CN219352163U - Radiating assembly for power electronics - Google Patents

Abstract

The utility model discloses a heat radiation component for power electronics, which comprises a heat conduction plate and a plurality of first heat radiation fins, wherein the heat conduction plate and the plurality of first heat radiation fins are arranged on an electronic element at equal intervals, the plurality of second heat radiation fins are symmetrically fixed on two sides of the first heat radiation fins at equal intervals, two second fixing blocks are symmetrically fixed on two ends of the heat conduction plate, a through hole is formed in the top of each second fixing block in a penetrating way, and a third fixing block is arranged in the through hole in a penetrating way; through first heat conduction pad, second fixed block, third fixed block, through-hole, draw-in groove, holding tank, bayonet lock, the through-hole of design, conveniently install the device, simple structure, convenient operation, the time of spending is few, has improved the efficiency of its installation, has reduced staff's intensity of labour, and this structural stability is high moreover, is difficult for taking place not hard up.

Description

Radiating assembly for power electronics

Technical Field

The utility model belongs to the technical field of heat dissipation components, and particularly relates to a heat dissipation component for power electronics.

Background

In the working process of the power electronic equipment, more heat can be generated, the heat is not emitted, and the normal operation of the equipment is influenced, so that the power electronic equipment needs to be used for a radiating assembly, and the power electronic equipment comprises an electronic radiator which is usually a radiating fin for radiating high-power electronic components, is free from an external power supply, is naturally cooled, is mostly made into aluminum alloy sections, and is cut into required sizes according to the sizes of the components.

When the existing heat dissipation assembly for power electronics is used, more bolts and corresponding tools are needed to be used during installation, the time spent during installation is more, after the bolts are used for a long time, loosening is easy to occur, the stability of the device is reduced, and the normal operation of the device is affected, so that a structure is needed to be designed to solve the problem.

Disclosure of Invention

The utility model aims to provide a heat radiation assembly for power electronics, which solves the problems that the installation of a device is troublesome, the time is more, the installation efficiency is low, the distance between a plurality of first radiating fins is inconvenient to adjust, the range between two adjacent first radiating fins is narrow, and the heat radiation is not facilitated.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a radiator unit for power electronics, includes heat conduction plate and a plurality of first fin of placing on electronic component, and first fin can increase the area of contact of device and air, can accelerate thermal dissipation, and is a plurality of first fin equidistance sets up in the top of heat conduction plate, the both sides equidistance symmetry of first fin is fixed with a plurality of second fin, the both ends symmetry of heat conduction plate is fixed with two second fixed blocks, the through-hole has been seted up in the top of second fixed block, and the through-hole can play certain limiting displacement to the slip direction of heat conduction plate, the inside of through-hole runs through there is the third fixed block, the bottom and the electronic component fixed connection of third fixed block, the draw-in groove has been seted up to the inboard of third fixed block, and the draw-in groove can hold the tip of bayonet lock to further carry out spacingly to the heat conduction plate, the top symmetry of heat conduction plate is fixed with two first fixed blocks, the holding tank has been seted up in the outside of first fixed block, and the holding tank can make things convenient for the slip of extrusion piece to occupy the space simultaneously, the inside of holding tank has been seted up to the through-hole, the inside of through-hole has the inside the metal pile has one side of extrusion, the inside has the one side of the metal pile to be corresponding to the inside of one side of extrusion pile.

Preferably, a plurality of balls are arranged on the inner wall of the through hole, the balls can reduce friction force between the metal pile and the inner wall of the through hole, and the balls are in rolling connection with the surface of the metal pile.

Preferably, a first heat conducting pad is fixed at the bottom of the heat conducting plate, the first heat conducting pad is a silica gel member, and the first heat conducting pad is tightly attached to the surface of the electronic element.

Preferably, a first limit groove is formed in one side of the extrusion block, the first limit groove facilitates relative sliding of the limit pile, the limit pile with the T-shaped cross section is embedded in the first limit groove, one end of the limit pile is fixedly connected with the inner wall of the accommodating groove, a spring is connected between the other end of the limit pile and the inner wall of the first limit groove, and the spring can enable the extrusion block to reset.

Preferably, two blocking piles are symmetrically fixed on the inner walls of the two sides of the first limiting groove, the blocking piles can be prevented from completely sliding out of the first limiting groove, and the blocking piles are propped against the limiting piles.

Preferably, the bottom of first fin is fixed with the second heat conduction pad, and the second heat conduction pad is the silica gel material component, the second heat conduction pad is laminated mutually with the surface of heat-conducting plate, the top of heat-conducting plate is fixed with two fixed plates for the both ends symmetry of first fin, the second spacing groove of cross-section "T" structure has been seted up to the inboard of fixed plate, and the second spacing groove makes things convenient for the slip of slider to drive first fin and remove, one side inner wall of second spacing groove has run through and has seted up the slide hole, and the slide hole makes things convenient for fixing bolt's run through, the inside equidistance of second spacing groove is provided with a plurality of cross-sections and is "T" structure's slider, the one end of slider and corresponding first fin fixed connection, be connected with fixing bolt between slider and the fixed plate.

Preferably, a rubber pad is fixed on the inner side of the fixing bolt, the rubber pad can improve the friction force between the fixing bolt and the fixing plate, the stability of the first radiating fin is improved, and the rubber pad is tightly attached to the outer side surface of the fixing plate.

Compared with the prior art, the utility model has the beneficial effects that:

1. through first heat conduction pad, second fixed block, third fixed block, through-hole, draw-in groove, holding tank, bayonet lock, the through-hole of design, conveniently install the device, simple structure, convenient operation, the time of spending is few, has improved the efficiency of its installation, has reduced staff's intensity of labour, and this structural stability is high moreover, is difficult for taking place not hard up.

2. Through fixed plate, slide hole, second heat conduction pad, second spacing groove, the slider of design, can adjust the distance between two adjacent first fin, make things convenient for the thermal dissipation between the two, improved the flexibility of device.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a front cross-sectional view of the utility model at section A of FIG. 1;

FIG. 3 is a right side cross-sectional view of the heat conductive plate and the first heat sink of the present utility model;

FIG. 4 is an enlarged view of region B of FIG. 3 in accordance with the present utility model;

in the figure: 1. an electronic component; 2. a heat conductive plate; 3. a first thermal pad; 4. a first heat sink; 5. a second heat sink; 6. a fixing plate; 7. a sliding hole; 8. a first fixed block; 9. a second fixed block; 10. a third fixed block; 11. a through hole; 12. a clamping groove; 13. a receiving groove; 14. a bayonet lock; 15. a through hole; 16. a metal pile; 17. extruding a block; 18. a first limit groove; 19. spacing piles; 20. a second thermal pad; 21. the second limit groove; 22. a sliding block.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1 to 4, the present utility model provides a technical solution: the heat radiation component for power electronics comprises a heat conduction plate 2 and a plurality of first heat radiation fins 4 which are arranged on an electronic element 1, wherein the plurality of first heat radiation fins 4 are equidistantly arranged at the top of the heat conduction plate 2, a plurality of second heat radiation fins 5 are symmetrically fixed at the two sides of the first heat radiation fins 4, the first heat radiation fins 4 and the second heat radiation fins 5 are all metal material components, the second heat radiation fins 5 can further enlarge the contact area between the device and air and improve the heat radiation efficiency of the device, two second fixing blocks 9 are symmetrically fixed at the two ends of the heat conduction plate 2, through holes 11 are formed at the top of the second fixing blocks 9 in a penetrating way, a third fixing block 10 is penetrated in the through holes 11, the second fixing blocks 9 and the third fixing blocks 10 can initially limit the heat conduction plate 2, the bottom ends of the third fixing blocks 10 are fixedly connected with the electronic element 1, clamping grooves 12 are formed in the inner sides of the third fixing blocks 10, two first fixed blocks 8 are symmetrically fixed at the top of the heat conducting plate 2, a containing groove 13 is formed in the outer side of the first fixed block 8, an extrusion block 17 is slidably arranged in the containing groove 13, the extrusion block 17 can drive a clamping pin 14 to move in the same direction, a clamping pin 14 with an L-shaped cross section structure is fixed at the bottom of the extrusion block 17, the clamping pin 14 and the clamping groove 12 can further limit the heat conducting plate 2, the device is convenient to install, the structure is simple, the operation is convenient, the time spent is short, the installation efficiency is improved, the labor intensity of workers is reduced, the structure is high in stability, looseness is not easy to occur, one end of the clamping pin 14 is embedded into the corresponding clamping groove 12, two through holes 15 are formed in one side of the clamping pin 14 in a penetrating mode, metal piles 16 are arranged in the penetrating mode in the through holes 15 in a penetrating mode, and the sliding direction of the clamping pin 14 can be limited by the metal piles 16, one end of the metal pile 16 is fixedly connected with the inner wall of the accommodating groove 13, a plurality of balls are arranged on the inner wall of the through hole 15, the balls are in rolling connection with the surface of the metal pile 16, a first heat conducting pad 3 is fixed at the bottom of the heat conducting plate 2, the first heat conducting pad 3 is a silica gel material component, heat on the electronic element 1 can be transferred to the heat conducting plate 2, the first heat conducting pad 3 is tightly attached to the surface of the electronic element 1, a first limit groove 18 is formed in one side of the extrusion block 17, a limit pile 19 with a T-shaped structure in cross section is embedded in the first limit groove 18, the spring can be extruded, one end of the limit pile 19 is fixedly connected with the inner wall of the accommodating groove 13 due to stress shrinkage of the spring, two baffle piles are symmetrically fixed on the inner walls of two sides of the first limit groove 18, and the baffle piles are propped against the limit pile 19.

In this embodiment, preferably, the bottom of the first heat sink 4 is fixed with a second heat conducting pad 20, the second heat conducting pad 20 can transfer the heat on the heat conducting plate 2 to the first heat sink 4, the second heat conducting pad 20 is attached to the surface of the heat conducting plate 2, two fixing plates 6 are symmetrically fixed on the top of the heat conducting plate 2 relative to two ends of the first heat sink 4, a second limit groove 21 with a T-shaped cross section is formed in the inner side of the fixing plate 6, a sliding hole 7 is formed in the inner wall of one side of the second limit groove 21 in a penetrating manner, a plurality of sliding blocks 22 with a T-shaped cross section are equidistantly formed in the second limit groove 21, the sliding direction of the first heat sink 4 can be limited by the sliding blocks 22, one end of each sliding block 22 is fixedly connected with the corresponding first heat sink 4, a fixing bolt is connected between each sliding block 22 and each fixing plate 6, the fixing bolt can fix the first heat sink 4, a rubber pad is fixed on the inner side of each fixing bolt, and the rubber pad is attached to the outer side surface of each fixing plate 6; the structure can adjust the distance between two adjacent first cooling fins 4, is convenient for the heat dissipation between the two, and improves the flexibility of the device.

The working principle and the using flow of the utility model are as follows: when the device is used, firstly, the device is arranged on the electronic element 1, the extrusion block 17 is pressed, so that the limiting pile 19 slides relatively in the first limiting groove 18, the spring is extruded, the spring is stressed and contracted, the extrusion block 17 moves and drives the bayonet lock 14 to slide in the same direction, the metal pile 16 slides relatively in the through hole 15 until the bayonet lock 14 slides completely in the accommodating groove 13, then the heat-conducting plate 2 is arranged on the electronic element 1, the third fixed block 10 penetrates through the through hole 11, the pressed extrusion block 17 is loosened, the spring is pushed reversely after losing extrusion, the extrusion block 17 drives the bayonet lock 14 to be embedded in the clamping groove 12, and the device is installed. If the distance between two adjacent first cooling fins 4 needs to be adjusted, the bolts can be rotated to detach the two adjacent first cooling fins, then the first cooling fins 4 are moved to drive the sliding blocks 22 to slide in the same direction in the second limiting grooves 21 until the adjacent first cooling fins 4 are adjusted to a proper position, then the bolts are connected with the sliding blocks 22, the rubber pads on the inner sides of the bolts are tightly attached to the outer side surfaces of the fixing plates 6, the first cooling fins 4 are fixed, the distance between the two adjacent first cooling fins 4 can be adjusted through the structure, heat dissipation between the two adjacent first cooling fins is facilitated, and flexibility of the device is improved.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a heat dissipation subassembly for power electronics, includes heat conduction board (2) and a plurality of first fin (4) of placing on electronic component (1), a plurality of first fin (4) equidistance sets up in the top of heat conduction board (2), its characterized in that: the utility model discloses a metal pile, including heat conduction board (2), electronic component (1), clamping groove (12) have been seted up to the both sides equidistance symmetry of first fin (4), the both ends symmetry of heat conduction board (2) is fixed with two second fixed blocks (9), through-hole (11) have been seted up in the top of second fixed block (9), the inside of through-hole (11) is run through and is had third fixed block (10), the bottom and the electronic component (1) fixed connection of third fixed block (10), draw-in groove (12) have been seted up to the inboard of third fixed block (10), the top symmetry of heat conduction board (2) is fixed with two first fixed blocks (8), holding tank (13) have been seted up in the outside of first fixed block (8), the inside slip of holding tank (13) is provided with extrusion piece (17), the bottom of extrusion piece (17) is fixed with bayonet lock (14) that the cross-section is "L" structure, the inside of one end embedding to corresponding bayonet lock (12), one side of bayonet lock (14) is run through and is seted up two inside metal pile (16), one end (16) have inside through-hole (16).

2. A heat sink assembly for power electronics as recited in claim 1, wherein: the inner wall of the through hole (15) is provided with a plurality of balls, and the balls are in rolling connection with the surface of the metal pile (16).

3. A heat sink assembly for power electronics as recited in claim 1, wherein: the bottom of the heat conducting plate (2) is fixedly provided with a first heat conducting pad (3), and the first heat conducting pad (3) is tightly attached to the surface of the electronic element (1).

4. A heat sink assembly for power electronics as recited in claim 1, wherein: a first limit groove (18) is formed in one side of the extrusion block (17), a limit pile (19) with a T-shaped cross section is embedded in the first limit groove (18), one end of the limit pile (19) is fixedly connected with the inner wall of the accommodating groove (13), and a spring is connected between the other end of the limit pile (19) and the inner wall of the first limit groove (18).

5. The heat dissipating assembly for a power electronics assembly of claim 4, wherein: two blocking piles are symmetrically fixed on the inner walls of the two sides of the first limiting groove (18), and the blocking piles are propped against the limiting piles (19).

6. A heat sink assembly for power electronics as recited in claim 1, wherein: the bottom of first fin (4) is fixed with second heat conduction pad (20), the surface of second heat conduction pad (20) and heat conduction board (2) is laminated mutually, the top of heat conduction board (2) is fixed with two fixed plates (6) for the both ends symmetry of first fin (4), second spacing groove (21) that the cross-section is "T" type structure have been seted up to the inboard of fixed plate (6), sliding hole (7) have been run through to one side inner wall of second spacing groove (21), the inside equidistance of second spacing groove (21) is provided with slider (22) that a plurality of cross-sections are "T" type structure, one end and the corresponding first fin (4) fixed connection of slider (22), be connected with fixing bolt between slider (22) and the fixed plate (6).

7. The heat dissipating assembly for a power electronics assembly of claim 6, wherein: the inner side of the fixing bolt is fixed with a rubber pad, and the rubber pad is tightly attached to the outer side surface of the fixing plate (6).

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