CN219066776U - Semiconductor packaging bonding wire device - Google Patents
Semiconductor packaging bonding wire device Download PDFInfo
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- CN219066776U CN219066776U CN202221681913.0U CN202221681913U CN219066776U CN 219066776 U CN219066776 U CN 219066776U CN 202221681913 U CN202221681913 U CN 202221681913U CN 219066776 U CN219066776 U CN 219066776U
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Abstract
The utility model discloses a semiconductor packaging bonding wire device, which comprises: the welding wire plate is provided with a sliding groove in the middle, a sliding column is arranged in the sliding groove, a packaging device is connected to the sliding column, a moving device is arranged at the connecting end of the packaging device and the sliding column, the moving device comprises a sliding rail and a friction piece arranged in the sliding rail, a fixed column is arranged on one side of the welding wire plate, a fixed rod is connected to the fixed column in a sliding manner, the packaging device can be fixed on the fixed rod, a driving motor is arranged in the fixed rod, and the driving motor is used for driving the fixed rod to slide on the fixed column; be provided with drive assembly in the slip post, drive assembly can drive the slip post and remove in the spout, and sealing device can be at the last mobile device of slip post and do longitudinal movement, and the slip post can be at bonding wire board middle part lateral movement, makes it form XYZ triaxial and removes and adjust sealing device to improve the soldering tin progress, and can remove the welding mode of encapsulation and further improved work efficiency.
Description
Technical Field
The utility model relates to the field of semiconductor bonding wires, in particular to a semiconductor packaging bonding wire device.
Background
Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the wafer front process is cut into small wafers after the dicing process, then the cut wafers are attached to corresponding substrate frames by using glue, then bonding pads of the wafers are connected to corresponding pins of the substrate by using superfine metal wires or conductive resin, required circuits are formed, then the independent wafers are packaged and protected by using a plastic shell, the situation that bonding wires cannot be formed when the semiconductor bonding wire device faces semiconductors with smaller volumes is frequently caused, and the position accuracy requirement on the bonding wires is high in the bonding wire process, so that the situation that the defective rate is high and the efficiency is too low easily occurs in the batch production process is caused, and the novel semiconductor packaging device is provided to solve the problems in the prior art.
Disclosure of Invention
The utility model overcomes the defects of the prior art and provides a semiconductor packaging bonding wire device.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a semiconductor package wire bonding apparatus comprising: a semiconductor package wire bonding apparatus comprising: the welding wire plate is characterized in that a sliding groove is formed in the middle of the welding wire plate, a sliding column is arranged in the sliding groove, a packaging device is connected to the sliding column, a moving device is arranged at the connecting end of the packaging device and the sliding column, the moving device comprises a sliding rail and a friction piece arranged in the sliding rail, an adjusting piece is connected to the friction piece in a sliding manner, and the friction force of the friction piece in the sliding rail can be adjusted by the adjusting piece;
a fixed column is arranged on one side of the welding wire plate, the position of the fixed column is opposite to the sliding column, a fixed rod is connected to the fixed column in a sliding manner, the packaging device can be fixed on the fixed rod, a driving motor is arranged in the fixed rod, and the driving motor is used for driving the fixed rod to slide on the fixed column;
the sliding column is internally provided with a driving assembly, and the driving assembly can drive the sliding column to move in the sliding groove.
In a preferred embodiment of the present utility model, the packaging groove includes a tray and a cover plate connected by a positioning machine, wherein a plurality of fixing grooves are arranged on the tray, and the size of the fixing grooves is adapted to the size of the semiconductor.
In a preferred embodiment of the present utility model, the edge of the fixing groove is raised, and the raised part is located at the inner edge of the fixing groove.
In a preferred embodiment of the utility model, the positioning machine comprises a magnetic block and a suction groove for placing the magnetic block, wherein the suction groove is arranged between the tray and the cover plate, and the magnetic block magnetically attracts the tray, so that the semiconductor in the fixing groove is pressed on the tray.
In a preferred embodiment of the present utility model, the sliding rail is provided with a through hole, one end of the adjusting member can move in the through hole, and the other end of the adjusting member is connected to the friction member, so that the friction member can move.
In a preferred embodiment of the present utility model, a ball is disposed at the bottom end of the sliding column, and a rolling groove adapted to the ball is disposed in the sliding groove.
In a preferred embodiment of the present utility model, a heat dissipation port is disposed in the packaging groove, and an insulating sheet is disposed on an inner wall of the heat dissipation port.
In a preferred embodiment of the present utility model, the friction member includes an elastic sheet and a mute sheet, the elastic sheet is accommodated in the mute sheet, the mute sheet is slidably connected to the sliding rail, and the sliding friction force between the mute sheet and the sliding rail can be changed after the adjustment member rotates.
In a preferred embodiment of the utility model, the tray is provided with a positioning pin, the cover plate is provided with a positioning hole matched with the positioning pin, and the positioning between the tray and the cover plate is realized through the matching of the positioning pin and the positioning hole.
In a preferred embodiment of the present utility model, the bonding wire plate is disposed on a base, fixing angles are disposed around the base, and anti-slip pads are disposed at bottoms of the fixing angles.
The utility model solves the defects existing in the background technology, and has the following beneficial effects:
(1) According to the utility model, the sliding column is arranged on one side of the bonding wire plate, the packaging device is connected to the sliding column, the packaging device can longitudinally move on the moving device on the sliding column, and the sliding column can transversely move in the middle of the bonding wire plate, so that the bonding wire plate forms an XYZ triaxial movement adjustment packaging device, the soldering tin progress is improved, and the working efficiency is further improved by a welding mode of movable packaging.
(2) According to the utility model, the friction piece is arranged in the sliding rail, the friction piece is connected with the adjusting piece, the movement relation between the sliding rail and the friction piece can be adjusted by rotating the adjusting piece, so that the sliding friction force between the friction piece and the sliding rail can be adjusted, the packaging device and the sliding rail can be positioned immediately under the condition that the sliding friction force between the packaging device and the friction piece is large, the relative sliding between the packaging device and the sliding rail is facilitated when the sliding friction between the packaging device and the friction piece is small, and the sliding friction force between the friction piece and the sliding rail can be adjusted by rotating the adjusting piece by the packaging device, so that the friction force is convenient to adjust and the operation is simple.
(3) The tray is provided with the plurality of fixing grooves for fixing the semiconductor to be processed, so that the chip can be kept stable when the small-size semiconductor bonding wires are packaged, the key positions are protected, the large-scale production in industry is facilitated, meanwhile, the positioning mechanism is arranged between the cover plate and the tray, and the problems that the small-size product cannot be fixed, vibration and the bonding wire position are inaccurate in the bonding wire process are solved through attractive force between the magnetic block and the cover plate.
Drawings
The utility model is further described below with reference to the drawings and examples;
fig. 1 is a perspective view of a wire bonding apparatus according to a preferred embodiment of the present utility model;
fig. 2 is a perspective view of a bonding wire plate according to a preferred embodiment of the present utility model.
In the figure: 1. a sliding column; 2. a chute; 3. a wire bonding plate; 31. a packaging groove; 310. a tray; 3101. a fixing groove; 4. fixing the column; 5. a fixed rod; 6. a base; 7. fixing the angle; 8. packaging means; 9. a slide rail.
Detailed Description
The utility model will now be described in further detail with reference to the drawings and examples, which are simplified schematic illustrations of the basic structure of the utility model, which are presented only by way of illustration, and thus show only the structures that are relevant to the utility model.
As shown in fig. 1-2, a semiconductor package wire bonding apparatus includes: a semiconductor package wire bonding apparatus comprising: the welding wire plate 3 and a plurality of packaging grooves 31 arranged on the welding wire plate 3 are characterized in that a sliding groove 2 is formed in the middle of the welding wire plate 3, a sliding column 1 is arranged in the sliding groove 2, a packaging device 8 is connected to the sliding column 1, a moving device is arranged at the connecting end of the packaging device 8 and the sliding column 1, the moving device comprises a sliding rail 9 and a friction piece arranged in the sliding rail 9, an adjusting piece is connected to the friction piece in a sliding manner, and the friction force of the friction piece in the sliding rail 9 can be adjusted by the adjusting piece; a fixed column 4 is arranged on one side of the welding wire plate 3, the position of the fixed column 4 is opposite to that of the sliding column 1, a fixed rod 5 is connected to the fixed column 4 in a sliding manner, the packaging device 8 can be fixed on the fixed rod 5, a driving motor is arranged in the fixed rod 5, and the driving motor is used for driving the fixed rod 5 to slide on the fixed column 4; a driving component is arranged in the sliding column 1, and the driving component can drive the sliding column 1 to move in the sliding groove 2.
Through setting up sliding column 1 in bonding wire board 3 one side, connect encapsulation device 8 on sliding column 1, encapsulation device 8 can be on sliding column 1 mobile device do longitudinal movement, sliding column 1 can do lateral shifting at bonding wire board 3 middle part, makes it form XYZ triaxial and removes and adjust encapsulation device 8 to improve the soldering tin progress, and can remove the welding mode of encapsulation further improved work efficiency.
In a preferred embodiment of the present utility model, the packaging groove 31 includes a tray 310 and a cover plate connected by a positioning machine, and a plurality of fixing grooves 3101 are provided on the tray 310, and the size of the fixing grooves 3101 is adapted to the size of the semiconductor. Through set up a plurality of fixed slot 3101 and be used for fixed pending semiconductor on tray 310, can keep the chip stable, have the guard action to the critical position when making its small-size semiconductor bonding wire encapsulation, be favorable to in industry mass production, set up positioning mechanism simultaneously between apron and tray 310, through the appeal between magnetic path and the apron, solved the unable fixed, vibration in bonding wire in-process of small-size product, the inaccurate scheduling problem in bonding wire position, have simple structure, convenient operation, low in cost, advantages such as production efficiency height.
In a preferred embodiment of the present utility model, the edge of the fixing groove 3101 is protruded, and the protrusion is located at the inner edge of the fixing groove 3101.
In a preferred embodiment of the present utility model, the positioning machine includes a magnetic block and a suction groove for placing the magnetic block, the suction groove is disposed between the tray 310 and the cover plate, and the magnetic block magnetically sucks the tray 310, so that the semiconductor in the fixing groove 3101 is pressed on the tray 310.
In a preferred embodiment of the present utility model, the sliding rail 9 is provided with a through hole, one end of the adjusting member can move in the through hole, and the other end of the adjusting member is connected with the friction member, so that the friction member can move.
In a preferred embodiment of the present utility model, the bottom end of the sliding column 1 is provided with a ball, and the sliding groove 2 is provided with a rolling groove matched with the ball.
In a preferred embodiment of the present utility model, a heat dissipation opening is disposed in the packaging groove 31, and an insulating sheet is disposed on an inner wall of the heat dissipation opening.
In a preferred embodiment of the present utility model, the friction member includes an elastic piece and a mute piece, the elastic piece is accommodated in the mute piece, the mute piece is slidably connected to the sliding rail 9, and the sliding friction force between the mute piece and the sliding rail 9 can be changed after the adjusting member rotates.
In a preferred embodiment of the present utility model, the tray 310 is provided with a positioning pin, the cover plate is provided with a positioning hole matched with the positioning pin, and the positioning between the tray 310 and the cover plate is realized through the matching of the positioning pin and the positioning hole.
In a preferred embodiment of the present utility model, the bonding wire plate 3 is disposed on the base 6, the fixing angle 7 is disposed around the base 6, and the anti-slip pad is disposed at the bottom of the fixing angle 7.
The friction piece is arranged in the sliding rail 9, the friction piece is connected with the adjusting piece, the motion relation between the sliding rail 9 and the friction piece can be adjusted through rotating the adjusting piece, so that the sliding friction force between the friction piece and the sliding rail 9 can be adjusted, the packaging device 8 and the sliding rail 9 can be positioned in real time under the condition that the sliding friction force between the packaging device 8 and the friction piece is large, the packaging device 8 and the sliding rail 9 can slide relatively conveniently when the sliding friction between the packaging device 8 and the friction piece is small, the sliding friction force between the friction piece and the sliding rail 9 can be adjusted through rotation of the adjusting piece by the packaging device 8, and the friction force can be adjusted conveniently and is easy to operate.
The above-described preferred embodiments according to the present utility model are intended to suggest that, from the above description, various changes and modifications can be made by the person skilled in the art without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. A semiconductor package wire bonding apparatus comprising: the bonding wire board and a plurality of packaging grooves arranged on the bonding wire board are characterized in that,
the middle part of the welding wire plate is provided with a sliding groove, a sliding column is arranged in the sliding groove, a packaging device is connected to the sliding column, a moving device is arranged at the connecting end of the packaging device and the sliding column, the moving device comprises a sliding rail and a friction piece arranged in the sliding rail, an adjusting piece is connected to the friction piece in a sliding manner, and the friction piece can adjust the friction force of the friction piece in the sliding rail;
a fixed column is arranged on one side of the welding wire plate, the position of the fixed column is opposite to the sliding column, a fixed rod is connected to the fixed column in a sliding manner, the packaging device can be fixed on the fixed rod, a driving motor is arranged in the fixed rod, and the driving motor is used for driving the fixed rod to slide on the fixed column;
the sliding column is internally provided with a driving assembly, and the driving assembly can drive the sliding column to move in the sliding groove.
2. The semiconductor package bonding wire apparatus of claim 1, wherein: the packaging groove comprises a tray and a cover plate connected through a positioning machine, wherein a plurality of fixing grooves are formed in the tray, and the sizes of the fixing grooves are matched with the sizes of semiconductors.
3. The semiconductor package bonding wire apparatus of claim 2, wherein: the edge of the fixing groove is convex, and the convex is positioned at the inner edge of the fixing groove.
4. The semiconductor package bonding wire apparatus of claim 2, wherein: the positioning machine comprises a magnetic block and a suction groove for placing the magnetic block, wherein the suction groove is arranged between the tray and the cover plate, and the magnetic block magnetically attracts the tray, so that a semiconductor in the fixing groove is tightly pressed on the tray.
5. The semiconductor package bonding wire apparatus of claim 1, wherein: the sliding rail is provided with a through hole, one end of the adjusting piece can move in the through hole, and the other end of the adjusting piece is connected with the friction piece, so that the friction piece can move.
6. The semiconductor package bonding wire apparatus of claim 1, wherein: the bottom end of the sliding column is provided with a ball, and a rolling groove matched with the ball is arranged in the sliding groove.
7. The semiconductor package bonding wire apparatus of claim 1, wherein: and a heat radiation opening is arranged in the packaging groove, and an insulating sheet is arranged on the inner wall of the heat radiation opening.
8. The semiconductor package bonding wire apparatus of claim 1, wherein: the friction piece comprises an elastic piece and a mute piece, wherein the elastic piece is accommodated in the mute piece, the mute piece is connected with the sliding rail in a sliding mode, and the sliding friction force between the mute piece and the sliding rail can be changed after the adjusting piece rotates.
9. The semiconductor package bonding wire apparatus of claim 2, wherein: the tray is provided with a locating pin, the cover plate is provided with a locating hole matched with the locating pin, and the locating pin is matched with the locating hole to realize the locating between the tray and the cover plate.
10. The semiconductor package bonding wire apparatus of claim 1, wherein: the bonding wire board sets up on the base, the base is provided with fixed angle all around, fixed angle bottom is provided with the slipmat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221681913.0U CN219066776U (en) | 2022-06-30 | 2022-06-30 | Semiconductor packaging bonding wire device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221681913.0U CN219066776U (en) | 2022-06-30 | 2022-06-30 | Semiconductor packaging bonding wire device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219066776U true CN219066776U (en) | 2023-05-23 |
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ID=86362971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221681913.0U Active CN219066776U (en) | 2022-06-30 | 2022-06-30 | Semiconductor packaging bonding wire device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219066776U (en) |
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2022
- 2022-06-30 CN CN202221681913.0U patent/CN219066776U/en active Active
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