CN209328875U - Packaging fixture applied to cmos image sensor ceramics PGA - Google Patents
Packaging fixture applied to cmos image sensor ceramics PGA Download PDFInfo
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- CN209328875U CN209328875U CN201822137877.1U CN201822137877U CN209328875U CN 209328875 U CN209328875 U CN 209328875U CN 201822137877 U CN201822137877 U CN 201822137877U CN 209328875 U CN209328875 U CN 209328875U
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Abstract
The utility model discloses a kind of packaging fixtures applied to cmos image sensor ceramics PGA, it is related to the field of structural design of fixture, including for the bottom plate of stacked glass cover plate and cmos image sensor chip, the pressing plate for pressing cover glass and cmos image sensor chip, the hold-down mechanism for adjusting vertical range between pressing plate and bottom plate；Pressing plate is removably fixed in above bottom plate；The accommodating space of accommodating cmos image sensor Chip Vertical pin is provided on pressing plate.Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA; when pressing cover glass and cmos image sensor chip; the vertical pins of cmos image sensor chip, which are located in accommodating space, to be protected; therefore it can avoid bonding processes to damage caused by vertical pins; keep cover glass encapsulation cmos image sensor chip processes convenient and efficient, easily operated; the packaging efficiency for improving cover glass, increases the productive profit of enterprise.
Description
Technical field
The utility model relates to the field of structural design of fixture, more particularly to one kind to be applied to cmos image sensor ceramics
The packaging fixture of PGA.
Background technique
Cmos image sensor is a kind of typical solid state image sensor, usually by image-sensitive cell array, line driver,
A few part compositions such as row driver, time sequence control logic, converter, data/address bus output interface, control interface, this several part
Usually all it is integrated on same silicon wafer.Cmos image sensor has random window reading capability, capability of resistance to radiation, system
Complexity and reliability, non-destructive data playback mode, optimization the advantages such as spectrum assignment, in view of cmos image sensor
Relatively superior performance, so that cmos image sensor is widely used in every field.
PGA encapsulation, i.e. contact pin grid array packages technology have inside and outside the chip encapsulated by this technology and multiple square matrix-shaped are in
The pin of contact pin type, each square matrix-shaped contact pin are arranged along the circumferentially-spaced certain distance of chip.Utilize multilayer ceramic base material material pair
Chip, which is packaged, has many advantages, such as that high reliablity, adaptation frequency is high, it is big to adapt to power.But it is encapsulated using PGA encapsulation technology
After chip, the perpendicular shape distribution of pin on chip, in subsequent packaged glass patch process, especially by cover glass with
In cmos image sensor chip compaction process, vertical pins make compaction process be difficult to operate, and reduce the envelope of cover glass
Fill efficiency.
Utility model content
In view of the above problems, the utility model provides a kind of envelope applied to cmos image sensor ceramics PGA
Clamps, to solve the problems, such as that vertical pins make compaction process be difficult to operate in cover glass encapsulation process in the prior art,
By designing the fixture of specific structure, keeps cover glass encapsulation process easily operated, improve the packaging efficiency of cover glass, increase
The productive profit of enterprise.
To achieve the above object, technical solution provided by the utility model are as follows:
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, including for being stacked glass
The bottom plate of glass cover plate and cmos image sensor chip, the pressing plate for pressing cover glass and cmos image sensor chip,
For adjusting the hold-down mechanism of vertical range between the pressing plate and the bottom plate；The pressing plate is removably fixed on the bottom plate
Side；The accommodating space of accommodating cmos image sensor Chip Vertical pin is provided on the pressing plate.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that the bottom plate
On be provided with several notch portions for stacked glass cover plate and cmos image sensor chip.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that the pressing plate
On be provided with it is several first opening；Several first openings run through the pressing plate；One first opening is located at an institute
State the top of notch portion；It is provided on the inner sidewall of first opening for pressing cover glass and cmos image sensor core
The pressing frame of piece；The oral area of notch portion described in the pressing frame part overlaid；The pressing frame inner hollow；The pressing frame
Inside edge surrounds the second opening；Several second openings constitute the accommodating space.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that the recess
The bottom opening in portion；The side for placing cover glass Yu cmos image sensor chip is provided on the notch portion inner sidewall
Frame；The frame inner hollow；It further include first base；The first base is located at the lower section of the bottom plate；First bottom
Flexible connector is provided on seat；The flexible connector has elasticity in the vertical direction；The first base passes through described
Flexible connector is connected with several lower support blocks；One lower support block passes through a frame；The top of the lower support block is high
Degree is higher than the overhead height of the frame；The overhead height of the lower support block is lower than the height of notch portion top oral area.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that the elasticity
Connector includes several springs；The axis of several springs is perpendicular to the first base；The bottom of several springs is solid
Due in the first base；The lower support block is fixed at the top of one spring.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that described first
The first positioning mechanism for limiting several lower support block overhead heights is provided on pedestal.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that further include
Two pedestals and third pedestal；The second base is set to above the first base；The third pedestal is set to described
Above two pedestals；The bottom plate is located above the third pedestal；It is provided in the second base several for the lower support block
The first passage that moves up and down of lower part；It is provided with what several tops for the lower support block moved up and down in the third pedestal
Second channel；One first passage is corresponding with a second channel to form a Vertical Channel；Under one described
Support block is located in the Vertical Channel；The cross-sectional area of the lower support block lower part is greater than the cross section of the second channel
Product；Several first passages and several second channels constitute first positioning mechanism.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that the third
The second positioning mechanism for limiting the bottom plate and the press plate position is provided on pedestal.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that described second
Positioning mechanism include several locating rods being set on the third pedestal, several first through hole being set on the bottom plate and
Several second through-holes being set on the pressing plate；One first through hole is corresponding with second through-hole to form one
A vertical through-hole；The locating rod passes through the vertical corresponding first through hole and second through-hole.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, it is preferable that the compression
If mechanism includes several threaded fasteners, several first threaded holes being set on the bottom plate and is set on the pressing plate
Dry second threaded hole；One second threaded hole is corresponding with first threaded hole to form a vertical threaded hole；
Several second threaded holes run through the pressing plate；The threaded fastener passes through second threaded hole and first screw thread
Hole is fixed.
The technical scheme has the following advantages or beneficial effects:
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA passes through setting bottom plate, pressure
Plate, hold-down mechanism, and setting accommodates the accommodating space of cmos image sensor Chip Vertical pin on pressing plate, in pressing glass
When cover plate and cmos image sensor chip, the vertical pins of cmos image sensor chip, which are located in accommodating space, is protected
Shield, therefore can avoid bonding processes and damaged caused by vertical pins, so that cover glass is encapsulated cmos image sensor chip mistake
Journey is convenient and efficient, easily operated, improves the packaging efficiency of cover glass, increases the productive profit of enterprise.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the utility model and its spy
Sign, shape and advantage will become more apparent.Identical label indicates identical part in all the attached drawings.Do not press deliberately
Attached drawing is drawn according to ratio, it is preferred that emphasis is the purport of the utility model is shown.
Fig. 1 is the packaging fixture structure applied to cmos image sensor ceramics PGA that the utility model embodiment 1 provides
Schematic diagram；
Fig. 2 is the packaging fixture part applied to cmos image sensor ceramics PGA that the utility model embodiment 1 provides
Structural schematic diagram；
Fig. 3 is the packaging fixture pressing plate applied to cmos image sensor ceramics PGA that the utility model embodiment 1 provides
Top view；
Fig. 4 is the packaging fixture part applied to cmos image sensor ceramics PGA that the utility model embodiment 1 provides
Convex structure schematic diagram；
Fig. 5 is that the packaging fixture applied to cmos image sensor ceramics PGA that the utility model embodiment 1 provides is looked up
Figure.
Specific embodiment
Below with reference to the attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu, complete explanation, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole realities
Apply example.Therefore, the detailed description in the utility model embodiment provided in attached drawing is not intended to limit below claimed
The scope of the utility model, but be merely representative of the selected embodiment of the utility model.Based on the embodiments of the present invention,
Those skilled in the art's every other embodiment obtained without creative labor belongs to practical
Novel protection scope.
Embodiment 1:
As shown in Figure 1, the packaging clip applied to cmos image sensor ceramics PGA that the utility model embodiment 1 provides
Tool, including for stacked glass cover plate and cmos image sensor chip bottom plate 1, for pressing cover glass and cmos image
The pressing plate 2 of sensor chip, the hold-down mechanism 3 for adjusting vertical range between pressing plate 2 and bottom plate 1；Pressing plate 2 is removably fixed in
1 top of bottom plate；The accommodating space 21 of accommodating cmos image sensor Chip Vertical pin is provided on pressing plate 2.
Packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, by setting bottom plate 1,
Pressing plate 2, hold-down mechanism 3, and the accommodating space 21 for accommodating cmos image sensor Chip Vertical pin is set on pressing plate 2, one
Aspect, when pressing cover glass and cmos image sensor chip, the vertical pins of cmos image sensor chip, which are located at, to be held
It is protected in 21 between emptying, therefore can avoid bonding processes and damaged caused by vertical pins, cover glass is made to encapsulate CMOS
Image sensor chip process is convenient and efficient, easily operated, improves the packaging efficiency of cover glass, increases the production benefit of enterprise
Profit；On the other hand, while hold-down mechanism 3 provides pressure force by adjusting the vertical range between bottom plate 1 and pressing plate 2, may be used also
Suitable for pressing the cover glass and cmos image sensor chip of a variety of different models, the glass cover of replacement different model is avoided
Matched packaging fixture is needed to change when piece and cmos image sensor chip, simplifies the cover glass and CMOS of encapsulation different model
Operating process when image sensor chip improves the packaging efficiency of cover glass, increases the productive profit of enterprise, saves enterprise
Cost.
Preferably, several notch portions for stacked glass cover plate and cmos image sensor chip are provided on bottom plate 1
11.Specifically, as shown in Fig. 2, the cross section phase contract of the cross section of notch portion 11 and cover glass, cmos image sensor chip
It closes.Several 11 uniform intervals of notch portion are set on bottom plate；The quantity of notch portion 11 is 12, and the arrangement mode of notch portion is 2
6 column rectangular array of row.
By the way that several notch portions 11 are arranged on bottom plate 1, by cover glass with cmos image sensor chip stack in recessed
It being pressed in oral area 11, notch portion 11 plays the role of positioning to cover glass and the stacked of cmos image sensor chip, so that
Cover glass and cmos image sensor chip pressing process are convenient and efficient, easily operated, therefore the envelope of cover glass can be improved
Efficiency is filled, the productive profit of enterprise is increased；In addition, cover glass and cmos image sensor also can be improved in the setting of notch portion 11
The pressing accuracy of chip, therefore the pressing quality and effect of cover glass can be improved.
Preferably, as shown in figure 3, being provided with several first openings 22 on pressing plate 2；Several first openings 22 run through pressing plate 2；
One first opening 22 is located at the top of a notch portion 11；It is provided on the inner sidewall of first opening 22 for pressing glass cover
The pressing frame 23 of piece and cmos image sensor chip；Press the oral area of 23 part overlaid notch portion 11 of frame；It presses inside frame 23
It is hollow；The inside edge of pressing frame 23 surrounds the second opening 211；Several second openings 211 constitute accommodating space 21.Specifically,
Two openings 211 are rectangle；Pressing frame 23 is set to the oral area in the first opening 22 close to bottom plate 1.
By setting pressing frame 23 for pressing cover glass and cmos image sensor chip, accommodating space 21 is set as
Several second openings 211；The design structure for pressing frame 23 and the second opening 211 is simple, is readily produced, is with better simply device
It may make pressing cover glass and cmos image sensor chip processes convenient and efficient, easily operated, therefore there is stronger reality
The property used.
Preferably, as shown in figure 4, the bottom opening of notch portion 11；It is provided on notch portion inner sidewall for placing glass
The frame 12 of cover plate and cmos image sensor chip；12 inner hollow of frame；It further include first base 4；First base 4 is located at
The lower section of bottom plate 1；Flexible connector 41 is provided in first base 4；Flexible connector 41 has elasticity in the vertical direction；The
One pedestal 4 is connected with several lower support blocks 42 by flexible connector 41；One lower support block 42 passes through a frame 12；Lower support block 42
Overhead height be higher than frame 12 overhead height；The overhead height of lower support block 42 is lower than the height of 11 top oral area of notch portion.
Specifically, the quantity of corresponding notch portion 11, the quantity of lower support block 42 are 12.
Cover glass is packaged in cmos image sensor chip processes, since different cover glasses or CMOS are schemed
As highly having differences vertically for sensor chip or notch portion 11, therefore it cannot be guaranteed pressing frame 23 and 11 bottom of notch portion
Highly meet the requirements of all cover glasses Yu cmos image sensor chip pressing height vertically, therefore easy there are part glass
Glass cover plate and cmos image sensor chip pressing situation of low quality, certain loss is caused to enterprise.The utility model
The packaging fixture applied to cmos image sensor ceramics PGA provided, the bottom of notch portion 11 includes frame 12 and lower support block
42, the overhead height of lower support block 42 is higher than the overhead height of frame 12；The overhead height of lower support block 42 is lower than 11 top of notch portion
The height of oral area, lower support block 42 can move in the vertical direction under the action of flexible connector 41, thus when pressing frame 23 with
When the vertical height of frame 12 is not able to satisfy requirement of the cover glass with cmos image sensor chip pressing height, elastic connection
Part 41 can make up the vertical height of pressing frame 23 and frame 12 to the upward active force of lower support block 42 automatically, be allowed to meet glass cover
The requirement of piece and cmos image sensor chip pressing height；Therefore cover glass and cmos image sensor chip pressure can be improved
Quality and effect are closed, the loss caused by enterprise of error caused by objective factor in bonding processes is made up.
Preferably, as shown in figure 4, flexible connector 41 includes several springs 411；The axis of several springs 411 perpendicular to
First base 4；The bottom of several springs 411 is fixed in first base 4；The top of one spring 411 is fixed under one and supports
Block 42.
By setting several springs 411 for flexible connector 41, the structure of spring 411 is simple, and acquisition cost is lower, property
Valence can save the cost of investment and operation cost of enterprise than high.
Preferably, as shown in figure 4, being provided with first for limiting several 42 overhead heights of lower support block in first base 4
Positioning mechanism 5.By the way that the first positioning mechanism 5 is arranged, the first, first positioning mechanism 5 can make lower 42 overhead height of support block lower than recessed
The height of 11 top oral area of oral area, therefore can guarantee that notch portion 11 makees the positioning of cover glass and cmos image sensor chip
With so that bonding processes are easily operated, improving the packaging efficiency of cover glass, increase the productive profit of enterprise；Improve glass cover
The pressing accuracy of piece and cmos image sensor chip improves the pressing quality and effect of cover glass.The second, the first positioning
Mechanism 5 can make lower 42 overhead height of support block be higher than the overhead height of frame 12, therefore work as the vertical height of pressing frame 23 and frame 12
When degree is not able to satisfy requirement of the cover glass with cmos image sensor chip pressing height, it is ensured that 42 pairs of several lower support blocks pressures
Vertical height makes up effect, guarantee cover glass and cmos image sensor chip pressing quality between conjunction frame 23 and frame 12
With effect.Third, the first positioning mechanism 5 can eliminate several lower 42 overhead heights of support block as caused by 411 self reason of spring
Inconsistent problem is convenient for standardized operation and large-scale production so that the overhead height of several lower support blocks 42 is consistent.
Preferably, as shown in figure 4, further including second base 51 and third pedestal 52；Second base 51 is set to the first bottom
4 top of seat；Third pedestal 52 is set to 51 top of second base；Bottom plate 1 is located at 52 top of third pedestal；It is set in second base 51
It is equipped with the first passage 511 that several lower parts for lower support block 42 move up and down；It is provided in third pedestal 52 several for lower support block
The second channel 521 that 42 top moves up and down；One first passage 511 is corresponding with a second channel 521 to form one
Vertical Channel；One lower support block 42 is located in a Vertical Channel；The cross-sectional area of lower 42 lower part of support block is greater than second channel 521
Cross-sectional area；Several first passages 511 and several second channels 521 constitute the first positioning mechanism 5.
Specifically, second base 51 is removably fixed in the top of first base 4；Third pedestal 52 is removably fixed in
The top of two pedestals 51.More specifically, as shown in figure 5, be provided with several third threaded holes in first base 4, several third spiral shells
Pit runs through first base 4；Several 4th threaded holes are provided in second base 51, several 4th threaded holes run through second base
51；Several 5th threaded holes are provided on third pedestal 52, the 5th threaded hole is blind hole, and the opening of the 5th threaded hole is located at third
On the bottom surface of pedestal 52；One third threaded hole, the 4th threaded hole, a 5th threaded hole correspondence can form one vertically
Threaded hole；Screw 53 passes through third threaded hole, the 4th threaded hole is fixed with the 5th object threaded hole；Screw 53 can also for bolt or
Person's stud.
By setting several first passages 511 and several second channels 521, the first localization machine for the first positioning mechanism 5
The setting structure of structure 5 is simple, is readily produced；Second base 51 is detachably fixed with first base 4；Third pedestal 52 and the second bottom
Seat 51 is detachably fixed, thus when spring 411 occur damaging or lower support block 42 move up and down there is Caton when, can be by second
Pedestal 51 and third pedestal 52 are dismantled, and the component damaged occur in on-call maintenance or replacement, are extended and are applied to cmos image sensing
The service life of the packaging fixture of device ceramics PGA, saves the cost of enterprise.
Preferably, as shown in Figure 1, being provided with the second positioning for limiting 2 position of bottom plate 1 and pressing plate on third pedestal 52
Mechanism 6.First, by the way that the second positioning mechanism 6 is arranged, therefore when bottom plate 1 to be placed on third pedestal 52, pressing plate 2 is placed in bottom
It is easily operated when on plate 1, improve the combined efficiency of the packaging fixture applied to cmos image sensor ceramics PGA；Therefore it can mention
The packaging efficiency of high cover glass and cmos image sensor chip increases the productive profit of enterprise；Second, pass through setting second
Positioning mechanism 6, pressing plate 2 are accurately placed on bottom plate 1, guarantee pressing of the pressing plate 2 to cover glass and cmos image sensor chip
Effect improves the package quality of cover glass.
Preferably, the second positioning mechanism 6 includes several locating rods 61 being set on third pedestal 52, is set to bottom plate 1
On several first through hole (being not shown) and several second through-holes 63 for being set on pressing plate 2；One first through hole with
One 63 correspondence of the second through-hole can form a vertical through-hole；Locating rod 61 passes through vertical corresponding first through hole and the second through-hole
63.Specifically, the quantity of locating rod 61 is 2, and the quantity of corresponding first through hole and the second through-hole 63 is 2.
By the setting of above-mentioned second positioning mechanism 6, the design structure of the second positioning mechanism 6 is simple, is readily produced；Positioning
Bar 61 passes through vertical corresponding first through hole and the second through-hole 63 can be realized the positioning to bottom plate 1 and pressing plate 2, convenient and efficient,
It is easily operated, improve the combined efficiency of the packaging fixture applied to cmos image sensor ceramics PGA；Therefore glass cover can be improved
The packaging efficiency of piece and cmos image sensor chip increases the productive profit of enterprise.
Preferably, as shown in Figure 1, hold-down mechanism 3 include several threaded fasteners 31, be set on bottom plate 1 several the
One threaded hole (being not shown) and several second threaded holes 33 being set on pressing plate 2 (shown in Fig. 3)；One the second screw thread
Hole 33 is corresponding with first threaded hole to form a vertical threaded hole；Several second threaded holes 33 run through pressing plate；Screw thread is tight
Firmware 31 passes through the second threaded hole 33 and fixes with the first threaded hole.
Specifically, the first threaded hole is blind hole；Threaded fastener 31 is one of screw, bolt, stud.More specifically
Ground, threaded fastener 31 are screw 31；The quantity of screw 31 is 4, and the quantity of corresponding first threaded hole is 4, the second spiral shell
The quantity of pit 33 is 4.First, the design structure of hold-down mechanism 3 is simple, is readily produced；Second, by by hold-down mechanism 3
It is set as threaded fastener 31, the first threaded hole and the second threaded hole 33, therefore can be at any time by rotation threaded fastener 31
The vertical range between pressing plate 2 and bottom plate 1 is adjusted, guarantees the pressing effect of cover glass and cmos image sensor；Adjustment mode
Simply, easily operated.
The packaging fixture applied to cmos image sensor ceramics PGA provided using the utility model embodiment 1, the bottom of by
Plate 1 is placed in the top of third pedestal 52 by the second positioning mechanism 6；Cover glass is placed in the notch portion 11 on bottom plate 1, one
A cover glass is placed in a notch portion 11；Cmos image sensor chip is placed on cover glass, cmos image sensing
Side on device chip where vertical pins is upward；Pressing plate 2 is placed in the top of bottom plate 1 by the second positioning mechanism 6, presses frame
23 are located on cmos image sensor chip perimeter, and the vertical pins on cmos image sensor chip are placed in the second opening 211
In；According to the sum of cover glass and the vertical height of cmos image sensor chip, bottom plate 1 and pressure are adjusted by hold-down mechanism 3
Vertical distance between plate 2, by cover glass and cmos image sensor chip pressing；When the minimum of pressing frame 23 and frame 12 is perpendicular
When straight height is not able to satisfy requirement of the cover glass with cmos image sensor chip pressing height, spring 411 is to lower support block 42
Upward active force can make up the vertical height of pressing frame 23 and frame 12 automatically, be allowed to meet cover glass and cmos image biography
The requirement of sensor chip pressing height.
In conclusion the packaging fixture provided by the utility model applied to cmos image sensor ceramics PGA, by setting
Bottom set plate, pressing plate, hold-down mechanism, and setting accommodates the accommodating space of cmos image sensor Chip Vertical pin on pressing plate,
When pressing cover glass and cmos image sensor chip, the vertical pins of cmos image sensor chip are located at accommodating space
In protected, therefore can avoid bonding processes damaged caused by vertical pins, make cover glass encapsulation cmos image sensing
Device chip processes are convenient and efficient, easily operated, improve the packaging efficiency of cover glass, increase the productive profit of enterprise.
It should be appreciated by those skilled in the art that those skilled in the art combine the prior art and above-described embodiment can be real
The existing change case, it will not be described here.Such change case has no effect on the substantive content of the utility model, not superfluous herein
It states.
The preferred embodiment of the utility model is described above.It is to be appreciated that the utility model not office
It is limited to above-mentioned particular implementation, devices and structures not described in detail herein should be understood as with the common side in this field
Formula is practiced；Anyone skilled in the art, do not depart from technical solutions of the utility model make it is many possible
Changes and modifications or equivalent example modified to equivalent change, this has no effect on the substantive content of the utility model.Therefore,
All contents without departing from technical solutions of the utility model, it is made to the above embodiment according to the technical essence of the utility model
Any simple modifications, equivalents, and modifications, still fall within technical solutions of the utility model protection in the range of.
Claims (10)
1. a kind of packaging fixture applied to cmos image sensor ceramics PGA, which is characterized in that including being used for stacked glass lid
Piece and the bottom plate of cmos image sensor chip, are used for the pressing plate for pressing cover glass and cmos image sensor chip
Adjust the hold-down mechanism of vertical range between the pressing plate and the bottom plate；The pressing plate is removably fixed in above the bottom plate；
The accommodating space of accommodating cmos image sensor Chip Vertical pin is provided on the pressing plate.
2. being applied to the packaging fixture of cmos image sensor ceramics PGA as described in claim 1, which is characterized in that described
Several notch portions for stacked glass cover plate and cmos image sensor chip are provided on bottom plate.
3. being applied to the packaging fixture of cmos image sensor ceramics PGA as claimed in claim 2, which is characterized in that described
Several first openings are provided on pressing plate；Several first openings run through the pressing plate；One first opening is located at one
The top of a notch portion；It is provided on the inner sidewall of first opening and is sensed for pressing cover glass and cmos image
The pressing frame of device chip；The oral area of notch portion described in the pressing frame part overlaid；The pressing frame inner hollow；The pressing
The inside edge of frame surrounds the second opening；Several second openings constitute the accommodating space.
4. being applied to the packaging fixture of cmos image sensor ceramics PGA as claimed in claim 2, which is characterized in that described
The bottom opening of notch portion；It is provided on the notch portion inner sidewall for placing cover glass and cmos image sensor chip
Frame；The frame inner hollow；
It further include first base；The first base is located at the lower section of the bottom plate；Flexible company is set in the first base
Fitting；The flexible connector has elasticity in the vertical direction；The first base is connected with by the flexible connector
Several lower support blocks；One lower support block passes through a frame；The overhead height of the lower support block is higher than the frame
Overhead height；The overhead height of the lower support block is lower than the height of notch portion top oral area.
5. being applied to the packaging fixture of cmos image sensor ceramics PGA as claimed in claim 4, which is characterized in that described
Flexible connector includes several springs；The axis of several springs is perpendicular to the first base；The bottom of several springs
Portion is fixed in the first base；The lower support block is fixed at the top of one spring.
6. being applied to the packaging fixture of cmos image sensor ceramics PGA as claimed in claim 4, which is characterized in that described
The first positioning mechanism for limiting several lower support block overhead heights is provided in first base.
7. being applied to the packaging fixture of cmos image sensor ceramics PGA as claimed in claim 6, which is characterized in that also wrap
Include second base and third pedestal；The second base is set to above the first base；The third pedestal is set to institute
It states above second base；The bottom plate is located above the third pedestal；It is provided in the second base several under described
The first passage that the lower part of support block moves up and down；It is provided on several tops for the lower support block and moves down in the third pedestal
Dynamic second channel；One first passage is corresponding with a second channel to form a Vertical Channel；One institute
Lower support block is stated in a Vertical Channel；The cross-sectional area of the lower support block lower part is greater than the transversal of the second channel
Area；Several first passages and several second channels constitute first positioning mechanism.
8. the use as claimed in claim 7 in the packaging fixture of cmos image sensor ceramics PGA, which is characterized in that described
The second positioning mechanism for limiting the bottom plate and the press plate position is provided on third pedestal.
9. being applied to the packaging fixture of cmos image sensor ceramics PGA as claimed in claim 8, which is characterized in that described
Second positioning mechanism includes that several locating rods being set on the third pedestal, several first be set on the bottom plate are logical
Hole and several second through-holes being set on the pressing plate；One first through hole is corresponding with second through-hole can shape
At a vertical through-hole；The locating rod passes through the vertical corresponding first through hole and second through-hole.
10. being applied to the packaging fixture of cmos image sensor ceramics PGA as described in claim 1, which is characterized in that described
Hold-down mechanism includes several threaded fasteners, several first threaded holes being set on the bottom plate and is set on the pressing plate
Several second threaded holes；One second threaded hole is corresponding with first threaded hole to form a vertical screw thread
Hole；Several second threaded holes run through the pressing plate；The threaded fastener passes through second threaded hole and described first
Threaded hole is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822137877.1U CN209328875U (en) | 2018-12-19 | 2018-12-19 | Packaging fixture applied to cmos image sensor ceramics PGA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822137877.1U CN209328875U (en) | 2018-12-19 | 2018-12-19 | Packaging fixture applied to cmos image sensor ceramics PGA |
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| CN209328875U true CN209328875U (en) | 2019-08-30 |
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| CN201822137877.1U Active CN209328875U (en) | 2018-12-19 | 2018-12-19 | Packaging fixture applied to cmos image sensor ceramics PGA |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449176A (en) * | 2018-12-19 | 2019-03-08 | 积高电子(无锡)有限公司 | Applied to cmos image sensor ceramics PGA adjustable sealing clamps |
| CN113263336A (en) * | 2021-04-29 | 2021-08-17 | 北京航天光华电子技术有限公司 | Device capable of being replaced and clamped quickly for engraving chip tube shell |
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2018
- 2018-12-19 CN CN201822137877.1U patent/CN209328875U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449176A (en) * | 2018-12-19 | 2019-03-08 | 积高电子(无锡)有限公司 | Applied to cmos image sensor ceramics PGA adjustable sealing clamps |
| CN113263336A (en) * | 2021-04-29 | 2021-08-17 | 北京航天光华电子技术有限公司 | Device capable of being replaced and clamped quickly for engraving chip tube shell |
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