CN111787752B - Split type heat conductor and electronic device with heat dissipation structure - Google Patents
Split type heat conductor and electronic device with heat dissipation structure Download PDFInfo
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- CN111787752B CN111787752B CN201910273687.9A CN201910273687A CN111787752B CN 111787752 B CN111787752 B CN 111787752B CN 201910273687 A CN201910273687 A CN 201910273687A CN 111787752 B CN111787752 B CN 111787752B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract
The invention discloses a split type heat conductor, which comprises a heat collecting device and a heat releasing device, wherein the heat collecting device comprises a heat collecting base and a plurality of V-shaped metal sheets I fixedly connected with the heat collecting base; the heat collecting base is used for being in close contact with the electronic component and absorbing heat emitted by the electronic component; the V-shaped metal sheet I is used for conducting heat from the heat collecting base to the V-shaped metal sheet II; the V-shaped metal sheet II is used for conducting the heat absorbed from the V-shaped metal sheet I to the heat release base; the heat release base is adapted to be in intimate contact with the device housing and conduct heat to the device housing. The device provided by the invention has a simple structure, is convenient to disassemble, realizes the close contact between the split bodies through elasticity, effectively overcomes the assembly error, and realizes the high-efficiency heat conduction between the electronic component and the shell.
Description
Technical Field
The present invention relates to the field of heat dissipation design of electronic devices, and in particular, to a split heat conductor and an electronic device having a heat dissipation structure.
Background
The electronic component generates heat due to the flow of current, and the temperature rises to become a heat source. If the temperature rise is too high, control is needed so as to prevent the electronic components from not working normally. In order to control the temperature, either a heat sink is designed to rapidly dissipate the heat of the heat source into the air, or a heat conductor is designed to conduct the heat of the heat source to the housing for heat dissipation.
In order to facilitate disassembly, assembly and maintenance, the circuit board where the electronic component is located and the shell need to be separated conveniently, so that the heat conductor is used for connecting the electronic component and the shell and is required to be movably connected. Since air conducts heat too poorly, the movable connection must ensure tightness and achieve sufficient contact between the highly heat-conductive materials. Because of assembly tolerances, the heat conductor cannot be designed to be rigid and must be made resilient to overcome assembly tolerances.
A common radiator adopts a fan for heat dissipation, the heat dissipation of the fan brings dust problems, and the long-time operation of the fan causes the problem of the service life of the fan.
At present, because of the lack of a heat conductor which is movably connected and has both elasticity and high-efficiency heat conduction performance, a radiator is basically adopted to directly radiate heat of an electronic component.
Disclosure of Invention
The present invention aims to overcome the above-mentioned shortcomings and provide a technical solution to solve the above-mentioned problems.
In a first aspect, a split heat conductor includes a heat collecting device and a heat releasing device, where the heat collecting device includes a heat collecting base and a plurality of first V-shaped metal sheets fixedly connected to the heat collecting base, and the heat releasing device includes a heat releasing base and a plurality of second V-shaped metal sheets fixedly connected to the heat releasing base;
the heat collecting base is used for being in direct close contact with the electronic component or being in close contact with the high-heat-conductivity spacer at intervals so as to absorb heat emitted by the electronic component;
the first V-shaped metal sheet is used for conducting heat from the heat collecting base to the second V-shaped metal sheet;
the V-shaped metal sheet II is used for conducting heat absorbed from the V-shaped metal sheet I to the heat release base;
the heat release base is adapted to be in intimate contact with the device housing and conduct heat to the device housing.
Further, the first V-shaped metal sheets and the second V-shaped metal sheets have the same geometric size, and both include a top edge and two bottom edges, the bottom edges of every two adjacent first V-shaped metal sheets are spaced apart by 0 mm to 5 mm, and the bottom edges of every two adjacent second V-shaped metal sheets are spaced apart by 0 mm to 5 mm.
Furthermore, the V-shaped structures of the first V-shaped metal sheet and the second V-shaped metal sheet have elasticity, the distance between two bottom edges of the first V-shaped metal sheet and the second V-shaped metal sheet is squeezed and reduced after assembly, and the first V-shaped metal sheet and the second V-shaped metal sheet are restored to the original shape after disassembly and assembly.
Further, the first V-shaped metal sheet and the second V-shaped metal sheet are made of metal or a metal and heat conducting graphite sheet combined material.
Further, the heat release base has a smooth and flat heat release plane for being in close contact with the case.
Further, the heat collecting base is provided with a smooth and flat heat collecting plane which is used for being in direct close contact with the electronic component or being in close contact with the high-heat-conductivity spacer.
Furthermore, the heat collecting base is also provided with mounting holes for mounting and fixing, and the number of the mounting holes is between 1 and 8.
Further, the heat release base is integral with the housing.
In a second aspect, an electronic device with a heat dissipation structure includes a circuit board and a housing, the circuit board has a first electronic component that needs to dissipate heat, and the electronic device with a heat dissipation structure further includes the split heat conductor according to the first aspect of the present invention; the heat collecting device of the split heat conductor is in direct close contact with the first electronic component or in close contact with the first electronic component at intervals by high heat conduction gaskets so as to absorb heat emitted by the first electronic component; the heat release device of the split heat conductor is fixedly mounted on the shell or integrated with the shell.
Furthermore, the electronic device with the heat dissipation structure further comprises a shell end cover and one or two drawer supports fixedly connected with the shell end cover; the drawer support is used for fixedly mounting the circuit board to form a drawer inner structure formed by fixedly connecting the shell end cover, the drawer support and the circuit board together, and the drawer inner structure is used for being inserted into the shell to complete the assembly of the split type heat conductor; between drawer support and the casing, reduce the assembly resistance through gyro wheel or ball or draw-in groove.
Furthermore, only one end of the cavity structure of the shell is an open end, and the other ends of the cavity structure of the shell are closed and waterproof, the open end is used for inserting the drawer support and the circuit board and is matched with the shell end cover in size, and the shell end cover is provided with at least one interface hole for exposing an equipment interface.
Furthermore, a handle which is convenient for a person to hold the shell end cover is arranged on the shell end cover.
The invention has the beneficial effects that: the split heat conductor is simple in structure and convenient to detach, the elastic force formed by mutual extrusion between the first V-shaped metal sheet and the second V-shaped metal sheet guarantees enough heat conduction contact area, meanwhile, assembly errors are effectively overcome, and efficient heat conduction between the electronic component and the shell is achieved. The electronic device with the heat dissipation structure avoids dust problems and fan service life problems caused by heat dissipation of the fan, the drawer structure can also enable equipment to be sealed in the shell to achieve water resistance and moisture resistance, and even the shell can be partially soaked in liquid to achieve efficient shell heat dissipation.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of a split heat conductor according to an embodiment of the present invention before assembly;
FIG. 2 is a schematic cross-sectional view of an assembled split heat conductor of an embodiment of the present invention;
FIG. 3 is a schematic view of a V-shaped metal foil structure according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a V-shaped metal sheet II according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device with a heat dissipation structure according to an embodiment of the invention;
in the figure: the heat collecting device comprises a 1-heat collecting device, a 2-heat releasing device, a 3-heat collecting base, a 4-V type metal sheet I, a 5-heat releasing base, a 6-V type metal sheet II, a top side of a 7-V type metal sheet I, a bottom side of a 8-V type metal sheet I, a top side of a 9-V type metal sheet II, a bottom side of a 10-V type metal sheet II, 11-mounting holes, 12-heat collecting planes, 13-heat releasing planes, 14-circuit boards, 15-shells, 16-first electronic components, 17-shell end covers, 18-drawer supports, 19-interface holes and 20-handles.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, in an embodiment of the present invention, a split heat conductor includes a heat collecting device 1 and a heat releasing device 2, the heat collecting device 1 includes a heat collecting base 3 and V-shaped metal sheets one 4, the heat collecting base 3 is used for being closely attached to an electronic component requiring heat dissipation, a plurality of V-shaped metal sheets one 4 distributed at left and right intervals are welded and fixed to a front side of the heat collecting base 3, top edges 7 of all the V-shaped metal sheets one 4 face the same direction, the heat releasing device 2 includes a heat releasing base 5 and V-shaped metal sheets two 6, the front side of the heat releasing base 5 is used for being closely attached to a housing wall, a plurality of V-shaped metal sheets two 6 spaced at left and right intervals are welded and fixed to a rear side of the heat releasing base 5, top edges 9 of all the V-shaped metal sheets two 6 face the same direction, when assembling, a top 7 of the V-shaped metal sheet one 4 is inserted between two adjacent V-shaped metal sheets two 6, and simultaneously, a top edge 9 of the V-shaped metal sheet two V-shaped metal sheets 6 is inserted between two adjacent V-shaped metal sheets 4, and a top edge of the V-shaped metal sheet 6 passes through a gap, and a top edge 9 of the two adjacent V-shaped metal sheets 6 and a top edge of the two adjacent V-shaped metal sheets 6 deforms under an elastic force is generated.
The working principle of the invention is as follows: during assembly, the top 7 of the first V-shaped metal sheet 4 is inserted between two adjacent second V-shaped metal sheets 6, meanwhile, the top 9 of the second V-shaped metal sheet 6 is also inserted between the two adjacent first V-shaped metal sheets 4, the top edge 7 of the first V-shaped metal sheet 4 penetrates through a gap between the bottom edges 10 of the two adjacent second V-shaped metal sheets 6, meanwhile, the top edge 9 of the second V-shaped metal sheet 6 penetrates through a gap between the bottom edges 8 of the two adjacent first V-shaped metal sheets 4, the first V-shaped metal sheet 4 and the second V-shaped metal sheet 6 are deformed, and are tightly attached under elastic acting force generated by deformation. The heat that electronic components work produced is at first conducted to heat collection base 3, heat collection base 3 transmits for V type foil 4, V type foil 4 transmits the heat for V type foil two 6, V type foil two 6 transmits the heat for heat release base 5, heat release base 5 releases the heat to the shell, derive the heat by the shell, V type foil one 4 and V type foil two 6 are the V font and mutual extrusion can guarantee sufficient area of contact, improve heat conduction efficiency.
The geometry of the V-shaped foils one 4 and the V-shaped foils two 6 remains the same so that optimum results are achieved, and the V-shaped foils one 4 or the V-shaped foils two 6 can be arranged next to each other, i.e. the gap between the bottom edges 8 of two adjacent V-shaped foils one 4 is 0 mm, or the gap between the bottom edges 10 of two adjacent V-shaped foils two 6 is 0 mm, so that after the top edge 7 of a V-shaped foil one 4 has passed through the gap between the bottom edges 10 of two adjacent V-shaped foils two 6, it is ensured that deformation has occurred. Of course, if the gap between the bottom edges 8 of two adjacent V-shaped metal sheets one 4 or the gap between the bottom edges 10 of two adjacent V-shaped metal sheets two 6 is appropriately adjusted to control the amount of deformation and the degree of elasticity, the gap is preferably not more than 5 mm in consideration of the size of a typical electronic component.
In order to ensure that the V-shaped structures of the V-shaped metal sheets I4 and II 6 have proper elasticity, the distance between the two bottom edges of the V-shaped metal sheets is extruded and reduced after assembly, and the V-shaped metal sheets are restored to the original shape after disassembly and assembly, the proper thickness of the V-shaped metal sheets needs to be considered according to the characteristics of heat-conducting metal, and the elasticity of the V-shaped metal sheets can be enhanced through a heat treatment process.
After the sufficient contact area between the first V-shaped metal sheet 4 and the second V-shaped metal sheet 6 is ensured, the heat conducting performance of the whole split heat conductor is limited by the heat conducting cross section area and the heat conducting coefficient of the material, and in order to keep proper elasticity, the thicknesses of the first V-shaped metal sheet 4 and the second V-shaped metal sheet 6 cannot be too large, so that the heat conducting cross section area cannot be increased by increasing the thicknesses of the first V-shaped metal sheet 4 and the second V-shaped metal sheet 6. The method for increasing the effective heat conduction capacity comprises three methods, namely increasing the quantity of the V-shaped metal sheet I4 and the quantity of the V-shaped metal sheet II 6, adopting metal copper with high heat conduction coefficient, and utilizing the heat conduction graphite sheet to enhance the heat conduction capacity. The heat conducting performance of the heat conducting graphite sheet has directionality, the heat conductivity coefficient of the heat conducting graphite sheet in the horizontal direction is far higher than that of metal copper, and the influence of adding a layer of heat conducting graphite sheet with the thickness of less than 1 mm on the elasticity is small. The thermally conductive graphite sheets are placed inside the V-shape of the V-shaped metal sheets one 4 and two 6 to avoid friction during assembly. The heat conducting graphite sheet extends to the heat collecting base 3 or the heat releasing base 5 to form a contact surface, so that the heat conducting advantage of the heat conducting graphite sheet can be better exerted.
The other plane of the heat release base 5 opposite to the plane connected with the V-shaped metal sheet II 6 is a heat release plane 13, the heat release plane 13 is a smooth and flat plane, and after assembly, the heat release plane 13 is in close contact with the shell. The heat release base 5 can be fixed on the case by welding, or the heat release plane 13 can be tightly adhered to the case by using a strong 3M heat conductive double sided adhesive tape.
The other plane opposite to the plane connected with the V-shaped metal sheet I4 on the heat collecting base 3 is a heat collecting plane 12, the heat collecting plane 12 is a smooth and flat plane, and after the heat collecting base is assembled, the heat collecting plane 12 is in close contact with an electronic component needing heat dissipation. A strong 3M bond may be used to tightly attach the heat collection plane 12 to the electronic components requiring heat dissipation.
The circuit board is provided with a front surface and a back surface, electronic components needing heat dissipation are arranged on the front surface or the back surface of the circuit board, a heat dissipation plane of the electronic components needing heat dissipation is parallel to the front surface or the back surface of the circuit board, and after the heat collection device 1 is arranged on the circuit board, the heat collection plane 12 is parallel to the front surface or the back surface of the circuit board. The heat releasing device 2 is fixedly arranged on the shell, the split heat conductor is assembled in the process of assembling the shell and the circuit board, and the assembling direction of the heat collecting device 1 and the heat releasing device 2 is parallel to the heat collecting plane 12.
In order to fix the heat collecting device 1 more firmly on the circuit board and ensure that the assembly process does not affect the good contact between the heat collecting plane 12 and the electronic components needing heat dissipation, mounting holes are designed on the heat collecting base, screws penetrate through the mounting holes to fix the heat collecting device 1 on the circuit board, and the number of the mounting holes is at least 1 and is not more than 8 at most. If screws are used to fix the heat collector 1 to the circuit board through the mounting holes, an elastic heat-conducting silicone sheet is preferably prevented from being placed between the heat collecting plane 12 and the electronic components that need to be heat-dissipated.
The heat release device 2 can be integrated with a shell, the shell is a heat release base 5, and the V-shaped metal sheet II 6 is directly fixed on the shell.
Referring to fig. 5, in an embodiment of the present invention, an electronic device with a heat dissipation structure includes a circuit board 14 and a housing 15, where the circuit board 14 has a first electronic component 16 that needs to dissipate heat, and the electronic device with a heat dissipation structure further includes a split heat conductor according to the first aspect of the present invention; the heat collecting device 1 of the split heat conductor is in direct close contact with the first electronic component 16 or in close contact with the high-heat-conductivity spacer at intervals so as to absorb heat emitted by the first electronic component 16; the heat release device 2 of the split type heat conductor is fixedly installed on the case 15 or integrated with the case 15.
The split heat conductor is adopted to conduct heat generated by the first electronic component 16 to the shell 15, so that the problems of dust and fan service life caused by heat dissipation by a fan are solved.
The electronic device with the heat dissipation structure can adopt a drawer type structure for convenient assembly and disassembly. The electronic device with the heat dissipation structure comprises a shell end cover 17 and one or two drawer supports 18 fixedly connected with the shell end cover 17; the drawer support 18 is used for fixedly mounting the circuit board 14 to form a drawer inner structure formed by fixedly connecting the shell end cover 17, the drawer support 18 and the circuit board 14 together, and the drawer inner structure is used for being inserted into the shell 15 to finish the assembly of the split type heat conductor; between the drawer support 18 and the housing 15, the assembly resistance is reduced by means of rollers or balls or detents. The electronic device with a heat dissipation structure may only include a drawer support 18, and the drawer support 18 is made into an integral plate-like structure, or made into a frame structure with material saved, or even made into a structure similar to a U-shape with one side of the frame structure removed. Two separate drawer supports 18 may also be used, each fixed to the housing end cap 17. If balls are used between the drawer support 18 and the housing 15, the balls may be mounted on the drawer support 18 or on the housing 15. If rollers are used between the drawer support 18 and the housing 15, the rollers may be mounted on the drawer support 18 or on the housing 15. If a clamping groove is adopted between the drawer support 18 and the shell 15, the clamping groove can be arranged on the drawer support 18 or the shell 15.
On the basis of the drawer type structure, good moisture-proof and waterproof capabilities can be designed. Only one end of the cavity structure of the shell 15 is an open end, the other ends are closed and waterproof, the open end is used for inserting the drawer support 18 and the circuit board 14, the size of the open end is matched with that of a shell end cover 17, the shell end cover 17 is provided with at least one interface hole 19 used for exposing an interface of the circuit board 14, and the common interface holes 19 comprise a power supply jack and a network interface jack. The drawer structure can seal the circuit board 14 in the shell to realize water and moisture resistance, and even part of the shell can be soaked in liquid to realize efficient shell heat dissipation.
To further facilitate installation and removal, the housing end cap 17 is provided with a handle 20 for facilitating manual grasping of the housing end cap 17. The design of the handle 20 has various options, and the external handle 20 can be fixed on the shell end cover 17 through a screw, or the external handle 20 is provided with a thread and directly rotatably installed into a threaded hole on the shell end cover 17, or the external handle 20 is welded on the shell end cover 17; an opening may also be provided directly in the housing end cap 17 to facilitate finger insertion to form the built-in handle 20.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (12)
1. A split type heat conductor is applied to electronic equipment installed in a plug-in card type or drawer type and is characterized by comprising a heat collecting device and a heat releasing device, wherein the heat collecting device comprises a heat collecting base and a plurality of V-shaped metal sheets I fixedly connected with the heat collecting base;
the heat collecting base is used for being in direct close contact with the electronic components or being in close contact with the high-heat-conductivity spacer at intervals so as to absorb heat emitted by the electronic components;
the first V-shaped metal sheet is used for conducting heat from the heat collecting base to the second V-shaped metal sheet;
the second V-shaped metal sheet is used for conducting the heat absorbed from the first V-shaped metal sheet to the heat release base;
the heat release base is used for being in close contact with a shell of the electronic device so as to conduct heat to the shell;
the assembling direction of the split heat conductor is parallel to the heat absorption plane of the heat collection base;
the split heat conductor is kept in full contact by means of elastic force formed by mutual extrusion of the first V-shaped metal sheet and the second V-shaped metal sheet under the condition that no external force or gravity is needed.
2. The split heat conductor of claim 1, wherein the first and second V-shaped metal sheets have the same geometric dimensions and each comprise a top edge and two bottom edges, the bottom edges of each adjacent first V-shaped metal sheet are spaced apart by 0 mm to 5 mm, and the bottom edges of each adjacent second V-shaped metal sheet are spaced apart by 0 mm to 5 mm.
3. The split type heat conductor of claim 2, wherein the V-shaped structures of the first V-shaped metal sheet and the second V-shaped metal sheet have elasticity, and the distance between the two bottom edges is reduced by pressing after assembly and is restored after disassembly and assembly.
4. The split type heat conductor of claim 1, 2 or 3, wherein the first V-shaped metal sheet and the second V-shaped metal sheet are made of metal or a combination of metal and a heat conducting graphite sheet.
5. The split heat conductor of claim 4, wherein the heat release base has a smooth flat heat release plane for close contact with the housing.
6. The split type heat conductor of claim 4, wherein the heat collecting base has a smooth and flat heat collecting plane for direct close contact with electronic components or close contact with a spacer with high thermal conductivity.
7. The split heat conductor of claim 6, wherein the heat collecting base further comprises mounting holes for mounting and fixing, and the number of the mounting holes is between 1 and 8.
8. The split heat conductor of claim 7, wherein the heat release base is integral with the housing.
9. An electronic device with a heat dissipation structure, comprising a circuit board and a housing, wherein the circuit board has a first electronic component that needs heat dissipation, and the electronic device with a heat dissipation structure further comprises the split heat conductor of any one of claims 1-8; the heat collecting device of the split heat conductor is in direct close contact with the first electronic component or in close contact with the first electronic component at intervals of the high-heat-conductivity gasket so as to absorb heat emitted by the first electronic component; the heat release device of the split heat conductor is fixedly mounted on the shell or integrated with the shell.
10. The electronic device with a heat dissipation structure of claim 9, further comprising a housing end cap and one or two drawer brackets fixedly connected to the housing end cap; the drawer support is used for fixedly mounting the circuit board to form a drawer inner structure formed by fixedly connecting the shell end cover, the drawer support and the circuit board together, and the drawer inner structure is used for being inserted into the shell to complete the assembly of the split-type heat conductor; between drawer support and the casing, reduce the assembly resistance through gyro wheel or ball or draw-in groove.
11. The electronic device with a heat dissipating structure of claim 10, wherein only one end of the cavity structure of the housing is an open end, and the other ends are sealed and waterproof, the open end is used for inserting the drawer support and the circuit board and is matched with the housing end cover in size, and the housing end cover is provided with at least one interface hole for exposing the equipment interface.
12. The electronic device with a heat dissipating structure of claim 11, wherein the housing end cap is provided with a handle for facilitating a human hand to grasp the housing end cap.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910273687.9A CN111787752B (en) | 2019-04-06 | 2019-04-06 | Split type heat conductor and electronic device with heat dissipation structure |
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| CN201910273687.9A CN111787752B (en) | 2019-04-06 | 2019-04-06 | Split type heat conductor and electronic device with heat dissipation structure |
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| CN118250968A (en) * | 2020-12-15 | 2024-06-25 | 华为技术有限公司 | Electronic equipment |
| CN115226361A (en) * | 2021-04-19 | 2022-10-21 | 中兴通讯股份有限公司 | Thermal bridge and electronic device |
| CN117118156B (en) * | 2023-08-29 | 2024-05-14 | 深圳山河半导体科技有限公司 | Three-phase six-wire direct current brushless motor |
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