CN114112143B - Instrument for measuring elastic value of junction box thimble in photovoltaic module - Google Patents
Instrument for measuring elastic value of junction box thimble in photovoltaic module Download PDFInfo
- Publication number
- CN114112143B CN114112143B CN202111041545.3A CN202111041545A CN114112143B CN 114112143 B CN114112143 B CN 114112143B CN 202111041545 A CN202111041545 A CN 202111041545A CN 114112143 B CN114112143 B CN 114112143B
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- CN
- China
- Prior art keywords
- thimble
- junction box
- fixed
- photovoltaic module
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 abstract description 6
- 238000010248 power generation Methods 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0028—Force sensors associated with force applying means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to the technical field of photovoltaic power generation and discloses an instrument for measuring the elastic value of a junction box thimble in a photovoltaic module. The thickness of the spacer with the holes is made to be consistent with the thickness of the chip, so that the spacer with the holes can be used for measuring the elastic force of the position required by the thimble of the junction box, and the measuring result is more accurate and efficient. The elastic force values of different positions of the ejector pin can be measured by changing the thickness of the gasket with the holes.
Description
Technical Field
The invention relates to the technical field of photovoltaic power generation, in particular to an instrument for measuring the elastic value of a junction box thimble in a photovoltaic module.
Background
The CIGS photovoltaic module consists of a chip, cover glass, a laminated adhesive film, a junction box and a back guide rail. After the chip is perforated by laser, the thimble of the junction box is arranged at the perforated position, so that the thimble is connected with the outgoing line in the chip, and the thimble and the chip are bonded together by the box body adhesive. The junction box is a very important component because the junction box has the main functions of connecting and protecting the solar photovoltaic module and conducting the current generated by the photovoltaic module, and whether the junction box is qualified directly influences whether the module is qualified after installation. The ejector pin elasticity is too big, too little, and the elasticity is unstable can both directly influence the connection with the lead-out wire in the chip to influence the ejector pin and normally be connected with the lead-out wire in the chip, lead to unable current drainage that produces the chip to come out, switch on with outside cable.
At present, the CIGS photovoltaic industry measures the elasticity of the thimble of the junction box, and the elasticity of the thimble is measured after the junction box is installed on a chip, so that the actual elasticity value is obtained. However, after the chip is mounted, the thimble is blocked by the cover plate, so that the measurement cannot be operated. The manufacturer producing the junction box can only measure the elastic force value of the whole length of the thimble, can not measure the elastic force of the length of the thimble actually needed, and the measured elastic force value of the thimble is obtained by pressing the thimble by using a push-pull force machine, and the read pressure value is taken as the elastic force value. According to the operation measurement method, errors are caused in measurement results due to different operation methods of operators, and the main problem is that the actual needed elastic force value of the thimble still cannot be measured, whether the elastic force of the thimble of the junction box is qualified or not still cannot be accurately judged, so that hidden quality hazards exist in products.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide an instrument for measuring the elastic value of the thimble of the junction box in a photovoltaic module, wherein a pressure testing device is arranged on a push-pull machine, the junction box to be tested is arranged on a box body die, the thickness of a gasket with holes is made to be equal to that of a chip, and the holes of the gasket with holes are sleeved on the thimble of the junction box to be tested during measurement, so that when the push-pull machine drives the pressure testing device to contact with the thimble and press the thimble to the position of the gasket with holes, the reading of the pressure testing device is the actual elastic value of the thimble of the junction box to be tested, and the instrument has high accuracy and strong practicability.
The technical scheme adopted by the invention is as follows: an instrument for measuring the elasticity value of a junction box thimble in a photovoltaic module comprises a base, a fixed bracket, a push-pull machine, a pressure testing device, a box body die and a gasket with holes, wherein the bottom of the fixed bracket is fixed on the base;
the push-pull machine consists of a main body frame, a main shaft seat, a handle, a worm gear, a screw rod and a sliding block, wherein the main body frame is fixed on the side surface of a fixed support, the main shaft seat is respectively arranged in the middle of the top and the bottom of the main body frame, two ends of the screw rod are fixed on the main body frame through the main shaft seat, the sliding block is arranged on the screw rod, the lower end of the screw rod is connected with the worm gear, and the worm gear is connected with the handle;
the pressure testing device comprises a pressure tester and a pressure sensor, the pressure sensor is arranged at the lower part of the pressure tester, the pressure tester is arranged on a fixed baffle, and the fixed baffle is connected with the sliding block through a fixed block;
the box body die is fixed on the base, the upper surface of the box body die is provided with a containing cavity for placing the junction box, and the containing cavity is positioned right below the pressure sensor;
the thickness of the gasket with holes is equal to that of the chip, and the gasket with holes is provided with through holes for the ejector pins of the junction box to be tested to pass through.
During testing, the junction box to be tested is arranged on the box body grinding tool, the through hole of the perforated gasket with the same thickness as the chip is sleeved on the junction box thimble, the push-pull machine is driven by the starting handle to move downwards, when the pressure sensor downwards presses the junction box thimble to the position of the perforated gasket, the push-pull machine is stopped, and at the moment, the reading on the pressure tester is the actual elastic value required by the junction box thimble.
Compared with the prior art, the invention has the advantages that: the thickness of the gasket with the holes is made to be consistent with the thickness of the chip, so that the gasket with the holes can be used for measuring the elastic force of the thimble of the junction box at the required position, and the measuring result is more accurate and efficient. The elastic force values of different positions of the ejector pin can be measured by changing the thickness of the gasket with the holes.
The handle be hand formula handle, through hand formula handle control pressure testing arrangement's the speed of moving down and distance, it is more convenient, moreover more accurate than the result that direct movement pressure testing arrangement measured.
Four corners of the base are respectively provided with a leveling foot margin, so that the levelness of the instrument can be adjusted, and the requirements of various use environments are met.
Drawings
FIG. 1 is a schematic structural view of an instrument for measuring the spring force of a junction box thimble in a photovoltaic module according to the present invention.
Fig. 2 is a top view of the box abrasive article.
Fig. 3 is a schematic diagram of the installation state of the junction box to be tested.
Detailed Description
The invention is further described below with reference to the drawings and examples.
An instrument for measuring the elasticity value of a junction box thimble in a photovoltaic module, as shown in fig. 1-3, comprises a base 10, a fixed bracket 20, a push-pull machine, a pressure testing device, a box body die 50 and a gasket 60 with holes, wherein the bottom of the fixed bracket 20 is fixed on the base 10, and four leveling feet 11 are arranged at the bottom of the base 10;
the push-pull machine consists of a main body frame 31, a main shaft seat 32, a hand-operated handle 33, a worm gear 34, a screw rod 35 and a sliding block 36, wherein the main body frame 31 is fixed on the side surface of the fixed support 20, the main shaft seat 32 is respectively arranged at the middle positions of the top and the bottom of the main body frame 31, the two ends of the screw rod 35 are fixed on the main body frame 31 through the main shaft seat 32, the sliding block 36 is arranged on the screw rod 35, the lower end of the screw rod 35 is connected with the worm gear 34, and the worm gear 34 is connected with the hand-operated handle 33;
the pressure testing device comprises a pressure tester 41 and a pressure sensor 42, wherein the pressure sensor 42 is arranged at the lower part of the pressure tester 41, the pressure tester 41 is arranged on a fixed baffle plate 43, and the fixed baffle plate 43 is connected with the sliding block 36 through a fixed block 44;
the box body die 50 is fixed on the base 10, the upper surface of the box body die 50 is provided with a containing cavity 51 for placing a junction box, and the containing cavity 51 is positioned under the pressure sensor 42;
the perforated spacer 60 is movably disposed above the box body mold 50, the thickness of the perforated spacer 60 is equal to the thickness of the chip, and the perforated spacer 60 is provided with a through hole 61 for the thimble of the junction box to be tested to pass through.
During measurement, the junction box body M to be measured is arranged on the box body grinding tool 50, and the spacer 60 with the holes is sleeved on the thimble of the junction box. The hand-operated handle 33 is operated, the worm gear 34 drives the screw rod 35 to rotate, the sliding block 36 on the screw rod 35 drives the pressure testing device to move downwards, the pressure sensor 42 presses the thimble on the box body M downwards, when the thimble is pressed to the position of the gasket 60 with the hole, the hand-operated handle 33 is stopped, and the reading on the pressure tester 41 is the elastic force value required by the thimble of the box body.
Specific measurement examples:
the junction box to be tested is arranged on a box body grinding tool, a 2.1 mm-thick perforated gasket 60 is sleeved on a thimble of the junction box body, a manual crank handle enables the pressure sensor to move downwards, when the pressure sensor downwards presses the thimble of the junction box to the position of the perforated gasket, the crank handle is stopped, and at the moment, the reading on the pressure sensor is measured to be the elastic value required by the thimble. Each junction box positive and negative electrode is tested for 3 times, and the measured data are respectively: positive electrodes 5.34N, 5.36N, 5.34N, negative electrodes 5.39N, 5.41N, 5.42N, and the average value thereof is: the results of three tests are almost consistent, namely 5.35N for positive electrode and 5.41N for negative electrode, which shows that the instrument can accurately measure the elastic force value required by the thimble of the junction box.
The foregoing is only the best mode of carrying out the invention. It should be noted that, for those skilled in the art, several modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the principles of the present invention, and the technical effects of the present invention can be achieved, and the present invention shall also be considered as falling within the protection scope of the present invention.
Claims (3)
1. An instrument for measuring the elasticity value of a junction box thimble in a photovoltaic module comprises a base, a fixed bracket, a push-pull machine, a pressure testing device and a box body die, wherein the bottom of the fixed bracket is fixed on the base;
the push-pull machine consists of a main body frame, a main shaft seat, a handle, a worm gear, a screw rod and a sliding block, wherein the main body frame is fixed on the side surface of a fixed support, the main shaft seat is respectively arranged in the middle of the top and the bottom of the main body frame, two ends of the screw rod are fixed on the main body frame through the main shaft seat, the sliding block is arranged on the screw rod, the lower end of the screw rod is connected with the worm gear, and the worm gear is connected with the handle;
the pressure testing device comprises a pressure tester and a pressure sensor, the pressure sensor is arranged at the lower part of the pressure tester, the pressure tester is arranged on a fixed baffle, and the fixed baffle is connected with the sliding block through a fixed block;
the box body die is fixed on the base, the upper surface of the box body die is provided with a containing cavity for placing the junction box, and the containing cavity is positioned right below the pressure sensor;
the method is characterized in that: the box body die is characterized by further comprising a perforated gasket arranged above the box body die, wherein the thickness of the perforated gasket is equal to that of the chip, and a through hole for a thimble of the junction box to be tested to pass through is formed in the perforated gasket.
2. The apparatus for measuring the spring force of a terminal block thimble in a photovoltaic module according to claim 1, wherein: the handle is a hand handle.
3. The instrument for measuring the spring force of a junction box thimble in a photovoltaic module according to claim 1 or 2, wherein: four corners of the base are respectively provided with a leveling foot margin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041545.3A CN114112143B (en) | 2021-09-07 | 2021-09-07 | Instrument for measuring elastic value of junction box thimble in photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041545.3A CN114112143B (en) | 2021-09-07 | 2021-09-07 | Instrument for measuring elastic value of junction box thimble in photovoltaic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114112143A CN114112143A (en) | 2022-03-01 |
| CN114112143B true CN114112143B (en) | 2024-02-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111041545.3A Active CN114112143B (en) | 2021-09-07 | 2021-09-07 | Instrument for measuring elastic value of junction box thimble in photovoltaic module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114112143B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332395A (en) * | 2002-05-10 | 2003-11-21 | Shibasoku:Kk | Test equipment |
| CN108253879A (en) * | 2018-01-31 | 2018-07-06 | 广东欧珀移动通信有限公司 | The detection device and detection method of function test fixture thimble |
| CN108761308A (en) * | 2018-05-22 | 2018-11-06 | 湖州靖源信息技术有限公司 | A kind of mechanical chip automatic testing equipment |
| CN109725180A (en) * | 2017-10-27 | 2019-05-07 | 和硕联合科技股份有限公司 | Jig platform |
| CN209802616U (en) * | 2019-04-18 | 2019-12-17 | 珠海市运泰利自动化设备有限公司 | Elasticity testing structure for multiple groups of probes |
| CN210376594U (en) * | 2019-06-17 | 2020-04-21 | 福建捷宇电脑科技有限公司 | Protection component for testing ejector pin |
| CN111458063A (en) * | 2020-05-14 | 2020-07-28 | 上海博邦汽车技术有限公司 | U-shaped spring clamp elasticity testing system and method |
| CN212965036U (en) * | 2020-06-19 | 2021-04-13 | 深圳市拓普泰克技术股份有限公司 | Testing device for connecting board type circuit board |
| CN213023528U (en) * | 2020-07-21 | 2021-04-20 | 苏州矽利康测试系统有限公司 | Probe card needle point pressure detection equipment |
| WO2021164115A1 (en) * | 2020-02-19 | 2021-08-26 | 深圳市海铭德科技有限公司 | Method for monitoring ejection force of ejector pin during chip film-plating process |
-
2021
- 2021-09-07 CN CN202111041545.3A patent/CN114112143B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332395A (en) * | 2002-05-10 | 2003-11-21 | Shibasoku:Kk | Test equipment |
| CN109725180A (en) * | 2017-10-27 | 2019-05-07 | 和硕联合科技股份有限公司 | Jig platform |
| CN108253879A (en) * | 2018-01-31 | 2018-07-06 | 广东欧珀移动通信有限公司 | The detection device and detection method of function test fixture thimble |
| CN108761308A (en) * | 2018-05-22 | 2018-11-06 | 湖州靖源信息技术有限公司 | A kind of mechanical chip automatic testing equipment |
| CN209802616U (en) * | 2019-04-18 | 2019-12-17 | 珠海市运泰利自动化设备有限公司 | Elasticity testing structure for multiple groups of probes |
| CN210376594U (en) * | 2019-06-17 | 2020-04-21 | 福建捷宇电脑科技有限公司 | Protection component for testing ejector pin |
| WO2021164115A1 (en) * | 2020-02-19 | 2021-08-26 | 深圳市海铭德科技有限公司 | Method for monitoring ejection force of ejector pin during chip film-plating process |
| CN111458063A (en) * | 2020-05-14 | 2020-07-28 | 上海博邦汽车技术有限公司 | U-shaped spring clamp elasticity testing system and method |
| CN212965036U (en) * | 2020-06-19 | 2021-04-13 | 深圳市拓普泰克技术股份有限公司 | Testing device for connecting board type circuit board |
| CN213023528U (en) * | 2020-07-21 | 2021-04-20 | 苏州矽利康测试系统有限公司 | Probe card needle point pressure detection equipment |
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| Publication number | Publication date |
|---|---|
| CN114112143A (en) | 2022-03-01 |
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