CN212070003U

CN212070003U - Beryllium copper material surface leveling device

Info

Publication number: CN212070003U
Application number: CN202020694265.7U
Authority: CN
Inventors: 查晓锋
Original assignee: Suzhou Funaijia Technology Co ltd
Current assignee: Suzhou Funaijia Technology Co ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-12-04
Anticipated expiration: 2030-04-29

Abstract

The utility model belongs to the technical field of beryllium copper processing equipment, specifically disclose a beryllium copper material surface leveling device, comprises a workbench, be provided with clamping device on the workstation, the centre gripping has beryllium copper panel on the clamping device, the workstation both sides are provided with the spout, be provided with the mounting bracket through first slider in the spout, be provided with the slide rail on the mounting bracket, be provided with elevating gear through the second slider in the slide rail, all be provided with drive arrangement on first slider and the second slider, the elevating gear bottom is provided with the mounting panel, the mounting panel both sides are provided with cleaning device, be provided with evener and polisher on the mounting panel. The utility model discloses can clear away the sweeps on to panel before carrying out the flattening to panel, prevent that the sweeps from influencing the flattening and the polishing operation of panel, the practicality is strong.

Description

Beryllium copper material surface leveling device

Technical Field

The utility model relates to a beryllium copper material surface leveling device belongs to beryllium copper processing equipment technical field.

Background

Beryllium copper is a copper alloy with beryllium as a main alloy element, and after the beryllium copper is processed and manufactured, the surface of the beryllium copper needs to be leveled, so that the surface of the beryllium copper is smoother, and the practical use of the beryllium copper is met.

Then most all carry out the flattening to the arch on beryllium copper material surface of present beryllium copper surface leveling device, mostly need the polishing of taking again panel after the flattening, lead to the manufacturing procedure complicated, and the sweeps can remain on the panel surface when the leveling device flattening of present simultaneously, influences the processing of panel, designs a beryllium copper material surface leveling device now and solves above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a beryllium copper material surface leveling device solves the problem of proposing among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the beryllium copper material surface leveling device comprises a workbench, wherein a clamping device is arranged on the workbench, beryllium copper plates are clamped on the clamping device, sliding grooves are formed in two sides of the workbench, a mounting frame is arranged in the sliding grooves through a first sliding block, a sliding rail is arranged on the mounting frame, a lifting device is arranged in the sliding rail through a second sliding block, driving devices are arranged on the first sliding block and the second sliding block, a mounting plate is arranged at the bottom end of the lifting device, cleaning devices are arranged on two sides of the mounting plate, and a leveling device and a polishing device are arranged on the mounting plate.

Preferably, the clamping device comprises supporting blocks, the supporting blocks are symmetrically arranged on the workbench, an installation frame is arranged on the supporting blocks, a pressing block is arranged in the installation frame, and a threaded rod is arranged on the pressing block.

Preferably, the lifting device comprises a lifting motor and a lifting rod, the lifting motor is fixed on the second sliding block, and a mounting plate is arranged on the lifting rod of the lifting motor.

Preferably, the cleaning device comprises a rotating motor, the rotating motor is symmetrically arranged on two sides of the mounting plate, and a cleaning brush is arranged on a rotating shaft of the rotating motor.

Preferably, the leveler comprises a fixing plate, the fixing plate is arranged on the mounting plate, a leveling knife is arranged on the fixing plate through a telescopic rod, and a spring is sleeved on the telescopic rod.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model belongs to the technical field of beryllium copper processing equipment, specifically disclose a beryllium copper material surface leveling device, it is fixed to make things convenient for beryllium copper panel's installation through the clamping device who sets up, and the cleaning device of setting can be swept away the sweeps of remaining on beryllium copper panel, makes things convenient for flush trimmer and polisher to carry out flattening and polishing to panel, improves flattening and polishing quality, the utility model discloses simple structure, convenient operation, the practicality is strong.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the screed of the present invention;

in the figure: 1. a work table; 2. a clamping device; 3. a beryllium copper plate; 4. a chute; 5. a first slider; 6. a mounting frame; 7. a slide rail; 8. a second slider; 9. a lifting device; 10. a drive device; 11. mounting a plate; 12. a cleaning device; 13. a leveler; 14. a polisher; 15. a support block; 16. installing a frame; 17. briquetting; 18. a threaded rod; 19. a lifting motor; 20. a lifting rod; 21. a spring; 22. a rotating electric machine; 23. a rotating shaft; 24. cleaning the brush; 25. a fixing plate; 26. a telescopic rod; 27. a leveling knife.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-2, the present invention provides a technical solution: the beryllium copper material surface leveling device comprises a workbench 1, wherein a clamping device 2 is arranged on the workbench 1, a beryllium copper plate 3 is clamped on the clamping device 2, sliding grooves 4 are formed in two sides of the workbench 1, a mounting frame 6 is arranged in the sliding grooves 4 through a first sliding block 5, a sliding rail 7 is arranged on the mounting frame 6, a lifting device 9 is arranged in the sliding rail 7 through a second sliding block 8, driving devices 10 are arranged on the first sliding block 5 and the second sliding block 8, a mounting plate 11 is arranged at the bottom end of the lifting device 9, cleaning devices 12 are arranged on two sides of the mounting plate 11, and a leveling device 13 and a polishing device 14 are arranged on the mounting plate 11.

Further, the clamping device 2 comprises supporting blocks 15, the supporting blocks 15 are symmetrically arranged on the workbench 1, an installation frame 16 is arranged on the supporting blocks 15, a pressing block 17 is arranged in the installation frame 16, and a threaded rod 18 is arranged on the pressing block 17.

Further, the lifting device 9 comprises a lifting motor 19 and a lifting rod 20, the lifting motor 19 is fixed on the second slider 8, and the lifting rod 20 of the lifting motor 19 is provided with a mounting plate 11.

Further, the cleaning device 12 includes a rotating motor 22, the rotating motor 22 is symmetrically disposed on two sides of the mounting plate 11, and a rotating shaft 23 of the rotating motor 22 is provided with a cleaning brush 24.

Further, the flattening device 13 includes a fixing plate 25, the fixing plate 25 is disposed on the mounting plate 11, a flattening knife 27 is disposed on the fixing plate 25 through an expansion rod 26, and a spring 21 is sleeved on the expansion rod 26.

The working principle is as follows: the utility model relates to a beryllium copper material surface leveling device, when in use, the beryllium copper plate 3 is fixed on a workbench 1 through a clamping device 2, the beryllium copper plate 3 is placed on a supporting block 15, a threaded rod 18 is rotated to enable a pressing block 17 to press the beryllium copper plate 3 so as to fix the beryllium copper plate 3 on the workbench 1, then a driving device 10 on a first slider 5 and a second slider 8 works to drive the first slider 5 and the second slider 8 to move in a chute 4 and a sliding rail 7, a leveling device 13 and a polisher 14 are adjusted to move to the uneven position of the beryllium copper plate 3, then a lifting motor 19 works to drive a lifting rod 20 to descend, a leveling knife 27 of the leveling device 13 is attached to the surface of the beryllium copper plate 3, then the driving device 10 works to drive the second slider 8 to move to drive a leveling knife 27 to move, so that the leveling knife 27 performs leveling operation on the beryllium copper plate 3, the place after the flattening can be polished through polisher 14 after the flattening operation is accomplished, when carrying out the flattening to the place that next needs the flattening, drive cleaning brush 24 by the rotating electrical machines 22 work among the cleaning device 12 and rotate, cleaning brush 24 rotates and carries out the sweeps to the position that needs the flattening of beryllium copper plate 3 surface, prevents that the sweeps from influencing flattening and polishing operation to improve flattening and polishing quality.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A beryllium copper material surface leveling device is characterized in that: including workstation (1), be provided with clamping device (2) on workstation (1), the centre gripping has beryllium copper board (3) on clamping device (2), workstation (1) both sides are provided with spout (4), be provided with mounting bracket (6) through first slider (5) in spout (4), be provided with slide rail (7) on mounting bracket (6), be provided with elevating gear (9) through second slider (8) in slide rail (7), all be provided with drive arrangement (10) on first slider (5) and second slider (8), elevating gear (9) bottom is provided with mounting panel (11), mounting panel (11) both sides are provided with cleaning device (12), be provided with evener (13) and polisher (14) on mounting panel (11).

2. The device for leveling the surface of the beryllium copper material according to claim 1, wherein: the clamping device (2) comprises supporting blocks (15), the supporting blocks (15) are symmetrically arranged on the workbench (1), an installation frame (16) is arranged on the supporting blocks (15), a pressing block (17) is arranged in the installation frame (16), and a threaded rod (18) is arranged on the pressing block (17).

3. The device for leveling the surface of the beryllium copper material according to claim 1, wherein: the lifting device (9) comprises a lifting motor (19) and a lifting rod (20), the lifting motor (19) is fixed on the second sliding block (8), and a mounting plate (11) is arranged on the lifting rod (20) of the lifting motor (19).

4. The device for leveling the surface of the beryllium copper material according to claim 1, wherein: cleaning device (12) include rotating electrical machines (22), rotating electrical machines (22) symmetry sets up in mounting panel (11) both sides, be provided with cleaning brush (24) on rotating shaft (23) of rotating electrical machines (22).

5. The device for leveling the surface of the beryllium copper material according to claim 1, wherein: the flattening device (13) comprises a fixing plate (25), the fixing plate (25) is arranged on the mounting plate (11), a flattening knife (27) is arranged on the fixing plate (25) through a telescopic rod (26), and a spring (21) is sleeved on the telescopic rod (26).