CN214622934U - Placing jig for probe adjustment of probe card - Google Patents

Placing jig for probe adjustment of probe card Download PDF

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Publication number
CN214622934U
CN214622934U CN202120649547.XU CN202120649547U CN214622934U CN 214622934 U CN214622934 U CN 214622934U CN 202120649547 U CN202120649547 U CN 202120649547U CN 214622934 U CN214622934 U CN 214622934U
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Prior art keywords
probe card
film
placing
probe
groove
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CN202120649547.XU
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Chinese (zh)
Inventor
傅智云
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Wuxi Zidian Semiconductor Co ltd
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Wuxi Zidian Semiconductor Co ltd
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Priority to CN202120649547.XU priority Critical patent/CN214622934U/en
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  • Measuring Leads Or Probes (AREA)

Abstract

The utility model discloses a put tool for probe card probe adjustment, it can realize the quick adjustment of probe card probe interval or depth of parallelism, adjustment convenient operation is swift, can prevent that finished product quality from being uneven, machining efficiency and finished product quality can be improved, it includes the base to put the tool, the probe card that is located the base places the district, the district is placed to the film, the probe card is placed the district and is used for placing the probe card, the probe card is placed the district and is included at least two, the film is placed the district and is located the base and place the district adjacent arrangement with the probe card, the film is placed the shape phase-match of district and film, the film is placed the district and is used for placing the film, it has the through-hole that corresponds with the probe card's probe to open on the film.

Description

Placing jig for probe adjustment of probe card
Technical Field
The utility model relates to a probe card processing equipment technical field specifically is a put tool for probe card probe adjustment.
Background
The probe card is also called as IC detection card, which is a precision tool for testing the yield of IC chips, and in the production process of the probe, the processing technologies of punching blind holes or micropores, slotting, bending and the like are involved, and the probe is fixed on a PCB after being processed to form the probe card. After the bent probes are fixed with the PCB, the bent parts of the probes often have the problems of deflection, poor parallelism and the like, in order to meet the test and installation requirements of subsequent IC chips, the parallelism of the probes and the distance between adjacent probes need to be adjusted, the parallelism or the distance between the probes which are commonly used at present are manually adjusted by simple tools such as tweezers, only one probe card can be adjusted at a time, and after the adjustment is finished, a microscope is needed to detect the probes on each probe card, so the adjustment operation is time-consuming and labor-consuming. Particularly, when the probe cards are produced in batches, the adjusting mode has the defects of uneven quality of finished products and the like, and the processing efficiency and the quality of the finished products are seriously influenced.
SUMMERY OF THE UTILITY MODEL
The interval or the mode of depth of parallelism to the manual adjustment probe card probes such as manual work use tweezers that exist among the prior art, waste time and energy, easily make finished product quality uneven, influence machining efficiency and finished product quality's problem, the utility model provides a put tool for probe card probe adjustment, its quick adjustment that can realize probe card probe interval or depth of parallelism, adjustment convenient operation is swift, and once can realize the adjustment of two at least probe card probes, can prevent that finished product quality is uneven, can improve machining efficiency and finished product quality.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the placing jig for probe adjustment of the probe card comprises a base and probe card placing areas located on the base, wherein the shape of each probe card placing area is matched with that of the probe card and used for placing the probe card.
The probe card is further characterized in that the probe card placing area is quadrilateral or circular;
when the probe card placing area is quadrilateral, the film placing area is quadrilateral;
the film placing area is positioned in the middle of the base, the probe card placing areas are positioned on two sides of the film placing area, and the probe card placing areas on the two sides are axially and symmetrically distributed by taking the transverse center line of the film placing area as an axis;
the probe card placing area is provided with a first groove, and the film placing area is provided with a second groove;
the first groove is in a step shape;
the bottom end of the second groove is provided with a third groove and a fourth groove which correspond to the through holes of the film, the film is provided with two rows of through holes which are distributed in parallel, and the third groove and the fourth groove respectively correspond to the two rows of through holes on the film;
the probe card placing area comprises a supporting plate and through holes distributed on two sides of the supporting plate, the supporting plate is located in the middle of the first groove, a positioning block is fixed in the middle of the supporting plate, and a first threaded hole is formed in the center of the positioning block;
supporting blocks which are opposite to bulges and symmetrically distributed are arranged between the first groove and the second groove, and second threaded holes are formed in the top ends of the two supporting blocks respectively.
A method for adjusting probes of a probe card is realized based on the placing jig, and is characterized by comprising the following steps: s1, fixing the film in the film placing area;
s2, fixing the probe card in the probe card placing area;
s21, before the probe card is fixed, the probes on the probe card are in one-to-one correspondence with the through holes on the film;
s22, adjusting the distance between two adjacent probes and the parallelism of the probes, and inserting the probes on the probe card into the through holes;
and S23, fixing the probe card on the probe card placing area, and adjusting the distance between two adjacent probes and the parallelism of the probes again.
It is further characterized in that the method further comprises the steps of,
fixing the probe card in the first groove through a screw, a first threaded hole and a second threaded hole;
a double-sided adhesive tape is adhered in the second groove, and the adhesive sheet is fixed in the second groove through the double-sided adhesive tape;
the double-sided adhesive tape is a high-temperature-resistant double-sided adhesive tape;
the film is a high temperature resistant film.
Adopt the utility model discloses above-mentioned structure and method can reach following beneficial effect: 1. the placing jig comprises a probe card placing area matched with the shape of a probe card and a film placing area matched with the shape of a film, when the placing jig is adopted to adjust the probes of the probe card, the probe card is fixed in the probe card placing area, the film is fixed in the film placing area, through holes corresponding to the probes of the probe card are formed in the film, and the through holes in the film are punched in advance according to the actual positions on the IC chip.
2. This put probe card on tool and place district includes at least two, consequently, once can realize the adjustment of two at least probe card probes, has improved machining efficiency, compares in the mode of the interval or the depth of parallelism of manual adjustment probe card probes such as present manual work use tweezers, and this application realizes the quick adjustment of probe card probe interval or depth of parallelism through putting the tool to the problem of finished product quality irregularity has been prevented and has been appeared, has improved finished product quality.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic top view of a probe card mounted to a probe card mounting area and a film mounted to a film mounting area;
fig. 3 is a schematic structural diagram of the probe card with probes corresponding to the through holes on the film.
Detailed Description
Referring to fig. 1 to 3, a placing jig for probe adjustment of a probe card includes a base 1, a probe card placing area 2 located on the base 1, and a film placing area 3 located on the base 1 and arranged adjacent to the probe card placing area 2, where the shape of the probe card placing area 1 matches the shape of the probe card for placing the probe card, the probe card placing area 2 includes at least two (in this embodiment, the probe card placing area 2 includes six probe card placing areas 2, the six probe card placing areas 2 are distributed on the base 1 in a matrix manner), the film placing area 3 matches the shape of the film for placing the film, the film 10 is provided with through holes 102 (see fig. 3) corresponding to probes 101 of the probe card 11, and the film is an existing high temperature resistant film.
In the embodiment, the probe card placing area 2 and the film placing area 3 are both quadrilateral; the film placing area 3 is positioned in the middle of the base 1, the probe card placing areas 2 are positioned on two sides of the film placing area 3, and the probe card placing areas 2 on the two sides are axially and symmetrically distributed by taking the transverse center line of the film placing area 3 as an axis;
the probe card placing area 2 is provided with a first groove 21, and the film placing area 3 is provided with a second groove 31; the maximum width of the first groove 21 is equal to the maximum length of the second groove 31; the first groove 21 is stepped; the bottom end of the second groove 31 is provided with a third groove 32 and a fourth groove 33 which correspond to the through holes of the film, the film is provided with two rows of through holes 102 which are distributed in parallel, and the third groove 32 and the fourth groove 33 correspond to the two rows of through holes on the film respectively;
the probe card placing area 2 comprises a supporting plate 22 and first through holes 23 distributed on two sides of the supporting plate 22 (when the probe card is placed in the probe card placing area 2, the through holes 23 are placing areas of electronic elements on the probe card), the supporting plate 22 is located in the middle of the first groove 21, a positioning block 24 is fixed in the middle of the supporting plate 22, and a first threaded hole 25 is formed in the center of the positioning block 24;
supporting blocks 4 which are opposite to each other and convex and symmetrically distributed are arranged between the first groove 21 and the second groove 31, and second threaded holes 40 are respectively formed at the top ends of the two supporting blocks 4.
A method for adjusting probes of a probe card is realized based on the placing jig, and comprises the following steps: s1, fixing the film in the film placing area 2, specifically: a double-sided adhesive tape is stuck in the second groove 31, the adhesive tape 10 is fixed in the second groove 31 through the double-sided adhesive tape, the shape of the double-sided adhesive tape is consistent with that of the adhesive tape placing area 2, and the double-sided adhesive tape is the existing high-temperature resistant double-sided adhesive tape;
s2, fixing the probe card on the probe card placing area 2, specifically operating as follows:
s21, before the probe card is fixed, the probes 101 on the probe card 11 are in one-to-one correspondence with the through holes 102 on the film 10;
s22, adjusting the distance between two adjacent probes and the parallelism of the probes 101 to insert the probes 101 on the probe card into the through holes 102;
s23, fixing the probe card in the first groove 25 by the screws, the first screw holes 25 and the second screw holes 40, that is, fixing the probe card in the probe card placing region 2, and adjusting the distance between two adjacent probes 101 and the parallelism of the probes 101 again. This application has realized the quick adjustment of probe card probe interval or depth of parallelism through putting the tool, adopts this application to put the probe adjustment back on the tool to the probe card, can reduce the distance error between two adjacent probes on the probe card to within 3 microns, has effectively prevented that the problem of finished product quality discrepancy from appearing.
The above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.

Claims (7)

1. The placing jig is characterized in that the probe card placing areas comprise at least two film placing areas, the film placing areas are located on the base and are arranged adjacent to the probe card placing areas, the film placing areas are matched with the films in shape and are used for placing the films, and the films are provided with through holes corresponding to the probes of the probe card.
2. The placing jig for probe card probe adjustment according to claim 1, wherein the probe card placing area is quadrilateral or circular.
3. The placing jig for probe card probe adjustment according to claim 1 or 2, wherein the film placing area is located in the middle of the base, the probe card placing areas are located on both sides of the film placing area, and the probe card placing areas on both sides are distributed axisymmetrically with respect to a transverse center line of the film placing area.
4. The placing jig for probe card probe adjustment according to claim 3, wherein the probe card placing area is provided with a first groove, and the film placing area is provided with a second groove.
5. The placing jig for adjusting the probe of the probe card according to claim 4, wherein the bottom end of the second groove is provided with a third groove and a fourth groove corresponding to the through holes of the film, the film is provided with two rows of through holes distributed in parallel, and the third groove and the fourth groove correspond to the two rows of through holes on the film respectively.
6. The placing jig for probe adjustment of probe cards of claim 5, wherein the probe card placing area comprises a supporting plate and through holes distributed on two sides of the supporting plate, the supporting plate is located in the middle of the first groove, a positioning block is fixed in the middle of the supporting plate, and a first threaded hole is formed in the center of the positioning block.
7. The placing jig for adjusting the probe of the probe card according to claim 6, wherein the first groove and the second groove are provided with supporting blocks which are opposite to each other and convex and symmetrically distributed, and the top ends of the two supporting blocks are respectively provided with a second threaded hole.
CN202120649547.XU 2021-03-30 2021-03-30 Placing jig for probe adjustment of probe card Active CN214622934U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120649547.XU CN214622934U (en) 2021-03-30 2021-03-30 Placing jig for probe adjustment of probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120649547.XU CN214622934U (en) 2021-03-30 2021-03-30 Placing jig for probe adjustment of probe card

Publications (1)

Publication Number Publication Date
CN214622934U true CN214622934U (en) 2021-11-05

Family

ID=78398261

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120649547.XU Active CN214622934U (en) 2021-03-30 2021-03-30 Placing jig for probe adjustment of probe card

Country Status (1)

Country Link
CN (1) CN214622934U (en)

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