CN102655193A - Translation-type chip flip device - Google Patents

Translation-type chip flip device Download PDF

Info

Publication number
CN102655193A
CN102655193A CN201210145727XA CN201210145727A CN102655193A CN 102655193 A CN102655193 A CN 102655193A CN 201210145727X A CN201210145727X A CN 201210145727XA CN 201210145727 A CN201210145727 A CN 201210145727A CN 102655193 A CN102655193 A CN 102655193A
Authority
CN
China
Prior art keywords
film releasing
sheet
chip
vertical
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210145727XA
Other languages
Chinese (zh)
Inventor
何田
姜凯
韩笑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MU2 PAK (WUXI) SEMICONDUCTOR EQUIPMENT CO Ltd
Original Assignee
MU2 PAK (WUXI) SEMICONDUCTOR EQUIPMENT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MU2 PAK (WUXI) SEMICONDUCTOR EQUIPMENT CO Ltd filed Critical MU2 PAK (WUXI) SEMICONDUCTOR EQUIPMENT CO Ltd
Priority to CN201210145727XA priority Critical patent/CN102655193A/en
Publication of CN102655193A publication Critical patent/CN102655193A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a translation-type chip flip device comprising a chip picking mechanism and a chip releasing mechanism, wherein the chip picking mechanism is driven to go up and down in the vertical direction by virtue of one linear motor; the chip releasing mechanism is driven to go up and down in the vertical direction and to move in the longitudinal direction in a plane by virtue of two linear motors respectively; a blue chip film is hung upside down on the chip picking and releasing mechanisms, and chips of the blue chip film are downward; an package substrate is positioned below the chip picking and releasing mechanisms; the chip picking mechanism is upward to pick the chips with downward bumps on the blue chip film; and the chip releasing mechanism is downward to pick the chips from the chip picking mechanism and then is downward to adhere the chips on the package substrate in a manner of respectively aligning the bumps of the chips to a pad of the package substrate. The translation-type chip flip device can be used for picking, turning and placing the high-speed chips by virtue of small-stroke translational motion, thus improving the speed and precision of chip flip operation, and reducing the floor space to lower the using cost. The translation-type chip flip device is applicable to an LED (light-emitting diode) and integrated-circuit flip chip bonding machine and other electromechanical devices with the need of high-speed precious flip operation.

Description

Parallel-moving type flip-chip device
Technical field
The present invention relates to a kind of parallel-moving type flip-chip device; This device has realized only accomplishing through little stroke translational motion high-speed picking-up, upset and the placement of chip, is applicable to the electromechanical equipment that LED and IC chip back bonding machine and other have the high speed and precision flip-chip operation to need.
Background technology
Flip-chip bonding machine is to spin upside down then the crucial production equipment of semiconductor device that is connected the salient point on the bare chip with pad contraposition on the base plate for packaging after bare chip is picked up.The flip-chip bonding technology has obtained increasing application because it distinctively is electrically connected that the path is short, pin number is big and advantage such as area of dissipation is big in the encapsulation of high frequency, many pins, high-power integrated circuit.In the high brightness, high-power LED encapsulation that with the sapphire are substrate, the flip-chip technology Sapphire Substrate that led chip is transparent is upwards placed, and is convenient to the light that led chip produces and appears; Bigger contact area is convenient to the heat radiation of chip between while chip and the substrate.Flip-chip technology is obtaining number of applications as the encapsulation solution of high brightness, the logical photosensitiveness of great power LED and fine heat radiation property.The flip-chip device of flip-chip bonding machine is accomplished picking up, spin upside down and placing of bare chip, is the critical component of flip-chip bonding machine.The existing chip flipped device adopt pick up the sheet arm pick up behind the chip that salient point makes progress around horizontal rotating shaft chip is turned over from bottom to top turnback thereafter by the film releasing arm from after picking up the sheet arm to pick up the downward chip of salient point with the mode of chip bump and each artoregistration of base plate for packaging pad with the mode of die bonding to the base plate for packaging; Not only the long stroke upset of 180 of chip degree has reduced production efficiency of equipment; The labyrinth that picks up translation simultaneously of sheet arm and rotation has reduced positioning accuracy; And pick up sheet arm and film releasing arm and all above blue film of chip bearing and base plate for packaging, operate simultaneously; The workbench of blue film and substrate can't compact superpose; Cause the translational motion stroke of flip-chip device long and occupation area of equipment is bigger, reduced the use cost that production efficiency of equipment has also increased equipment.Existingly carry out 180 degree behind the sheet arm pick-up chip and spin upside down then that the film releasing arm can't satisfy the requirement to speed and precision and use cost that flip-chip bonding machine improves day by day with chip and the bonding flip-chip device scheme of base plate for packaging contraposition after picking up sheet arm pick-up chip based on picking up.
Summary of the invention
The purpose of this invention is to provide a kind of parallel-moving type flip-chip device, solve the speed and the not enough problem of precision of existing flip-chip device; Also solve the problem that flip-chip plant area area is big, use cost is high.
Technical scheme of the present invention:
This parallel-moving type flip-chip device be included under the linear electric motor vertically go up and down pick up sheet mechanism and under two linear motor driving, vertically go up and down respectively and horizontal plane in the film releasing mechanism that vertically moves; The blue film of chip is hung by the feet in picking up on sheet and the film releasing mechanism with the downward mode of chip; Base plate for packaging is positioned at and picks up sheet and film releasing mechanism below, it is characterized in that:
Picking up the sheet lifting motor is linear electric machine; Its stator is fixed on the ten sheet mechanism base; Its mover is fixed on the ten sheet lifting motor connectors; Pick up sheet lifting motor connector and be fixed on the ten sheet mechanism base through slide block and guide rail, an end that picks up the sheet arm is fixed on the ten sheet lifting motor connectors, is separately fixed at the positional information that ten sheet lifting motor connectors and the grating chi and the read head that pick up on the sheet mechanism base provide ten sheet arms; Pick up the sheet lifting motor and drive and to pick up the sheet arm and do elevating movement, pick up the terminal suction nozzle of sheet arm and upwards after the blue film of the chip of hanging by the feet picks up the downward chip of salient point, pick up the decline of sheet arm through picking up sheet lifting motor connector; The film releasing lifting motor is a linear electric machine, and its stator is fixed on the film releasing mechanism base, and its mover is fixed on the film releasing lifting motor connector, and film releasing lifting motor connector is fixed on the film releasing mechanism base through slide block and guide rail; The vertical motor of film releasing is a linear electric machine, and its stator is fixed on the film releasing mechanism base, and its mover is fixed on the vertical motor connector of film releasing, and the vertical motor connector of film releasing is fixed on the quadrature keyset through vertical switching slide block and guide rail; The quadrature keyset is fixed on the film releasing lifting motor connector through vertical switching slide block and guide rail; One end of film releasing arm is fixed on the quadrature keyset; Be separately fixed at the vertical position information that grating chi and read head on film releasing lifting motor connector and the film releasing mechanism base provide the film releasing arm, be separately fixed at the longitudinal position information that grating chi and read head on vertical motor connector of film releasing and the film releasing mechanism base provide the film releasing arm; The film releasing lifting motor is through film releasing lifting motor connector, vertically transfer slide block and guide rail, quadrature keyset drives the film releasing arm and do elevating movement; The vertical motor of film releasing is through the vertical motor connector of film releasing, vertically transfer slide block and guide rail, quadrature keyset drives the film releasing arm and do the lengthwise movement in the horizontal plane; The quadrature keyset reaches fixing vertical switching slide block and guide rail on it and reaches the decoupling zero that vertically transfer slide block and guide rail have been realized vertical and vertical two orthogonal motions of level, and the film releasing arm is the vertical and horizontal lengthwise movement in edge simultaneously under the driving of film releasing lifting motor and the vertical motor of film releasing; The film releasing arm at first through horizontal lengthwise movement arrive pick up the sheet arm directly over descend then; Use its terminal suction nozzle to pick up the downward chip of salient point from picking up the sheet arm; Rise then and horizontally vertically move one section very little but the distance back that is enough to avoid to pick up the sheet arm descend, with the mode of chip bump and each artoregistration of base plate for packaging pad with die bonding to base plate for packaging.
The placement that superposes fully up and down of the workbench of blue film of said chip and base plate for packaging.
Above-mentioned sheet mechanism base and the film releasing mechanism base of picking up can be fixed and the blue film workbench of chip and base plate for packaging workbench are made vertical, horizontal by motor-driven respectively and moved and pick up sheet and film releasing position to reach next in horizontal plane; Also can chip blue film workbench is motionless and pick up sheet mechanism base and film releasing mechanism base and in horizontal plane, make vertical, horizontal by motor-driven respectively and move and pick up sheet and film releasing position to reach next with the base plate for packaging stationary table, and vertical motor of film releasing and corresponding decoupling mechanism can save in this case.
Above-mentioned when picking up the fixed and blue film workbench of chip of sheet mechanism and film releasing mechanism and base plate for packaging workbench and doing horizontal vertical, horizontal motion, pick up that the lateral separation in the horizontal plane can be through picking up the accurate thread slide unit manual adjustments under the sheet mechanism base and locking between sheet mechanism and the film releasing mechanism.
Above-mentioned base plate for packaging can be various ways such as metal lead wire frame, printed substrate, Scroll carrier band and wafer.
The present invention has cancelled the long stroke flip-flop movement of 180 degree of existing flip-chip device, has shortened the processing time and has simplified the structure of picking up the sheet arm, thereby improved the speed and the precision of installing simultaneously.The compact layout that the present invention adopts the workbench of blue film of chip and base plate for packaging to superpose has fully up and down been dwindled the floor space of flip-chip device, thereby has reduced the use cost of device; Up and down the blue film of the chip of stack and the workbench of base plate for packaging try one's best each other near, can shorten the stroke of ten sheet mechanisms and the translational motion of film releasing mechanism, further improve the speed of device.
Description of drawings
Fig. 1 is a general assembly schematic three dimensional views of the present invention;
Fig. 2 is the sheet mechanism structure figure that picks up of the present invention;
Fig. 3 is film releasing mechanism structure figure of the present invention.
1-picks up sheet mechanism; 2-film releasing mechanism; 3-base plate for packaging workbench; The blue film of 4-chip; The 5-base plate for packaging; 6-picks up sheet lifting motor stator; 7-picks up sheet lifting motor mover; 8-picks up the sheet vertical guide; 9-picks up the vertical slide block of sheet; 10-picks up the sheet mechanism base; 11-picks up sheet lifting motor connector; 12-picks up sheet up-down grating chi; 13-picks up sheet up-down read head; 14-picks up the sheet suction nozzle; 15-picks up the sheet arm; 16-film releasing lifting motor stator; 17-film releasing lifting motor mover; 18-film releasing lifting motor connector; 19-film releasing vertical guide; The vertical slide block of 20-film releasing; 21-film releasing up-down grating chi; 22-film releasing up-down read head; The vertical read head of 23-film releasing; The vertical grating chi of 24-film releasing; 25-film releasing mechanism base; The 26-slide block of vertically transferring; 27-quadrature keyset; The 28-guide rail of vertically transferring; The 29-guide rail of vertically transferring; The 30-slide block of vertically transferring; The vertical motor connector of 31-film releasing; 32-film releasing suction nozzle; 33-film releasing arm; The vertical electric mover of 34-film releasing; The vertical motor stator of 35-film releasing.
Embodiment
Embodiment is referring to Fig. 1,2,3.Structure of the present invention: comprise ten sheet mechanisms 1 and film releasing mechanism 2, the blue film 4 of chip is hung by the feet in picking up on sheet mechanism 1 and the film releasing mechanism 2 with the downward mode of chip, and base plate for packaging 5 is positioned at ten sheet mechanisms 1 and film releasing mechanism 2 belows with base plate for packaging workbench 3; Picking up sheet lifting motor stator 6 is fixed on the ten sheet mechanism base 10; Picking up sheet lifting motor mover 7 is fixed on the ten sheet lifting motor connectors 11; Picking up the vertical slide block 9 of sheet is fixed on the ten sheet lifting motor connectors 11; With pick up the sheet vertical guide 8 of picking up that the vertical slide block 9 of sheet cooperates and be fixed on the ten sheet mechanism base 10; Picking up the vertical slide block 9 of sheet is that the interconnective sheet lifting motor mover 7 that picks up provides guiding and supporting with the elevating movement of picking up sheet lifting motor connector 11 with picking up sheet vertical guide 8; An end that picks up sheet arm 15 is fixed on the ten sheet lifting motor connectors 11; Be separately fixed at ten sheet lifting motor connectors 11 and pick up picking up sheet up-down grating chi 12 and picking up the positional information that sheet up-down read head 13 provides ten sheet arms 15 on the sheet mechanism base 10, pick up sheet lifting motor (stator 6 and mover 7) and drive and pick up sheet arm 15 and do elevating movement, pick up the sheet arm 15 terminal sheet suction nozzles 14 that pick up and upwards after the blue film 4 of the chip of hanging by the feet picks up the downward chip of salient point, pick up 15 declines of sheet arm through picking up sheet lifting motor connector 11; Film releasing lifting motor stator 16 is fixed on the film releasing mechanism base 25; Film releasing lifting motor mover 17 is fixed on the film releasing lifting motor connector 18; The vertical slide block 20 of film releasing is fixed on the film releasing lifting motor connector 18; The film releasing vertical guide 19 that cooperates with the vertical slide block 20 of film releasing is fixed on the film releasing mechanism base 25, and the vertical slide block of film releasing 20 and film releasing vertical guide 19 provide guiding and supporting for the elevating movement of interconnective film releasing lifting motor mover 17, film releasing lifting motor connector 18 and quadrature keyset 27; The vertical motor stator 35 of film releasing is fixed on the film releasing mechanism base 25; The vertical electric mover 34 of film releasing is fixed on the vertical motor connector 31 of film releasing; Vertical switching slide block 30 is fixed on the vertical motor connector 31 of film releasing, and the vertical switching guide rail 28 that cooperates with vertical switching slide block 30 is fixed on the quadrature keyset 27; Vertically switching slide block 26 is fixed on the quadrature keyset 27; The vertical switching guide rail 29 that cooperates with vertical switching slide block 26 is fixed on the film releasing lifting motor connector 18; Vertically switching slide block 26 and vertical switching guide rail 29 provide guiding and supporting for the lengthwise movement of the vertical electric mover of interconnective film releasing 34, the vertical motor connector 31 of film releasing and quadrature keyset 27; One end of film releasing arm 33 is fixed on the quadrature keyset 27; Be separately fixed at film releasing up-down grating chi 21 and film releasing up-down read head 22 on film releasing lifting motor connector 18 and the film releasing mechanism base 25 the vertical position information of film releasing arm 33 is provided, be separately fixed at the longitudinal position information that the vertical motor connector 31 of film releasing and vertical grating chi 24 of the film releasing on the film releasing mechanism base 25 and the vertical read head 23 of film releasing provide film releasing arm 33; Film releasing lifting motor (stator 16 with mover 17) is through film releasing lifting motor connector 18, vertically the transfer slide block 26 and the guide rail 29 of vertically transferring, quadrature keyset 27 drives film releasing arms 33 and do elevating movement; The vertical motor of film releasing (stator 35 with mover 34) is through the vertical motor connector of film releasing 31, vertically the transfer slide block 30 and the guide rail 28 of vertically transferring, quadrature keyset 27 drives the lengthwise movement that film releasing arms 33 are done in the horizontal plane; Quadrature keyset 27 and fixing on it vertical switching slide block 26 and vertically switching guide rail 29 and vertical switching slide block 30 and vertical switching guide rail 28 have been realized vertically the decoupling zero with vertical two orthogonal motions of level, film releasing arm 33 while vertical and horizontal lengthwise movement in edge under the driving of film releasing lifting motor (stator 16 and mover 17) and the vertical motor of film releasing (stator 35 and mover 34); Film releasing arm 33 at first through horizontal lengthwise movement arrive pick up sheet arm 15 directly over descend then; Use its terminal film releasing suction nozzle 32 to pick up the downward chip of salient point from picking up sheet arm 15; Rise then and horizontally vertically move one section very little but the distance back that is enough to avoid to pick up sheet arm 15 descend, with the mode of each artoregistration of pad of chip bump and base plate for packaging 5 with die bonding to base plate for packaging 5.
The placement that superposes fully up and down of the blue film 4 of chip and base plate for packaging workbench 3.
Picking up sheet mechanism base 10 and film releasing mechanism base 25 can be fixed and workbench of the blue film 4 of chip (for the blue film workbench of display chip details not among the figure for purpose of brevity) and base plate for packaging workbench 3 are made vertical, horizontal by motor-driven respectively and moved and pick up sheet and film releasing position to reach next in horizontal plane; Also can chip workbench and the base plate for packaging workbench 3 of blue film 4 fixed and pick up sheet mechanism base 10 and in horizontal plane, do the vertical, horizontal motion by motor-driven respectively with film releasing mechanism base 25 and pick up sheet and film releasing position to reach next, vertical motor of film releasing (stator 35 and mover 34) and corresponding decoupling mechanism (the vertical motor connector of film releasing 31, vertically transfer the slide block 30 and the guide rail 28 of vertically transferring, quadrature keyset 27, vertically the transfer slide block 26 and the guide rail 29 of vertically transferring, the vertical grating chi 24 of film releasing and the vertical read head 23 of film releasing etc.) can save (end of film releasing arm 33 directly is fixed on the film releasing lifting motor connector 18) in this case.
When the workbench that picks up the fixed and blue film 4 of chip of sheet mechanism 1 and film releasing mechanism 2 and base plate for packaging workbench 3 are done horizontal vertical, horizontal motion, pick up that the interior lateral separation of horizontal plane can be through picking up the accurate thread slide unit manual adjustments under the sheet mechanism base 10 and locking (not shown) between sheet mechanism 1 and the film releasing mechanism 2.
Base plate for packaging 5 can be various ways such as metal lead wire frame, printed substrate, Scroll carrier band and wafer.

Claims (5)

1. parallel-moving type flip-chip device; Be included under the linear electric motor vertically go up and down pick up sheet mechanism and under two linear motor driving, vertically go up and down respectively and horizontal plane in the film releasing mechanism that vertically moves; The blue film of chip is hung by the feet in picking up on sheet and the film releasing mechanism with the downward mode of chip; Base plate for packaging is positioned at and picks up sheet and film releasing mechanism below, it is characterized in that:
Picking up the sheet lifting motor is linear electric machine; Its stator is fixed on the ten sheet mechanism base; Its mover is fixed on the ten sheet lifting motor connectors; Pick up sheet lifting motor connector and be fixed on the ten sheet mechanism base through slide block and guide rail, an end that picks up the sheet arm is fixed on the ten sheet lifting motor connectors, is separately fixed at the positional information that ten sheet lifting motor connectors and the grating chi and the read head that pick up on the sheet mechanism base provide ten sheet arms; Pick up the sheet lifting motor and drive and to pick up the sheet arm and do elevating movement, pick up the terminal suction nozzle of sheet arm and upwards after the blue film of the chip of hanging by the feet picks up the downward chip of salient point, pick up the decline of sheet arm through picking up sheet lifting motor connector; The film releasing lifting motor is a linear electric machine, and its stator is fixed on the film releasing mechanism base, and its mover is fixed on the film releasing lifting motor connector, and film releasing lifting motor connector is fixed on the film releasing mechanism base through slide block and guide rail; The vertical motor of film releasing is a linear electric machine, and its stator is fixed on the film releasing mechanism base, and its mover is fixed on the vertical motor connector of film releasing, and the vertical motor connector of film releasing is fixed on the quadrature keyset through vertical switching slide block and guide rail; The quadrature keyset is fixed on the film releasing lifting motor connector through vertical switching slide block and guide rail; One end of film releasing arm is fixed on the quadrature keyset; Be separately fixed at the vertical position information that grating chi and read head on film releasing lifting motor connector and the film releasing mechanism base provide the film releasing arm, be separately fixed at the longitudinal position information that grating chi and read head on vertical motor connector of film releasing and the film releasing mechanism base provide the film releasing arm; The film releasing lifting motor is through film releasing lifting motor connector, vertically transfer slide block and guide rail, quadrature keyset drives the film releasing arm and do elevating movement; The vertical motor of film releasing is through the vertical motor connector of film releasing, vertically transfer slide block and guide rail, quadrature keyset drives the film releasing arm and do the lengthwise movement in the horizontal plane; The quadrature keyset reaches fixing vertical switching slide block and guide rail on it and reaches the decoupling zero that vertically transfer slide block and guide rail have been realized vertical and vertical two orthogonal motions of level, and the film releasing arm is the vertical and horizontal lengthwise movement in edge simultaneously under the driving of film releasing lifting motor and the vertical motor of film releasing; The film releasing arm at first through horizontal lengthwise movement arrive pick up the sheet arm directly over descend then; Use its terminal suction nozzle to pick up the downward chip of salient point from picking up the sheet arm; Rise then and horizontally vertically move one section very little but the distance back that is enough to avoid to pick up the sheet arm descend, with the mode of chip bump and each artoregistration of base plate for packaging pad with die bonding to base plate for packaging.
2. parallel-moving type flip-chip device according to claim 1 is characterized in that: the placement that superposes fully up and down of the workbench of blue film of said chip and base plate for packaging.
3. parallel-moving type flip-chip device according to claim 1 is characterized in that: above-mentioned sheet mechanism base and the film releasing mechanism base of picking up can be fixed and the blue film workbench of chip and base plate for packaging workbench are made vertical, horizontal by motor-driven respectively and moved and pick up sheet and film releasing position to reach next in horizontal plane; Also can chip blue film workbench is motionless and pick up sheet mechanism base and film releasing mechanism base and in horizontal plane, make vertical, horizontal by motor-driven respectively and move and pick up sheet and film releasing position to reach next with the base plate for packaging stationary table, and vertical motor of film releasing and corresponding decoupling mechanism can save in this case.
4. parallel-moving type flip-chip device according to claim 1; It is characterized in that: above-mentioned when picking up the fixed and blue film workbench of chip of sheet mechanism and film releasing mechanism and base plate for packaging workbench and doing horizontal vertical, horizontal motion, pick up that the lateral separation in the horizontal plane can be through picking up the accurate thread slide unit manual adjustments under the sheet mechanism base and locking between sheet mechanism and the film releasing mechanism.
5. parallel-moving type flip-chip device according to claim 1 is characterized in that: above-mentioned base plate for packaging can be various ways such as metal lead wire frame, printed substrate, Scroll carrier band and wafer.
CN201210145727XA 2012-03-11 2012-05-11 Translation-type chip flip device Pending CN102655193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210145727XA CN102655193A (en) 2012-03-11 2012-05-11 Translation-type chip flip device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201210061438 2012-03-11
CN201210061438.1 2012-03-11
CN201210145727XA CN102655193A (en) 2012-03-11 2012-05-11 Translation-type chip flip device

Publications (1)

Publication Number Publication Date
CN102655193A true CN102655193A (en) 2012-09-05

Family

ID=46730786

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210145727XA Pending CN102655193A (en) 2012-03-11 2012-05-11 Translation-type chip flip device

Country Status (1)

Country Link
CN (1) CN102655193A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017101805A1 (en) * 2015-12-15 2017-06-22 上海微电子装备(集团)股份有限公司 Chip-bonding system and method
CN108766912A (en) * 2018-06-07 2018-11-06 大连佳峰自动化股份有限公司 Chip bonding mechanism and chip package machine
CN109095170A (en) * 2018-09-01 2018-12-28 温州市科泓机器人科技有限公司 The quick conveying of manipulator companion chip is equipped
CN109737060A (en) * 2018-11-30 2019-05-10 沈阳工业大学 Straight line motor drive type low pressure huge discharge oil-free turbo-compressor
CN111430251A (en) * 2020-04-01 2020-07-17 深圳新益昌科技股份有限公司 Tie up first solid brilliant device
CN114865878A (en) * 2022-05-05 2022-08-05 苏州艾科瑞思智能装备股份有限公司 High-speed XYZ motion platform suitable for chip taking and placing of chip loader

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017101805A1 (en) * 2015-12-15 2017-06-22 上海微电子装备(集团)股份有限公司 Chip-bonding system and method
CN108766912A (en) * 2018-06-07 2018-11-06 大连佳峰自动化股份有限公司 Chip bonding mechanism and chip package machine
CN108766912B (en) * 2018-06-07 2024-04-26 大连佳峰自动化股份有限公司 Chip binding mechanism and chip packaging machine
CN109095170A (en) * 2018-09-01 2018-12-28 温州市科泓机器人科技有限公司 The quick conveying of manipulator companion chip is equipped
CN109737060A (en) * 2018-11-30 2019-05-10 沈阳工业大学 Straight line motor drive type low pressure huge discharge oil-free turbo-compressor
CN109737060B (en) * 2018-11-30 2020-07-17 沈阳工业大学 Linear motor driven low-pressure large-displacement oil-free scroll compressor
CN111430251A (en) * 2020-04-01 2020-07-17 深圳新益昌科技股份有限公司 Tie up first solid brilliant device
CN111430251B (en) * 2020-04-01 2020-10-13 深圳新益昌科技股份有限公司 Tie up first solid brilliant device
CN114865878A (en) * 2022-05-05 2022-08-05 苏州艾科瑞思智能装备股份有限公司 High-speed XYZ motion platform suitable for chip taking and placing of chip loader
CN114865878B (en) * 2022-05-05 2023-05-23 苏州艾科瑞思智能装备股份有限公司 High-speed XYZ motion platform suitable for chip loading machine chip picking and placing

Similar Documents

Publication Publication Date Title
CN102655193A (en) Translation-type chip flip device
CN106373914B (en) Chip bonding device
KR102079082B1 (en) Electronic Component Handling Unit
CN104701199A (en) Flip chip bonding equipment
EP3306397A1 (en) Silicon wafer transportation system
KR101886923B1 (en) Die bonder and manufacturing method of semiconductor device
US20190027388A1 (en) Electronic component mounting apparatus
JP2010073924A (en) Component packaging apparatus
CN107895705B (en) Chip inversion mounting equipment
KR20130066234A (en) Fabricating method of semiconductor device and appratus for pick-up of semiconductor device used thereof
KR101044622B1 (en) Apparatus for bonding semiconductor chip
US7120995B2 (en) Apparatus for mounting semiconductors
CN104241150A (en) A flip chip surface-mount machine and a surface mount method utilizing the surface-mount machine
CN108172541B (en) Chip mounting device
KR101657531B1 (en) Unit for transferring a die, die bonder including the same and method of transferring a die
JP6093125B2 (en) Wafer cart and electronic component mounting apparatus
CN108389815A (en) A kind of flip-chip sealed in unit
CN115410939A (en) High-speed high-precision reverse loading machine
CN112349636A (en) High-precision large-board-level micro-assembly equipment
CN113451176B (en) Electronic component mounting apparatus
CN113451175B (en) Electronic component mounting apparatus
CN110648953A (en) Wafer loading equipment
CN219066776U (en) Semiconductor packaging bonding wire device
CN219106107U (en) Wafer conveying device for vertical furnace
CN210443534U (en) Wafer loading equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120905