CN104241150A - A flip chip surface-mount machine and a surface mount method utilizing the surface-mount machine - Google Patents
A flip chip surface-mount machine and a surface mount method utilizing the surface-mount machine Download PDFInfo
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- CN104241150A CN104241150A CN201410171503.5A CN201410171503A CN104241150A CN 104241150 A CN104241150 A CN 104241150A CN 201410171503 A CN201410171503 A CN 201410171503A CN 104241150 A CN104241150 A CN 104241150A
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- 238000000034 method Methods 0.000 title claims abstract description 39
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- 238000012546 transfer Methods 0.000 claims description 42
- 238000010586 diagram Methods 0.000 description 17
- 230000033001 locomotion Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 206010022000 influenza Diseases 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides a flip chip surface-mount machine and a surface mount method utilizing the surface-mount machine. According to one embodiment of the invention, the flip-chip surface-mount machine comprises an inverted-mounting head which picks a chip from a wafer and carries out inverted-mounting, a transmission head picking the chip which has been subjected to inverted-mounting from the inverted-mounting head and placing the chip at a transmission module and a surface-mount head picking the placed chip from the transmission module and mounting the chip on the surface of a substrate. The transmission head enables the chip to rotate for a predetermined angle through leftward rotating and rightward rotating, and then places the chip on the transmission module.
Description
Technical field
The present invention relates to a kind of flip-chip placement equipment and utilize the attaching method of this placement equipment, more specifically, be mounted on the flip-chip placement equipment of substrate and utilize the attaching method of this placement equipment after relating to angle needed for a kind of chip can rotation.
Background technology
Along with the fast development of technology, electric/electronic device develops to trend toward miniaturization, electronic component is also to Highgrade integration and subminaturization development, therefore, studying the technology of installing high density, microminiature surface mount part at printed circuit board (PCB) energetically, recently, the technology of flip-chip is installed in research mostly.
Fig. 1 a and Fig. 1 b is the figure that the chip that the chip connected by wire-bonded (Wire Bonding) is connected with by pedestal (Solder Bump) is shown.Fig. 2 illustrates the figure installing the process of flip-chip at substrate.
Flip-chip 5 is the devices of the mounting mat 11 electronic equipment or semiconductor device being directly mounted on substrate 10 with upside-down mounting (face-down) form.When described flip-chip 5 is mounted on substrate 10, be electrically connected by the conductive salient point (bump) 7 being formed at the surface 6 of chip 5.When chip 5 is mounted on substrate, with back-off mode chip 5, therefore be called flip-chip 5.
Because flip-chip 5 does not need lead-in wire 3 to engage, therefore its size is very little compared with the general chip 1 through wire bonding technique.And for wire-bonded, the chip 1 that lead-in wire 3 engages and substrate 10 once can only be bonding one, and flip-chip 5 can perform, and can reduce expenses compared with the chip 1 that therefore flip-chip 5 and lead-in wire 3 engage simultaneously.And connecting length is short compared to wire-bonded, therefore, performance is also improved.
Fig. 3 illustrates the figure being formed with the technique of the chip of salient point in substrate installation in order.
According to Fig. 3, after wafer-separate chip 5, back-off (flip) chip 5 makes position, top and bottom upside-down mounting (bumping).The mounting head (omitting diagram) of placement equipment adsorbs the chip 5 of upside-down mounting and moves to assigned position, and if desired, heating is formed with the face (" backflow " with reference to Fig. 3) of salient point 7.If desired, cosolvent 15 (" welding " with reference to Fig. 3) is passed on to salient point 7.Then, will the position of chip of installation base plate 10 and mounting mat 11 with visual confirmation, carry out chip 5 (" vision and installation " with reference to Fig. 3) at mounting mat 11 contact salient point 7.Bonded substrate 10 and chip 5 (" solder reflow " with reference to Fig. 3) by backflow (reflow) heating.By being partially filled (underfilling) epoxy resin 20 and carrying out protect IC 5 (" filling and solidification " with reference to Fig. 3) by hot curing (curing) etc.
Fig. 4 is the front view carrying out the placement equipment mounted from die pick chip of the prior art.
Device shown in Fig. 4 is used for controlled collapsible chip connec-tion, therefore is called as flip-chip placement equipment 50.
According to Fig. 4, flip-chip placement equipment 50 possesses: wafer station (Wafer Stage) 52, and the feeder section of supply chip (omitting diagram) installs wafer (omitting diagram); Injector (ejector) 53, is positioned at the bottom of wafer station 52, up pushes away the chip being provided to wafer; Box lifting device (CassetteElevator) 54, is supplied to stacked wafer in wafer station 52; Motor 55, for providing actuating force; Clamper (Grippe) 56, holding frame or part move; Pick-up (Picker) 57, transmits from wafer absorption chip; Upside-down mounting portion (Flipper) 58, assists the motion of pick-up 57; Chip shuttle (Chip Shuttle) 59, the suction nozzle (omitting diagram) chip being moved to mounting head 61 carries out the position of picking up; Reciprocating conveyor (Shuttle Conveyor) 60, for moving substrate (board, substrate, PCB etc.); Mounting head (head) 61, adsorbs the chip by chip shuttle 59 movement, and is mounted on substrate.That is, existing flip-chip placement equipment 50 adsorbs the chip sprayed from wafer, and is sent to superposed mounting head 61, is then mounted on substrate.
Now, in order to chip is mounted on substrate exactly, the setting angle of chip is extremely important.But, usually, in order to compensate mounting angle, though the mounting head of flip-chip placement equipment has the structure that suction nozzle can be rotated predetermined angular, but, can only adjust in small angle range.Therefore, recently, as LED chip etc. need with various angle chip time, existing with existing flip-chip placement equipment is cannot carry out with various angle the problem that mounts.
Summary of the invention
The present invention proposes for solving described problem, its object is to, one is provided to utilize transfer head (Transfer Head) and chip rotated required angle and is passed to mounting head (Mount Head), then the flip-chip placement equipment of substrate is mounted on and utilizes the attaching method of this placement equipment, described transfer head to possess rotation (rotation) function that can rotate predetermined angular.
The object of the invention is to, a kind of spinfunction by adding at the upside-down mounting head (Flip Head) for flip-chip for rotary chip is provided, thus, be passed to mounting head after utilizing the spinfunction of described upside-down mounting head that chip is rotated required angle, and be mounted on the flip-chip placement equipment of substrate and utilize the attaching method of this placement equipment.
And, the object of the invention is to, there is provided a kind of under the state of mounting head from upside-down mounting head receiving chip, described upside-down mounting head is positioned over after chip is rotated required angle, then, mounting head again rotates and gets back to original position, and is mounted on the flip-chip placement equipment of substrate from described upside-down mounting head receiving chip and utilizes the attaching method of this placement equipment.
Technical problem to be solved by this invention is not limited to above said content, and for NM problem, those skilled in the art will clearly understand by following record.
For reaching described object, according to the flip-chip placement equipment of one embodiment of the invention, to comprise: upside-down mounting head, carrying out upside-down mounting from die pick chip; Transfer head, picks up by the described chip of upside-down mounting from described upside-down mounting head and is placed in delivery module; Mounting head, picks up the described chip that is placed and by described chip attachment in substrate from described delivery module, and wherein said transfer head is by left-right rotary then make described chip rotate predetermined angular, is then placed in described delivery module.
For reaching described object, flip-chip placement equipment according to another embodiment of the present invention, comprising: upside-down mounting head, carries out upside-down mounting from die pick chip; And mounting head, from the pickup of described upside-down mounting head by the described chip of upside-down mounting, and by described chip attachment in substrate, wherein, described upside-down mounting head is by left-right rotary then make described chip rotate predetermined angular, is then passed to described mounting head.
For reaching described object, flip-chip placement equipment according to still another embodiment of the invention, comprising: upside-down mounting head, carries out upside-down mounting from die pick chip; And mounting head, from described upside-down mounting head pickup by the described chip of upside-down mounting, and by described chip attachment in substrate, wherein, described mounting head is by left-right rotary then described chip is rotated after predetermined angular be passed to described upside-down mounting head, carry out opposite spin again and get back to original position, again picking up described chip from described upside-down mounting head.
For reaching described object, according to the flip-chip placement equipment of other another embodiments of the present invention, to comprise: upside-down mounting head, carrying out upside-down mounting from die pick chip; Transfer head, from described upside-down mounting head pickup by the described chip of upside-down mounting; Delivery module, for settling the chip picked up by described transfer head; And mounting head, pickup is placed in the chip of described delivery module, and by described chip attachment in substrate, wherein, described delivery module comprises the placement portion for settling described chip, and described placement portion is by left-right rotary then make described chip rotate predetermined angular.
For reaching described object, according to the attaching method of the flip-chip placement equipment of one embodiment of the invention, comprising: upside-down mounting head is from die pick chip and carry out the step of upside-down mounting; Transfer head from the pickup of described upside-down mounting head by the described chip of upside-down mounting, and left-right rotary then be placed in the step of delivery module after making described chip rotate predetermined angular; And mounting head picks up the described chip be placed from described delivery module, then by the step of described chip attachment in substrate.
For reaching described object, the attaching method of flip-chip placement equipment according to another embodiment of the present invention, comprising: upside-down mounting head is from die pick chip and carry out the step of upside-down mounting; Described upside-down mounting head is by left-right rotary then make described chip rotate the step of predetermined angular; And mounting head is rotated the chip of predetermined angular from described upside-down mounting head pickup after upside-down mounting, and by the step of described chip attachment in substrate.
For reaching described object, the attaching method of flip-chip placement equipment according to still another embodiment of the invention, comprising: upside-down mounting head is from die pick chip and carry out the step of upside-down mounting; Mounting head picks up by the step of the described chip of upside-down mounting from described upside-down mounting head; Described mounting head is by left-right rotary then make described chip rotate the step of predetermined angular; Described mounting head transmits the step of the described chip through rotating to described upside-down mounting head; Described mounting head rotates in the opposite direction and gets back to the step of original position; And pick up described chip again from described upside-down mounting head, and by the step of described chip attachment in substrate.
For reaching described object, according to the attaching method of the flip-chip placement equipment of other another embodiments of the present invention, comprising: upside-down mounting head is from die pick chip and carry out the step of upside-down mounting; Transfer head is picked up by the described chip of upside-down mounting from described upside-down mounting head, and is placed in the step of delivery module; For settling the placement portion left rotation and right rotation of described chip in delivery module, and described chip is made to rotate the step of predetermined angular; And mounting head is from the described chip of described delivery module pickup through rotating, and by the step of described chip attachment in substrate.
Other details of the present invention are contained in detailed description and accompanying drawing.
Invention effect
According to the present invention, possess the spinfunction that chip can be made to rotate predetermined angular by making flip-chip placement equipment, thus, when needs are with various angle chip, can be effectively corresponding.
Accompanying drawing explanation
Fig. 1 a and Fig. 1 b is the figure that the chip that the chip connected by wire-bonded (Wire Bonding) is connected with by pedestal (Solder Bump) is shown.
Fig. 2 illustrates the figure installing the process of flip-chip at substrate.
Fig. 3 illustrates the figure being formed with the technique of the chip of salient point in substrate attachment in order.
Fig. 4 is the front view carrying out the placement equipment mounted from die pick chip of the prior art.
Fig. 5 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to one embodiment of the invention.
Fig. 6 a, Fig. 6 b and Fig. 6 c are the figure of the upside-down mounting head of the flip-chip placement equipment according to one embodiment of the invention that Fig. 5 is shown respectively, transfer head and mounting head.
Fig. 7 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to another embodiment of the present invention.
Fig. 8 a and Fig. 8 b is the upside-down mounting head of flip-chip placement equipment according to another embodiment of the present invention and the figure of mounting head that Fig. 7 is shown respectively.
Fig. 9 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to still another embodiment of the invention.
Figure 10 a and Figure 10 b is the upside-down mounting head of flip-chip placement equipment according to still another embodiment of the invention and the figure of mounting head that Fig. 9 is shown respectively.
Figure 11 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to other another embodiments of the present invention.
Figure 12 is the figure of the delivery module of the flip-chip placement equipment according to other another embodiments of the present invention that Figure 11 is shown.
Figure 13 is the precedence diagram of the attaching method of flip-chip placement equipment according to one embodiment of the invention.
Figure 14 is the precedence diagram of the attaching method of flip-chip placement equipment according to another embodiment of the present invention.
Figure 15 is the precedence diagram of the attaching method of flip-chip placement equipment according to still another embodiment of the invention.
Figure 16 is the precedence diagram of the attaching method of flip-chip placement equipment according to other another embodiments of the present invention.
Symbol description:
100,200,300,400: flip-chip placement equipment
110,210,310,410: upside-down mounting head (Flip Head)
120,420: transfer head (Transfer Head)
130,230,330,430: mounting head (Mount Head)
Embodiment
Advantage of the present invention, feature and reach the method for described object will be clear and definite by accompanying drawing and detailed description described later.But the present invention is not limited to the embodiment of the following stated and can be presented as various different form, following examples are used for making the present invention definitely, and provide complete technical scope to those skilled in the art in the invention.The present invention is only decided by right.In whole specification, identical symbol is marked to identical inscape.
The term of first, second ordinal number such as grade is in order to illustrate that various element, inscape and/or part use, but described element, inscape and/or part are not limited to described term.Described term be only used for difference element, inscape and/or part and another element, inscape and/or part.Therefore, first element of the following stated, the first inscape or Part I also can be the second element, the second inscape or Part II in technological thought of the present invention.
The term used in this manual is used to embodiment is described, does not limit the present invention.In this specification, when being not particularly illustrated, not only comprise odd number form, also comprise plural form." comprising (comprises) " of using in specification and/or " by ~ and form (made of) " in, the existence or additional of other inscapes more than one, step, action and/or element do not got rid of by mentioned inscape, step, action and/or element.
When not having other to define, all terms (comprising technology and scientific terminology) used in this manual can use the implication for those skilled in the art in the invention can understand jointly.And, when not defining especially, the meaning of a word explained on dictionary must not be exaggerated.
Below, the present invention is further described with reference to accompanying drawing.
Fig. 5 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to one embodiment of the invention.Fig. 6 a and Fig. 6 b is the figure of the upside-down mounting head of the flip-chip placement equipment according to one embodiment of the invention that Fig. 5 is shown respectively, transfer head and mounting head.
According to the flip-chip placement equipment 100 of one embodiment of the invention, possess: upside-down mounting 110, carry out upside-down mounting from wafer 101 pick-up chip 103; Transfer head 120, is placed in delivery module 105 from upside-down mounting 110 pickup by the chip 103 of upside-down mounting; Mounting head 103, is placed in the chip 103 of delivery module 105, and is mounted on substrate 107 from delivery module 105 pickup.Now, transfer head 120 left-right rotary then be placed in delivery module 105 after making chip 103 rotate predetermined angular, thus, can with various angle chip 103.
More specifically, in Fig. 5, the chip 103 sprayed by injector (omitting diagram) is adsorbed in upside-down mounting 110 from wafer 101, and prepares pickup (" injection " with reference to Fig. 5).Upside-down mounting 110 absorption chips 103 after pickup, upside-down mounting 110 is revolved turnback and is carried out upside-down mounting (" upside-down mounting " with reference to Fig. 5).Chip 103 through upside-down mounting is sent to transfer head 120 from upside-down mounting 110, because transfer head 120 has spinfunction, therefore, chip 103 can be rotated required angle (" rotation " with reference to Fig. 5).After transfer head 120 carries out the angle of rotation adjustment chip 103, chip 103 is placed in delivery module 105 (" transmission " with reference to Fig. 5).Then, mounting head 130 from transfer head 105 pick-up chip 103, and is mounted on substrate 107 (" attachment " with reference to Fig. 5).
Herein, in order to pick-up chip 103, upside-down mounting 110, transfer head 120, and mounting head 130 can carry out gate-type (gantry) motion on an x-y plane.So-called gate-type motion refers to, moving along X-direction and Y-direction movement in XY plane.Therefore, pick-up chip 103, upside-down mounting 110, transfer head 120, and mounting head 130 can only vertically move with horizontal direction and move to desired position.
With reference to Fig. 6 a, upside-down mounting 110, possesses: upside-down mounting pickup section 112, for pick-up chip 103; Upside-down mounting linear drives 114, moves up and down for making upside-down mounting pickup section 112; Upside-down mounting rotary driving part 116, revolves turnback (that is, turned upside down) for making upside-down mounting pickup section about 112.Upside-down mounting pickup section 112 possesses: suction nozzle 112b, direct pick-up chip 103; And main shaft 112a, for supporting suction nozzle 112b, and transmit actuating force.Upside-down mounting linear drives 114 provides actuating force to make suction nozzle 112b and main shaft 112a mobile towards Z-direction (vertical direction), thus make upside-down mounting pickup section 112 pick-up chip 103, thus, upside-down mounting pickup section 112 can move along vertical frame 115.Upside-down mounting rotary driving part 116 makes upside-down mounting pickup section 112 revolve turnback up and down centered by horizontal frame 117, thus, can the chip 103 that picked up by upside-down mounting pickup section 112 of upside-down mounting.Herein, upside-down mounting linear drives 114 and upside-down mounting rotary driving part 116 possess motor etc. and provide actuating force, but are not limited thereto, and this is self-explantory to one skilled in the art.In Fig. 6 a, though illustrate three upside-down mounting pickup section 112, but upside-down mounting 110 can comprise more than one upside-down mounting pickup section 112.
With reference to Fig. 6 b, transfer head 120 possesses: transmit pickup section 122, for pick-up chip 103; Transmitting linear drives 124, moving up and down for making transmission pickup section 122; And transmit rotary driving part 126, for make transmission pickup section 122 left rotation and right rotation (that is, overlook or look up time, carry out clockwise or be rotated counterclockwise).Transmit pickup section 122, possess: suction nozzle 122b, from the direct pick-up chip 103 of suction nozzle 112b of upside-down mounting 110; And main shaft 122a, for supporting suction nozzle 122b, and transmit actuating force.Transmit linear drives 124 and possess motor etc., actuating force is provided to make suction nozzle 122b and main shaft 122a mobile towards Z-direction (vertical direction) accordingly, thus, transmission pickup section 122 pick-up chip 103 can be made, thus, transmit pickup section 122 to move along vertical rack 125.Transmission rotary driving part 126 possesses motor (omitting diagram) etc. provides actuating force, can make transmission pickup section 122 left rotation and right rotation accordingly.By transmitting rotary driving part 126 rotary chip 103 and being sent to mounting head 130, thus freely can adjust the mounting angle of chip 103.In Fig. 6 b, though illustrate one to transmit pickup section 122, but transfer head 120 can comprise more than 2 and transmit pickup section 122.In Fig. 6 b, on top, configuration transmits linear drives 124, and in bottom, configuration transmits rotary driving part 126, but also can configure on the contrary, can also have different configuration structures.This is self-explantory to one skilled in the art.
With reference to Fig. 6 c, mounting head 130 possesses: attachment pickup section 132, for pick-up chip 103; Attachment linear drives 134, moves up and down for making attachment pickup section 132.With upside-down mounting pickup section 112 and to transmit pickup section 122 identical, attachment pickup section 132 possesses: suction nozzle 132b, from delivery module 105 directly pick-up chip 103; And main shaft 132a, for supporting suction nozzle 132b, and transmit actuating force.Attachment linear drives 134 provides actuating force to make suction nozzle 132b and main shaft 132a mobile towards Z-direction (vertical direction), thus can make attachment pickup section 132 pick-up chip 103, thus, attachment pickup section 132 can move along vertical rack 135.In Fig. 6 c, though illustrate an attachment pickup section 132, but mounting head 130 can comprise more than 2 attachment pickup section 132.This is clear and definite to one skilled in the art.
According in the flip-chip placement equipment 100 of one embodiment of the invention, revolve turnback after a upside-down mounting chip 103 that 110 receptions are sprayed and carry out upside-down mounting, then chip 103 be sent to transfer head 120 and be placed in delivery module 105, now, because transfer head 120 has spinfunction, therefore, delivery module 105 is placed in after making the required angle of chip rotation, then, mounting head 130 pick-up chip 103 is also mounted on substrate 107, thus chip 103 can be mounted on substrate 107 with various angle.
Fig. 7 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to another embodiment of the present invention.Fig. 8 a and Fig. 8 b is the upside-down mounting head of flip-chip placement equipment according to another embodiment of the present invention and the figure of mounting head that Fig. 7 is shown respectively.
Flip-chip placement equipment 200 according to another embodiment of the present invention, comprising: upside-down mounting 210, carries out upside-down mounting from wafer 201 pick-up chip 203; And mounting head 230, from described upside-down mounting 210 pickup by the described chip 203 of upside-down mounting, and be mounted on substrate, described upside-down mounting 210 left-right rotary then make chip 203 rotate predetermined angular, then described mounting head 230 is sent to, thus can with various angle chip 203.
Specifically, in Fig. 7, the chip 203 sprayed by injector (omitting diagram) is adsorbed in upside-down mounting 210 from wafer 201, and prepares pickup (" injection " with reference to Fig. 7).Upside-down mounting 210 absorption chips 203 after pickup, upside-down mounting 210 is revolved turnback and is carried out upside-down mounting (" upside-down mounting " with reference to Fig. 7).Because upside-down mounting 210 has spinfunction, the chip 203 therefore through upside-down mounting rotates required angle (" rotation " with reference to Fig. 7) by upside-down mounting 210.Be sent to mounting head 230 by the chip 203 that rotates after upside-down mounting from upside-down mounting 210 by upside-down mounting 210, the chip 203 of pickup is mounted on substrate 107 by mounting head 230.
Herein, in order to pick-up chip 203, upside-down mounting 210 and mounting head 230 carry out gate-type (gantry) motion on an x-y plane.
With reference to Fig. 8 a, upside-down mounting 210, comprising: upside-down mounting pickup section 212, for pick-up chip 203; Upside-down mounting linear drives 214, moves up and down for making described upside-down mounting pickup section 212; Upside-down mounting vertical rotary drive division 216, revolves turnback (that is, turned upside down) for making described upside-down mounting pickup section about 212; And upside-down mounting horizontally rotates drive division 218, make described upside-down mounting pickup section 212 left rotation and right rotation (that is, overlook or look up time, carry out clockwise or be rotated counterclockwise).Herein, the structure of upside-down mounting pickup section 212, upside-down mounting linear drives 214, upside-down mounting vertical rotary drive division 216 and function are identical with the upside-down mounting pickup section 112 of the aforementioned flip-chip placement equipment 100 according to one embodiment of the invention, upside-down mounting linear drives 114, upside-down mounting rotary driving part 116 respectively, therefore omit and illustrate.
To be picked up by upside-down mounting pickup section 212 and the mounting angle of chip 203 by the upside-down mounting of upside-down mounting vertical rotary drive division 216 to adjust, upside-down mounting horizontally rotates drive division 218 and makes upside-down mounting pickup section 212 left rotation and right rotation.Therefore, transfer head 120 and delivery module 105 can be omitted compared to the aforementioned flip-chip placement equipment 100 according to one embodiment of the invention.Though illustrate 1 upside-down mounting pickup section 212 in Fig. 8 a, but upside-down mounting 210 can comprise multiple upside-down mounting pickup section 212.Upside-down mounting linear drives 214, upside-down mounting vertical rotary drive division 216, upside-down mounting horizontally rotate drive division 218 can be possessed motor etc. and provide actuating force, but, be not limited thereto.This is self-explantory to one skilled in the art.
With reference to Fig. 8 b, mounting head 230, comprising: attachment pickup section 232, for picking up described chip 203; And attachment linear drives 234, move up and down for making described attachment pickup section 232.Herein, the example as attachment linear drives 234 can utilize motor etc., but be not limited thereto, this is self-explantory to one skilled in the art.The attachment pickup section 132 of attachment pickup section 232, the attachment structure of linear drives 234 and function and the aforementioned flip-chip placement equipment 100 according to one embodiment of the invention, to mount linear drives 134 identical, and therefore omission illustrates.
In flip-chip placement equipment 200 according to another embodiment of the present invention, upside-down mounting 210 for flip-chip 203 has spinfunction, thus can rotary chip 203, thus, mounting head 230 can be mounted on substrate from a upside-down mounting 210 direct pick-up chip 203, thus, chip 203 can be mounted on substrate with various angle.
Fig. 9 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to still another embodiment of the invention.Figure 10 a and Figure 10 b is the upside-down mounting head of the flip-chip placement equipment illustrated respectively according to still another embodiment of the invention and the figure of mounting head.
Flip-chip placement equipment 300 according to still another embodiment of the invention, comprising: upside-down mounting 310, carries out upside-down mounting from wafer 301 pick-up chip 303; And mounting head 330, from described upside-down mounting 310 pickup by the described chip 303 of upside-down mounting, and be mounted on substrate, wherein, described mounting head 330 left-right rotary then make described chip 303 rotate predetermined angular, be then sent to described upside-down mounting 310, described mounting head 330 again opposite spin gets back to original position pick-up chip 303 again, thus, can with various angle chip 303.Accordingly, angle compensation more accurately can be carried out between mounting head 330 and substrate, and chip 303 more successfully can be mounted on substrate by mounting head 330.
Specifically, in Fig. 9, the chip 303 sprayed by injector (omitting diagram) is adsorbed in upside-down mounting 310 from wafer 301, and prepares pickup (" injection " with reference to Fig. 9).Upside-down mounting 310 absorption chips 303 after pickup, upside-down mounting about 310 is revolved turnback and is carried out upside-down mounting (" upside-down mounting " with reference to Fig. 9).Be sent to mounting head 330 by the chip 303 of upside-down mounting from upside-down mounting 310, because mounting head 330 has spinfunction, therefore, chip 303 rotates required angle (" rotation " with reference to Fig. 9) by mounting head 330.The chip 303 rotated by mounting head 330 is sent to upside-down mounting 310 in the opposite direction from mounting head 330, after mounting head 330 turns back to original angle, then be mounted on desired location (" transmission " with reference to Fig. 9) from upside-down mounting 310 receiving chip 303.
Herein, in order to pick-up chip 303, upside-down mounting 310 and mounting head 330 can carry out gate-type (gantry) motion on an x-y plane.
With reference to Figure 10 a, upside-down mounting 310 comprises: upside-down mounting pickup section 312, for pick-up chip; Upside-down mounting linear drives 314, moves up and down for making described upside-down mounting pickup section 312; And upside-down mounting rotary driving part 316, revolve turnback (that is, turned upside down) for making described upside-down mounting pickup section about 312.Herein, the structure of upside-down mounting pickup section 312, upside-down mounting linear drives 314, upside-down mounting rotary driving part 316 and function are identical with the upside-down mounting pickup section 112 of the flip-chip placement equipment 100 of aforementioned one embodiment of the invention, upside-down mounting linear drives 114, upside-down mounting rotary driving part 116 respectively, therefore omit and illustrate.Though illustrate 1 upside-down mounting pickup section 312 in Figure 10 a, but upside-down mounting 310 can include more than one upside-down mounting pickup section 312.Upside-down mounting linear drives 314, upside-down mounting rotary driving part 316 can possess motor etc. provides actuating force, but, be not limited thereto.This is self-explantory to one skilled in the art.
With reference to Figure 10 b, mounting head 330 comprises: attachment pickup section 332, for picking up described chip 303; Attachment linear drives 334, moves up and down for making described attachment pickup section 332; Attachment rotary driving part 336, for make attachment pickup section 332 left rotation and right rotation (that is, overlook or look up time, carry out clockwise or be rotated counterclockwise).Herein, attachment pickup section 332, the attachment structure of linear drives 334 and function respectively with the attachment pickup section 132 of the aforementioned flip-chip placement equipment 100 according to one embodiment of the invention, mount linear drives 134 identical, therefore omission illustrates.In order to adjust the mounting angle of the chip 303 picked up by attachment pickup section 332, attachment rotary driving part 336 makes attachment pickup section 332 left rotation and right rotation.Therefore, transfer head 120 and delivery module 105 can be omitted compared to the aforementioned flip-chip placement equipment 100 according to one embodiment of the invention.Though illustrate 1 attachment pickup section 332 in Figure 10 b, but mounting head 330 can include multiple attachment pickup section 332.Attachment linear drives 334, attachment rotary driving part 336 can possess motor etc. and provide actuating force, but, be not limited thereto.This is self-explantory to one skilled in the art.
At flip-chip placement equipment 300 weight according to still another embodiment of the invention, after upside-down mounting 310 flip-chip 303, by mounting head 330 pick-up chip, and after chip 303 is rotated required angle, chip 303 is sent to again upside-down mounting 310, after mounting head 330 gets back to original angle, receiving chip 303 again, and chip 303 is mounted on desired location, thus, with various angle, chip 303 can be mounted on substrate.
Figure 11 is the figure of the operating sequence of the flip-chip placement equipment illustrated according to other another embodiments of the present invention.Figure 12 is the figure of the delivery module of the flip-chip placement equipment according to other another embodiments of the present invention that Figure 11 is shown.
According to the flip-chip placement equipment 400 of other another embodiments of the present invention, to comprise: upside-down mounting 410, carry out upside-down mounting from wafer 401 pick-up chip 403; Transfer head 420, from described upside-down mounting 410 pickup by the described chip 403 of upside-down mounting; Delivery module 405, for settling the chip 403 picked up by described transfer head 420; And, mounting head 430, pickup is placed in the chip 403 of described delivery module 405, and be mounted on substrate 107, wherein, described delivery module 405 comprises the placement portion 406 for settling described chip 403, described placement portion 406 left rotation and right rotation (namely, when overlooking or look up, carry out clockwise or be rotated counterclockwise) and make described chip 403 rotate predetermined angular, thus can with various angle pasting chip 403.
Specifically, Tu11Zhong, the chip 403 sprayed by injector (omitting diagram) is adsorbed in upside-down mounting 410 from wafer 401, and prepares pickup (" injection " with reference to Figure 11).Upside-down mounting 410 absorption chips 403 after pickup, upside-down mounting about 410 is revolved turnback and is carried out upside-down mounting (" upside-down mounting " with reference to Figure 11).Transfer head 420 from upside-down mounting 410 pickup by the chip 403 (" pickup " with reference to Figure 11) of upside-down mounting.Chip 403 is sent to delivery module 405 (" transmission " with reference to Figure 11) from transfer head 420, and delivery module 405 carries out rotating and makes chip 403 rotate required angle (" rotation " with reference to Figure 11).Mounting head 430 from delivery module 405 pick-up chip 403, and is mounted on the desired location (" attachment " with reference to Figure 11) of substrate 107.
With reference to Figure 12, described delivery module 405 comprises the placement portion 406 for settling chip 403.Herein, placement portion 406 possesses motor etc. provides actuating force needed for rotation, but is not limited thereto, and this is self-explantory to one skilled in the art.Be explained above upside-down mounting 410, transfer head 420, the function of mounting head 430 and operation, but omit the explanation to these concrete structure.
In the flip-chip placement equipment 400 of other another embodiments according to the present invention, delivery module 405 for transmitting chip 403 has spinfunction and for rotary chip 403, thus, mounting head 430 is mounted on substrate after delivery module 405 receives the chip 403 through rotating, thus, with various angle, chip 403 can be mounted on substrate.
Figure 13 is the precedence diagram of the attaching method of flip-chip placement equipment according to one embodiment of the invention.
According to Figure 13, in the attaching method of the flip-chip placement equipment according to one embodiment of the invention, upside-down mounting head is from die pick chip and carry out upside-down mounting (S12), transfer head is picked up by the described chip of upside-down mounting from described upside-down mounting head, carry out left-right rotary then described chip is rotated after predetermined angular being placed in delivery module (S14), mounting head to pick up this chip attachment from described delivery module after the described chip be placed in substrate (S16).
Figure 14 is the precedence diagram of the attaching method of flip-chip placement equipment according to another embodiment of the present invention.
According to Figure 14, at the attaching method of flip-chip placement equipment according to another embodiment of the present invention, upside-down mounting head is from die pick chip and carry out upside-down mounting (S22), described upside-down mounting head carries out left rotation and right rotation makes described chip rotate predetermined angular (S24), then, mounting head is rotated the described chip of predetermined angular from described upside-down mounting head pickup after upside-down mounting, and by this chip attachment in substrate (S26).
Figure 15 is the precedence diagram of the attaching method of flip-chip placement equipment according to still another embodiment of the invention.
With reference to Figure 15, in the attaching method of flip-chip placement equipment according to still another embodiment of the invention, upside-down mounting head is from die pick chip and carry out upside-down mounting (S32), mounting head from the pickup of described upside-down mounting head by the described chip (S34) of upside-down mounting, described mounting head left-right rotary then make described chip rotate predetermined angular (S36).Then, described chip through rotating is passed to described upside-down mounting head (S38) by described mounting head, described mounting head again opposite spin gets back to original position (S40), then, again picks up described chip and be mounted on substrate (S42) from described upside-down mounting head.
Figure 16 is the precedence diagram of the attaching method of flip-chip placement equipment according to other another embodiments of the present invention.
With reference to Figure 16, upside-down mounting head is from die pick chip and carry out upside-down mounting (S52), transfer head is picked up by after the described chip of upside-down mounting from described upside-down mounting head, by this chip placing in delivery module (S54), left rotation and right rotation is carried out in the placement portion being mounted with chip on described delivery module, to make the described chip be placed rotate predetermined angular (S56), mounting head is from described delivery module pickup through the described chip of rotation and by this chip attachment in substrate (S58).
Above, though with reference to the accompanying drawings of embodiments of the invention, however, it should be understood that those skilled in the art in the invention may be embodied as other concrete forms within the scope of technological thought of the present invention or essential feature.Therefore, the above embodiment is all illustrate, does not limit the present invention.
Claims (22)
1. a flip-chip placement equipment, comprising:
Upside-down mounting head, carries out upside-down mounting from die pick chip;
Transfer head, picks up by the described chip of upside-down mounting from described upside-down mounting head and is placed in delivery module; And
Mounting head, picks up the described chip that is placed and by described chip attachment in substrate from described delivery module,
Wherein, described transfer head by left-right rotary then make described chip rotate predetermined angular, be then placed in described delivery module.
2. flip-chip placement equipment according to claim 1, wherein, described upside-down mounting head comprises:
Upside-down mounting pickup section, for picking up described chip;
Upside-down mounting linear drives, moves up and down for making described upside-down mounting pickup section; And
Upside-down mounting rotary driving part, revolves turnback up and down for making described upside-down mounting pickup section.
3. flip-chip placement equipment according to claim 1, wherein, described transfer head comprises:
Transmit pickup section, for picking up described chip;
Transmitting linear drives, moving up and down for making described transmission pickup section; And
Transmit rotary driving part, for making described transmission pickup section left rotation and right rotation.
4. flip-chip placement equipment according to claim 1, wherein, described mounting head comprises:
Attachment pickup section, for picking up described chip; And
Attachment linear drives, moves up and down for making described attachment pickup section.
5. a flip-chip placement equipment, comprising:
Upside-down mounting head, carries out upside-down mounting from die pick chip; And
Mounting head, from described upside-down mounting head pickup by the described chip of upside-down mounting, and by described chip attachment in substrate,
Wherein, described upside-down mounting head by left-right rotary then make described chip rotate predetermined angular, be then passed to described mounting head.
6. flip-chip placement equipment according to claim 5, wherein, described upside-down mounting head, comprising:
Upside-down mounting pickup section, for picking up described chip;
Upside-down mounting linear drives, moves up and down for making described upside-down mounting pickup section;
Upside-down mounting vertical rotary drive division, revolves turnback up and down for making described upside-down mounting pickup section; And
Upside-down mounting horizontally rotates drive division, for making described upside-down mounting pickup section left rotation and right rotation.
7. flip-chip placement equipment according to claim 5, wherein, described mounting head, comprising:
Attachment pickup section, for picking up described chip; And
Attachment linear drives, moves up and down for making described attachment pickup section.
8. a flip-chip placement equipment, comprising:
Upside-down mounting head, carries out upside-down mounting from die pick chip; And
Mounting head, from described upside-down mounting head pickup by the described chip of upside-down mounting, and by described chip attachment in substrate,
Wherein, described mounting head by left-right rotary then make described chip rotate predetermined angular, be then sent to described upside-down mounting head, then carry out opposite spin and get back to original position, then pick up described chip from described upside-down mounting head.
9. flip-chip placement equipment according to claim 8, wherein, described upside-down mounting head comprises:
Upside-down mounting pickup section, for picking up described chip;
Upside-down mounting linear drives, moves up and down for making described upside-down mounting pickup section; And
Upside-down mounting rotary driving part, revolves turnback up and down for making described upside-down mounting pickup section.
10. flip-chip placement equipment according to claim 8, wherein, described mounting head comprises:
Attachment pickup section, picks up described chip;
Attachment linear drives, makes described attachment pickup section move up and down; And
Attachment rotary driving part, makes described attachment pickup section left rotation and right rotation.
11. 1 kinds of flip-chip placement equipments, comprising:
Upside-down mounting head, carries out upside-down mounting from die pick chip;
Transfer head, from described upside-down mounting head pickup by the described chip of upside-down mounting;
Delivery module, for settling the chip picked up by described transfer head; And
Mounting head, pickup is placed in the chip of described delivery module, and by described chip attachment in substrate,
Wherein, described delivery module comprises the placement portion for settling described chip,
Described placement portion by left-right rotary then make described chip rotate predetermined angular.
The attaching method of 12. 1 kinds of flip-chip placement equipments, comprises the steps:
Upside-down mounting head is from die pick chip and carry out upside-down mounting;
Transfer head is carried out left rotation and right rotation from described upside-down mounting head pickup by after the described chip of upside-down mounting, and is placed in delivery module after described chip is rotated predetermined angular; And
Mounting head picks up the chip be placed from described delivery module, and by described chip attachment in substrate.
The attaching method of 13. flip-chip placement equipments according to claim 12, wherein, described upside-down mounting head comprises:
Upside-down mounting pickup section, for picking up described chip;
Upside-down mounting linear drives, moves up and down for making described upside-down mounting pickup section; And
Upside-down mounting rotary driving part, revolves turnback up and down for making described upside-down mounting pickup section.
The attaching method of 14. flip-chip placement equipments according to claim 12, wherein, described transfer head comprises:
Transmit pickup section, for picking up described chip;
Transmitting linear drives, moving up and down for making described transmission pickup section; And
Transmit rotary driving part, for making described transmission pickup section left rotation and right rotation.
The attaching method of 15. flip-chip placement equipments according to claim 12, wherein, described mounting head comprises:
Attachment pickup section, for picking up described chip; And
Attachment linear drives, moves up and down for making described attachment pickup section.
The attaching method of 16. 1 kinds of flip-chip placement equipments, comprises the steps:
Upside-down mounting head is from die pick chip and carry out upside-down mounting;
Described upside-down mounting head by left-right rotary then make described chip rotate predetermined angular; And
Mounting head is rotated the chip of predetermined angular from described upside-down mounting head pickup after upside-down mounting, and by described chip attachment in substrate.
The attaching method of 17. flip-chip placement equipments according to claim 16, wherein, described upside-down mounting head comprises:
Upside-down mounting pickup section, for picking up described chip;
Upside-down mounting linear drives, moves up and down for making described upside-down mounting pickup section;
Upside-down mounting vertical rotary drive division, revolves turnback up and down for making described upside-down mounting pickup section; And
Upside-down mounting horizontally rotates drive division, for making described upside-down mounting pickup section left rotation and right rotation.
The attaching method of 18. flip-chip placement equipments according to claim 16, wherein, described mounting head comprises:
Attachment pickup section, for picking up described chip; And
Attachment linear drives, moves up and down for making described attachment pickup section.
The attaching method of 19. 1 kinds of flip-chip placement equipments, comprises the steps:
Upside-down mounting head is from die pick chip and carry out upside-down mounting;
Mounting head picks up by the described chip of upside-down mounting from described upside-down mounting head;
Described mounting head by left-right rotary then make described chip rotate predetermined angular;
Described mounting head transmits the described chip through rotating to described upside-down mounting head;
Described mounting head opposite spin and get back to original position; And
Described chip is again picked up from described upside-down mounting head, and by described chip attachment in substrate.
The attaching method of 20. flip-chip placement equipments according to claim 19, wherein, described upside-down mounting head comprises:
Upside-down mounting pickup section, for picking up described chip;
Upside-down mounting linear drives, moves up and down for making described upside-down mounting pickup section; And
Upside-down mounting rotary driving part, revolves turnback up and down for making described upside-down mounting pickup section.
21. flip-chip placement equipments according to claim 19, wherein, described mounting head comprises:
Attachment pickup section, picks up described chip;
Attachment linear drives, makes described attachment pickup section move up and down; And
Attachment rotary driving part, makes described attachment pickup section left rotation and right rotation.
The attaching method of 22. 1 kinds of flip-chip placement equipments, comprises the steps:
Upside-down mounting head is from die pick chip and carry out upside-down mounting;
Transfer head is picked up by the described chip of upside-down mounting from described upside-down mounting head, and is placed in delivery module;
For settling the placement portion of described chip to carry out left-right rotary then making described chip rotate predetermined angular in described delivery module; And
Mounting head picks up the described chip through rotating from described delivery module, and by described chip attachment in substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130069681A KR20140146852A (en) | 2013-06-18 | 2013-06-18 | Flip-chip mounter and mounting mehtod using it |
| KR10-2013-0069681 | 2013-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104241150A true CN104241150A (en) | 2014-12-24 |
Family
ID=52228996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410171503.5A Pending CN104241150A (en) | 2013-06-18 | 2014-04-25 | A flip chip surface-mount machine and a surface mount method utilizing the surface-mount machine |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20140146852A (en) |
| CN (1) | CN104241150A (en) |
| TW (1) | TWI581347B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871684A (en) * | 2016-09-26 | 2018-04-03 | 捷进科技有限公司 | The manufacture method of flip-chip placement equipment and semiconductor devices |
| CN107887293A (en) * | 2016-09-30 | 2018-04-06 | 上海微电子装备（集团）股份有限公司 | A kind of batch processing bonding apparatus and bonding method |
| CN109860066A (en) * | 2017-11-30 | 2019-06-07 | 台湾积体电路制造股份有限公司 | Method for engaging semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970322A (en) * | 2018-09-30 | 2020-04-07 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
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| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进系统自动化有限公司 | Flip chip bonder and method therefor |
| CN1723749A (en) * | 2003-02-25 | 2006-01-18 | 松下电器产业株式会社 | Electronic component placement machine and electronic component placement method |
| US20120104074A1 (en) * | 2010-10-29 | 2012-05-03 | Samsung Electronics Co., Ltd. | Apparatus for mounting semiconductor chip |
| CN202759670U (en) * | 2012-08-09 | 2013-02-27 | 广州市中励电子科技有限公司 | Chip mounter |
| CN103000558A (en) * | 2011-09-15 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
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| JP2000068296A (en) * | 1998-08-19 | 2000-03-03 | Nichiden Mach Ltd | Die bonder |
| KR20120096727A (en) * | 2011-02-23 | 2012-08-31 | 삼성테크윈 주식회사 | Apparatus and method for picking up and mounting bare die |
-
2013
- 2013-06-18 KR KR1020130069681A patent/KR20140146852A/en not_active Application Discontinuation
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- 2014-03-11 TW TW103108458A patent/TWI581347B/en active
- 2014-04-25 CN CN201410171503.5A patent/CN104241150A/en active Pending
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| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进系统自动化有限公司 | Flip chip bonder and method therefor |
| CN1723749A (en) * | 2003-02-25 | 2006-01-18 | 松下电器产业株式会社 | Electronic component placement machine and electronic component placement method |
| US20120104074A1 (en) * | 2010-10-29 | 2012-05-03 | Samsung Electronics Co., Ltd. | Apparatus for mounting semiconductor chip |
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| CN202759670U (en) * | 2012-08-09 | 2013-02-27 | 广州市中励电子科技有限公司 | Chip mounter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871684A (en) * | 2016-09-26 | 2018-04-03 | 捷进科技有限公司 | The manufacture method of flip-chip placement equipment and semiconductor devices |
| CN107871684B (en) * | 2016-09-26 | 2021-12-28 | 捷进科技有限公司 | Flip chip mounter and method of manufacturing semiconductor device |
| CN107887293A (en) * | 2016-09-30 | 2018-04-06 | 上海微电子装备（集团）股份有限公司 | A kind of batch processing bonding apparatus and bonding method |
| CN107887293B (en) * | 2016-09-30 | 2020-06-16 | 上海微电子装备（集团）股份有限公司 | Batch bonding device and method |
| US10763235B2 (en) | 2016-09-30 | 2020-09-01 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Batch bonding apparatus and bonding method |
| CN109860066A (en) * | 2017-11-30 | 2019-06-07 | 台湾积体电路制造股份有限公司 | Method for engaging semiconductor device |
| CN109860066B (en) * | 2017-11-30 | 2022-11-15 | 台湾积体电路制造股份有限公司 | Method for bonding semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201501225A (en) | 2015-01-01 |
| TWI581347B (en) | 2017-05-01 |
| KR20140146852A (en) | 2014-12-29 |
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Application publication date: 20141224 |