CN219748551U - Semiconductor wafer cutting processing device - Google Patents
Semiconductor wafer cutting processing device Download PDFInfo
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- CN219748551U CN219748551U CN202320827410.8U CN202320827410U CN219748551U CN 219748551 U CN219748551 U CN 219748551U CN 202320827410 U CN202320827410 U CN 202320827410U CN 219748551 U CN219748551 U CN 219748551U
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- semiconductor wafer
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- 238000005520 cutting process Methods 0.000 title claims abstract description 67
- 238000012545 processing Methods 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 90
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 238000007689 inspection Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 49
- 238000003825 pressing Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a semiconductor wafer cutting processing device, wherein a bottom plate is used for placing a semiconductor wafer body to be cut; the graduated scale clamping mechanisms are respectively and movably arranged at two sides of the bottom plate and are used for clamping and fixing the semiconductor wafer body to be cut and positioning the semiconductor wafer body to the position to be cut; the Y-axis moving mechanisms are symmetrically arranged on two sides of the bottom plate, the X-axis moving mechanisms are arranged between two adjacent Y-axis moving mechanisms, the Y-axis moving mechanisms move and adjust the X-axis moving mechanisms, and the X-axis moving mechanisms move and adjust the cutting mechanism; the cutting mechanism is arranged to be in sliding connection with the outer side of the X-axis moving mechanism and is used for cutting the semiconductor wafer body to be cut on the bottom plate. The utility model can not only avoid frequent cutter stopping inspection and manual adjustment of the upper and lower positions of the cutter blade caused by manual calibration required for the height adjustment of the cutter blade of the cutter in the prior art, but also effectively improve the convenience and the accuracy of the position adjustment of the semiconductor wafer during cutting.
Description
Technical Field
The utility model relates to the field of semiconductor wafers, in particular to a semiconductor wafer cutting processing technology.
Background
An integrated circuit (Integrated Circuit) is a technology in electronics that highly integrates and miniaturizes circuits (including semiconductor devices and passive components, etc.). It is often fabricated on the surface of a semiconductor wafer, also known as a microcircuit, microchip, or die. By integrating hundreds of millions of components such as transistors, capacitors, resistors and the like onto one chip, the integrated circuit realizes high integration of circuit functions, and the performance and reliability of the electronic equipment are greatly improved.
Semiconductor die sawing machines are commonly used to dice semiconductor wafers into individual chips, and are commonly used equipment for die singulation. In the dicing process of a semiconductor wafer, due to factors such as the dicing force of a dicing blade and the compression deformation of the wafer, there may occur a shearing stress overload between the upper and lower surfaces of the wafer, resulting in breakage or cracking of the back surface of the wafer, which is referred to as "backfin" (Backside chipping), and sometimes referred to as "backface crack" (Backside Cracking). Therefore, in the process of cutting the semiconductor chip, the height of the cutting knife needs to be reasonably adjusted, the acting force of the cutting knife on the wafer is controlled, and the risk of back collapse is reduced. However, the existing cutting machine needs to manually adjust and calibrate the height of the blade, needs to frequently stop the blade for inspection and manually adjust the blade up and down, which not only consumes a lot of manpower, but also can affect the production efficiency.
On the other hand, the convenience and accuracy of positional adjustment of the semiconductor wafer at the time of dicing have also been required to be improved.
Therefore, a new semiconductor wafer dicing processing apparatus is required to solve the above problems.
Disclosure of Invention
In view of the above technical problems, an object of the present utility model is to provide a semiconductor wafer dicing apparatus, which can not only avoid frequent blade stop inspection and manual adjustment of the upper and lower positions of the blade due to manual calibration required for blade height adjustment of the dicing machine in the prior art, but also effectively improve the convenience and accuracy of position adjustment of the semiconductor wafer during dicing.
In order to achieve the above object, the present utility model provides a semiconductor wafer dicing apparatus comprising:
the utility model discloses a semiconductor wafer cutting processing device, which comprises: a base plate, a graduated scale clamping mechanism, a Y-axis moving mechanism, an X-axis moving mechanism and a cutting mechanism, wherein,
the bottom plate is used for placing the semiconductor wafer body to be cut;
the graduated scale clamping mechanisms are respectively and movably arranged at two sides of the bottom plate and are used for clamping and fixing the semiconductor wafer body to be cut and positioning the semiconductor wafer body to the position to be cut;
the Y-axis moving mechanisms are symmetrically arranged on two sides of the bottom plate, the X-axis moving mechanisms are arranged between two adjacent Y-axis moving mechanisms, the Y-axis moving mechanisms move along the Y-axis direction to adjust the X-axis moving mechanisms, and the X-axis moving mechanisms move along the X-axis direction to adjust the cutting mechanism;
the cutting mechanism is arranged to be in sliding connection with the outer side of the X-axis moving mechanism and is used for cutting the semiconductor wafer body to be cut on the bottom plate.
In a preferred embodiment, the scale holding mechanism comprises:
the scale, the scale is located the bottom plate top, just scale and bottom plate fixed connection, the support crossbearer has been seted up to bottom plate top symmetry, the inboard sliding connection of support crossbearer has the removal grip block, it is provided with the pointer to remove the grip block top, the pointer is located scale one side, scale top one side is through mounting and bottom plate fixed connection.
In a preferred embodiment, the Y-axis moving mechanism comprises a support frame, wherein the support frame is U-shaped, a groove is formed in the inner side of the support frame, and first limiting rods are symmetrically and fixedly connected in the groove;
the support frame one side fixedly connected with first driving motor, first driving motor's output fixedly connected with first screw rod, first screw rod outside threaded connection has the slider, slider both sides sliding connection has first gag lever post.
In a preferred embodiment, the X-axis moving mechanism comprises a second driving motor, one side of the second driving motor is fixedly connected with a bearing fixing piece, the output end of the second driving motor is fixedly connected with a second screw rod, and the outer side of the second screw rod is in threaded connection with a cutting mechanism;
the X-axis moving mechanism is located between two adjacent sliding blocks, second limiting rods are symmetrically and fixedly connected between the two adjacent sliding blocks, and the other end of the second screw rod is fixedly connected with the sliding blocks through bearings.
In a preferred embodiment, the cutting mechanism comprises a cutting machine, wherein connecting pieces are symmetrically and fixedly connected to the top of the cutting machine, and the inner sides of the connecting pieces are rotationally connected with a rotating shaft through a rotating shaft rod;
the cutting machine is far away from connecting piece one side symmetry fixedly connected with spring, the spring bottom with the cutting machine corresponds to set up and has seted up the hole groove, the inside sliding connection of hole groove has the bracing piece, the spring is located the bracing piece outside, bracing piece top fixedly connected with depression bar, adjacent two fixedly connected with connecting rod between the depression bar, bracing piece bottom fixedly connected with connection depression bar.
In a preferred embodiment, grooves are formed in two sides of the cutting machine, the second screw rod is in threaded connection with the cutting machine, and the second limiting rod is in sliding connection with the cutting machine;
the cutting machine is characterized in that one side of the bottom of the cutting machine is rotationally connected with a rotating plate through a connecting shaft, the rotating plate is L-shaped, and the rotating plate is attached to a connecting compression bar.
In a preferred embodiment, the bottom of the bottom plate is symmetrically provided with supporting feet, and the supporting feet are provided with a plurality of supporting feet.
In a preferred embodiment, a dicing blade for dicing the semiconductor wafer is provided at the bottom of the rotating plate.
The semiconductor wafer cutting processing device provided by the utility model has at least one of the following beneficial effects:
1. according to the utility model, the graduated scale is arranged in the graduated scale clamping mechanism, the semiconductor wafer body is clamped and fixed through the movable clamping plate, and the graduated scale measures the movement of the movable clamping plate, so that the semiconductor wafer body is conveniently positioned at the position to be cut during cutting, and the cutting is more accurate.
2. According to the utility model, the first driving motor is arranged in the Y-axis moving mechanism to drive the sliding blocks outside the first screw rod to move along the first limiting rod, so that the X-axis moving mechanism arranged between the sliding blocks can be conveniently moved and adjusted along the Y-axis direction, and the first driving motor is arranged in the X-axis moving mechanism to drive the cutting mechanism outside the second screw rod to be moved and adjusted along the X-axis direction, so that the accurate positioning of the cutting position of the semiconductor wafer is facilitated.
3. The utility model adopts the rotating shaft arranged in the cutting mechanism to press downwards, and transmits acting force to the connecting rod so as to enable the connecting rod to move downwards. The bottom of the supporting rod pushes the connecting pressing rod to push the rotating plate downwards, so that the semiconductor wafer is conveniently cut. The design can reduce manual adjustment of the height of the blade and improve cutting efficiency.
Drawings
The above features, technical features, advantages and implementation of the present utility model will be further described in the following description of preferred embodiments with reference to the accompanying drawings in a clear and easily understood manner.
Fig. 1 is an overall schematic view of a semiconductor wafer dicing processing apparatus according to one embodiment of the utility model;
fig. 2 is a detailed structural schematic diagram of a moving dicing mechanism of the semiconductor wafer dicing processing apparatus according to an embodiment of the utility model;
FIG. 3 is a detailed schematic diagram of a dicing machine of a semiconductor wafer dicing processing apparatus according to one embodiment of the utility model;
fig. 4 is a schematic top view of a semiconductor wafer dicing apparatus according to an embodiment of the utility model.
Reference numerals illustrate:
the semiconductor wafer comprises a bottom plate 01, supporting legs 02, a supporting frame 03, a supporting transverse frame 04, a graduated scale 05, a movable clamping plate 06, a first driving motor 07, a first screw 08, a first limiting rod 09, a sliding block 10, a second driving motor 11, a bearing fixing piece 12, a second screw 13, a second limiting rod 14, a fixing piece 15, a cutting machine 16, a connecting piece 17, a rotating shaft 18, a pressing rod 19, a spring 20, a connecting pressing rod 21, a rotating plate 22, a cutting tool bit 23 and a semiconductor wafer body 24.
Detailed Description
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following description will explain the specific embodiments of the present utility model with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the utility model, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
For simplicity of the drawing, only the parts relevant to the utility model are schematically shown in each drawing, and they do not represent the actual structure thereof as a product. Additionally, in order to simplify the drawing for ease of understanding, components having the same structure or function in some of the drawings are shown schematically with only one of them, or only one of them is labeled. Herein, "a" means not only "only this one" but also "more than one" case.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
In this context, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, unless explicitly stated or limited otherwise; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In addition, in the description of the present utility model, the terms "first," "second," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
In one embodiment, referring to fig. 1, 2, 3 and 4 of the specification, the semiconductor wafer dicing apparatus provided by the present utility model includes: a base plate 01, a graduated scale clamping mechanism, a Y-axis moving mechanism, an X-axis moving mechanism and a cutting mechanism. Wherein, scale fixture mainly includes: a graduated scale 05 and a movable clamping plate 06. The Y-axis moving mechanism mainly comprises: the first driving motor 07, the first screw 08, the first limiting rod 09 and the sliding block 10. The X-axis moving mechanism mainly comprises: a second drive motor 11 and a bearing mount 12. The cutting mechanism mainly comprises: the cutting machine 16, the connecting piece 17, the rotating shaft 18, the connecting compression bar 21, the rotating plate 22 and the cutting bit 23.
Specifically, the base plate 01 is used for placing a semiconductor wafer body to be diced; the graduated scale clamping mechanisms are respectively and movably arranged at two sides of the bottom plate 01 and are used for clamping and fixing the semiconductor wafer body to be cut and positioning the semiconductor wafer body to the position to be cut; the Y-axis moving mechanisms are symmetrically arranged on two sides of the bottom plate 01, the X-axis moving mechanisms are arranged between two adjacent Y-axis moving mechanisms, the Y-axis moving mechanisms are used for moving and adjusting the X-axis moving mechanisms along the Y-axis direction, and the X-axis moving mechanisms are used for moving and adjusting the cutting mechanisms along the X-axis direction; the cutting mechanism is arranged in sliding connection with the outer side of the X-axis moving mechanism and is used for cutting the semiconductor wafer body to be cut on the bottom plate 01.
In one embodiment, referring to fig. 2 of the specification, a scale 05 in a scale clamping mechanism is located at the top of a bottom plate 01, the scale 05 is fixedly connected with the bottom plate 01, a supporting transverse frame 04 is symmetrically arranged at the top of the bottom plate 01, a movable clamping plate 06 is slidably connected to the inner side of the supporting transverse frame 04, a pointer is arranged at the top of the movable clamping plate 06 and located on one side of the scale 05, and one side of the top of the scale 05 is fixedly connected with the bottom plate 01 through a fixing piece 15.
Specifically, through the inside scale 05 that is provided with of scale fixture, it is fixed to carry out the centre gripping through removing grip block 06 to semiconductor wafer body 24, and scale 05 is removed removing grip block 06 and is measured, is convenient for ensure that semiconductor wafer body 24 is located the position that will cut when cutting, makes more accurate when cutting.
In one embodiment, referring to fig. 1 and 2 of the specification, a support frame 03 in a Y-axis moving mechanism is in a U shape, a groove is formed in the inner side of the support frame 03, and a first limiting rod 09 is symmetrically and fixedly connected to the inner side of the groove; one side of the supporting frame 03 is fixedly connected with a first driving motor 07, the output end of the first driving motor 07 is fixedly connected with a first screw 08, the outer side of the first screw 08 is in threaded connection with a sliding block 10, and two sides of the sliding block 10 are in sliding connection with a first limiting rod 09.
Specifically, the first driving motor 07 is arranged inside the Y-axis moving mechanism to drive the sliding blocks 10 outside the first screw 08 to move along the first limiting rod 09, namely along the Y-axis direction, so that the X-axis moving mechanism arranged between the sliding blocks 10 can be conveniently moved and adjusted along the Y-axis direction.
In one embodiment, referring to fig. 1 and 2 of the specification, the X-axis moving mechanism comprises a second driving motor 11, wherein one side of the second driving motor 11 is fixedly connected with a bearing fixing piece 12, the output end of the second driving motor 11 is fixedly connected with a second screw rod 13, and the outer side of the second screw rod 13 is in threaded connection with a cutting mechanism; the X-axis moving mechanism is positioned between two adjacent sliding blocks 10, second limiting rods 14 are symmetrically and fixedly connected between the two adjacent sliding blocks 10, and the other end of each second screw rod 13 is fixedly connected with the corresponding sliding block 10 through a bearing;
specifically, the second driving motor 11 is arranged in the X-axis moving mechanism to drive the cutting mechanism outside the second screw 13 to move and adjust along the X-axis, so that the cutting position of the semiconductor wafer can be accurately positioned.
In one embodiment, referring to fig. 1, 2 and 3 of the specification, a connecting piece 17 is symmetrically and fixedly connected to the top of the cutting machine 16, and the inner side of the connecting piece 17 is rotatably connected to a rotating shaft 18 through a rotating shaft rod.
Specifically, two springs 20 are symmetrically and fixedly arranged on one side of the cutting machine 16 away from the connecting piece 17, two compression bars 19 are respectively sleeved on the two springs 20, and can move up and down by the elastic force of the springs 20, and a connecting rod is fixedly arranged between the two compression bars 19 and is positioned below the rotating shaft 18, so that when the rotating shaft 18 presses or releases the connecting rod, the compression bars 19 connected with the connecting rod correspondingly move down or up by the elastic force of the springs 20. Further, a hole groove is formed at the bottom of the spring 20 corresponding to the cutter 16, a supporting rod (not shown) is slidably connected in the hole groove, the top of the supporting rod is connected with the two compression rods 19, and the bottom of the supporting rod is connected with the connecting compression rod 21.
Further, as shown in fig. 3, a dicing blade 23 is provided at the bottom of the rotating plate 22 for dicing the semiconductor wafer.
Based on the above configuration, the rotary plate 22 is pressed down by the rotation shaft 18 provided inside the dicing mechanism, the connecting rod between the springs 20 is urged downward by the bottom of the supporting rod, and the dicing blade 23 provided at the bottom of the rotary plate 22 is caused to dice the semiconductor wafer body 24 downward by pushing the connecting rod 21 down by the bottom of the supporting rod.
In one embodiment, referring to fig. 1 and 2 and fig. 3 of the specification, slots are formed on two sides of the cutter 16, the second screw 13 is in threaded connection with the cutter 16, and the second limit rod 14 is in sliding connection with the cutter 16.
One side of the bottom of the cutting machine 16 is rotationally connected with a rotating plate 22 through a connecting shaft, the rotating plate 22 is L-shaped, and the rotating plate 22 is attached to a connecting compression bar 21.
In one embodiment, on the basis of the above embodiment, referring to fig. 1 of the specification, support feet 02 are symmetrically arranged at the bottom of the bottom plate 01, and a plurality of support feet 02 are arranged.
The technical effects are as follows:
according to the embodiment, the graduated scale is arranged inside the graduated scale clamping mechanism, the semiconductor wafer body is clamped and fixed through the movable clamping plate, and the graduated scale measures the movement of the movable clamping plate, so that the semiconductor wafer body is located at the position to be cut when the semiconductor wafer body is cut, and the semiconductor wafer body is more accurate when cut.
Further, the embodiment drives the sliding blocks outside the first screw rods to move along the first limiting rods through the first driving motor arranged inside the Y-axis moving mechanism, so that the X-axis moving mechanism arranged between the sliding blocks can be conveniently moved and adjusted along the Y-axis direction, and the first driving motor is arranged inside the X-axis moving mechanism to drive the cutting mechanism outside the second screw rods to move and adjust along the X-axis direction, so that the cutting position of the semiconductor wafer can be accurately positioned.
Further, the above embodiment uses a rotation shaft provided inside the cutting mechanism to press down, and transmits the acting force to the connecting rod, so that the connecting rod moves downward. The bottom of the supporting rod pushes the connecting pressing rod to push the rotating plate downwards, so that the semiconductor wafer is conveniently cut. The design can reduce manual adjustment of the height of the blade and improve cutting efficiency.
Therefore, the embodiment can not only avoid frequent blade stopping inspection and manual adjustment of the upper and lower positions of the blade caused by manual calibration required for blade height adjustment of the cutting machine in the prior art, but also effectively improve the convenience and accuracy of position adjustment of the semiconductor wafer during cutting.
It should be noted that the above embodiments can be freely combined as needed. The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.
Claims (8)
1. A semiconductor wafer dicing apparatus, comprising: a base plate, a graduated scale clamping mechanism, a Y-axis moving mechanism, an X-axis moving mechanism and a cutting mechanism, wherein,
the bottom plate is used for placing the semiconductor wafer body to be cut;
the graduated scale clamping mechanisms are respectively and movably arranged at two sides of the bottom plate and are used for clamping and fixing the semiconductor wafer body to be cut and positioning the semiconductor wafer body to the position to be cut;
the Y-axis moving mechanisms are symmetrically arranged on two sides of the bottom plate, the X-axis moving mechanisms are arranged between two adjacent Y-axis moving mechanisms, the Y-axis moving mechanisms move along the Y-axis direction to adjust the X-axis moving mechanisms, and the X-axis moving mechanisms move along the X-axis direction to adjust the cutting mechanism;
the cutting mechanism is arranged to be in sliding connection with the outer side of the X-axis moving mechanism and is used for cutting the semiconductor wafer body to be cut on the bottom plate.
2. The semiconductor wafer dicing processing apparatus of claim 1, wherein the scale holding mechanism comprises:
the scale, the scale is located the bottom plate top, just scale and bottom plate fixed connection, the support crossbearer has been seted up to bottom plate top symmetry, the inboard sliding connection of support crossbearer has the removal grip block, it is provided with the pointer to remove the grip block top, the pointer is located scale one side, scale top one side is through mounting and bottom plate fixed connection.
3. The semiconductor wafer cutting processing device according to claim 1, wherein the Y-axis moving mechanism comprises a supporting frame, the supporting frame is U-shaped, a groove is formed in the inner side of the supporting frame, and first limiting rods are symmetrically and fixedly connected in the groove;
the support frame one side fixedly connected with first driving motor, first driving motor's output fixedly connected with first screw rod, first screw rod outside threaded connection has the slider, slider both sides sliding connection has first gag lever post.
4. A semiconductor wafer dicing apparatus according to any one of claims 1 to 3, wherein the X-axis moving mechanism comprises a second driving motor, one side of which is fixedly connected with a bearing fixing member, the output end of which is fixedly connected with a second screw, and the outside of which is screwed with a dicing mechanism;
the X-axis moving mechanism is located between two adjacent sliding blocks, second limiting rods are symmetrically and fixedly connected between the two adjacent sliding blocks, and the other end of the second screw rod is fixedly connected with the sliding blocks through bearings.
5. The semiconductor wafer dicing apparatus according to claim 1, wherein the dicing mechanism comprises a dicing machine, a connecting member is symmetrically and fixedly connected to the top of the dicing machine, and the inner side of the connecting member is rotatably connected to the rotation shaft via a rotation shaft;
the cutting machine is far away from connecting piece one side symmetry fixedly connected with spring, the spring bottom with the cutting machine corresponds to set up and has seted up the hole groove, the inside sliding connection of hole groove has the bracing piece, the spring is located the bracing piece outside, bracing piece top fixedly connected with depression bar, adjacent two fixedly connected with connecting rod between the depression bar, bracing piece bottom fixedly connected with connection depression bar.
6. The semiconductor wafer dicing apparatus according to claim 4, wherein grooves are formed in both sides of the dicing machine, the second screw is screwed to the dicing machine, and the second stopper is slidably connected to the dicing machine;
the cutting machine is characterized in that one side of the bottom of the cutting machine is rotationally connected with a rotating plate through a connecting shaft, the rotating plate is L-shaped, and the rotating plate is attached to a connecting compression bar.
7. The semiconductor wafer dicing apparatus according to claim 1, wherein the bottom plate is provided with support pads symmetrically at the bottom thereof, the support pads being provided in plural.
8. The semiconductor wafer dicing apparatus according to claim 6, wherein a dicing blade for dicing the semiconductor wafer is provided at the bottom of the rotating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320827410.8U CN219748551U (en) | 2023-04-14 | 2023-04-14 | Semiconductor wafer cutting processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320827410.8U CN219748551U (en) | 2023-04-14 | 2023-04-14 | Semiconductor wafer cutting processing device |
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| Publication Number | Publication Date |
|---|---|
| CN219748551U true CN219748551U (en) | 2023-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202320827410.8U Active CN219748551U (en) | 2023-04-14 | 2023-04-14 | Semiconductor wafer cutting processing device |
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| CN (1) | CN219748551U (en) |
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- 2023-04-14 CN CN202320827410.8U patent/CN219748551U/en active Active
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