CN218445617U - Test tool for wafer chip - Google Patents

Abstract

The utility model discloses a test tool for wafer chips, which comprises a test machine body, wherein an upper coupling plate, a lower coupling plate and a chip holder are sequentially arranged below the test machine body; the upper coupling plate comprises a test head fixing plate, the lower surface of the test head fixing plate is connected with a first sliding block and a second sliding block, the two ends of the first sliding block are respectively provided with a first steering connecting block and a second steering connecting block, the end, close to the second steering connecting block, of the second sliding block is provided with a third steering connecting block, the first sliding block, the second steering connecting block, the third steering connecting block and the second sliding block are sequentially connected, and the opposite outer sides of the first sliding block and the second sliding block are respectively provided with a plurality of inclined grooves; the lower coupling plate comprises a test machine fixing plate, two sliding block adapter plates are arranged on the upper surface of the test machine fixing plate, and a plurality of roller bearings are arranged on the sliding block adapter plates. The utility model has the advantages that: the height of the upper coupling plate is manually adjusted, the height of a testing machine body is adjusted, and the wafer chip is tested.

Description

Test tool for wafer chip

Technical Field

The utility model relates to a wafer chip tests technical field, specifically is a wafer chip is with test fixture.

Background

The wafer is the most basic semiconductor material for making the IC, and the quality of the wafer will directly determine the quality of the finished IC. Due to different process levels, wafers may generate three defects, namely redundancy, crystal defects and mechanical damage at the production stage. Therefore, the efficient and accurate detection equipment can provide guarantee for high-reliability wafer materials. With the rapid improvement of the chip manufacturing technology, the challenges of wafer inspection are increasing, and the cost proportion of the test is also obviously increased. The wafer test is to perform a probe test on each die on the chip, and a probe (probe) made of gold wire into fine hair is mounted on the test head to contact with a contact (pad) on the die to test the electrical characteristics of the die, so that the unqualified die is marked with a mark, and then when the chip is cut into independent dies according to the unit of the die, the unqualified die marked with the mark is eliminated, and the next process is not performed, so as to avoid waste. The wafer chip testing needs to be connected with a testing machine, and the existing wafer chip testing mostly adopts automatic detection, so that the wafer chip testing device is suitable for simultaneously detecting large batches of wafer chips. However, the automatic wafer chip detection equipment has high starting requirements, consumes a large amount of power when being started every time, and is not suitable for testing a small number of wafer chips.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer is test fixture for chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a test tool for a wafer chip comprises a tester body, wherein an upper coupling plate, a lower coupling plate and a chip holder are sequentially arranged below the tester body; the upper coupling plate comprises a test head fixing plate, the lower surface of the test head fixing plate is connected with a first sliding block and a second sliding block which are parallel to each other in a sliding mode, a first steering connecting block and a second steering connecting block are arranged at two ends of the first sliding block respectively, a third steering connecting block is arranged at the end, close to the second steering connecting block, of the second sliding block, the first steering connecting block, the first sliding block, the second steering connecting block, the third steering connecting block and the second sliding block are connected in sequence, and a plurality of inclined grooves are formed in the opposite outer sides of the first sliding block and the second sliding block; the lower coupling plate comprises a tester fixing plate, the upper surface of the tester fixing plate is provided with two slide block adapter plates which respectively correspond to the first slide block and the second slide block, and the slide block adapter plates are provided with a plurality of roller bearings.

Preferably, the test head fixing plate and the test machine fixing plate are polygonal plates with holes in the middle, and the chip base is arranged in the middle of the lower surface of the test machine fixing plate to achieve communication between the test machine body and the wafer chip.

Preferably, the edge of the lower surface of the test head fixing plate is provided with a plurality of guide pillars, the edge of the upper surface of the test machine fixing plate is provided with a plurality of equal-height blocks matched with the guide pillars, and the equal-height blocks are provided with limiting holes for limiting the guide pillars and used for positioning the test head fixing plate and the test machine fixing plate, so that the limit of the test head fixing plate relative to the lowest position of the test machine fixing plate is realized, and the wafer chip is prevented from being crushed.

Preferably, transmission rods are connected between the first steering connecting block and the first sliding block, between the first sliding block and the second steering connecting block, between the second steering connecting block and the third steering connecting block, and between the third steering connecting block and the second sliding block, so that synchronous reverse movement of the first sliding block and the second sliding block is realized, and synchronous lifting movement of the first sliding block and the second sliding block is realized; all be equipped with adjustment handle on first turning to the connecting block and the third turning to the connecting block, be convenient for drive three rotation that turn to the connecting block, realize the horizontal migration of first slider of drive and second slider.

Further preferably, the first slider and the second slider are respectively arranged on two sides of the middle opening of the test head fixing plate, and linear guide rails are arranged between the first slider, the second slider and the test head fixing plate, so that the first slider and the second slider are guaranteed to move smoothly and ascend and descend stably, and the tester body is guaranteed to ascend and descend stably.

Further preferably, the two slider adapter plates are respectively arranged on the outer sides of the first slider and the second slider in a covering mode, and the plurality of roller bearings on the slider adapter plates are respectively in one-to-one rolling connection with the plurality of inclined grooves on the first slider and the second slider, so that the first slider and the second slider can stably ascend and descend.

Preferably, the lower surface of the tester body is provided with a probe guide plate corresponding to the chip holder, and the probe guide plate is used for communicating the tester body with the wafer chip to realize the test of the wafer chip.

Has the beneficial effects that: the utility model discloses a test fixture for wafer chip, through the cooperation of adjustment handle, first turn to the connecting block, the second turns to the connecting block, the third turns to the connecting block, first slider, the second slider, transfer line and roller bearing, can realize that the chute on first slider and the second slider takes place relative movement under roller bearing's support, realize the synchronous lift of first slider and second slider, drive the lift of test head fixed plate relative fixed plate, namely realize the manual regulation of the height of upper coupling plate relative lower coupling plate, and then realize the regulation of the height of test machine fuselage, realize the intercommunication test of wafer chip; the test tool is ingenious in design, simple to operate, suitable for manual test of a small number of wafer chips, low in operation requirement and low in energy consumption.

Drawings

Fig. 1 is a schematic view of a test state decomposition structure of a test tool for a wafer chip according to an embodiment of the present invention;

fig. 2 is a schematic view illustrating another exploded view of a test fixture for wafer chips according to an embodiment of the present invention;

fig. 3 is a schematic axial view of a test tool for wafer chips according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a testing machine body disclosed in the embodiment of the present invention;

fig. 5 is a schematic structural view of an upper coupling plate disclosed in an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a lower coupling plate according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a first slider according to an embodiment of the present invention.

Reference numerals: 1-tester body, 11-probe guide plate, 2-upper coupling plate, 21-test head fixing plate, 22-first sliding block, 23-second sliding block, 24-first steering connecting block, 25-second steering connecting block, 26-third steering connecting block, 27-transmission rod, 28-adjusting handle, 29-guide column, 3-lower coupling plate, 31-tester fixing plate, 32-sliding block adapter plate, 33-roller bearing, 34-equal-height block, 341-limit hole and 4-chip seat.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-7, a test tool for wafer chips comprises a tester body 1, an upper coupling plate 2, a lower coupling plate 3 and a chip holder 4 are sequentially arranged below the tester body 1, the lower coupling plate 3 is mounted on a test base (the test base is a jig for testing the wafer chips), the upper coupling plate 2 is connected with the lower coupling plate 3, the upper coupling plate 2 can perform height adjustment relative to the lower coupling plate 3, the tester body 1 is mounted above the upper coupling plate 2, the wafer chips to be tested are placed between the tester body 1 and the chip holder 4, the height adjustment of the tester body 1 is realized by adjusting the upper coupling plate 2, the height required by testing is reached, and the testing of the wafer chips is realized. The lower surface of the tester body 1 is provided with a probe guide plate 11 corresponding to the chip holder 4, a test probe is arranged in the probe guide plate 11, and a wafer chip to be tested is placed between the probe guide plate 11 and the chip holder 4 to realize test communication of the wafer chip.

In this application, go up coupling plate 2 and contain test head fixed plate 21, the upper surface of test head fixed plate 21 is connected with test machine fuselage 1, the lower surface sliding connection of test head fixed plate 21 has first slider 22 and second slider 23 that are parallel to each other, first slider 22's both ends are equipped with first turning connecting block 24 respectively and the second turns to connecting block 25, the second slider 23 be close to the second and turn to connecting block 25 end and be equipped with third turning connecting block 26, first turning connecting block 24, first slider 22, the second turns to connecting block 25, third turning connecting block 26 and second slider 23 connect gradually, relative outside on first slider 22 and the second slider 23 all is equipped with a plurality of chutes. The structure of the first slider 22 is the same as that of the second slider 23, transmission rods 27 are connected between the first steering connecting block 24 and the first slider 22, the first slider 22 and the second steering connecting block 25, the second steering connecting block 25 and the third steering connecting block 26, and the third steering connecting block 26 and the second slider 23, adjusting handles 28 are arranged on the first steering connecting block 24 and the third steering connecting block 26, and the opening and closing adjusting handles 28 can drive the first steering connecting block 24 and the third steering connecting block 26 to rotate; the first turning connecting block 24 can be driven to rotate by opening the adjusting handle 28 connected with the first turning connecting block 24, the first slider 22 is driven to move towards the first turning connecting block 24 through the first turning connecting block 24 by the transmission rod 27, the first slider 22 drives the second turning connecting block 25 to rotate through the transmission rod 27, then the second turning connecting block 25 drives the third turning connecting block 26 to rotate through the transmission rod 27, finally the third turning connecting block 26 drives the second slider 22 to move towards the third turning connecting block 26 through the transmission rod 27, and finally the first slider 22 and the second slider 23 move towards opposite directions, so that the inclined grooves on the first slider 22 and the second slider 23 move relatively under the support of the roller bearing 33 on the slider adapter plate 32, the synchronous rising or synchronous falling of the first slider 22 and the second slider 23 is realized, the lifting adjustment of the test head fixing plate 21 is further realized, the lifting adjustment of the upper coupling plate 2 is realized, the height adjustment of the testing machine body 1 is realized, and the height required by the test of the wafer chip is reached.

In this application, the lower coupling plate 3 includes the test machine fixing plate 31, and the upper surface of test machine fixing plate 31 is equipped with two slider keysets 32 that correspond first slider 22 and second slider 23 respectively, is equipped with a plurality of roller bearing 33 on the slider keysets 32. The lower surface of the test machine fixing plate 31 is mounted on the test base, and the upper coupling plate 2 and the test machine body 1 are integrally connected on the test base through the test machine fixing plate 31; the two slide block adapter plates 32 are respectively arranged on the opposite outer sides of the first slide block 22 and the second slide block 23 in a covering mode, a plurality of roller bearings 33 on the slide block adapter plates 32 are respectively in one-to-one rolling connection with a plurality of inclined grooves on the first slide block 22 and the second slide block 23, the slide block adapter plates 32 and the roller bearings 33 arranged on the slide block adapter plates 32 are used for being connected with the first slide block 22 and the second slide block 23, the roller bearings 33 can roll in the inclined grooves of the first slide block 22 and the second slide block 23, the height of the first slide block 22 and the height of the second slide block 23 relative to the slide block adapter plates 32 are adjusted, and the first slide block 22 and the second slide block 23 are stable in lifting. The chute on first slider 22 and the second slider 23 in this application all is equipped with threely, and roller bearing 33 on two slider keysets 32 also respectively has threely, guarantees that the removal of first slider 22 and second slider 23 is smooth and easy, and it is stable to go up and down.

In this application, test head fixed plate 21 and test machine fixed plate 31 are the polygonal plate of middle trompil, and chip holder 4 sets up in the middle of the lower surface of test machine fixed plate 31. Through the middle opening of the test head fixing plate 21 and the test machine fixing plate 31, the wafer chip can be conveniently placed, so that the probe in the probe guide plate 11 on the test machine body 1 can be communicated with the wafer chip placed in the chip holder 4, and the test of the wafer chip is realized.

In the application, the lower surface edge of the test head fixing plate 21 is provided with a plurality of guide posts 29, the upper surface edge of the test machine fixing plate 31 is provided with a plurality of equal-height blocks 34 matched with the guide posts 29, and the equal-height blocks 34 are provided with limit holes 341 used for limiting the guide posts 29. The positions of the test head fixing plate 21 and the test machine fixing plate 31 are positioned by the guide posts 29 and the equal-height blocks 34, so that the test head fixing plate 21 is prevented from moving relative to the position of the test machine fixing plate 31 in the height adjusting process; meanwhile, the equal-height blocks 34 can limit the descending distance of the test head fixing plate 21, limit the lowest position of the test head fixing plate 21 relative to the test machine fixing plate 31, and prevent the test machine body 1 from crushing the wafer chip.

In the application, the first slider 22 and the second slider 23 are respectively arranged on two sides of the middle opening of the test head fixing plate 21, so that the test head fixing plate 21 is ensured to stably lift relative to the test machine fixing plate 31, and the lifting adjustment of the upper coupling plate 2 is facilitated; all be equipped with linear guide between first slider 22, second slider 23 and the test head fixed plate 21, guarantee that first slider 22 and second slider 23 move smoothly on the test head fixed plate 21, and remove along setting for the direction, guarantee to go up the lift stability of coupling plate 2.

In the application, the test tool can realize the manual adjustment of the height of the tester body 1 through the adjusting handle 28, the first steering connecting block 24, the second steering connecting block 25, the third steering connecting block 26, the first sliding block 22, the second sliding block 23 and the roller bearing 33, so that the communication test of the wafer chip is realized. The test tool is ingenious in design and simple to operate.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.

Claims (7)

1. The utility model provides a wafer is test fixture for chip, includes test machine fuselage (1), its characterized in that: an upper coupling plate (2), a lower coupling plate (3) and a chip seat (4) are sequentially arranged below the testing machine body (1); the upper coupling plate (2) comprises a test head fixing plate (21), the lower surface of the test head fixing plate (21) is connected with a first sliding block (22) and a second sliding block (23) which are parallel to each other in a sliding mode, a first steering connecting block (24) and a second steering connecting block (25) are arranged at two ends of the first sliding block (22) respectively, a third steering connecting block (26) is arranged at the end, close to the second steering connecting block (25), of the second sliding block (23), the first steering connecting block (24), the first sliding block (22), the second steering connecting block (25), the third steering connecting block (26) and the second sliding block (23) are connected in sequence, and a plurality of inclined grooves are formed in the opposite outer sides of the first sliding block (22) and the second sliding block (23); the lower coupling plate (3) comprises a test machine fixing plate (31), two slider adapter plates (32) which respectively correspond to the first slider (22) and the second slider (23) are arranged on the upper surface of the test machine fixing plate (31), and a plurality of roller bearings (33) are arranged on the slider adapter plates (32).

2. The test tool for the wafer chip as claimed in claim 1, wherein: the testing head fixing plate (21) and the testing machine fixing plate (31) are both polygonal plates with holes in the middle, and the chip holder (4) is arranged in the middle of the lower surface of the testing machine fixing plate (31).

3. The test tool for the wafer chip as claimed in claim 2, wherein: the testing device is characterized in that a plurality of guide posts (29) are arranged on the edge of the lower surface of the testing head fixing plate (21), a plurality of equal-height blocks (34) matched with the guide posts (29) are arranged on the edge of the upper surface of the testing machine fixing plate (31), and limiting holes (341) used for limiting the guide posts (29) are formed in the equal-height blocks (34).

4. The test tool for the wafer chip as claimed in claim 3, wherein: first turn to connecting block (24) and first slider (22), first slider (22) and second turn to connecting block (25), second turn to connecting block (25) and third turn to connecting block (26), third turn to all be connected with transfer line (27) between connecting block (26) and second slider (23), all be equipped with adjustment handle (28) on first turn to connecting block (24) and the third turn to connecting block (26).

5. The test tool for the wafer chip as claimed in claim 4, wherein: the first slider (22) and the second slider (23) are respectively arranged on two sides of a middle opening of the test head fixing plate (21), and linear guide rails are arranged among the first slider (22), the second slider (23) and the test head fixing plate (21).

6. The test tool for the wafer chip as claimed in claim 5, wherein: the two sliding block adapter plates (32) are respectively covered on the opposite outer sides of the first sliding block (22) and the second sliding block (23), and a plurality of roller bearings (33) on the sliding block adapter plates (32) are respectively in one-to-one rolling connection with a plurality of inclined grooves on the first sliding block (22) and the second sliding block (23).

7. The test tool for the wafer chip as claimed in claim 6, wherein: the lower surface of the tester body (1) is provided with a probe guide plate (11) corresponding to the chip seat (4).

Images