CN214672556U

CN214672556U - Chip sliding positioning encapsulation tool

Info

Publication number: CN214672556U
Application number: CN202120747007.5U
Authority: CN
Inventors: 张锋
Original assignee: Kunshan Zhuolida Precision Metal Parts Co ltd
Current assignee: Kunshan Zhuolida Precision Metal Parts Co ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2021-11-09
Anticipated expiration: 2031-04-13

Abstract

The utility model discloses a chip sliding positioning packaging jig, the surface of a lower template is provided with a rib groove, the surface of the lower template is fixedly provided with a positioning pin, the surface of the lower template is fixedly provided with a sliding mechanism, the sliding mechanism comprises a fixed plate, the surface of the fixed plate is fixedly provided with a slide rail, the slide rail is fixedly provided with a fixture block, one side of the fixed plate is fixedly provided with a stopper, the surface of the sliding mechanism is slidably provided with an upper template, the surface of the upper template is fixedly provided with a press plate, the surface of the upper template is fixedly provided with four groups of limiting posts, the bottom of the upper template is correspondingly provided with a clamping groove at the mounting part of the fixture block, the clamping groove is arranged into a step-type groove, the device realizes the fixation and the loosening of a chip to be packaged through the sliding mechanism, thus the adverse effect caused by the thermal expansion of the chip due to heating can be avoided, the chip can be taken out even after the packaging is finished, the packaging efficiency is improved, and the chip is prevented from being damaged.

Description

Chip sliding positioning encapsulation tool

Technical Field

The utility model relates to a chip tool technical field specifically is a chip sliding positioning encapsulation tool.

Background

The chip is a silicon chip containing an integrated circuit, is small in size and is often a part of a computer, a mobile communication terminal or other electronic equipment, is liked to be the national 'industrial grain', and is the 'heart' of all complete equipment. Since chip production requires hundreds of process steps, errors in any one step can result in device failure.

The chip need encapsulate it after accomplishing processing, encapsulate the chip and need heat, and the chip is after the encapsulation is accomplished in the heating, all takes place the heat and expand, just so cause the result that is difficult for taking out easily, not only can cause production efficiency's reduction like this, but also can cause the damage of chip to cause the waste of resource, current chip packaging device most all is the chip carries out the encapsulation of fixed size moreover, use the flexibility lower.

Therefore, it is desirable to provide a chip sliding positioning and packaging jig to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip sliding location encapsulation tool, the device realize fixing and lax the chip that needs were capsulated through slide mechanism, just so can avoid the chip because of being heated the harmful effects that the thermal expansion brought, can take out the chip after the encapsulation is ended, improve the efficiency of encapsulation, avoid the chip impaired to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip sliding positioning encapsulation tool, includes the lower bolster, the muscle groove has been seted up on the lower bolster surface, lower bolster fixed surface installs the locating pin, lower bolster fixed surface installs slide mechanism, slide mechanism slidable mounting has the cope match-plate pattern, cope match-plate pattern fixed surface installs the clamp plate, cope match-plate pattern fixed surface installs four groups of spacing posts.

Preferably, the sliding mechanism comprises a fixed plate, a slide rail is fixedly mounted on the surface of the fixed plate, a fixture block is fixedly mounted on the slide rail, and a limiting block is fixedly mounted on one side of the fixed plate.

Preferably, the bottom of the upper template is correspondingly provided with a clamping groove at the mounting position of the clamping block, and the clamping groove is a stepped groove.

Preferably, first bolt holes are formed in the surfaces of the pressing plate and the upper die plate, first bolts are mounted in the first bolt holes in an internal thread mode, the pressing plate is located between the four groups of limiting columns, and first hexagonal grooves are formed in the tops of the first bolts.

Preferably, the upper die plate and the surface of the clamping block are both provided with second bolt holes, second bolts are mounted in the second bolt holes in an internal thread mode, and second hexagonal grooves are formed in the tops of the second bolts.

Preferably, a supporting gasket is fixedly mounted on the surface of the fixing plate, the supporting gasket is a rubber sheet, and a groove is formed in the surface of the fixing plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the device realizes the limitation of the sliding track of the sliding mechanism in the sliding process through the mutual matching of the clamping block and the clamping groove, can prevent the sliding mechanism from deviating in the sliding process, can realize the loosening of the packaged chip due to the existence of the sliding mechanism, and thus can not be taken out due to the thermal expansion caused by the heating of the chip, and can take out the chip in time after the packaging is finished, thereby improving the packaging efficiency of the chip to a certain extent, avoiding the possibility of damage when the chip is taken out, and reducing the waste of the chip;

2. due to the application of the sliding mechanism, the requirement of packaging chips with different sizes can be met, so that the flexibility of chip packaging can be improved, a new packaging device does not need to be prepared, and the packaging cost can be reduced.

Drawings

Fig. 1 is a schematic view of a top-down three-dimensional structure of a chip slide positioning and packaging jig of the present invention;

fig. 2 is a schematic top view of the chip slide positioning and packaging jig of the present invention;

fig. 3 is a schematic top view of the sliding mechanism of the present invention.

In the figure: 1. a lower template; 2. a sliding mechanism; 201. a fixing plate; 202. a slide rail; 203. a clamping block; 204. a limiting block; 3. mounting a template; 4. pressing a plate; 5. a limiting column; 6. a card slot; 7. a first bolt hole; 8. a first bolt; 9. a second bolt hole; 10. a second bolt; 11. a support pad; 12. a groove; 13. a first hexagonal groove; 14. a second hexagonal groove; 15. a rib groove; 16. and a positioning pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a chip sliding positioning packaging jig comprises a lower template 1, wherein a rib groove 15 is formed in the surface of the lower template 1, a packaged chip is protected through the rib groove 15, a positioning pin 16 is fixedly arranged on the surface of the lower template 1, limiting and fixing of the packaged chip are realized through the positioning pin 16, a sliding mechanism 2 is fixedly arranged on the surface of the lower template 1, the packaged chip is conveniently taken out through the sliding mechanism 2, the sliding mechanism 2 comprises a fixing plate 201, fixing of a supporting gasket 11 and a sliding rail 202 is realized through the fixing plate 201, the supporting gasket 11 is fixedly arranged on the surface of the fixing plate 201, supporting of the fixing plate 201 and an upper template 3 is realized through the supporting gasket 11, the supporting gasket 11 is arranged to be a rubber sheet, the rubber sheet is arranged to be a rubber material with good elasticity, the lower template 1 can be prevented from being damaged, a groove 12 is formed in the surface of the fixing plate 201, the surface of the fixing plate 201 is fixedly provided with a slide rail 202, the slide connection between the upper template 3 and the fixing plate 201 is realized through the slide rail 202, a fixture block 203 is fixedly arranged on the slide rail 202, the fixture block 203 is used for clamping and fixing the fixing plate 201, one side of the fixing plate 201 is fixedly provided with a limiting block 204, and the limiting and fixing of the fixing plate 201 are realized through the limiting block 204;

an upper template 3 is arranged on the surface of the sliding mechanism 2 in a sliding way, the upper template 3 is matched with the lower template 1 to package a chip, a clamping groove 6 is correspondingly arranged at the mounting position of the clamping block 203 at the bottom of the upper template 3, the clamping groove 6 is matched with the clamping block 203 to realize the clamping connection of the fixing plate 201 and the upper template 3, the clamping groove 6 is arranged into a step-shaped groove, the arrangement is to improve the anti-falling performance of the fixture block 203 and prevent the fixing plate 201 from being separated from the upper template 3 in the packaging process, the surfaces of the upper template 3 and the fixture block 203 are both provided with second bolt holes 9, the second bolt 10 is fixedly installed through the second bolt hole 9, the second bolt 10 is installed in the second bolt hole 9 through internal threads, the upper template 3 and the fixture block 203 are fixedly mounted through the second bolt 10, the top of the second bolt 10 is provided with a second hexagonal groove 14, and the second bolt 10 is screwed through the second hexagonal groove 14;

fixed surface of upper die plate 3 has clamp plate 4, realize compressing tightly to the chip through clamp plate 4,

clamp plate

4 and 3 surfaces of upper die plate have all seted up first bolt hole 7, realize the fixed mounting to first bolt 8 through first bolt hole 7, first bolt 8 is installed to first bolt hole 7 internal thread, realize the fixed mounting to clamp plate 4 and upper die plate 3 through first bolt 8, clamp plate 4 is located between four groups of spacing post 5, first hexagonal groove 13 has been seted up at first bolt 8 top, realize screwing up first bolt 8 through first

hexagonal groove

13, 3 fixed surface of upper die plate installs four groups of spacing post 5, realize the injecing to clamp plate 4 position through four groups of spacing post 5, prevent to take place to rock at the in-process that compresses tightly the chip.

When the packaging device is used, a user controls the sliding mechanism 2 to slide outwards, then a chip to be packaged is placed on the surface of the lower template 1, then the upper template 3 is fixed above the lower template 1 and is pressed tightly, then the sliding mechanism 2 is controlled to slide inwards, the fixing plate 201, the sliding rail 202 and the fixture block 203 slide simultaneously while the sliding mechanism 2 slides, the fixture block 203 slides in the clamping groove 6, the sliding track of the fixing plate 201 can be limited, after the sliding mechanism 2 slides for a certain distance, the limiting block 204 is contacted with one side of the upper template 3, then the movement of the sliding mechanism 2 is stopped, then the first bolt 8 is installed in the first bolt hole 7 in a threaded mode, then the first bolt 8 is screwed through the first hexagonal groove 13, then the pressing plate 4 is fixed on the surface of the upper template 3, then the second bolt 10 is installed in the second bolt hole 9 in a threaded mode, then screw up second bolt 10 through second hexagonal groove 14, then remove certain angle with four group's spacing posts 5, realize fixed spacing to clamp plate 4, then encapsulate the chip, after the chip encapsulation is accomplished, each part of user control slide mechanism 2 outwards slides, and fixture block 203 slides in draw-in groove 6 simultaneously, and then the chip after the encapsulation can take place to become flexible to the convenience is taken out it.

In the description of the present application, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, a connection through an intermediate medium, and a connection between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to specific circumstances.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chip sliding positioning encapsulation tool, includes lower bolster (1), its characterized in that: muscle groove (15) have been seted up on lower bolster (1) surface, lower bolster (1) fixed surface installs locating pin (16), lower bolster (1) fixed surface installs slide mechanism (2), slide mechanism (2) fixed surface installs cope match-plate pattern (3), cope match-plate pattern (3) fixed surface installs clamp plate (4), cope match-plate pattern (3) fixed surface installs four sets of spacing post (5).

2. The chip sliding positioning and packaging jig of claim 1, wherein: the sliding mechanism (2) comprises a fixing plate (201), a sliding rail (202) is fixedly mounted on the surface of the fixing plate (201), a clamping block (203) is fixedly mounted on the sliding rail (202), and a limiting block (204) is fixedly mounted on one side of the fixing plate (201).

3. The chip sliding positioning and packaging jig of claim 2, wherein: the bottom of the upper template (3) is positioned at the mounting position of the clamping block (203) and is correspondingly provided with a clamping groove (6), and the clamping groove (6) is arranged into a stepped groove.

4. The chip sliding positioning and packaging jig of claim 3, wherein: first bolt hole (7) have all been seted up on clamp plate (4) and cope match-plate pattern (3) surface, first bolt (8) are installed to first bolt hole (7) internal thread, clamp plate (4) are located between four sets of spacing post (5), first hexagonal groove (13) have been seted up at first bolt (8) top.

5. The chip sliding positioning and packaging jig of claim 4, wherein: second bolt holes (9) are formed in the surfaces of the upper template (3) and the fixture block (203), second bolts (10) are mounted in the second bolt holes (9) in an internal thread mode, and second hexagonal grooves (14) are formed in the tops of the second bolts (10).

6. The chip sliding positioning and packaging jig of claim 2, wherein: the surface of the fixing plate (201) is fixedly provided with a supporting gasket (11), the supporting gasket (11) is a rubber sheet, and the surface of the fixing plate (201) is provided with a groove (12).