CN215786022U - Positioning fixture of lead frame - Google Patents
Positioning fixture of lead frame Download PDFInfo
- Publication number
- CN215786022U CN215786022U CN202121449484.XU CN202121449484U CN215786022U CN 215786022 U CN215786022 U CN 215786022U CN 202121449484 U CN202121449484 U CN 202121449484U CN 215786022 U CN215786022 U CN 215786022U
- Authority
- CN
- China
- Prior art keywords
- square tube
- lead frame
- support plate
- square
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 230000003028 elevating effect Effects 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
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- Punching Or Piercing (AREA)
Abstract
The utility model provides a positioning clamp of a lead frame, which comprises a support plate in an L-shaped structure, a screw rod pair fixedly arranged on the support plate through a mounting seat, and a first square tube and a second square tube which are respectively arranged at two ends of the support plate, wherein slide rails are respectively arranged at two ends of the support plate, slide blocks are arranged on the slide rails in a sliding manner, the first square tube and the second square tube both slide on the slide rails through the slide blocks, a nut of the screw rod pair is fixedly connected with the first square tube, a model plate and a blank holder are clamped inside the second square tube, and the blank holder is positioned above the model plate; according to the utility model, the lead frame raw material can be clamped in the lead frame stamping process through the matching use of the model plate and the edge pressing frame, the lead frame raw material is prevented from deviating from the stamping position under the mechanical vibration and other factors, and the position of the through hole of the second square pipe is adjusted to be consistent with the position pressed by the jack through the screw rod pair, so that the blanking accuracy is preserved.
Description
Technical Field
The utility model mainly relates to the field of clamps for lead frames, in particular to a positioning clamp for a lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
In the stamping process of the lead frame stamping device, due to the fact that the extending distance of the ejector rod of the jack is large and other mechanical errors, when the upper die is close to the lower die, horizontal deviation exists, and the upper die and the lower die are not completely meshed, so that the upper die and the lower die are damaged under the huge pressure of the jack, and the production cost of the lead frame is greatly improved.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides a positioning clamp of a lead frame, which comprises a support plate 1 in an L-shaped structure, a screw rod pair 3 fixedly arranged on the support plate 1 through a mounting seat 2, and a first square tube 4 and a second square tube 5 respectively arranged at two ends of the support plate 1,
it is characterized in that the preparation method is characterized in that,
Preferably, the second square pipe 5 is provided with a plurality of through holes 10, and the through holes 10 are arranged at equal intervals.
Preferably, a plurality of placing grooves 11 are formed in the model plate 8 at equal intervals, and the plurality of placing grooves 11 and the plurality of through holes 10 are arranged in a one-to-one correspondence manner.
Preferably, the first square tube 4 and the second square tube 5 are connected together by welding.
Preferably, the included angle formed by the first square tube 4 and the second square tube 5 is 90 degrees.
Preferably, the lower end of the supporting plate 1 is provided with an elevating frame 12.
The utility model has the beneficial effects that:
the lead frame raw materials can be clamped in the process of lead frame stamping through the matching use of the model plate and the edge pressing frame, the deviation of the lead frame raw materials from the stamping position under the mechanical vibration and other factors is avoided, and the position of the through hole of the second square pipe is adjusted to be consistent with the position pressed by the jack through the screw rod pair, so that the blanking accuracy is saved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
in the figure, the position of the upper end of the main shaft,
1. a support plate; 2. a mounting seat; 3. a screw pair; 4. a first square tube; 5. a second square tube; 6. a slide rail; 7. a slider; 8. a mold plate; 9. a trimming frame; 10. a through hole; 11. a placement groove; 12. and (5) an elevating frame.
Detailed Description
In order to make the technical solutions of the present invention better understood and make the above features, objects, and advantages of the present invention more comprehensible, the present invention is further described with reference to the following examples. The examples are intended to illustrate the utility model only and are not intended to limit the scope of the utility model.
As shown in fig. 1, the present invention includes: a supporting plate 1 in an L-shaped structure, a screw rod pair 3 fixedly arranged on the supporting plate 1 through a mounting seat 2, a first square pipe 4 and a second square pipe 5 respectively arranged at two ends of the supporting plate 1,
it is characterized in that the preparation method is characterized in that,
In this embodiment, preferably, the second square pipe 5 is provided with a plurality of through holes 10, and the through holes 10 are equidistantly arranged.
In this embodiment, it is preferable that the mold plate 8 is provided with a plurality of placing grooves 11, the placing grooves 11 are provided at equal intervals, and the plurality of placing grooves 11 are provided in one-to-one correspondence with the plurality of through holes 10.
In this embodiment, the first square tube 4 and the second square tube 5 are preferably connected by welding.
In this embodiment, the angle formed by the first square tube 4 and the second square tube 5 is preferably 90 degrees.
In the present embodiment, it is preferable that the lower end of the supporting plate 1 is provided with an elevating frame 12.
In use, can clip the lead frame raw materials at the in-process of lead frame punching press through the cooperation use of template board and blank pressing frame, avoided the lead frame raw materials skew punching press position under mechanical vibration and other factors, the position of adjusting second side pipe through-hole through the lead screw pair is unanimous with the position that the jack pushed down to save the accuracy of blanking.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.
Claims (6)
1. A positioning clamp of a lead frame comprises a support plate (1) which is of an L-shaped structure, a screw rod pair (3) which is fixedly arranged on the support plate (1) through a mounting seat (2), and a first square tube (4) and a second square tube (5) which are respectively arranged at two ends of the support plate (1),
it is characterized in that the preparation method is characterized in that,
slide rail (6) have all been seted up at backup pad (1) both ends, the slip is equipped with slider (7) on slide rail (6), first side pipe (4) and second side pipe (5) all slide on slide rail (6) through slider (7), the nut and first side pipe (4) fixed connection of lead screw pair (3), second side pipe (5) inside card is equipped with model board (8) and blank pressing frame (9), blank pressing frame (9) are located model board (8) top.
2. The positioning jig for lead frames according to claim 1, characterized in that: through-hole (10) have been seted up on second side pipe (5), through-hole (10) equidistance is equipped with a plurality ofly.
3. The positioning jig for lead frames according to claim 2, characterized in that: the mold plate (8) is provided with a plurality of placing grooves (11), the placing grooves (11) are arranged at equal intervals, and the placing grooves (11) and the through holes (10) are arranged in a one-to-one correspondence mode.
4. The positioning jig for lead frames according to claim 1, characterized in that: the first square pipe (4) and the second square pipe (5) are connected together in a welding mode.
5. The positioning jig for lead frames according to claim 4, wherein: the included angle formed by the first square pipe (4) and the second square pipe (5) is 90 degrees.
6. The positioning jig for lead frames according to claim 1, characterized in that: the lower end of the supporting plate (1) is provided with an elevating frame (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121449484.XU CN215786022U (en) | 2021-06-28 | 2021-06-28 | Positioning fixture of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121449484.XU CN215786022U (en) | 2021-06-28 | 2021-06-28 | Positioning fixture of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215786022U true CN215786022U (en) | 2022-02-11 |
Family
ID=80179102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121449484.XU Active CN215786022U (en) | 2021-06-28 | 2021-06-28 | Positioning fixture of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215786022U (en) |
-
2021
- 2021-06-28 CN CN202121449484.XU patent/CN215786022U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231123 Address after: 101200 Zhongguancun Science and Technology Park, Pinggu District, Beijing Pinggu District, Zone 1-20207 (cluster registration) Patentee after: Beijing Fengfeng Energy Management Co.,Ltd. Address before: 214000 No. 58, Hudai Road, Hudai Industrial Park, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Jiatai precision mould Co.,Ltd. |
|
| TR01 | Transfer of patent right |