CN211786964U - Heat radiation structure for ruggedized computer and ruggedized computer - Google Patents

Abstract

The utility model discloses a reinforced computer is with heat radiation structure and reinforced computer relates to the reinforced computer field. The heat dissipation structure comprises at least one soaking module, and each soaking module comprises a first soaking part, a second soaking part and a heat dissipation fin, wherein the first soaking part and the second soaking part are arranged side by side, and the heat dissipation fin is arranged between the first soaking part and the second soaking part; one side of the first soaking part, which is far away from the radiating fins, and one side of the second soaking part, which is far away from the radiating fins, are respectively in contact connection with plug-in modules of the ruggedized computer, and a radiating air duct section is formed between the first soaking part and the second soaking part. The utility model provides a heat radiation structure and reinforcement computer for reinforcement computer, the radiating efficiency is higher, and the radiating effect is better.

Description

Heat radiation structure for ruggedized computer and ruggedized computer

Technical Field

The utility model relates to a ruggedized computer field particularly, relates to a reinforced heat radiation structure for computer and ruggedized computer.

Background

A ship-borne reinforced computer or chassis is computer equipment loaded in use environments of ships, warships and the like. The shipborne ruggedized computer needs to be subjected to severe environments such as electromagnetic interference, damp and hot, salt fog, mold and the like, and in order to avoid the influence of the severe environments, the shipborne ruggedized computer needs to adopt a closed structural form, along with the development of electronic technology, the performance of a plug-in module of the ruggedized computer is continuously improved, and electronic elements on the plug-in module can generate a large amount of heat during working, so how to effectively radiate heat for the plug-in module of the ruggedized computer in the closed form is a problem which needs to be solved urgently in the prior art.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that the heat dissipation effect of a plug-in module of a ship-borne ruggedized computer is not good in the prior art, the heat dissipation structure for the ruggedized computer and the ruggedized computer are provided.

An embodiment of the utility model provides a heat radiation structure for ruggedized computer, including at least one soaking module, each soaking module includes a first soaking part and a second soaking part that are arranged side by side, and a heat radiation fin that is arranged between the first soaking part and the second soaking part;

one side of the first soaking part, which is far away from the radiating fins, and one side of the second soaking part, which is far away from the radiating fins, are respectively in contact connection with plug-in modules of the ruggedized computer, and a radiating air duct section is formed between the first soaking part and the second soaking part.

Further, in an embodiment of the present invention, the heat dissipation structure further includes an air inlet guiding portion and/or an air outlet guiding portion, an air inlet duct section running through the air inlet guiding portion is formed on the air inlet guiding portion, an air outlet duct section running through the air outlet guiding portion is formed on the air outlet guiding portion, the air inlet duct section is communicated with one end of the heat dissipation duct section, and the air outlet duct section is communicated with the other end of the heat dissipation duct section.

Further, in a preferred embodiment of the present invention, along the airflow flowing direction, the area of the first longitudinal section of the air inlet/guide portion decreases from large to small, and the first longitudinal section is a plane perpendicular to the extending direction of the air inlet duct section; and/or the presence of a gas in the gas,

along the air flow flowing direction, the area of a second longitudinal section of the air outlet air guide part is increased from small to large, and the second longitudinal section is a plane perpendicular to the extending direction of the air outlet air duct section.

Further, in a preferred embodiment of the present invention, the heat dissipation structure further includes an air flow driving portion, the air flow driving portion is disposed at the air inlet of the air inlet guiding portion, and/or at the air outlet of the air outlet guiding portion.

Further, in a preferred embodiment of the present invention, the heat dissipation structure further includes a plug-in guide rail, into which the plug-in module of the ruggedized computer is inserted, and the plug-in guide rail is connected to the soaking module.

Further, in a preferred embodiment of the present invention, the heat dissipation structure further includes a box structure for reinforcing the computer, and the plug-in guide rail is connected to the box structure.

Further, in a preferred embodiment of the present invention, the heat dissipation structure further includes a relative air inlet and an air outlet disposed on the box structure, one end of the heat dissipation air duct section is communicated with the air inlet, and the other end of the heat dissipation air duct section is communicated with the air outlet.

Further, in a preferred embodiment of the present invention, the first soaking portion and the second soaking portion each include a microstructure soaking plate.

Another embodiment of the utility model provides a ruggedized computer, include any of the above-mentioned heat radiation structure for ruggedized computer.

Further, in a preferred embodiment of the present invention, the ruggedized computer further includes a plurality of plug-in modules, every two of the plug-in modules are disposed with a soaking module therebetween, and the first soaking portion and the second soaking portion of the soaking module are respectively in contact connection with two of the plug-in modules on a side where the electronic component is disposed.

The utility model discloses in provide a pair of reinforced computer and heat radiation structure and reinforced computer for, wherein heat radiation structure includes the soaking module, and the first samming portion and the second samming portion of soaking module are connected with the plug-in components module face contact of reinforced computer, and heat-conduction area of contact is big, and the heat that plug-in components module produced can realize effectively dispelling the heat through face conduction. In addition, through set up radiating fin between first soaking portion and second soaking portion, conduct the heat of first soaking portion and second soaking portion to radiating fin on, radiating fin is in the radiating air duct section, the air current exchanges heat with radiating fin, take away the heat that first soaking portion and second soaking portion passed to radiating fin, further promote the radiating efficiency, derive the heat that produces in will consolidating the computer working process fast, electronic equipment's in the reinforcement computer life and operational reliability have been promoted.

Drawings

The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:

fig. 1 is a schematic structural view of a soaking module according to an embodiment of the present invention;

fig. 2 is a schematic view of a first soaking portion or a second soaking portion according to an embodiment of the present invention;

fig. 3 is a schematic diagram of an explosive structure of a ruggedized computer provided by an embodiment of the present invention;

fig. 4 is a partially enlarged schematic view of a ruggedized computer provided by an embodiment of the present invention;

fig. 5 is a schematic view illustrating the flow direction of the airflow of the ruggedized computer provided by an embodiment of the present invention;

fig. 6 is a partial schematic view of a heat dissipation structure according to an embodiment of the present invention;

FIG. 7 is a schematic flow diagram of heat transfer provided by an embodiment of the present invention;

fig. 8 is a schematic front view of a ruggedized computer provided by an embodiment of the present invention;

fig. 9 is a schematic diagram of a box structure of a ruggedized computer provided by an embodiment of the present invention;

FIG. 10 is a side schematic view of the partial structure of FIG. 9;

fig. 11 is a schematic perspective view of a ruggedized computer provided by an embodiment of the present invention;

fig. 12 is another perspective view of a ruggedized computer provided by an embodiment of the present invention;

fig. 13 is a side view of a card module according to an embodiment of the invention;

fig. 14 is a schematic front view of a card module according to an embodiment of the present invention;

fig. 15 is a schematic diagram of a keyboard module according to an embodiment of the present invention.

Reference numerals:

1. a soaking module 11, a first soaking part 111, a reinforcing counter bore 112, a screw hole,

113. a metal solid wall region 1131, an evaporation surface 1132, a condensation surface,

114. a liquid absorption core area 115, a vacuum cavity 12, a second heat homogenizing part,

13. the heat dissipation fins 131, the heat dissipation air duct sections 14 and the conductive sealing ring mounting grooves;

2. an air inlet and guide part 21 and an air inlet duct section;

3. an air outlet guide part 31 and an air outlet duct section;

4. an airflow driving part 41, an air draft fan 42 and a fan mounting frame;

5. a card guide 51, a first fitting part, 511, a ventilation hole, 52, a second fitting part,

521. a second connection portion 522, a guide groove boss;

6. a plug-in module, 61, a first connecting portion, 62, a slider, 621, a slider shaft,

63. a first side 64, a second side 65, an electrical plug 66, a guide pin sleeve;

7. a box body structure 71, an air inlet 72 and an air outlet,

73. a side cover plate 731, a third screw hole,

74. an upper frame body module 741, a handle 742, a first screw hole 743, an avoiding groove,

75. a lower frame module 751, a second screw hole 752, a mounting cavity,

7521. a boss structure 7522, a fastening member;

76. a back plate mounting plate 77, a back plate 78, a back cover plate module;

8. a display module 81, a first mounting hole, 82, a second mounting hole, 83 and a third mounting hole;

9. a keyboard module 91, a damping slide bar 92 and a keyboard drawing limiting block,

93. simple drag chain mechanism 94, locking mechanism.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

Related technologies show that heat dissipation of a plug-in module of a ship-borne ruggedized computer often depends on structures such as heat pipes or guide grooves. When the plug-in module is in contact with the guide groove for heat dissipation, the contact area of the guide groove is small, so that the heat exchange area is small, and meanwhile, the guide groove needs to support a frame for reinforcing a case of a computer, so that the thickness of the guide groove is thick, and a heat conduction path is long. When the heat pipe is contacted with the plug-in module for heat dissipation, the heat conduction path is single because the heat conduction of the heat pipe is linear conduction. Therefore, the heat conduction and connection area between the structures such as the heat pipe or the guide groove and the plug-in module is small, the heat conduction capability is insufficient, the heat dissipation effect of the plug-in module is poor, the junction temperature of the electronic device on the plug-in module is increased, and the function and the service life of the computer reinforcing device are seriously influenced.

The embodiment of the utility model provides a heat radiation structure for ruggedized computer can be applied to the shipboard ruggedized computer, and comprises at least one soaking module, each soaking module comprises a first soaking part and a second soaking part which are arranged side by side, and a heat radiation fin arranged between the first soaking part and the second soaking part; one side of the first soaking part, which is far away from the radiating fins, and one side of the second soaking part, which is far away from the radiating fins, are respectively in contact connection with plug-in modules of the ruggedized computer, and a radiating air duct section is formed between the first soaking part and the second soaking part. Because first soaking portion and the second soaking portion of soaking module all can be connected with the plug-in components module contact of reinforcement computer, heat-conduction area of contact is big, and the heat that plug-in components module produced can be conducted to the soaking module through the face conduction form on, promotes the radiating efficiency, and the heat that produces plug-in components module is everywhere fast, avoids plug-in components module to take place to damage because of the high temperature. In addition, through set up radiating fin between first soaking portion and second soaking portion, conduct the heat of first soaking portion and second soaking portion to radiating fin on, radiating fin is in the radiating air duct section, and the air current exchanges heat with radiating fin, takes away the heat that first soaking portion and second soaking portion conducted to radiating fin, further promotes the radiating efficiency, derives the heat that produces in will consolidating the computer working process fast, has promoted life and the operational reliability of electronic equipment in the reinforcement computer.

As shown in fig. 1-2, an exemplary embodiment of the present invention provides a heat dissipation structure for a ruggedized computer, including at least one soaking module 1, where each soaking module 1 includes a first soaking portion 11 and a second soaking portion 12 disposed side by side, and a heat dissipation fin 13 disposed between the first soaking portion 11 and the second soaking portion 12. The number of the soaking modules 1 is determined according to the number of the plug-in modules (heat sources in the ruggedized computer, described in detail later) which need to dissipate heat in the ruggedized computer, and when the number of the plug-in modules is large, the number of the soaking modules is correspondingly increased. As shown in fig. 1, the heat dissipation fins 13 may be fixed between the first soaking portion 11 and the second soaking portion 12 by welding, reinforcing counter bores 111 for assisting welding are respectively disposed on the first soaking portion 11 and the second soaking portion 12, and the reinforcing counter bores 111 on the first soaking portion 11 and the reinforcing counter bores 111 on the second soaking portion 12 are correspondingly disposed. Before welding, fixing parts such as rods with limiting parts are adopted to sequentially penetrate through the corresponding reinforcing counter bores 111 on the first heat equalizing part 11 and the second heat equalizing part 12, so that the first heat equalizing part 11 and the second heat equalizing part 12 can be limited and fixed, and subsequent welding is facilitated. Referring to fig. 3 and 4, when the soaking module 1 is installed in the ruggedized computer, one side of the first soaking portion 11, which is away from the heat dissipation fins 13, and one side of the second soaking portion 12, which is away from the heat dissipation fins 13, are respectively in contact connection with the plug-in module 6 of the ruggedized computer, that is, both the first soaking portion 11 and the second soaking portion 12 can be in surface contact with the plug-in module 6, so that the heat conduction area is larger, and the heat conduction efficiency is higher. A heat dissipation air duct section 131 is formed between the first heat equalizing part 11 and the second heat equalizing part 12, the heat dissipation fins 13 are located in the heat dissipation air duct section 131, the first heat equalizing part 11 and the second heat equalizing part 12 conduct heat generated by the plug-in module 6 to the heat dissipation fins 13, air flows pass through the heat dissipation air duct section 131, the air flows contact with the heat dissipation fins 13 for heat exchange, the heat of the heat dissipation fins 13 is taken away, and the heat dissipation effect is improved. As shown in fig. 1, the conductive seal ring mounting grooves 14 and the screw holes 112 are provided on the side wall surfaces at both ends of the heat dissipation air duct section 131 of the soaking module 1 along the air flow path. The screw holes 112 are screwed with fixing members such as screws, so that the soaking module 1 can be fixed in the ruggedized computer more conveniently. The conductive sealing ring mounting groove 14 is used for mounting a conductive sealing ring (not shown in the figure), the conductive sealing ring is arranged to ensure that the soaking module 1 is mounted after a ruggedized computer, the heat dissipation air duct section 131 is in conductive connection with the mounting part and the joint is effectively sealed, and the heat dissipation air duct section 131 is isolated from the electrical cavity where the plug-in module 6 is located, so that the electromagnetic shielding property is maintained, and the electrical safety is also effectively maintained.

In this embodiment, still referring to fig. 1 and 2, the first soaking portion 11 and the second soaking portion 12 each include a microstructure soaking plate. The microstructure soaking plate is a two-phase fluid device and comprises a metal solid wall region 113 with a vacuum cavity 115 formed inside, a liquid absorption core region 114 in a microstructure form is distributed on the inner wall of the metal solid wall region 113, cooling liquid can be injected into the vacuum cavity 115, and a steam region can be formed in the vacuum cavity 115 when the cooling liquid is heated, as shown in fig. 2. The side of the first soaking portion 11 away from the heat dissipation fins 13 and the side of the second soaking portion 12 away from the heat dissipation fins 13 are evaporation surfaces 1131 (i.e., the surface contacting the plug-in module 6), and the side of the first soaking portion 11 close to the heat dissipation fins 13 and the side of the second soaking portion 12 close to the heat dissipation fins 13 are condensation surfaces 1132 (i.e., the surface away from the plug-in module 6). When the heat of the plug-in module 6 is transferred to the steam zone from the evaporation surface 1131, the liquid-phase working medium inside the vacuum cavity 115 starts to generate a liquid-phase gasification phenomenon in a low-vacuum-degree environment, at this time, the liquid-phase working medium absorbs heat energy and rapidly expands in volume, the gas-phase working medium quickly fills the whole vacuum cavity 115, a condensation phenomenon (in this embodiment, the relatively cold region is the heat dissipation air duct section 131) occurs when the gas-phase working medium contacts the relatively cold region, the heat accumulated during evaporation is released by the condensation phenomenon, and the condensed liquid-phase working medium returns to the heat source by the capillary phenomenon of the microstructure. The above process is circulated in the vacuum chamber 115, and the microstructure can generate capillary force when the liquid working medium is evaporated, so the operation of the microstructure vapor chamber can not be influenced by gravity. The first heat equalizing part 11 and the second heat equalizing part 12 both adopt a microstructure heat equalizing plate, the thickness of the microstructure heat equalizing plate can be set to be 3mm to 4.2mm, and the thickness is smaller, so that the thermal resistance of the microstructure heat equalizing plate and the plug-in module 6 in the heat conduction process is smaller. The flatness of the evaporation surface 1131 of the micro-structure vapor chamber, which is in contact with the package module 6, can reach 50 μm, so that the contact and attachment effect of the micro-structure vapor chamber and the package module 6 is better. The micro-structure soaking plate of the first soaking part 11 and the second soaking part 12 is in surface contact with the plug-in module 6, the heat generated by the plug-in module 6 is direct and efficiently led out, the heat radiating fins 13 are matched with the heat radiating air duct sections 131 to radiate the heat of the micro-structure soaking plate in a heat conduction mode, the structures of the soaking module 1 are matched with each other to enable the overall heat radiating effect to be better, compared with the technical scheme that heat pipes are used for conducting heat in the related technology, the heat resistance of the soaking module 1 in the embodiment is 20% of that of the heat pipe, the heat conductivity is more than 7 times that of the heat pipe, the heat conduction starting speed is more than 9 times faster than that of the heat pipe, the heat conduction efficiency can reach more than ten times, the heat exchange efficiency is greatly improved, and.

In another exemplary embodiment of the present invention, as shown in fig. 3-5, the heat dissipation structure further includes an air inlet guiding portion 2 and/or an air outlet guiding portion 3, an air inlet duct section 21 penetrating through the air inlet guiding portion 2 is formed on the air inlet guiding portion 2, an air outlet duct section 31 penetrating through the air outlet guiding portion 3 is formed on the air outlet guiding portion 3, the air inlet duct section 21 is communicated with one end of the heat dissipation duct section 131, and the air outlet duct section 31 is communicated with the other end of the heat dissipation duct section 131. The air inlet guide part 2 and the air outlet guide part 3 can be independently arranged to respectively perform air inlet guide or air outlet guide, and the air inlet guide and the air outlet guide can be simultaneously arranged to perform air inlet guide and air outlet guide simultaneously. The air inlet guide part 2 and the air outlet guide part 3 can guide the flowing direction of air flow so as to further improve the heat exchange efficiency. The air inlet duct section 21 of the air inlet guiding part 2, the heat dissipation duct section 131 formed between the first soaking part 11 and the second soaking part 12, and the air outlet duct section 31 of the air outlet guiding part 3 are sequentially communicated to form an air duct of a heat dissipation structure. The air flow for heat dissipation enters from the air inlet duct section 21 and flows through the heat dissipation duct section 131, and then flows out from the air outlet duct section 31 to perform air cooling heat exchange with the first heat equalizing part 11, the second heat equalizing part 12 and the heat dissipation fins 13, so that the heat dissipation effect is realized.

In another exemplary embodiment of the present invention, as shown in fig. 5, along the airflow flowing direction, the area of the first longitudinal section of the air inlet guiding portion 2 is reduced by a small size, the first longitudinal section is a plane perpendicular to the extending direction of the air inlet duct section 21, i.e. the air inlet duct section 21 is in a circular truncated cone shape, so that the air inlet amount of the air inlet is larger, the air can be gathered more after passing through the air inlet duct section 21, the air speed is faster to flow into the heat dissipation duct section 131, so that the air pressure of the heat dissipation duct section 131 is increased, and the heat dissipation efficiency is high. Along the air flow direction, the area of the second longitudinal section of the air outlet guiding part 3 is changed from small to large, the second longitudinal section is a plane perpendicular to the extending direction of the air outlet duct section 31, the air flowing out from the heat dissipation duct section 131 keeps a certain air speed, and after passing through the air outlet duct section 31, the air outlet side area of the air outlet duct section 31 is large, the air outlet speed is high, and the heat is taken away rapidly. The air inlet side and the air outlet side of the air duct in the embodiment have the largest air flow flux, so that smooth exchange between external air and hot air in the air duct is ensured. As shown in fig. 3 and 5, the first cross section of the air inlet guiding portion 2 and the second cross section of the air outlet guiding portion 3 may be isosceles trapezoids, the air inlet guiding portion 2 is connected to the air inlet end of the heat dissipating air duct section 131 corresponding to the short side of the isosceles trapezoid, and the air outlet guiding portion 3 is connected to the air outlet end of the heat dissipating air duct section 131 corresponding to the short side of the isosceles trapezoid. The air inlet guide part 2 or the air outlet guide part 3 corresponds to the structure of two inclined edges of the isosceles trapezoid, and can play a role in guiding and reducing wind resistance in a gentle slope path in an airflow path. By arranging the air inlet guide part 2 and the air outlet guide part 3, the space in the length direction of the ruggedized computer is effectively utilized, the depth space of the ruggedized computer can not be occupied much, the areas of the air inlet 71 and the air outlet 72 are enlarged, the wind resistance is reduced as much as possible, the air volume value and the air pressure value of the heat dissipation air duct section 131 (the main corresponding position of a heat source) are ensured, and the air flow speed is accelerated.

As shown in fig. 3-5, in another exemplary embodiment of the present invention, the heat dissipation structure further includes an airflow driving portion 4, the airflow driving portion 4 is disposed at the air inlet of the air inlet guiding portion 2, and/or at the air outlet of the air outlet guiding portion 3. Wherein, air current drive portion 4 sets up to induced-draft fan 41 in this embodiment, sets up in the air outlet 72 department of air-out wind-guiding portion 3, and induced-draft fan 41 drives outside air current to flow in to air inlet duct section 21 through taking the air current out from air outlet duct section 31 to drive the air current flow and carry out the heat transfer with heat radiation structure, promote the radiating efficiency. The exhaust fan 41 may be a fan whose power can be adjusted, and operates at different powers according to different heat dissipation requirements. As shown in fig. 3 and 4, the induced draft fan 41 is installed in the fan installation frame 42, the induced draft fan 41 is installed on the air inlet side of the fan installation frame 42, and the air outlet side of the fan installation frame 42 is left vacant. In the implementation process, one air draft fan 41 may be correspondingly arranged in each air duct, or only one air draft fan 41 with a larger size may be arranged to correspond to a plurality of air ducts.

In an exemplary embodiment of the present invention, as shown in fig. 3-5, the heat dissipation structure further includes a plug-in guide rail 5, and the plug-in module 6 of the ruggedized computer is inserted into the plug-in guide rail 5, thereby facilitating plugging and unplugging. In the direction of flow of the air flow, the card modules 6 can be plugged into one card guide 5 at each end. One side of each plug-in component guide rail 5 can play the roles of fixing the plug-in component module 6 and the limiting soaking module 1, and the other side of each plug-in component guide rail 5 can be used for installing the air inlet air guide part 2 or the air outlet air guide part 3. Specifically, as shown in fig. 4, one side of the plug-in guide rail 5, which is used for fixing the plug-in module 6, includes a first adaptive portion 51 and a second adaptive portion 52, the first adaptive portion 51 is in adaptive connection with the soaking module 1, and a vent 511 is arranged at a position on the first adaptive portion 51 corresponding to the heat dissipation fin 13 of the soaking module 1, so that the heat dissipation air duct section 131 can be communicated with the air inlet guiding portion 2 or the air outlet guiding portion 3 through the plug-in guide rail 5. The second adapting portion 52 is connected to the plug-in module 6 in a plug-in manner, and with reference to the orientation of fig. 4, the top of the plug-in module 6 is slidably provided with a first connecting portion 61, the second adapting portion 52 is provided with a second connecting portion 521, the second connecting portion 521 is arranged corresponding to the first connecting portion 61, and the first connecting portion 61 and the second connecting portion 521 are locked by sliding the first connecting portion 61. As shown in fig. 4, the second fitting part 52 in the present embodiment is provided as: a guide groove formed between the two guide groove bosses 522 (heat dissipation is performed by such a guide groove provided on the chassis in the related art); the side surface of the plug-in module 6 is provided with a plurality of sliding blocks 62, the sliding blocks 62 are connected through a sliding block shaft 621, and the sliding block shaft 621 can adopt a long screw shaft of an inner hexagonal bolt; when the card module 6 is mounted, each slider 62 can be inserted into the guide groove, and the slider shaft 621 is adjusted to adjust the protruding end of the slider 62 to be clamped with the guide groove boss 522. In addition, the plug-in guide rail 5 is connected with the soaking module 1, and the connection is realized by installing a conductive sealing ring in a conductive sealing ring installation groove 14 on the soaking module 1. A ventilation condensation cavity formed by the heat dissipation air duct section 131 of the soaking module 1 is isolated from an electrical cavity formed by the electrical elements of the plug-in module 6, so that the electrical cavity is sealed, air in the ventilation condensation cavity is prevented from entering the electrical cavity, and the ventilation condensation cavity is prevented from generating electromagnetic signal interference on the electrical cavity; and effectively improve the salt spray mildew resistance of the reinforced computer. The plug-in guide rail 5 is provided with a through hole corresponding to the screw hole 112 of the soaking module 1, and a fastening piece such as a screw or a bolt is used for penetrating through the screw hole 112 of the soaking module 1 and the through hole of the plug-in guide rail 5 to lock and fix the soaking module 1 and the plug-in guide rail 5.

In addition, as shown in fig. 3 and fig. 5, in this embodiment, the heat dissipation structure further includes a box structure 7 for reinforcing the computer, the card guide 5 is connected to the box structure 7, and the heat of the soaking module 1 is conducted to the box structure 7 through the card guide 5, so as to achieve contact-assisted heat dissipation. It can be seen that the heat dissipation path of the plug-in module 6 as a heat source can be two kinds, as shown in fig. 5-7:

the first method is as follows: the heat dissipated by each electrical component on the card module 6 is conducted to the heat dissipation fins 13 through the micro-structure soaking plates (i.e. the first soaking portion 11 and the second soaking portion 12), the first soaking portion 11 is taken as an example in fig. 7, air enters the heat dissipation air duct section 131 to exchange heat with the heat dissipation fins 13 under the driving of the air draft fan 41, and the air flow after the heat exchange is exhausted to the outside of the box structure 7 of the ruggedized computer under the action of the air draft fan 41, so that the heat dissipation is realized. This is the primary heat dissipation means of the ruggedized computer by which most of the heat of the plug-in module 6 is dissipated to the exterior of the ruggedized computer.

The second method comprises the following steps: the heat generated by the plug-in module 6 is transferred to the side wall of the box structure 7 or other metal parts for reinforcing the computer through the plug-in guide rail 5, and finally transferred to the outside of the box structure 7 to realize heat dissipation, the second mode is an auxiliary heat dissipation mode, and a small part of heat of the plug-in module 6 is dissipated through the second mode.

In this embodiment, as shown in fig. 3-4 and 8-12, the box structure 7 is a rectangular parallelepiped structure surrounded by a panel, an upper frame module 74, left and right side cover plates 73, a lower frame module 75, and a rear cover plate module 78, and an inner accommodating cavity of the rectangular parallelepiped structure is used for accommodating the soaking module 1 and the plug-in module 6. The panel and the rear cover plate module 78 are disposed opposite to each other, the upper frame module 74 and the lower frame module 75 are disposed opposite to each other, the side cover plates 73 on the left and right sides are disposed opposite to each other, the adjacent plates are fixed by screws, and the fixing positions of the adjacent plates are provided with conductive sealing rings (not shown) to ensure that the ventilation condensation cavity and the electrical cavity are not communicated with each other, for example, the connecting positions between the panel and the adjacent plates (such as the side cover plates 73, the upper frame module 74, and the lower frame module 75) are provided with the conductive sealing rings. The upper frame module 74 is provided with a handle 741 with a built-in steel bar, which facilitates transportation and movement of the whole box structure 7. The card guide 5 is attached to the lower frame block 75, and a back plate 77 is fixed to the upper surface of the lower frame block 75 via a back plate attachment plate 76. The plug-in module 6 and the soaking module 1 are arranged on the back plate 77, a socket which can be electrically connected with the plug-in module 6 is arranged on the back plate 77, an electrical plug 65 at the bottom of the plug-in module 6 can be plugged into the socket of the back plate 77 so as to realize the electrical connection of the plug-in module 6, and the plug-in module 6 realizes the limit through the soaking module 1 and the plug-in guide rail 5.

In addition, when the panel is fixed in the related art, a large number of screws are usually arranged on the panel, which affects the simplicity and the aesthetic property of the appearance of the chassis structure. In this embodiment, in order to ensure the aesthetic property of the panel, the panel and other plates may be assembled in the following manner, as shown in fig. 11, a first mounting hole 81 for being matched with the upper frame module 74 is provided at an upper side of the panel, a first threaded hole 742 is provided on the upper frame module 74, the first threaded hole 742 corresponds to the first mounting hole 81, and a process avoiding groove 743 is further provided at the first threaded hole 742 of the upper frame module 74, so as to be conveniently fastened and connected with the upper frame module 74 at a side of the panel. As shown in fig. 12, a second mounting hole 82 for engaging with the lower frame block 75 is provided on the lower side of the panel, a second screw hole 751 is provided on the lower frame block 75, the second screw hole 751 is provided corresponding to the second mounting hole 82, and the lower side of the panel is fixedly attached to the lower frame block 75. As shown in fig. 11, the side of the panel is provided with a third mounting hole 83 for matching with the side cover plate 73, the side cover plate 73 is provided with a third threaded hole 731, the third threaded hole 731 is arranged corresponding to the third mounting hole 83, and the panel and the side cover plate 73 can be assembled by splicing and embedding, so that the mounting position of the side cover plate 73 and the panel is converted to the side. The positions of the screw mounting holes are all located on the side edge of the panel, so that after the mounting is completed, screws cannot be observed on the front face of the panel, the attractiveness of the box body structure 7 is guaranteed, and meanwhile the space of the panel is effectively utilized. When the ruggedized computer has the display module 8, the display module 8 can be used as a panel.

As shown in fig. 3 to 4, the plug-in modules 6 are arranged in the middle of the box structure 7, and the air ducts are distributed at various positions of the box structure 7, for example, a part of the air ducts are close to the upper side or the lower side of the box structure 7, and a part of the air ducts are close to the left side or the right side of the area of the side cover plate 73, so that the air ducts are far away from the plug-in modules 6, the heat exchange efficiency is low, and the heat exchange effect is poor. In order to keep the cold air flow path straight, the air inlet 71 of the air duct is arranged on the front surface of the panel in the existing reinforced computer, which not only occupies the layout space of the panel for arranging other functional electric devices, but also affects the simple and beautiful appearance of the panel. The air inlets 71 are disposed on the left and right side cover plates 73, which causes the air flow path to be curved or L-shaped, and the air volume will be more lost when the air flow turns, and the heat dissipation effect is still poor.

In another exemplary embodiment of the present invention, as shown in fig. 3-4, the heat dissipation structure further includes an air inlet 71 and an air outlet 72 opposite to each other, which are disposed on the box structure 7, one end of the heat dissipation air duct section 131 is communicated with the air inlet 71, and the other end of the heat dissipation air duct section 131 is communicated with the air outlet 72. In this embodiment, referring to the orientation shown in fig. 3, the air inlet 71 is provided on the left side cover plate 73 of the box structure 7, and the air outlet 72 is provided on the right side cover plate 73 of the box structure 7. The air inlets 71 and the air outlets 72 can be provided with a plurality of groups, each group of air inlets 71 or each group of air outlets 72 comprises a plurality of ventilation openings which are uniformly distributed, each group of air inlets 71 is communicated with each corresponding group of air outlets 72 through an air channel which transversely penetrates through the box structure 7 to form a straight-line through air flow path, and the plug-in modules 6 are positioned on two sides of the air channel, so that the heat dissipation effect is better. In the embodiment, the route of the cold air flow is a horizontal straight line, and the air quantity is lost without turning; meanwhile, the air inlet 71 does not need to be arranged on the front surface of the panel, so that the problems that the existing air inlet occupies space and affects appearance attractiveness are solved. The side cap 73 air inlet of the first side of box structure 7, the side cap 73 air-out of the second side relative with first side of box structure 7, under the assistance of air-draft fan 41, air inlet air-out portion 2, air-out wind-guiding portion 3, can the most efficient lead out the heat on radiating fin 13 fast through the air current, and the radiating mode advantage is obvious, and the radiating effect promotes greatly.

From the above, as shown in fig. 3-5, the main improvement of the air duct structure in the embodiment of the present invention over the prior art includes: the setting of soaking module 1, the setting of radiating fin 13 and radiating air duct section 131, the setting of the 21 trapezium structure of the air inlet air duct section of air inlet guiding part 2, the setting of the 31 trapezium structure of the air outlet air duct section of air outlet guiding part 3, the setting of ventilation hole 511 of plug-in component guide rail 5, the setting of one side air inlet and one side air outlet of fan installing frame 42, the setting of active convection of air draft fan 41 and the setting of air inlet 71 and air outlet 72 of box structure 7. The main power of the cold air entering the air duct structure is the air draft fan 41 arranged on the side of the air outlet 72, the cold air outside the box structure 7 enters the box structure 7 through the air inlet 71, enters the air inlet duct section 21, flows through the heat dissipation air duct section 131, flows out of the air outlet 72 through the air outlet duct section 31 and the air draft fan 41, and performs air cooling heat exchange with the first heat equalizing part 11, the second heat equalizing part 12 and the heat dissipation fins 13, so that the heat dissipation effect is realized.

In another exemplary embodiment of the present invention, a reinforced computer is provided, which includes the above heat dissipation structure for reinforced computer. In this embodiment, the ruggedized computer further includes a display module 8 and a keyboard module 9, as shown in fig. 8 or 11, the display module 8 may be used as a panel, and the display module 8 includes: liquid crystal screen, pilot lamp, switch, debugging window and display panel isotructure combine aforementioned box structure 7's panel fixed mode, and display module 8's fixed mode adopts the hidden arrangement mode of screw in this embodiment, and display module 8's front does not have screw hole installation characteristic promptly, and set screw distributes in display module 8's side.

As shown in fig. 9 and 15, the keyboard module 9 is housed in the lower frame module 75 of the box structure 7, the lower frame module 75 is provided with a mounting cavity 752 on the lower side thereof, and the keyboard module 9 is mounted in the mounting cavity 752 in a pull-out and insert manner. As shown in fig. 15, the keyboard module 9 and the lower frame module 75 form a drawing limit fit, damping sliding strips 91 are disposed on two sides of the installation cavity 752, the damping sliding strips 91 have a guide rail and an additional damping function, two side edges of the keyboard module 9 are correspondingly installed at the damping sliding strips 91, and the damping sliding strips 91 are disposed to facilitate sliding out and locking of the keyboard module 9. When the keyboard module 9 is pulled out, the keyboard module is locked in a limited manner by the keyboard pulling and limiting block 92 arranged on the keyboard module 9. When the keyboard module 9 is stored, the locking mechanism 94 arranged on the keyboard module 9 is matched with the groove structure of the installation cavity 752 to lock the keyboard module 9, and the storage is completed. Moreover, when the keyboard is stored, the keyboard drawing limiting block 92 is matched with the boss structure 7521 in the installation cavity 752, and the boss structure 7521 plays a role in supporting and buffering. In addition, the keyboard module 9 and the installation cavity 752 can be connected through the simple tow chain mechanism 93, and when the keyboard module 9 is pulled out, the simple tow chain mechanism 93 is extended; when the keyboard module 9 is retracted, the simple tow chain mechanism 93 is retracted. A fastening member 7522 for cooperating with the simple tow chain mechanism 93 is further disposed in the installation cavity 752 of the lower frame module 75, so that the keyboard module 9 is effectively limited when being pulled out to a design threshold.

In an exemplary embodiment of the present invention, as shown in fig. 3-4, the ruggedized computer further includes a plurality of plug-in modules 6, wherein the plug-in modules 6 are VPX standard plug-in modules 6, which can be selectively configured to meet the standard modules of the OpenVPX standard specification (VITA-48-2-2010) of 6U or 3U, and meet the plug-in structure and electrical requirements of the VPX standard specification (VPX, also referred to as VITA 46, which is a serial data communication standard). The bottom of the plug-in module 6 is inserted on the back plate 77 through the VPX electrical plug 65, the left and right sides of the plug-in module 6 are inserted and assembled with the plug-in guide rail 5, wherein the bottom of the plug-in module 6 is further provided with a guide pin sleeve 66, when in installation, a limiting piece such as a guide pin can be adopted to pass through the guide pin sleeve 66, and the plug-in module 6 is limited to play a role in assisting in installing the plug-in module 6.

Generally, one side of the plug-in module 6 is used for disposing electronic components, and the side for disposing electronic components is a main heat generating surface and a main heat dissipating surface which is required to dissipate heat. For better heat dissipation, in this embodiment, a soaking module 1 is disposed between every two plug-in modules 6, so that the space of the box structure 7 is effectively saved, and the first soaking part 11 and the second soaking part 12 of the soaking module 1 are respectively in contact connection with one side of the corresponding plug-in module 6, which is used for setting the electronic component. That is, in the present embodiment, two sides of each soaking module 1 are provided with one plug-in module 6, and the side surface of each plug-in module 6 on which the electronic component is arranged can be guaranteed to be in full-surface contact connection with the first soaking portion 11 or the second soaking portion 12, so that each plug-in module 6 can effectively dissipate heat. Use this soaking module 1 as the central line, the plug-in components module 6 of its both sides is the setting of 180 degrees of upset (not considering concrete electronic component's shape), two plug-in modules 6 with the contact of same soaking module 1 promptly, the two sides of arranging electronic component are relative, in this kind of arrangement, can make full use of soaking module 1 two big faces of dispelling the heat (first soaking portion 11 and the equal heat portion 12 of second), and the heat of the heat source (plug-in components module 6) that the micro-structure soaking board of the wind channel section 131 both sides of the heat dissipation of same soaking module 1 is pressed close to is equivalent, the difference in temperature between the first soaking portion 11 of same soaking module 1 and the equal heat portion 12 of second can not be too big, the thermal equilibrium of soaking module 1 both sides has been realized. As shown in fig. 13-14, which are schematic views of the main heat dissipation surface of the card module 6, in the prior art, the heat dissipation surface of the card module 6 is the first side surface 63, and the card module 6 has a small heat conduction contact area and a poor heat dissipation effect. In this embodiment, the heat-conducting attaching surface is optimally adjusted, the contact surface between the plug-in module 6 and the micro-structure vapor chamber is the second side surface 64, the area of the second side surface 64 is much larger than that of the first side surface 63, and on the premise that the heat-conducting area is increased, the heat dissipation efficiency of this embodiment is effectively increased.

The reinforcing computer in the application is provided with the heat dissipation structure, so that heat generated by the plug-in module of the reinforcing computer in the working process can be quickly discharged out of the reinforcing computer, the electronic element on the plug-in module is prevented from being damaged in the high-temperature environment, the service life of the reinforcing computer is prolonged, and the use reliability and the safety of the reinforcing computer are improved.

The above-described embodiments can be implemented individually or in various combinations, and such variations are within the scope of the present invention.

It is to be noted that, in this document, the terms "comprises", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, so that an article or apparatus including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional like elements in the article or device comprising the element.

The above embodiments are merely for illustrating the technical solutions of the present invention and are not to be construed as limiting, and the present invention is described in detail with reference to the preferred embodiments. It should be understood by those skilled in the art that various modifications and equivalent substitutions may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all the modifications and equivalents should be covered by the scope of the claims of the present invention.

It will be understood by those of ordinary skill in the art that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof.

Claims (10)

1. The heat dissipation structure for the reinforced computer is characterized by comprising at least one soaking module, wherein each soaking module comprises a first soaking part, a second soaking part and a heat dissipation fin, the first soaking part and the second soaking part are arranged side by side, and the heat dissipation fin is arranged between the first soaking part and the second soaking part;

one side of the first soaking part, which is far away from the radiating fins, and one side of the second soaking part, which is far away from the radiating fins, are respectively in contact connection with plug-in modules of the ruggedized computer, and a radiating air duct section is formed between the first soaking part and the second soaking part.

2. The heat dissipation structure for the ruggedized computer of claim 1, further comprising an air inlet guide portion and/or an air outlet guide portion, wherein the air inlet guide portion is formed with an air inlet duct section that penetrates the air inlet guide portion, the air outlet guide portion is formed with an air outlet duct section that penetrates the air outlet guide portion, the air inlet duct section is communicated with one end of the heat dissipation duct section, and the air outlet duct section is communicated with the other end of the heat dissipation duct section.

3. The heat dissipation structure for the reinforced computer as recited in claim 2, wherein the area of the first longitudinal section of the air inlet guiding portion decreases from large to small along the airflow direction, and the first longitudinal section is a plane perpendicular to the extending direction of the air inlet duct section; and/or the presence of a gas in the gas,

along the air flow flowing direction, the area of a second longitudinal section of the air outlet air guide part is increased from small to large, and the second longitudinal section is a plane perpendicular to the extending direction of the air outlet air duct section.

4. The heat dissipation structure for a ruggedized computer of claim 2, further comprising an airflow driving portion disposed at an air inlet of the air inlet/guide portion and/or at an air outlet of the air outlet/guide portion.

5. The heat dissipating structure for a ruggedized computer of claim 1, further comprising a card guide into which a card module of the ruggedized computer is inserted, the card guide being connected to the heat soaking module.

6. The heat dissipating structure for a ruggedized computer of claim 5, further comprising a case structure of the ruggedized computer, the card guide coupled to the case structure.

7. The heat dissipating structure for ruggedized computers of claim 6, further comprising an air inlet and an air outlet disposed opposite the case structure, wherein one end of the heat dissipating air duct section is in communication with the air inlet and the other end of the heat dissipating air duct section is in communication with the air outlet.

8. The heat dissipating structure for a ruggedized computer of any one of claims 1 to 7, wherein the first soaking portion and the second soaking portion each comprise a microstructured soaking plate.

9. A ruggedized computer heat dissipation structure, comprising the heat dissipation structure for a ruggedized computer of any one of claims 1 to 8.

10. The ruggedized computer of claim 9, further comprising a plurality of plug-in modules, wherein a heat soaking module is disposed between every two of the plug-in modules, and wherein a first heat homogenizing portion and a second heat homogenizing portion of the heat soaking module are in contact connection with one side of each of the two plug-in modules, on which the electronic components are disposed.

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