CN218099477U

CN218099477U - Novel test tool for wafer chip

Info

Publication number: CN218099477U
Application number: CN202221887909.XU
Authority: CN
Inventors: 不公告发明人
Original assignee: Suzhou Huiken Electronic Technology Co ltd
Current assignee: Suzhou Huiken Electronic Technology Co ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2022-12-20
Anticipated expiration: 2032-07-20

Abstract

The utility model discloses a wafer chip is with novel test fixture, including the coupling plate, the circular shape through-hole has been seted up to the centre of coupling plate, the coupling plate top is equipped with a plurality of align to grid's first roller bearing along the edge of through-hole, the top of coupling plate is equipped with the circular shape change-over with a plurality of first roller bearing roll connection, the draw-in groove of the first roller bearing of cooperation is seted up to the lateral surface of change-over, the medial surface of change-over is equipped with a plurality of align to grid's second roller bearing, the change-over is connected with the handle, the change-over top is connected with the probe tower, the outside of probe tower is equipped with a plurality of align to grid's slide, the last side of every slide all is equipped with the inclined plane, the second roller bearing rolls and sets up in the inclined plane top. The utility model has the advantages that: the manual test of the wafer chip is convenient, the operation is convenient, and meanwhile, the stable installation and smooth rotation of the rotating ring are ensured; the height adjustment of the test head connected with the probe tower is realized, and the height required by the test of the wafer chip is achieved.

Description

Novel test tool for wafer chip

Technical Field

The utility model relates to a chip testing technology field specifically is a wafer chip is with novel test fixture.

Background

The wafer is the most basic semiconductor material for making the IC, and the quality of the wafer will directly determine the quality of the finished IC. Due to different process levels, wafers may generate three defects, namely redundancy, crystal defects and mechanical damage at the production stage. Therefore, the efficient and accurate detection equipment can provide guarantee for high-reliability wafer materials. With the rapid improvement of the chip manufacturing technology, the challenges of wafer inspection are increasing, and the cost proportion of the test is also obviously increased. The wafer test is to perform a probe test on each die on the chip, and a probe (probe) made of gold wire into fine hair is mounted on the test head to contact with a contact (pad) on the die to test the electrical characteristics of the die, so that the unqualified die is marked with a mark, and then when the chip is cut into independent dies according to the unit of the die, the unqualified die marked with the mark is eliminated, and the next process is not performed, so as to avoid waste. The wafer chip is placed between the testing head and the machine table when the wafer chip is required to be tested, and the testing communication of the wafer chip is realized by adjusting the height of the testing head. The existing wafer chip test mostly adopts automatic detection, and is suitable for simultaneous detection of large batch of wafer chips. However, the automatic wafer chip detection device has high startup requirements, and the cost of each startup is very high, so that the automatic wafer chip detection device is not suitable for testing a small number of wafer chips.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer chip is with novel test fixture to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer chip is with novel test fixture, includes the coupling plate, the circular shape through-hole has been seted up to the centre of coupling plate, the coupling plate top is equipped with a plurality of align to grid's first roller bearing along the edge of through-hole, the top of coupling plate is equipped with the circular shape change ring with a plurality of first roller bearing roll connection, the draw-in groove of the first roller bearing of cooperation is seted up to the lateral surface of change ring, the medial surface of change ring is equipped with a plurality of align to grid's second roller bearing, the change ring is connected with the handle, the change ring top is connected with the probe tower, the outside of probe tower is equipped with a plurality of align to grid's slide, every the last side of slide all is equipped with the inclined plane, second roller bearing rolls and sets up in the inclined plane top.

Preferably, the clamping groove is an arc-shaped groove arranged along the circumferential surface of the rotating ring, and a notch is formed in one end of the clamping groove.

Further preferably, the plurality of notches are uniformly arranged and communicated with the clamping groove, and the openings of the notches are downward.

Further preferably, a first avoidance groove is formed in the position, corresponding to the second roller bearing, of the outer side face of the rotating ring, and the second roller bearing is in threaded connection with the rotating ring.

Further preferably, the coupling plate is provided with a plurality of fixing blocks for mounting the first roller bearings, and the first roller bearings are arranged on the side faces, close to the through holes, of the fixing blocks.

Further preferably, the side of keeping away from the through-hole of fixed block is equipped with the second and dodges the groove, first roller bearing and fixed block spiro union.

Further preferably, a connecting groove matched with the probe tower is formed in the side edge, close to the probe tower, of the inclined sheet, and the probe tower is in threaded connection with the inclined sheet.

Further preferably, the upper part of the probe tower is connected with a testing head, and the lower part of the coupling plate is connected with a testing machine table.

Has the advantages that: the novel test tool for the wafer chip is connected with the first roller bearing through the rotation of the clamping groove, and the handle drives the rotating ring to rotate along the first roller bearing, so that the manual test on the wafer chip is facilitated, the operation is convenient, the stable installation of the rotating ring is ensured, and the rotation is smooth; through the matching of the second roller bearing and the inclined plane, the second roller bearing can rotate along the inclined sheet, so that the height of the inclined sheet is changed, the lifting adjustment of the probe tower is realized, the height adjustment of a test head connected with the probe tower is further realized, and the height required by the test of the wafer chip is reached; the testing device is ingenious in design, simple to operate, suitable for manual testing of a small number of wafer chips, low in operation requirement and low in cost consumption.

Drawings

Fig. 1 is an exploded view of a novel test fixture for a wafer chip according to an embodiment of the present invention;

fig. 2 is a schematic view of a main structure of the novel test fixture for wafer chips according to an embodiment of the present invention;

fig. 3 is a schematic top view of the novel testing tool for wafer chips according to an embodiment of the present invention;

fig. 4 is an exploded view of the swivel and coupling plate according to the embodiment of the present invention;

fig. 5 is a schematic structural diagram of a swivel and a coupling plate according to an embodiment of the present invention;

fig. 6 is a schematic structural view of the oblique sheet disclosed in the embodiment of the present invention.

Reference numerals are as follows: 1-coupling plate, 2-through hole, 3-first roller bearing, 4-swivel, 5-neck, 6-second roller bearing, 7-handle, 8-probe tower, 9-oblique sheet, 10-oblique surface, 11-connecting groove, 12-notch, 13-first avoidance groove, 14-fixing block, and 15-second avoidance groove.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-6, a novel test tool for wafer chips comprises a coupling plate 1, wherein a circular through hole 2 is formed in the middle of the coupling plate 1 to facilitate placement of a wafer chip, and a test machine is connected below the coupling plate 1 and used for fixing the coupling plate 1; a plurality of first roller bearings 3 which are uniformly arranged are arranged above the coupling plate 1 along the edge of the through hole 2, a circular rotating ring 4 which is in rolling connection with the plurality of first roller bearings 3 is arranged above the coupling plate 1, a clamping groove 5 which is matched with the first roller bearings 3 is formed in the outer side surface of the rotating ring 4, the first roller bearings 3 are clamped in the clamping groove 5, and the clamping groove 5 is an arc-shaped groove which is formed along the circumferential surface of the rotating ring 4, so that the first roller bearings 3 can roll along the clamping groove 5, and the rotating ring 4 can be ensured to rotate relative to the coupling plate 1; the rotating ring 4 is connected with a handle 7, the rotating ring 4 is driven to rotate conveniently through the handle 7, and the height of the probe tower 8 can be adjusted manually conveniently; a probe tower 8 is connected above the swivel 4, a testing head is connected above the probe tower 8, and the wafer chip is connected with the testing head through the probe tower 8, so that the wafer chip is tested; the inner side surface of the rotating ring 4 is provided with a plurality of uniformly arranged second roller bearings 6, the outer side of the probe tower 8 is provided with a plurality of uniformly arranged oblique sheets 9, the upper side surface of each oblique sheet 9 is provided with an inclined surface 10, the second roller bearings 6 are arranged above the inclined surfaces 10 in a rolling manner, and through the cooperation of the inclined surfaces 10 and the second roller bearings 6, because the rotating ring 4 rotates, the oblique sheets 9 are fixed on the outer side of the probe tower 8 and do not rotate, and meanwhile, because the test head always bears an upward force, the inclined surfaces 10 of the oblique sheets 9 always roll and abut against the second roller bearings 6, when the second roller bearings 6 roll on the inclined surfaces 10, the height position of the oblique sheets 9 relative to the second roller bearings 6 can be changed, so that the height position of the probe tower 8 relative to the rotating ring 4 is changed, the height required by testing a wafer chip is reached, the contact connection or separation of the probe tower 8 and the wafer chip can be realized, and the testing of the wafer chip is realized.

In the application, one end of the clamping groove 5 is provided with the notch 12, and the plurality of notches 12 are uniformly arranged and communicated with the clamping groove 5, so that the first roller bearing 3 can be clamped into the clamping groove 5 through the notches 12, and the rotating ring 4 can be conveniently connected with the first roller bearing 3; the opening of the notch 12 is downward, so that when the rotating ring 4 rotates and the notch 12 is positioned right above the first roller bearing 3, the first roller bearing 3 cannot be separated from the clamping groove 5 of the rotating ring 4.

In this application, the position that the lateral surface of swivel 4 corresponds second roller bearing 6 is equipped with first groove 13 of dodging, and second roller bearing 6 and swivel 4 spiro union, first groove 13 of dodging are the rectangle, and the installation of the screw in first groove 13 of dodging of being convenient for can prevent that the head of screw from outstanding in the lateral surface of swivel 4.

In the application, the coupling plate 1 is provided with the plurality of fixing blocks 14, so that the first roller bearing 3 can be conveniently installed, the first roller bearing 3 is arranged on the side surface, close to the through hole 2, of each fixing block 14, and the first roller bearing 3 is guaranteed to be matched with the clamping groove 5 on the outer side surface of the rotating ring 4; the side of the through hole 2 of keeping away from of fixed block 14 is equipped with the second and dodges groove 15, and first roller bearing 3 and fixed block 14 spiro union, the second dodges groove 15 and is the rectangle, and the installation of the screw in groove 15 is dodged to the second of being convenient for, can prevent that the head of screw salient from the lateral surface of swivel 4, influencing the rotation of swivel 4. The number of the fixing blocks 14, the number of the first roller bearings 3 and the number of the second roller bearings 6 are four, and the coupling plate 1 ensures the temperature property of the mutual connection between the rotating ring 4 and the probe tower 8.

In this application, the side that is close to probe tower 8 of oblique piece 9 is equipped with the spread groove 11 of cooperation probe tower 8, and the oblique piece 9 of being convenient for is connected with probe tower 8, and probe tower 8 passes through bolted connection with oblique piece 9, the installation or the change of the oblique piece 9 of being convenient for.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.

Claims

1. The utility model provides a wafer chip is with novel test fixture which characterized in that: including coupling plate (1), circular shape through-hole (2) have been seted up to the centre of coupling plate (1), coupling plate (1) top is equipped with a plurality of align to grid's first roller bearing (3) along the edge of through-hole (2), the top of coupling plate (1) is equipped with circular shape change ring (4) with a plurality of first roller bearing (3) roll connection, draw-in groove (5) of the first roller bearing of cooperation (3) are seted up to the lateral surface of change ring (4), the medial surface of change ring (4) is equipped with a plurality of align to grid's second roller bearing (6), change ring (4) are connected with handle (7), change ring (4) top is connected with probe tower (8), the outside of probe tower (8) is equipped with a plurality of align to grid's oblique piece (9), every the last side of oblique piece (9) all is equipped with inclined plane (10), second roller bearing (6) roll and set up in second inclined plane (10) top.

2. The novel test tool for the wafer chip as claimed in claim 1, wherein: the clamping groove (5) is an arc-shaped groove arranged along the circumferential surface of the rotating ring (4), and one end of the clamping groove (5) is provided with a notch (12).

3. The novel test tool for the wafer chip as claimed in claim 2, wherein: a plurality of the notches (12) are uniformly arranged and communicated with the clamping groove (5), and the openings of the notches (12) are downward.

4. The novel test tool for the wafer chip as claimed in claim 1, wherein: the position of the outer side surface of the rotating ring (4) corresponding to the second roller bearing (6) is provided with a first avoidance groove (13), and the second roller bearing (6) is in threaded connection with the rotating ring (4).

5. The novel test tool for the wafer chip as claimed in claim 1, wherein: the coupling plate (1) is provided with a plurality of fixing blocks (14) for mounting the first roller bearings (3), and the first roller bearings (3) are arranged on the side faces, close to the through holes (2), of the fixing blocks (14).

6. The novel test tool for the wafer chip as claimed in claim 5, wherein: the side of keeping away from through-hole (2) of fixed block (14) is equipped with the second and dodges groove (15), first roller bearing (3) and fixed block (14) spiro union.

7. The novel test tool for the wafer chip as claimed in claim 1, wherein: the side edge of the oblique sheet (9) close to the probe tower (8) is provided with a connecting groove (11) matched with the probe tower (8), and the probe tower (8) is in threaded connection with the oblique sheet (9).

8. The novel test tool for the wafer chip as claimed in claim 1, wherein: the test head is connected to the top of probe tower (8), the below of coupling plate (1) is connected with the test board.