CN213600748U - Four-probe detection device - Google Patents

Abstract

The utility model discloses a four probe detection device, include: a work table; the test rack is arranged on the workbench; the telescopic hydraulic cylinder is arranged on the test rack; the auxiliary frame is arranged at the output end of the telescopic hydraulic cylinder, and the auxiliary frame is provided with a test head; the test tray, the test tray setting is on the base of test frame, the utility model provides a silicon chip's electrical property detect inconvenient technical problem.

Description

Four-probe detection device

Technical Field

The utility model relates to a silicon chip processing technology field especially relates to a four probe detection device.

Background

Before the silicon chip is produced and used, the surface concentration and the resistivity of the silicon chip need to be detected, so that the electrical property of a subsequently produced product can be ensured; the existing detection mode is usually manual detection, namely, a gear is manually rotated, so that a test head vertically presses on the surface of a detected sample with certain pressure, but the pressure of the test head pressing on the surface of the detected sample cannot be ensured, if the pressure is too high, a silicon wafer is crushed, and a probe is broken; if the pressure is too low, the measured value is inaccurate; when the silicon wafer is detected, the middle part and the edge of the silicon wafer need to be detected by the test head, and the existing adjusting mode often generates offset to influence the detection result.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a four probe detection device, the electricity performance of solving silicon chip among the prior art detects inconvenient technical problem.

A four-probe assay device comprising:

a work table;

the test rack is arranged on the workbench;

the telescopic hydraulic cylinder is arranged on the test rack;

the auxiliary frame is arranged at the output end of the telescopic hydraulic cylinder, and the auxiliary frame is provided with a test head;

the test tray is arranged on the base of the test rack.

According to the embodiment of the application, the telescopic hydraulic cylinder moves up and down, the auxiliary frame is pushed up and down, the test head is close to or far away from the test disc, detection is completed, and the detection efficiency is improved.

On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:

further, the four corners of the bottom of the test rack are provided with supporting pads, so that gaps are reserved between the bottom surface of the test rack and the surface of the workbench, and the beneficial effect of the step is that the installation area to other parts is reserved through the gaps.

Furthermore, spacing posts are arranged on the test disc at intervals, and the beneficial effect of the step is that the area of the test disc can be limited through the spacing posts, so that the silicon wafer is effectively prevented from deviating during testing.

Furthermore, an inverted L-shaped supporting plate is arranged on the testing machine frame, and a telescopic hydraulic cylinder is arranged on the L-shaped supporting plate.

Further, the auxiliary frame includes:

the upper plate is connected with the output end of the telescopic hydraulic cylinder;

the utility model provides a test head, including hypoplastron, be connected with the stand between hypoplastron and the upper plate, and install the test head on the hypoplastron, the probe of test head is vertical downwards, and the beneficial effect who adopts this step can reduce the influence of external factor to the test head through the auxiliary frame.

Further, a displacement adjusting mechanism is installed at the bottom of the test rack, and the displacement adjusting mechanism drives the test disc to move at the bottom of the test rack.

Further, the displacement adjusting mechanism includes:

the rack is fixed on the bottom surface of the test disc;

the bottom plate is provided with a groove and is arranged at the bottom of the test rack, and the rack is positioned in the groove;

the rotating shaft penetrates through the bottom plate, a gear is installed on the rotating shaft, the gear is located inside the groove, and the gear is meshed with the rack.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

1. this application embodiment can drive the test head through the up-and-down motion of flexible pneumatic cylinder and reciprocate, accomplishes and detects.

2. The embodiment of the application is provided with the displacement adjusting mechanism, and the position of the test disc can be adjusted by the displacement adjusting mechanism, so that the detection is convenient.

3. The embodiment of the application has the advantages of simple structure, convenience in operation and high detection efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a four-probe detection apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a portion A of a four-probe inspection device according to an embodiment of the present invention;

reference numerals:

1-a workbench; 2-a test rack; 3-a telescopic hydraulic cylinder; 4-an auxiliary frame; 5-a test head; 6-test disc; 7-a support pad; 8-a limiting column; a 9-L shaped support plate; 10-a displacement adjustment mechanism;

401-upper plate; 402-a lower plate; 403-upright post;

1001-rack; 1002-a bottom plate; 1003-groove; 1004-a rotating shaft; 1005-gear.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "top", "bottom", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The embodiment of the application provides a four-probe detection device, which solves the technical problem that the electrical property of a silicon chip is inconvenient to detect in the prior art.

The general idea of the embodiment of the application is as follows: firstly, the auxiliary frame is driven to move up and down through a telescopic hydraulic cylinder, so that the test head moves up and down to complete detection; the center position of the silicon wafer is detected firstly, after the detection is finished, the edge of the silicon wafer is detected, at the moment, the displacement adjusting mechanism can drive the test disc to move, so that the test head is aligned to the edge of the silicon wafer, and then the test head is pushed to move downwards to finish the detection.

In order to better understand the technical solutions, the technical solutions will be described in detail below with reference to the drawings and the detailed description.

Examples

As shown in fig. 1-2, the present embodiment provides a four-probe detection apparatus, including:

the workbench 1 mainly plays a role in supporting, so that other devices are positioned at a relatively proper height, and detection by workers is facilitated;

the testing machine frame 2 is arranged on the workbench 1, the testing machine frame 2 is used for installing other components, and meanwhile, the testing machine frame 2 is placed on the workbench 1 and is not fixed, so that the position of the testing machine frame 2 can be conveniently adjusted;

the telescopic hydraulic cylinder 3 is arranged on the test rack 2, and the telescopic hydraulic cylinder 3 in the embodiment of the application is used as a power part to push other parts to move downwards so as to contact the surfaces of the silicon wafers and finish detection;

the auxiliary frame 4 is installed at the output end of the telescopic hydraulic cylinder 3, the test head 5 is installed on the auxiliary frame 4, and the test head 5 in the embodiment of the application is installed on the auxiliary frame 4, so that the influence of other external factors on the detection result is avoided; the test head 5 is a four-probe test head and can finish the electrical property detection of the silicon wafer;

the testing tray 6, the testing tray 6 sets up the bottom of testing frame 2, and the testing tray 6 in this application embodiment is used for placing the silicon chip, is convenient for accomplish the detection to the silicon chip.

Specifically, the four corners of 2 bottoms of test frame are provided with supporting pad 7 and make the bottom surface of test frame 2 with the space is left on the surface of workstation 1, and supporting pad 7 of this application embodiment is left the space for subsequent displacement adjustment mechanism can use.

Specifically, spacing post 8 is provided with at the interval on the test tray 6, and spacing post 8 in this application embodiment can restrict the scope of placing of silicon chip for the silicon chip can be in between spacing post 8, and when the test head contacted with the silicon chip, the silicon chip can not take place to slide.

Specifically, an inverted L-shaped support plate 9 is mounted on the test rack 2, and a telescopic hydraulic cylinder 3 is mounted on the L-shaped support plate 9; the telescopic hydraulic cylinder 3 in the embodiment of the application is vertically installed on the L-shaped supporting plate 9, the waist-shaped hole is formed in the L-shaped supporting plate 9 at the moment, so that the height of the L-shaped supporting plate 9 can be adjusted, and the height of the telescopic hydraulic cylinder 3 can also be adjusted.

Specifically, the auxiliary frame 4 includes:

the upper plate 401 is connected with the output end of the telescopic hydraulic cylinder 3, the output end of the telescopic hydraulic cylinder 3 is vertically downward, and the upper plate 401 is driven by the telescopic hydraulic cylinder 3 to move up and down;

the testing device comprises a lower plate 402, wherein a vertical column 403 is connected between the lower plate 402 and an upper plate 401, a testing head 5 is mounted on the lower plate 402, and a probe of the testing head 5 is vertically downward; in the embodiment of the present application, a gap is left between the upper plate 401 and the lower plate 402, which facilitates the installation of the test head 5, because the probe of the test head 5 is vertically downward, the circuit connection portion is vertically upward, and a gap is left, which facilitates the circuit connection portion to pass through; meanwhile, the upright column 403 can avoid the influence of external factors on the test head.

Specifically, a displacement adjusting mechanism 10 is installed at the bottom of the test rack 2, and the displacement adjusting mechanism 10 drives the test tray 6 to move at the bottom of the test rack 2; the displacement adjusting mechanism 10 in the embodiment of the application can drive the test disc 6 to move, so that the conversion from middle detection to edge detection of the test head is completed.

Specifically, the displacement adjusting mechanism 10 includes:

a rack 1001, wherein the rack 1001 is fixed on the bottom surface of the test tray 6, the non-rack surface of the rack 1001 of the embodiment of the present application is connected with the bottom of the test tray 6, and the rack surface is meshed with other components;

the bottom plate 1002 is provided with a groove 1003, the bottom plate 1002 is mounted at the bottom of the test rack 2, and the rack 1001 is located in the groove 1003;

a rotating shaft 1004, wherein the rotating shaft 1004 passes through the bottom plate 1002, a gear 1005 is mounted on the rotating shaft 1004, the gear 1005 is positioned inside the groove 1003, and the gear 1005 is meshed with the rack 1001; the groove 1003 formed in the bottom plate 1002 in the embodiment of the application is an area where the gear 1005 and the rack 1001 are meshed with each other, when the silicon wafer testing device is used, the rotating shaft 1004 is rotated manually or electrically, so that the gear 1005 rotates, the rack 1001 moves back and forth, and the testing disc 6 is driven to move back and forth, so that the testing head 5 moves from the center of a silicon wafer to the edge of the silicon wafer, or moves from the edge of the silicon wafer to the center of the silicon wafer.

In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims (5)

1. A four-probe assay device, comprising:

a work table;

the test rack is arranged on the workbench;

the telescopic hydraulic cylinder is arranged on the test rack;

the auxiliary frame is arranged at the output end of the telescopic hydraulic cylinder, and the auxiliary frame is provided with a test head;

the test tray is arranged on the base of the test rack.

2. The four-probe detecting device according to claim 1, wherein the four corners of the bottom of the testing machine frame are provided with supporting pads so that the bottom of the testing machine frame is spaced from the surface of the worktable.

3. The four-probe detection device according to claim 2, wherein the test tray is provided with spacing posts at intervals.

4. The four-probe detecting device according to claim 3, wherein an inverted L-shaped supporting plate is mounted on the testing machine frame, and a telescopic hydraulic cylinder is mounted on the L-shaped supporting plate.

5. The four-probe detecting device according to claim 4, wherein the auxiliary frame comprises:

the upper plate is connected with the output end of the telescopic hydraulic cylinder;

the testing device comprises a lower plate, wherein an upright post is connected between the lower plate and an upper plate, a testing head is arranged on the lower plate, and a probe of the testing head is vertically downward.

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