CN219819418U - Multi-station precision machining tool - Google Patents

Multi-station precision machining tool Download PDF

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Publication number
CN219819418U
CN219819418U CN202320659620.0U CN202320659620U CN219819418U CN 219819418 U CN219819418 U CN 219819418U CN 202320659620 U CN202320659620 U CN 202320659620U CN 219819418 U CN219819418 U CN 219819418U
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China
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plate
wafers
wafer
precision machining
grooves
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CN202320659620.0U
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Chinese (zh)
Inventor
沈金惠
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Yongdeli Technology Wuxi Co ltd
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Yongdeli Technology Wuxi Co ltd
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Abstract

The utility model discloses a multi-station precision machining tool, in particular to the technical field of precision machining tools, which comprises a tool plate, wherein sixteen positioning grooves are formed in the top surface of the tool plate, a base plate is arranged in each positioning groove, wafers to be machined are stored at the top of each base plate, clamping assemblies are arranged above each wafer, and an adjusting mechanism is arranged at the bottom of each base plate and used for adjusting the clamping force of the clamping assemblies on the wafers. According to the utility model, the wafers are simultaneously placed in sixteen positioning grooves for processing, so that the processing efficiency is greatly improved, the rubber pad at the bottom of the pressing plate is driven by the electric push rod to contact with the dome part of the wafer, the spring support backing plate at the bottom of the backing plate is matched with the four pressing plates, the wafers are clamped in the positioning grooves for processing, the stability and the precision of the wafers in processing are improved, the pressure sensor on the backing plate detects the pressure of the pressing plate on the wafers in real time, the clamping force of the pressing plate on the wafers is conveniently adjusted, and the wafers are prevented from being damaged.

Description

Multi-station precision machining tool
Technical Field
The utility model relates to the technical field of precision machining tools, in particular to a multi-station precision machining tool.
Background
The ultra-precise machining technology represents the forefront and development direction of the manufacturing industry, and the development of the ultra-precise machining technology directly affects the development of the advanced technology of one country and the national defense industry, so that the ultra-precise machining technology is very important for all countries in the world, and great manpower and material resources are input for research and development. With the rise of the semiconductor industry, semiconductor processing technology is also rapidly developed, which also puts more stringent demands on the function and control accuracy of semiconductor devices.
At present, wafer products used by a CPU are widely applied in the electronic industry, the appearance of the wafer is continuously required to be changed along with the improvement of a production process, the product precision requirement is higher and higher, and the wafer is usually clamped by a processing tool when being processed, so that the wafer is prevented from being deviated during processing, and the processing precision is prevented from being influenced.
For example, the utility model uses the fixing groove of the tooling plate to clamp and fix the wafer, and simultaneously uses the tightening degree of the tensioning groove and the locking screw to adjust the tensioning force of the tensioning groove, thereby changing the size of the fixing groove to clamp, smoothly increasing the clamping force, preventing the wafer from being damaged due to too strong stress during clamping, in addition, the fixing groove can vertically clamp the wafer, and the two sides of the wafer can be processed only by rotating the working table plate after primary clamping, so that secondary clamping is not needed, and the possibility of damage is reduced.
When the prior art is used, the wafer is clamped and fixed by the aid of the fixing grooves, the tensioning grooves and the locking screws, the bottom of the wafer is clamped by the structure, but the top of the wafer is not clamped, and when the wafer is processed by the aid of machine tool equipment such as turning, grinding and polishing, uneven processing stress of the top and the bottom of the wafer can be caused, and the top of the wafer is easy to break.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a multi-station precision machining tool, which is used for machining by simultaneously placing wafers in sixteen positioning grooves, so that the machining efficiency is greatly improved, a rubber pad at the bottom of a pressing plate is driven by an electric push rod to contact with the dome part of a wafer, a spring supporting base plate at the bottom of the base plate is matched with four pressing plates, the wafers are clamped in the positioning grooves for machining, the stability and precision of the wafers in machining are improved, and a pressure sensor on the base plate detects the pressure of the pressing plates on the wafers in real time, so that the clamping force of the wafers is conveniently adjusted by changing the heights of the pressing plates, the damage to the wafers is avoided, and the problems in the background art are solved.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a multistation precision machining frock, includes the frock board, sixteen constant head tanks have been seted up on frock board top surface, every constant head tank is inside all to be equipped with the backing plate, the wafer that remains to process is stored at backing plate top, every wafer top all is equipped with clamping assembly, every backing plate bottom all is equipped with adjustment mechanism for adjust clamping force of clamping assembly to the wafer, every clamping assembly all includes four electric putter, four electric putter all inlays and establishes at frock board top, every electric putter top all rotates and is connected with the clamp plate, be used for cooperation backing plate centre gripping wafer, every adjustment mechanism all includes the telescopic link, a plurality of telescopic links are fixed respectively between a plurality of backing plate bottoms and a plurality of positioning tank bottom inner walls, every telescopic link outer wall all overlaps and is equipped with the spring, spring top and backing plate bottom fixed connection, spring bottom and positioning tank bottom inner wall fixed connection, every backing plate top all inlays and is equipped with pressure sensor.
In a preferred embodiment, a plurality of mounting holes are formed in the top of the tooling plate, and a plurality of electric push rods are respectively embedded in the plurality of mounting holes, so that stability of the electric push rods in use is improved.
In a preferred embodiment, the bottom surface of each pressing plate is fixedly provided with a silica gel pad, the bottom surface of the silica gel pad is provided with anti-slip patterns, and the bottom of the silica gel pad is contacted with the surface of the wafer top, so that the outer wall of the wafer is prevented from being crushed. .
In a preferred embodiment, the top surface of each backing plate is provided with a groove, a plurality of pressure sensors are respectively arranged in the grooves, and the tops of the pressure sensors are respectively contacted with the bottoms of the wafers for detecting the pressure of the pressing plate on the wafers.
In a preferred embodiment, the front end of the tooling plate is fixedly provided with a controller, the controller is connected with the output end of the pressure sensor, and the controller is connected with the input end of the electric push rod, so that the device is convenient to operate and control.
In a preferred embodiment, the inner wall surfaces of two sides of each positioning groove are provided with limiting grooves, limiting blocks are arranged in the two limiting grooves, and the two limiting blocks are fixed on the outer wall of the base plate to prevent the base plate from moving out of the positioning grooves.
The utility model has the technical effects and advantages that:
1. according to the utility model, the wafers are simultaneously placed in sixteen positioning grooves for processing, so that the processing efficiency is greatly improved, the rubber pad at the bottom of the pressing plate is driven by the electric push rod to contact with the dome part of the wafer, the spring support backing plate at the bottom of the backing plate is matched with the four pressing plates, the wafers are clamped in the positioning grooves for processing, the stability and the precision of the wafers in processing are improved, the pressure sensor on the backing plate detects the pressure of the pressing plate on the wafers in real time, the clamping force of the pressing plate on the wafers is conveniently adjusted, and the wafers are prevented from being damaged.
2. Through all installing the stopper in every backing plate both sides, the backing plate is when reciprocating, and the stopper of left and right sides slides in two spacing inslot respectively, plays the spacing effect of direction to the backing plate, avoids the backing plate to drop from the constant head tank, all installs the telescopic link in every spring inboard, utilizes the telescopic link to play the guide effect to the spring, avoids the spring to appear shifting when using.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a cross-sectional view of a tooling plate of the present utility model;
FIG. 3 is a schematic view of a limiting groove according to the present utility model;
FIG. 4 is a schematic view of a backing plate and spring of the present utility model;
fig. 5 is a bottom view of the platen of the present utility model.
The reference numerals are: 1. a tooling plate; 2. a positioning groove; 3. a backing plate; 4. a wafer; 5. a clamping assembly; 6. an adjusting mechanism; 7. a mounting hole; 8. a groove; 9. a controller; 10. a limit groove; 11. a limiting block;
501. an electric push rod; 502. a pressing plate; 503. a silica gel pad;
601. a telescopic rod; 602. a spring; 603. a pressure sensor.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to the accompanying drawings 1-5 of the specification, the utility model provides a multi-station precision machining tool, which comprises a tool plate 1, wherein sixteen positioning grooves 2 are formed in the top surface of the tool plate 1, a base plate 3 is arranged in each positioning groove 2, a wafer 4 to be machined is stored in the top of each base plate 3, a clamping assembly 5 is arranged above each wafer 4, an adjusting mechanism 6 is arranged at the bottom of each base plate 3 and used for adjusting the clamping force of the clamping assembly 5 on the wafer 4, each clamping assembly 5 comprises four electric push rods 501, the four electric push rods 501 are embedded in the top of the tool plate 1, and a pressing plate 502 is rotationally connected to the top end of each electric push rod 501 and used for clamping the wafer 4 by matching with the base plate 3;
specifically, each adjusting mechanism 6 comprises a telescopic rod 601, a plurality of telescopic rods 601 are respectively fixed between the bottoms of a plurality of backing plates 3 and the inner walls of the bottoms of a plurality of positioning grooves 2, a spring 602 is sleeved on the outer wall of each telescopic rod 601, the top end of each spring 602 is fixedly connected with the bottom of each backing plate 3, the bottom end of each spring 602 is fixedly connected with the inner wall of the bottom of each positioning groove 2, and a pressure sensor 603 is embedded in the top of each backing plate 3;
and every clamp plate 502 bottom surface is all fixed and is equipped with silica gel pad 503, silica gel pad 503 bottom surface processing has the anti-skidding line, silica gel pad 503 bottom and wafer 4 top surface contact, avoid pressing the outer wall of wafer 4, frock board 1 front end is fixed to be equipped with controller 9, controller 9 is connected with pressure sensor 603's output, controller 9 is connected with electric putter 501's input, conveniently controls this device.
Through setting up sixteen constant head tanks 2 on frock board 1, when processing wafer 4, the staff can place wafer 4 simultaneously in sixteen constant head tanks 2 and process, improve machining efficiency greatly, after putting wafer 4, use controller 9 control electric putter 501 drive clamp plate 502 moves down, make the rubber pad of clamp plate 502 bottom and wafer 4 top contact, the spring 602 support backing plate 3 of backing plate 3 and four clamp plate 502 cooperation, press from both sides wafer 4 in constant head tank 2 and process, avoid wafer 4 to rock the precision that influences processing when processing, and the pressure sensor 603 at backing plate 3 top detects the pressure of clamp plate 502 to wafer 4 in real time, and give controller 9 with pressure value transmission, when detecting pressure too big, control electric putter 501 drive clamp plate 502 moves up, when detecting pressure too little, control electric putter 501 drive clamp plate 502 moves down, can realize the regulation to wafer 4 clamping force, avoid causing the damage of cutter and wafer 4, and simple structure, it is very convenient to use.
Referring to fig. 1-5 of the specification, the utility model provides a multi-station precision machining tool, wherein a plurality of mounting holes 7 are formed in the top of a tool plate, a plurality of electric push rods 501 are respectively embedded in the plurality of mounting holes 7, so that stability of the electric push rods 501 in use is improved, grooves 8 are formed in the top surface of each backing plate 3, a plurality of pressure sensors 603 are respectively arranged in the plurality of grooves 8, and the tops of the plurality of pressure sensors 603 are respectively contacted with the bottoms of a plurality of wafers 4 and are used for detecting pressure of a pressing plate 502 on the wafers 4;
and limiting grooves 10 are formed in the inner wall surfaces of two sides of each positioning groove 2, limiting blocks 11 are arranged in the two limiting grooves 10, and the two limiting blocks 11 are fixed on the outer wall of the base plate 3 to prevent the base plate 3 from moving out of the positioning grooves 2.
Through all installing stopper 11 in every backing plate 3 both sides, when backing plate 3 reciprocates, the stopper 11 of left and right sides slides in two spacing grooves 10 respectively, plays the spacing effect of direction to backing plate 3, avoids backing plate 3 to drop from constant head tank 2, all installs telescopic link 601 in every spring 602 inboard, utilizes telescopic link 601 to play the guide effect to spring 602, avoids spring 602 to appear the skew when using.
Finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.

Claims (6)

1. The utility model provides a multistation precision machining frock, includes frock board (1), its characterized in that: sixteen positioning grooves (2) are formed in the top surface of the tooling plate (1), base plates (3) are arranged in each positioning groove (2), wafers (4) to be processed are stored at the tops of the base plates (3), clamping assemblies (5) are arranged above each wafer (4), and adjusting mechanisms (6) are arranged at the bottoms of the base plates (3);
each clamping assembly (5) comprises four electric push rods (501), the four electric push rods (501) are embedded in the top of the tooling plate (1), and the top end of each electric push rod (501) is rotationally connected with a pressing plate (502);
every adjustment mechanism (6) all includes telescopic link (601), and a plurality of telescopic links (601) are fixed respectively between a plurality of backing plates (3) bottom and a plurality of constant head tank (2) bottom inner wall, and every telescopic link (601) outer wall all overlaps and is equipped with spring (602), spring (602) top and backing plate (3) bottom fixed connection, spring (602) bottom and constant head tank (2) bottom inner wall fixed connection, every backing plate (3) top all inlays and is equipped with pressure sensor (603).
2. The multi-station precision machining tool according to claim 1, wherein: a plurality of mounting holes (7) have been seted up at frock board top, and a plurality of electric putter (501) inlay respectively and establish in a plurality of mounting holes (7), improve electric putter (501) stability when using.
3. The multi-station precision machining tool according to claim 1, wherein: the bottom surface of each pressing plate (502) is fixedly provided with a silica gel pad (503), the bottom surface of each silica gel pad (503) is provided with anti-slip patterns, and the bottom of each silica gel pad (503) is contacted with the top surface of the wafer (4) so as to avoid crushing the outer wall of the wafer (4).
4. The multi-station precision machining tool according to claim 1, wherein: grooves (8) are formed in the top surface of each backing plate (3), a plurality of pressure sensors (603) are respectively arranged in the grooves (8), and the tops of the pressure sensors (603) are respectively contacted with the bottoms of the wafers (4) and are used for detecting the pressure of the pressing plate (502) on the wafers (4).
5. The multi-station precision machining tool according to claim 1, wherein: the front end of the tooling plate (1) is fixedly provided with a controller (9), the controller (9) is connected with the output end of the pressure sensor (603), and the controller (9) is connected with the input end of the electric push rod (501).
6. The multi-station precision machining tool according to claim 1, wherein: limiting grooves (10) are formed in the inner wall surfaces of two sides of each positioning groove (2), limiting blocks (11) are arranged in the two limiting grooves (10), and the two limiting blocks (11) are fixed on the outer wall of the base plate (3) to prevent the base plate (3) from moving out of the positioning grooves (2).
CN202320659620.0U 2023-03-29 2023-03-29 Multi-station precision machining tool Active CN219819418U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320659620.0U CN219819418U (en) 2023-03-29 2023-03-29 Multi-station precision machining tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320659620.0U CN219819418U (en) 2023-03-29 2023-03-29 Multi-station precision machining tool

Publications (1)

Publication Number Publication Date
CN219819418U true CN219819418U (en) 2023-10-13

Family

ID=88246984

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320659620.0U Active CN219819418U (en) 2023-03-29 2023-03-29 Multi-station precision machining tool

Country Status (1)

Country Link
CN (1) CN219819418U (en)

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