CN220553128U

CN220553128U - Efficient heat dissipation mechanism for CPU (Central processing Unit) of middle-duty computer

Info

Publication number: CN220553128U
Application number: CN202321395987.2U
Authority: CN
Inventors: 章伟明; 王玉; 徐爱平
Original assignee: Beijing Bigger Big Data Operations Co ltd
Current assignee: Beijing Bigger Big Data Operations Co ltd
Priority date: 2023-06-03
Filing date: 2023-06-03
Publication date: 2024-03-01
Anticipated expiration: 2033-06-03

Abstract

The utility model relates to the technical field of heat dissipation mechanisms, and discloses a high-efficiency heat dissipation mechanism for a Central Processing Unit (CPU) of a medium duty computer, which comprises a shell and a water pump, wherein a water cooling head is fixedly arranged on the back of the water pump, a storage device is fixedly arranged at the center of an inner cavity of the shell, a liquid exchange chamber is fixedly arranged in the inner cavity of the storage device, fixing frames are fixedly arranged on the periphery of the water pump, and fastening bolts are movably arranged on the front of the fixing frames. This a high-efficient heat dissipation mechanism for well job computer CPU, through laminating the back of water pump and the front of CPU each other, the water-cooling head can laminate on the surface of CPU, carries the coolant liquid to the water pump in through conveying hose to realize the cooling heat dissipation work to CPU, cooperate with the fan that bloies simultaneously, can upwards discharge unnecessary heat, and dispel the heat through heat radiation fin can be better, thereby effectually guaranteed the use of computer and CPU.

Description

Efficient heat dissipation mechanism for CPU (Central processing Unit) of middle-duty computer

Technical Field

The utility model relates to the technical field of heat dissipation mechanisms, in particular to an efficient heat dissipation mechanism for a Central Processing Unit (CPU) of a medium duty computer.

Background

When the CPU works, a large amount of heat is generated, if the heat is not timely emitted, the CPU is crashed, the CPU is possibly burned down if the heat is light, the CPU radiator is used for radiating the heat of the CPU, the radiator plays a decisive role in the stable operation of the CPU, and when the computer is assembled, the purchase of a good radiator is very important.

The CPU radiator can be divided into three types of air cooling, a heat pipe and water cooling according to the radiating mode of the CPU radiator, chinese patent discloses a high-efficiency radiating mechanism (authorized bulletin No. CN 215867759U) for a CPU of a middle-duty computer, the technology of the CPU radiator can achieve the purposes of being capable of comprising a fixed frame, fan blades are movably mounted inside the fixed frame, radiating fins are movably mounted behind the fixed frame, the heat pipe is movably mounted behind the fixed frame, a hollow copper block is movably mounted at the lower end of the heat pipe, a heat conducting strip is fixedly mounted on the lower surface of the radiating fins, a heat conducting sheet is fixedly mounted inside the heat pipe, a motor is fixedly mounted behind the fan blades, a fixed support is fixedly mounted on the outer side surface of the motor, and the motor is fixedly connected with the fixed frame through the fixed support. The efficient heat dissipation mechanism for the CPU of the medium duty computer can change the heat conduction path, enlarge the contact area between the heat pipe and the heat dissipation fins, enable the heat to be conducted between the heat dissipation fins, enable the heat to be conducted out rapidly, and enable the heat pipe, the heat dissipation fins and the copper block to be convenient to detach and install, but has poor heat dissipation effect relative to water cooling, and meanwhile, under the condition that a large number of computers are in a classroom, air cooling cannot guarantee heat dissipation of the CPU, and the phenomena of untimely heat dissipation effect and poor heat dissipation effect can be caused.

Accordingly, one skilled in the art would provide an efficient heat dissipation mechanism for a CPU of a mid-job computer to solve the problems set forth in the background art.

Disclosure of Invention

The utility model aims to provide a high-efficiency heat dissipation mechanism for a Central Processing Unit (CPU) of a medium-duty computer, which has the advantages of water-cooling circulation heat dissipation function and rapid heat dissipation so as to solve the problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a high-efficient heat dissipation mechanism for well job computer CPU, includes casing and water pump, the back fixed mounting of water pump has the water cooling head, the center department fixed mounting of casing inner chamber has the strorage device, the inner chamber fixed mounting of strorage device has the trading liquid room.

As still further aspects of the utility model: the fixing frames are fixedly arranged around the water pump, and fastening bolts are movably arranged on the front faces of the fixing frames.

As still further aspects of the utility model: the front center of the shell is fixedly provided with a conveying hose, the tail end of the conveying hose is fixedly connected with the front of the water pump, and the front of the storage device is fixedly connected with the top end of the conveying hose.

As still further aspects of the utility model: the fan is all fixed mounting in both sides of casing inner chamber, fan's inner chamber fixed mounting has the support, the center department fixed mounting of support bottom has the output shaft, all fixed mounting has the flabellum around the output shaft.

As still further aspects of the utility model: the top of the shell is fixedly provided with a mounting top plate, mounting holes are formed in the periphery of the top of the mounting top plate, and the top of the mounting top plate is fixedly provided with radiating fins.

As still further aspects of the utility model: the bottom of the inner cavity of the storage device is fixedly provided with a refrigerating sheet, and the top of the refrigerating sheet is mutually attached to the bottom of the liquid exchange chamber.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the back of the water pump is attached to the front of the CPU, the water cooling head is attached to the surface of the CPU, and the cooling liquid is conveyed into the water pump through the conveying hose, so that the cooling and heat dissipation work of the CPU is realized, meanwhile, the cooling and heat dissipation work is mutually matched with the blowing fan, the redundant heat can be discharged upwards, and the heat can be well dissipated through the heat dissipation fins, so that the use of a computer and the CPU is effectively ensured.

2. The utility model can ensure the lower temperature of the cooling liquid through the refrigerating sheet and ensure the temperature of the cooling liquid when the liquid exchange chamber exchanges liquid.

Drawings

FIG. 1 is a schematic diagram of a high efficiency heat dissipation mechanism for a CPU of a mid-job computer;

FIG. 2 is a top view of a housing structure for a high efficiency heat dissipation mechanism for a CPU of a mid-job computer;

FIG. 3 is a rear view of the structure of a high efficiency heat dissipating mechanism for a CPU of a mid-job computer;

fig. 4 is a bottom cross-sectional view of a storage structure in a high efficiency heat dissipation mechanism for a CPU of a mid-job computer. In the figure: 1. a housing; 2. a conveying hose; 3. an output shaft; 4. a storage; 5. installing a top plate; 6. a mounting hole; 7. a bracket; 8. a blowing fan; 9. a water pump; 10. a fastening bolt; 11. a fixing frame; 12. a heat radiation fin; 13. a water-cooled head; 14. a liquid exchange chamber; 15. a refrigerating sheet.

Detailed Description

Referring to fig. 1-4, a high-efficiency heat dissipation mechanism for a CPU of a Central Processing Unit (CPU) comprises a housing 1 and a water pump 9, wherein a water cooling head 13 is fixedly mounted on the back of the water pump 9, a storage device 4 is fixedly mounted at the center of an inner cavity of the housing 1, and a liquid exchange chamber 14 is fixedly mounted in an inner cavity of the storage device 4.

Specifically, fixing frames 11 are fixedly installed around the water pump 9, and fastening bolts 10 are movably installed on the front faces of the fixing frames 11.

Through the technical scheme, the fastening bolt 10 is matched with the fixing frame 11, so that the water pump 9 can be installed.

Specifically, the center of the front face of the shell 1 is fixedly provided with a conveying hose 2, the tail end of the conveying hose 2 is fixedly connected with the front face of the water pump 9, and the front face of the storage device 4 is fixedly connected with the top end of the conveying hose 2.

Through the technical scheme, the conveying hose 2 can convey the cooling liquid.

Specifically, both sides of the inner cavity of the shell 1 are fixedly provided with a blowing fan 8, the inner cavity of the blowing fan 8 is fixedly provided with a bracket 7, the center of the bottom of the bracket 7 is fixedly provided with an output shaft 3, and the periphery of the output shaft 3 is fixedly provided with fan blades.

Through the above technical scheme, the blowing fan 8 can perform blowing work and can blow out heat upwards.

Specifically, a top of the shell 1 is fixedly provided with a mounting top plate 5, mounting holes 6 are formed in the periphery of the top of the mounting top plate 5, and the top of the mounting top plate 5 is fixedly provided with radiating fins 12.

Through the above technical scheme, the radiating fins 12 can radiate heat, and the mounting top plate 5 can be mounted and fixed through the mounting holes 6.

Specifically, the bottom of the inner cavity of the storage device 4 is fixedly provided with a refrigerating sheet 15, and the top of the refrigerating sheet 15 is mutually attached to the bottom of the liquid exchange chamber 14.

Through the above technical scheme, the refrigerating plate 15 can ensure that the temperature of the cooling liquid is low, and the temperature of the cooling liquid in the liquid exchange chamber 14 during liquid exchange is ensured.

The working principle of the utility model is as follows: through laminating the back of water pump 9 and the front of CPU each other, water-cooling head 13 can laminate on the surface of CPU, carry to in water pump 9 through conveying hose 2 to realize cooling heat dissipation work to the CPU, simultaneously with blowing fan 8 mutually support, can upwards discharge unnecessary heat, and can be better dispel the heat through fin 12, fastening bolt 10 mutually support with mount 11, can install work to water pump 9, can install fixed work to installation roof 5 through mounting hole 6, refrigeration piece 15 can guarantee that the temperature of coolant liquid is lower, guarantee the temperature of coolant liquid when the liquid change room 14 trades the liquid.

The foregoing description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical solution of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. A high-efficient heat dissipation mechanism for well job computer CPU, includes casing (1) and water pump (9), its characterized in that: the back of the water pump (9) is fixedly provided with a water cooling head (13), the center of the inner cavity of the shell (1) is fixedly provided with a storage device (4), and the inner cavity of the storage device (4) is fixedly provided with a liquid exchange chamber (14).

2. A high efficiency heat dissipation mechanism for a CPU of a mid-job computer as defined in claim 1, wherein: the water pump is characterized in that a fixing frame (11) is fixedly arranged around the water pump (9), and a fastening bolt (10) is movably arranged on the front surface of the fixing frame (11).

3. A high efficiency heat dissipation mechanism for a CPU of a mid-job computer as defined in claim 1, wherein: the novel water pump is characterized in that a conveying hose (2) is fixedly arranged in the center of the front face of the shell (1), the tail end of the conveying hose (2) is fixedly connected with the front face of the water pump (9), and the front face of the storage device (4) is fixedly connected with the top end of the conveying hose (2).

4. A high efficiency heat dissipation mechanism for a CPU of a mid-job computer as defined in claim 1, wherein: the fan is characterized in that the two sides of the inner cavity of the shell (1) are fixedly provided with blowing fans (8), the inner cavity of each blowing fan (8) is fixedly provided with a support (7), the center of the bottom of each support (7) is fixedly provided with an output shaft (3), and the periphery of each output shaft (3) is fixedly provided with fan blades.

5. A high efficiency heat dissipation mechanism for a CPU of a mid-job computer as defined in claim 1, wherein: the top of the shell (1) is fixedly provided with a mounting top plate (5), mounting holes (6) are formed in the periphery of the top of the mounting top plate (5), and the top of the mounting top plate (5) is fixedly provided with radiating fins (12).

6. A high efficiency heat dissipation mechanism for a CPU of a mid-job computer as defined in claim 1, wherein: the bottom of the inner cavity of the storage device (4) is fixedly provided with a refrigerating sheet (15), and the top of the refrigerating sheet (15) is mutually attached to the bottom of the liquid exchange chamber (14).