CN212569024U - Wafer probe station - Google Patents
Wafer probe station Download PDFInfo
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- CN212569024U CN212569024U CN202022097382.8U CN202022097382U CN212569024U CN 212569024 U CN212569024 U CN 212569024U CN 202022097382 U CN202022097382 U CN 202022097382U CN 212569024 U CN212569024 U CN 212569024U
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- wafer
- probe card
- bearing table
- slide rail
- probe
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- 239000000523 sample Substances 0.000 title claims abstract description 126
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 238000012360 testing method Methods 0.000 claims abstract description 34
- 238000003384 imaging method Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims description 13
- 230000002250 progressing effect Effects 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 239000004579 marble Substances 0.000 claims description 3
- 230000000750 progressive effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 78
- 239000013078 crystal Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
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Abstract
The utility model discloses a wafer probe station, which comprises a main structure body, wherein the main structure body comprises a test box and a wafer detection device arranged in the test box; the wafer detection device comprises a detection table, a slide rail group is arranged on the detection table, a wafer bearing table is arranged on the slide rail group, a probe card imaging device is arranged on one side of the wafer bearing table, a probe card bearing table is further arranged on the detection table, the probe card bearing table is positioned above the wafer bearing table, and the wafer imaging device is arranged in front of the probe card bearing table; through the combined action of the wafer imaging device, the probe imaging device and the slide rail set, the wafer bearing table and the probe card bearing table can accurately move, so that the probe on the probe card can be aligned and contacted with each wafer, the accurate test of each wafer is realized, and the wafer which meets parameters and the wafer which does not meet the parameters can be distinguished in a refined mode.
Description
Technical Field
The utility model relates to a silicon wafer test technical field specifically is a wafer probe station.
Background
Wafer testing is an important component in the chip manufacturing industry, and is one of the main statistical methods for chip yield. The probe station is mainly applied to the quality test of semiconductor industry, photoelectric industry, integrated circuits and components. With the development of science and technology, the size of components is smaller and smaller, and a plurality of components are generally integrated on a wafer to form a to-be-detected piece, so that the follow-up detection is facilitated. The detection method is generally as follows: and conducting the positive electrode and the negative electrode of the component to be detected by using the electrified probe, and judging whether the detected component is qualified or not according to the working condition of the component.
The probe card on the existing wafer probe station in the market can not automatically move to realize accurate positioning, so that the probe on the probe card can not accurately contact with a welding pad on each crystal grain for testing, qualified crystal grains and unqualified crystal grains can not be accurately distinguished, and the crystal grains are not convenient to package subsequently.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a wafer probe station for solving the above problems.
The utility model realizes the above purpose by the following technical proposal, a wafer probe station comprises a structure main body, wherein the structure main body comprises a test box and a wafer detection device arranged in the test box;
the wafer detection device comprises a detection table, a slide rail group is arranged on the detection table, a wafer bearing table is arranged on the slide rail group, a probe card imaging device is arranged on one side of the wafer bearing table, a probe card bearing table is further arranged on the detection table, the probe card bearing table is positioned above the wafer bearing table, and the wafer imaging device is arranged in front of the probe card bearing table;
the slide rail set comprises a Y-axis axial slide rail fixedly arranged on the detection platform, an X-axis axial slide rail vertically connected with the Y-axis axial slide rail is arranged on the Y-axis axial slide rail, a wafer bearing moving seat in sliding connection with the X-axis axial slide rail is arranged on the X-axis axial slide rail, a lifting platform is arranged on the wafer bearing moving seat, and the wafer bearing platform is positioned on the lifting platform;
the wafer bearing table comprises a rotating assembly and a lifting assembly, wherein the rotating assembly is used for realizing rotation and the lifting assembly is used for realizing lifting, the rotating assembly comprises a second closed-loop progressing motor and a second high-precision lead screw, the second closed-loop progressing motor is in driving connection with the second high-precision lead screw, the second high-precision lead screw is tightly connected with the wafer bearing table, the lifting assembly comprises a high-precision spline shaft fixedly connected with the rotating assembly, a Z-axis axial high-precision lead screw is arranged at the center of the bottom of the high-precision spline shaft, and a Z-axis axial closed-loop progressing motor in driving connection with the Z-axis axial high-precision lead screw is arranged at the tail end of the Z-axis axial high;
the probe card bearing table comprises a probe card bearing table support frame, a probe card bearing panel is arranged on the probe card bearing table support frame, a probe card clamping mechanism is arranged at the center of the probe card bearing panel, and a probe card is clamped on the probe card clamping mechanism;
the probe card imaging device comprises a fixed connecting plate, wherein a probe card low-power CCD for searching probe card characteristic points and a high-power CCD for accurately positioning the probe card characteristic points are arranged on the fixed connecting plate;
the wafer imaging device comprises a longitudinal support piece and a beam arranged on the longitudinal support piece, wherein a wafer low-power CCD for searching wafer characteristic points and a wafer high-power CCD for accurately positioning the wafer characteristic points are arranged in the beam, and a high-precision displacement sensor for measuring the thickness of a wafer is arranged on one side of the beam close to the probe card bearing table.
Further, the detection table is fixedly connected with the bottom of the test box, and the detection table is a marble detection table with a rectangular structure.
Furthermore, a Y-axis axial linear driving motor in driving connection with the Y-axis axial slide rail is arranged on the Y-axis axial slide rail, and an X-axis axial linear driving motor in driving connection with the X-axis axial slide rail is arranged on the X-axis axial slide rail.
Furthermore, the probe card bearing table support frame comprises four groups of support legs and two groups of obliquely arranged lifting rods, and the four groups of support legs are provided with lifting adjusting mechanisms for realizing levelness adjustment of the probe card.
Furthermore, a probe card fixing disc with an annular structure is arranged in the center of the probe card bearing panel, a rectangular groove is formed in the center of the probe card fixing disc, and the probe card clamping mechanism is located on two sides of the rectangular groove to realize fixed clamping of the probe card.
Furthermore, a first high-precision screw rod is arranged on the fixed connecting plate, a first closed-loop progressive motor in driving connection with the first high-precision screw rod is arranged at the bottom end of the first high-precision screw rod, and the fixed connecting plate is vertically arranged on one side of the wafer bearing table and is fixedly connected with the wafer bearing movable table through screws.
Furthermore, the longitudinal supporting members comprise two groups, wherein a locking member vertically and fixedly connected with the longitudinal supporting members is arranged on one group of the longitudinal supporting members.
Furthermore, a rectangular mounting cavity is formed in the cross beam, the wafer low-power CCD and the wafer high-power CCD are located in the rectangular mounting cavity, and multiple groups of limiting assemblies for fixedly mounting the wafer low-power CCD and the wafer high-power CCD are arranged in the rectangular mounting cavity.
Furthermore, the longitudinal supporting piece and the supporting frame of the bearing table of the probe card are fixedly connected with the detection table through screws respectively.
Furthermore, an electric cabinet and a control button are arranged on the front plate of the test box, a three-color lamp is arranged at the top of the test box, and trundles are arranged at the bottom of the test box and consist of four groups of ground cup and four groups of pulleys.
The utility model has the advantages that:
(1) the wafer bearing table and the probe card bearing table are accurately moved through the combined action of the wafer imaging device, the probe imaging device and the slide rail group, so that a probe on a probe card can be aligned and contacted with each wafer, the accurate test of each wafer is realized, and the wafer which meets parameters and the wafer which does not meet the parameters can be distinguished in a fine mounting mode;
(2) the thickness of the wafer is measured by the arrangement of the high-precision displacement sensor, so that the probe on the probe card can be accurately contacted with the welding pad on each wafer, each wafer is tested, and the test precision is improved;
(3) the levelness of the probe card is ensured through the lifting adjusting mechanism for adjusting the levelness on the supporting legs, so that the probes on the probe card can be accurately contacted with the welding pads on each wafer, and the test accuracy is improved;
(4) through the arrangement of the slide rail set, the high-precision lead screw and the closed-loop stepping motor, the moving speed and the moving precision of the wafer bearing table are ensured.
Drawings
FIG. 1 is a schematic structural view of a wafer inspection apparatus according to the present invention;
FIG. 2 is a schematic view of the structure of the test box of the present invention;
FIG. 3 is a schematic structural view of a probe card carrier of the present invention;
FIG. 4 is a schematic view of the structure of the middle slide rail set of the present invention;
FIG. 5 is a schematic view of a wafer carrier of the present invention;
fig. 6 is a schematic structural view of a probe card imaging device according to the present invention;
fig. 7 is a schematic structural diagram of a middle wafer imaging device according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 7, a wafer probe station in this embodiment includes a main structure body, which includes a testing box 3 and a wafer detecting device 6 disposed in the testing box 3; the wafer detection device 6 comprises a detection table 12, a slide rail group 11 is arranged on the detection table 12, a wafer bearing table 9 is arranged on the slide rail group 11, a probe card imaging device 10 is arranged on one side of the wafer bearing table 9, a probe card bearing table 7 is further arranged on the detection table 12, the probe card bearing table 7 is positioned above the wafer bearing table 9, and a wafer imaging device 8 is arranged in front of the probe card bearing table 7; the slide rail set 11 comprises a Y-axis axial slide rail 41 fixedly arranged on the detection table 12, an X-axis axial slide rail 41 vertically connected with the Y-axis axial slide rail 42 is arranged on the Y-axis axial slide rail 41, a wafer bearing moving seat 39 slidably connected with the X-axis axial slide rail 41 is arranged on the X-axis axial slide rail 41, a lifting table 38 is arranged on the wafer bearing moving seat 39, and the wafer bearing table 9 is positioned on the lifting table 38; the wafer bearing table 9 comprises a rotating assembly for realizing rotation and a lifting assembly for realizing lifting, wherein the rotating assembly comprises a second closed-loop progressing motor 35 and a second high-precision lead screw 34, the second closed-loop progressing motor 35 is in driving connection with the second high-precision lead screw 34, the second high-precision lead screw 34 is tightly connected with the wafer bearing disc 33, the lifting assembly comprises a high-precision spline shaft 32 fixedly connected with the rotating assembly, a Z-axis axial high-precision lead screw 37 is arranged at the center of the bottom of the high-precision spline shaft 32, and a Z-axis axial closed-loop progressing motor 36 in driving connection with the Z-axis axial high-precision lead screw 37 is arranged at the tail end of the Z-axis axial high-precision lead screw 37; the probe card bearing table 7 comprises a probe card bearing table support frame 13, a probe card bearing panel 15 is arranged on the probe card bearing table support frame 13, a probe card clamping mechanism 18 is arranged at the center of the probe card bearing panel 15, and a probe card 17 is clamped on the probe card clamping mechanism 18; the probe card imaging device 10 comprises a fixed connecting plate 28, wherein a probe card low-power CCD27 for searching probe card characteristic points and a high-power CCD31 for accurately positioning the probe card characteristic points are arranged on the fixed connecting plate 28; the wafer imaging device 8 comprises a longitudinal support member 20 and a beam 22 arranged on the longitudinal support member 20, wherein a wafer low-power CCD26 for finding a wafer characteristic point and a wafer high-power CCD25 for accurately positioning the wafer characteristic point are arranged in the beam 22, and a high-precision displacement sensor 24 for measuring the thickness of a wafer is arranged on one side of the beam 22 close to the probe card bearing table 7.
In this embodiment, the detection table 12 is fixedly connected to the bottom of the test box 3, and the detection table 12 is a marble detection table with a rectangular structure; a Y-axis axial linear driving motor 43 in driving connection with the Y-axis axial slide rail 42 is arranged on the Y-axis axial slide rail 42, and an X-axis axial linear driving motor 40 in driving connection with the X-axis axial slide rail 41 is arranged on the X-axis axial slide rail 41; the probe card bearing table support frame 13 comprises four groups of support legs and two groups of obliquely arranged lifting rods 14, and the four groups of support legs are provided with lifting adjusting mechanisms 16 for realizing levelness adjustment of the probe card 17; the center of the probe card bearing panel 15 is provided with a probe card fixing disc 19 with an annular structure, the center of the probe card fixing disc 19 is provided with a rectangular groove, and the probe card clamping mechanism 18 is positioned on two sides of the rectangular groove to realize the fixed clamping of the probe card 17; a first high-precision screw 29 is arranged on the fixed connecting plate 28, a first closed-loop stepping motor 30 in driving connection with the first high-precision screw 29 is arranged at the bottom end of the first high-precision screw 29, and the fixed connecting plate 28 is vertically arranged on one side of the wafer bearing table 9 and is fixedly connected with the wafer bearing movable table 39 through screws; the longitudinal supporting members 20 comprise two groups, wherein a locking member 21 vertically and fixedly connected with one group of the longitudinal supporting members 20 is arranged on one group of the longitudinal supporting members 20; a rectangular mounting cavity 23 is formed in the beam 22, the wafer low-power CCD26 and the wafer high-power CCD25 are located in the rectangular mounting cavity 23, and a plurality of groups of limiting assemblies for fixedly mounting the wafer low-power CCD26 and the wafer high-power CCD25 are arranged in the rectangular mounting cavity 23; the longitudinal support member 20 and the probe card bearing table support frame 13 are respectively fixedly connected with the detection table 12 through screws; the testing box is characterized in that an electric cabinet 2 and a control button 5 are arranged on a front plate of the testing box 3, a three-color lamp 4 is arranged at the top of the testing box 3, a trundle 1 is arranged at the bottom of the testing box 3, and the trundle 1 is composed of four groups of ground foot cups and four groups of pulleys.
The working principle is as follows: in the embodiment, the wafer probe station mainly comprises a wafer bearing table, a probe card bearing table, a wafer imaging device, a probe imaging device and a slide rail set, wherein manual feeding is carried out on the wafer bearing table, the wafer is adjusted and positioned through the wafer imaging device by axial movement of the slide rail set, then accurate positioning is realized through adjustment of the probe imaging device and a probe on a probe card, then the probe on the probe card can be accurately contacted with a welding pad on each wafer to realize one-by-one test through accurately moving the wafer bearing table, the probe station records chips with parameter characteristics not meeting requirements after the test, the chips are removed before entering a packaging process, and only the wafers meeting the parameter characteristics are packaged.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A wafer probe station is characterized by comprising a structure main body, wherein the structure main body comprises a test box and a wafer detection device arranged in the test box;
the wafer detection device comprises a detection table, a slide rail group is arranged on the detection table, a wafer bearing table is arranged on the slide rail group, a probe card imaging device is arranged on one side of the wafer bearing table, a probe card bearing table is further arranged on the detection table, the probe card bearing table is positioned above the wafer bearing table, and the wafer imaging device is arranged in front of the probe card bearing table;
the slide rail set comprises a Y-axis axial slide rail fixedly arranged on the detection platform, an X-axis axial slide rail vertically connected with the Y-axis axial slide rail is arranged on the Y-axis axial slide rail, a wafer bearing moving seat in sliding connection with the X-axis axial slide rail is arranged on the X-axis axial slide rail, a lifting platform is arranged on the wafer bearing moving seat, and the wafer bearing platform is positioned on the lifting platform;
the wafer bearing table comprises a rotating assembly and a lifting assembly, wherein the rotating assembly is used for realizing rotation and the lifting assembly is used for realizing lifting, the rotating assembly comprises a second closed-loop progressing motor and a second high-precision lead screw, the second closed-loop progressing motor is in driving connection with the second high-precision lead screw, the second high-precision lead screw is tightly connected with the wafer bearing table, the lifting assembly comprises a high-precision spline shaft fixedly connected with the rotating assembly, a Z-axis axial high-precision lead screw is arranged at the center of the bottom of the high-precision spline shaft, and a Z-axis axial closed-loop progressing motor in driving connection with the Z-axis axial high-precision lead screw is arranged at the tail end of the Z-axis axial high;
the probe card bearing table comprises a probe card bearing table support frame, a probe card bearing panel is arranged on the probe card bearing table support frame, a probe card clamping mechanism is arranged at the center of the probe card bearing panel, and a probe card is clamped on the probe card clamping mechanism;
the probe card imaging device comprises a fixed connecting plate, wherein a probe card low-power CCD for searching probe card characteristic points and a high-power CCD for accurately positioning the probe card characteristic points are arranged on the fixed connecting plate;
the wafer imaging device comprises a longitudinal support piece and a beam arranged on the longitudinal support piece, wherein a wafer low-power CCD for searching wafer characteristic points and a wafer high-power CCD for accurately positioning the wafer characteristic points are arranged in the beam, and a high-precision displacement sensor for measuring the thickness of a wafer is arranged on one side of the beam close to the probe card bearing table.
2. The wafer probe station of claim 1, wherein: the detection table is fixedly connected with the bottom of the test box, and the detection table is a marble detection table with a rectangular structure.
3. The wafer probe station of claim 1, wherein: and the Y-axis axial linear driving motor is in driving connection with the Y-axis axial slide rail, and the X-axis axial linear driving motor is in driving connection with the X-axis axial slide rail.
4. The wafer probe station of claim 1, wherein: the probe card bearing table support frame comprises four groups of support legs and two groups of lifting rods which are obliquely arranged, and lifting adjusting mechanisms for adjusting the levelness of the probe card are arranged on the four groups of support legs.
5. The wafer probe station of claim 1, wherein: the center of the probe card bearing panel is provided with a probe card fixing disc with an annular structure, the center of the probe card fixing disc is provided with a rectangular groove, and the probe card clamping mechanism is positioned on two sides of the rectangular groove to realize the fixed clamping of the probe card.
6. The wafer probe station of claim 1, wherein: the fixed connecting plate is provided with a first high-precision screw rod, the bottom end of the first high-precision screw rod is provided with a first closed-loop progressive motor in driving connection with the first high-precision screw rod, and the fixed connecting plate is vertically arranged on one side of the wafer bearing table and is fixedly connected with the wafer bearing movable table through screws.
7. The wafer probe station of claim 1, wherein: the longitudinal supporting pieces comprise two groups, wherein a locking piece which is vertically and fixedly connected with the longitudinal supporting pieces is arranged on one group of the longitudinal supporting pieces.
8. The wafer probe station of claim 1, wherein: the wafer low-power CCD and the wafer high-power CCD are arranged in the rectangular mounting cavity, and a plurality of groups of limiting assemblies for fixedly mounting the wafer low-power CCD and the wafer high-power CCD are arranged in the rectangular mounting cavity.
9. The wafer probe station of claim 1, wherein: the longitudinal supporting piece and the supporting frame of the probe card bearing table are fixedly connected with the detection table through screws respectively.
10. The wafer probe station of claim 1, wherein: the testing box comprises a testing box body, and is characterized in that an electric control box and a control button are arranged on a front plate of the testing box body, a three-color lamp is arranged at the top of the testing box body, and trundles are arranged at the bottom of the testing box body and consist of four groups of ground cup and four groups of pulleys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022097382.8U CN212569024U (en) | 2020-09-22 | 2020-09-22 | Wafer probe station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022097382.8U CN212569024U (en) | 2020-09-22 | 2020-09-22 | Wafer probe station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212569024U true CN212569024U (en) | 2021-02-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022097382.8U Active CN212569024U (en) | 2020-09-22 | 2020-09-22 | Wafer probe station |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212569024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112014711A (en) * | 2020-09-22 | 2020-12-01 | 东莞市凯迪微清洗技术有限公司 | Wafer probe station |
-
2020
- 2020-09-22 CN CN202022097382.8U patent/CN212569024U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112014711A (en) * | 2020-09-22 | 2020-12-01 | 东莞市凯迪微清洗技术有限公司 | Wafer probe station |
| CN112014711B (en) * | 2020-09-22 | 2024-07-26 | 广东凯迪微智能装备有限公司 | Wafer probe station |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000 Room 302, floor 3, building A1, No. 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee after: Dongguan Kaidi Micro Intelligent Equipment Co.,Ltd. Address before: 523000 Room 302, floor 3, building A1, No. 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Kaidi micro Cleaning Technology Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee after: Guangdong Kaidi Micro Intelligent Equipment Co.,Ltd. Address before: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Kaidi Micro Intelligent Equipment Co.,Ltd. |
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| CP03 | Change of name, title or address |