the internal structure of the box body of the heat dissipation mechanism for the motherboard of the notebook computer.

Fig. 3 is a sectional view of the external material of the heat conducting copper tube of the heat dissipating mechanism of the notebook computer motherboard.

Fig. 4 is a sectional view of the external material of the case of the heat dissipation mechanism for the motherboard of the notebook computer of the present invention.

In the figure: 1. a box body; 2. a heat conducting copper pipe; 3. a heat radiation fan; 4. a first heat conducting plate; 5. a second heat conducting plate; 6. mounting blocks; 7. an aluminum heat sink; 8. erecting a rod; 9. a guide piece; 10. a support bar; 11. an air inlet; 12. a thermal insulation layer; 13. a thermally conductive pad; 14. a heat insulation sleeve.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-4, a notebook computer mainboard heat dissipation mechanism, includes box body 1, heat conduction copper pipe 2 and

radiator fan

3, 1 inside radiator fan 3 that has through the bolt fastening of box body and 1 inside one end of box body have aluminium system fin 7 through the bolt fastening, there is guide plate 9 in pole setting 8 and pole setting 8 one side through the bearing connection through the mounting groove installed to 1 inside one end of box body, 1 one side of box body is provided with heat

conduction copper pipe

2 and 2 one ends of heat conduction copper pipe and welds inside

aluminium system fin

7, 2 one end welding of heat conduction copper pipe has heat-conducting

plate

4 and 2 other end welding of heat conduction copper pipe has heat-conducting plate 5 No. two, 2 outside covers of heat conduction copper pipe are equipped with

insulation sleeve

14, 1 surface veneer of box.

Wherein, the bottom of the box body 1 is provided with an air inlet 11.

In this embodiment, as shown in fig. 2, the air inlet 11 facilitates the heat dissipation fan 3 to blow outside air into the box body 1 to perform air blowing and heat dissipation on the aluminum heat dissipation plate 7.

Wherein the heat insulation layer 12 is made of glass fiber cotton material and the heat insulation sleeve 14 is made of ceramic fiber material.

In this embodiment, as shown in fig. 1, the thermal insulation layer 12 made of glass fiber cotton material prevents the heat inside the box body 1 from being lost, and plays a role of sound insulation, and the thermal insulation sleeve 14 made of ceramic fiber material prevents the heat from being lost when the heat conduction copper pipe 2 conducts the heat, and improves the aesthetic property of the heat conduction copper pipe 2.

Wherein, No. one heat-conducting plate 4 and No. two heat-conducting plates 5 bottom all veneer have heat conduction pad 13 and heat conduction pad 13 to make for the silicon rubber material, No. one heat-conducting plate 4 and No. two heat-conducting plates 5 outside welding have installation piece 6 and the quantity of installation piece 6 to be a plurality of.

In this embodiment, as shown in fig. 1 and 3, the heat conducting pad 13 can quickly absorb heat of the main board fitting, and the plurality of mounting blocks 6 facilitate a person to mount the first heat conducting plate 4 and the second heat conducting plate 5 on the main board fitting.

Wherein, the quantity of guide piece 9 is a plurality of and install the bracing piece 10 through the bearing between the guide piece 9.

In this embodiment, as shown in fig. 2, the air outlet direction can be adjusted by the person stirring the guide pieces 9, and the support rod 10 is used for improving the structural stability of the plurality of guide pieces 9.

It should be noted that, the utility model relates to a notebook computer mainboard heat dissipation mechanism, when working, the personnel use the screw to install the box body 1 on the notebook computer mainboard, use the screw to install the first heat conduction plate 4 and the second heat conduction plate 5 on the top of the accessory on the mainboard through the installation block 6, and use the power cord radiator fan 3 to connect with the power supply equipment on the mainboard, the heat conduction pad 13 made of silicon rubber can absorb the heat generated when the accessory works rapidly, the heat conduction copper pipe 2 conducts into the box body 1, the heat insulation sleeve 14 made of ceramic fiber material makes the heat conduction copper pipe 2 not lose the heat when conducting the heat, simultaneously improve the aesthetic degree of the heat conduction copper pipe 2, the personnel can blow out the heat transferred from the heat conduction copper pipe 2 through the aluminum radiator 7 when opening the radiator fan 3, to achieve the purpose of heat dissipation, meanwhile, the personnel can stir the guide plate 9, the plurality of guide plates 9 are connected by the, 9 one sides of guide vane are connected in 8 one sides of dead lever through the pivot, stir guide vane 9 and adjust the air-out, avoid that radiator fan 3 blows off hot-blast being taken out to notebook computer inside once more, and insulating layer 12 is made to the fine cotton material of glass, makes 1 inside heat of box body can not run off, plays syllable-dividing effect simultaneously.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a notebook computer mainboard heat dissipation mechanism, includes box body (1), heat conduction copper pipe (2) and radiator fan (3), its characterized in that: the utility model discloses a heat-insulating sleeve, including box body (1), box body (1) inside have radiator fan (3) and box body (1) inside one end to have aluminium system fin (7) through the bolt fastening, pole setting (8) and pole setting (8) one side are installed through the mounting groove to box body (1) inside one end and are connected with guide vane (9) through the bearing, box body (1) one side is provided with heat conduction copper pipe (2) and heat conduction copper pipe (2) one end and welds inside aluminium system fin (7), heat conduction copper pipe (2) one end welding has heat-conducting plate (4) and heat conduction copper pipe (2) other end welding has heat-conducting plate (5) No. two, heat conduction copper pipe (2) outside cover is equipped with heat insulating sleeve (14).

2. The heat dissipation mechanism for a motherboard of a notebook computer according to claim 1, wherein: an air inlet (11) is formed in the bottom of the box body (1).

3. The heat dissipation mechanism for a motherboard of a notebook computer according to claim 1, wherein: the heat insulation layer (12) is made of glass fiber cotton material and the heat insulation sleeve (14) is made of ceramic fiber material.

4. The heat dissipation mechanism for a motherboard of a notebook computer according to claim 1, wherein: the heat-conducting plate is characterized in that the bottoms of the first heat-conducting plate (4) and the second heat-conducting plate (5) are both glued with heat-conducting pads (13), the heat-conducting pads (13) are made of silicon rubber materials, and the number of the mounting blocks (6) welded on the outer sides of the first heat-conducting plate (4) and the second heat-conducting plate (5) are multiple.

5. The heat dissipation mechanism for a motherboard of a notebook computer according to claim 1, wherein: the number of the guide pieces (9) is multiple, and the support rods (10) are arranged between the guide pieces (9) through bearings.