CN218099476U

CN218099476U - Manual wafer chip testing device

Info

Publication number: CN218099476U
Application number: CN202221884494.0U
Authority: CN
Inventors: 不公告发明人
Original assignee: Suzhou Huiken Electronic Technology Co ltd
Current assignee: Suzhou Huiken Electronic Technology Co ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2022-12-20
Anticipated expiration: 2032-07-20

Abstract

The utility model discloses a manual wafer chip testing arrangement, which comprises a worktable, the top of board is equipped with down the coupling plate, the top of lower coupling plate is rotated and is connected with the circular shape change, the top of change is equipped with a plurality of align to grid's second fixed block, the side that is close to the change axis of a plurality of second fixed blocks all is equipped with a second roller bearing, the side of keeping away from its axis of change is equipped with the handle, the test head sets up in the top of change, the below of test head is equipped with circular shape probe tower, the side of keeping away from its axis of probe tower is equipped with a plurality of chute pieces of cooperation second roller bearing, the upper surface of chute piece is equipped with the inclined plane of tilting from top to bottom, inclined plane roll connection on second roller bearing and the chute piece. The beneficial effects of the utility model are that: the height of the test head and the height of the probe tower are adjusted through adjusting the height of the chute piece, so that the height required by the test of the wafer chip is achieved; the testing device is ingenious in design and suitable for manual testing of a small number of wafer chips.

Description

Manual wafer chip testing device

Technical Field

The utility model relates to a wafer chip tests technical field, specifically is a manual wafer chip testing arrangement.

Background

The wafer is the most basic semiconductor material for manufacturing the IC, and the quality of the wafer directly determines the quality of the finished IC. Due to different process levels, wafers may generate three defects, namely redundancy, crystal defects and mechanical damage at the production stage. Therefore, the efficient and accurate detection equipment can provide guarantee for high-reliability wafer materials. With the rapid improvement of the chip manufacturing technology, the challenges of wafer inspection are increasing, and the cost proportion of the test is also obviously increased. The wafer test is to perform a probe test on each die on the chip, and a probe (probe) made of gold wire into fine hair is mounted on the test head to contact with a contact (pad) on the die to test the electrical characteristics of the die, so that the unqualified die is marked with a mark, and then when the chip is cut into independent dies according to the unit of the die, the unqualified die marked with the mark is eliminated, and the next process is not performed, so as to avoid waste. The wafer chip is placed between the testing head and the machine table when the wafer chip is required to be tested, and the testing communication of the wafer chip is realized by adjusting the height of the testing head. The existing wafer chip test mostly adopts automatic detection, and is suitable for simultaneous detection of large batch of wafer chips. However, the automatic wafer chip detection equipment has high starting requirements, is very high in cost for starting each time, is not suitable for testing a small number of wafer chips, and is complex in structure and high in operation difficulty.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a manual wafer chip testing arrangement to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a manual wafer chip testing arrangement, includes the board, the top of board is equipped with down the coupling plate, the top of coupling plate is rotated down and is connected with the circular shape change, the top of change is equipped with a plurality of align to grid's second fixed block, and is a plurality of the side that is close to the change axis of second fixed block all is equipped with a second roller bearing, the side of keeping away from its axis of change is equipped with the handle, the test head sets up in the top of change, the below of test head is equipped with circular shape probe tower, the side of keeping away from its axis of probe tower is equipped with a plurality of chute pieces of cooperation second roller bearing, the quantity of chute piece is the same with second roller bearing's quantity, the upper surface of chute piece is equipped with the inclined plane of slope from top to bottom, inclined plane roll connection on second roller bearing and the chute piece.

Preferably, a plurality of first fixing blocks which are arranged in a circular mode are arranged above the lower coupling plate, and a first roller bearing is arranged on the outer side, opposite to the first fixing blocks, of each first roller bearing.

Preferably, the swivel is clamped between the plurality of first roller bearings and the lower coupling plate and is in rolling connection with the first roller bearings.

Further preferably, the side of probe tower is equipped with a plurality of third fixed blocks, the chute piece is installed in the downside of third fixed block and with the spiro union of third fixed block.

Preferably, the lower coupling plate is a circular plate-shaped structure with a circular through hole in the middle, and a circular embedded ring is connected below the lower coupling plate.

Further preferably, the side of the embedding ring is provided with at least one straight edge, the machine table is provided with a test table matched with the embedding ring, and the lower coupling plate is in threaded connection with the test table.

Further preferably, a limit pin is arranged above the lower coupling plate.

Has the advantages that: the utility model discloses a manual wafer chip testing arrangement can drive the change ring through the handle and rotate along second roller bearing, makes second roller bearing roll along the inclined plane on the chute piece, makes the height of chute piece change, realizes the lift adjustment of chute piece, further realizes driving the probe tower lift of test head and lower extreme, realizes the manual adjustment of the height of test head and probe tower, reaches the wafer chip and tests required height; the testing device is ingenious in design, simple to operate, suitable for manual testing of a small number of wafer chips, low in operation requirement and low in cost consumption.

Drawings

Fig. 1 is a schematic view of a test state decomposition structure of a manual wafer chip testing device according to an embodiment of the present invention;

fig. 2 is an enlarged schematic structural view of a position a in fig. 1 according to an embodiment of the present invention;

fig. 3 is an exploded view of the swivel, the lower coupling plate and the machine platform according to the embodiment of the present invention;

fig. 4 is an exploded view of the swivel and lower coupling plate according to the embodiment of the present invention;

fig. 5 is a schematic view of an assembly axis measuring structure of the swivel and the lower coupling plate according to the embodiment of the present invention;

fig. 6 is an enlarged schematic structural view of the position B in fig. 5 according to an embodiment of the present invention;

fig. 7 is a schematic top view of the swivel and bottom coupling plate assembly according to an embodiment of the present invention;

fig. 8 is a schematic axial view of a test head according to an embodiment of the present invention;

fig. 9 is a schematic view of an axial measurement structure of the chute piece disclosed in the embodiment of the present invention.

Reference numerals are as follows: 1-machine table, 2-lower coupling plate, 3-first fixing block, 4-first roller bearing, 5-rotating ring, 6-second fixing block, 7-second roller bearing, 8-handle, 9-testing head, 10-probe tower, 11-inclined groove sheet, 12-inclined plane, 13-third fixing block, 14-testing table, 15-embedded ring, 16-limit pin and 17-wafer chip.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-9, a manual wafer chip testing device includes a machine table 1, a lower coupling plate 2 is disposed above the machine table 1 for placing a wafer chip 17 to test the wafer chip 17; the top of lower coupling plate 2 is rotated and is connected with circular shape change ring 5, the top of change ring 5 is equipped with a plurality of align to grid's second fixed block 6, the side that is close to change ring 5 axis of a plurality of second fixed blocks 6 all is equipped with a second roller bearing 7, the side of keeping away from its axis of change ring 5 is equipped with handle 8, test head 9 sets up in the top of change ring 5, the below of test head 9 is equipped with circular shape probe tower 10, the side of keeping away from its axis of probe tower 10 is equipped with a plurality of chute pieces 11 of cooperation second roller bearing 7. Wherein, the rotating ring 5 can rotate on the lower coupling plate 2 through the driving of a handle 8, and drives a second roller bearing 7 arranged on the rotating ring to rotate; the second roller bearing 7 is in rolling connection with a chute sheet 11 on the side of the probe tower 10, an inclined surface 12 which is inclined up and down is arranged on the upper surface of the chute sheet 11, the second roller bearing 7 is arranged above the inclined surface 12 on the chute sheet 11 in a rolling manner, and the test head 9 is connected with a fixing mechanism and generates an upward force on the test head 9 all the time, so that the second roller bearing 7 is always abutted against the inclined surface 12 of the chute sheet 11, when the rotating ring 5 rotates, the second roller bearing 7 is driven to roll on the inclined surface 12, the inclined surface 12 is always abutted against the second roller bearing 7, the relative height of the chute sheet 11 is changed, the chute sheet 11 is driven to ascend and descend, the height of the test head 9 is adjusted, and the height required by testing is achieved. The testing device has the advantages of ingenious structural design, easiness in operation, convenience in manual testing of the wafer chips 17, suitability for testing of a small number of wafer chips 17, low operation requirement and low testing cost.

In this application, the quantity of chute piece 11 is the same with second roller bearing 7's quantity, and the quantity of chute piece 11 and second roller bearing 7 is four, and every chute piece 11 all corresponds a second roller bearing 7, guarantees that the lift of chute piece 11 is steady, guarantees that the lift of test head 9 is stable, improves wafer chip 17's test accuracy.

In this application, 2 tops of lower coupling plate are equipped with a plurality of first fixed blocks 3 that are circular arrangement, and the relative outside of a plurality of first fixed blocks 3 all is equipped with a first roller bearing 4, and first fixed block 3 is used for the installation of first roller bearing 4, and first roller bearing 4 is used for the card of change 5 to establish, locates change 5 card under on the coupling plate 2, makes change 5 only can rotate, can not remove. Meanwhile, in the present application, the first roller bearing 4 may also be disposed on the opposite inner side of the first fixing block 3, and the rotating ring 5 is clamped on the inner side of the first fixing block 3.

In this application, the side of probe tower 10 is equipped with a plurality of third fixed blocks 13 for chute piece 11's installation, chute piece 11 is installed in the downside of third fixed block 13, and on being fixed in chute piece 11 in third fixed block 13 through the screw, make things convenient for chute piece 11's dismouting and change.

In the application, the lower coupling plate 2 is of a circular plate-shaped structure with a circular through hole in the middle, so that the wafer chip 17 can be conveniently connected with the machine table 1 and the probe tower 10 on the test head 9, and the communication and the test of the wafer chip 17 are realized; a circular embedded ring 15 is connected below the lower coupling plate 2, so that the lower coupling plate 2 can be conveniently installed; the side edge of the embedding ring 15 is provided with at least one straight edge for positioning the embedding ring 15 on the machine table 1, so that the accurate installation of the embedding ring 15 is ensured; be equipped with the testboard 14 of cooperation inlay ring 15 on the board 1, lower coupling plate 2 and testboard 14 spiro union, testboard 14 is used for the installation of lower coupling plate 2 on board 1, and inlay ring 15 can improve the installation firmness of lower coupling plate 2, guarantees that lower coupling plate 2 is fixed firm.

In this application, the top of lower coupling plate 2 is equipped with spacer pin 16, and it is connected with probe tower 10, realizes the location of probe tower 10 position of relative lower coupling plate 2, can restrict probe tower 10 simultaneously and take place to rotate, and then prevents that the test that rotation leads to is taken place to the atress when the height-adjusting from testing head 9 inaccurate.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.

Claims

1. The utility model provides a manual wafer chip testing arrangement, includes board (1) and test head (9), its characterized in that: the top of board (1) is equipped with down coupling plate (2), the top of lower coupling plate (2) is rotated and is connected with circular shape change (5), the top of change (5) is equipped with a plurality of align to grid's second fixed block (6), and is a plurality of the side that is close to change (5) axis of second fixed block (6) all is equipped with a second roller bearing (7), the side of keeping away from its axis of change (5) is equipped with handle (8), test head (9) set up in the top of change (5), the below of test head (9) is equipped with circular shape probe tower (10), the side of keeping away from its axis of probe tower (10) is equipped with a plurality of chute pieces (11) of cooperation second roller bearing (7), the quantity of chute piece (11) is the same with the quantity of second roller bearing (7), the upper surface of chute piece (11) is equipped with inclined plane (12) of tilting from top to bottom, second roller bearing (7) roll with inclined plane (12) on chute piece (11) and are connected.

2. The manual wafer chip testing device of claim 1, wherein: a plurality of first fixed blocks (3) which are circularly arranged are arranged above the lower coupling plate (2), and a plurality of first roller bearings (4) are arranged on the opposite outer sides of the first fixed blocks (3).

3. The manual wafer chip testing device of claim 2, wherein: the rotating ring (5) is clamped between the first roller bearings (4) and the lower coupling plate (2) and is in rolling connection with the first roller bearings (4).

4. The manual wafer chip testing device of claim 1, wherein: the side of probe tower (10) is equipped with a plurality of third fixed blocks (13), install in the downside of third fixed block (13) and with third fixed block (13) spiro union chute piece (11).

5. The manual wafer chip testing device of claim 4, wherein: the lower coupling plate (2) is of a circular plate-shaped structure with a circular through hole in the middle, and a circular embedded ring (15) is connected below the lower coupling plate (2).

6. The manual wafer chip testing device of claim 5, wherein: the side of the embedding ring (15) is provided with at least one straight edge, the machine table (1) is provided with a test table (14) matched with the embedding ring (15), and the lower coupling plate (2) is in threaded connection with the test table (14).

7. The manual wafer chip testing device of claim 1, wherein: and a limiting pin (16) is arranged above the lower coupling plate (2).