CN110648953A - Wafer loading equipment - Google Patents
Wafer loading equipment Download PDFInfo
- Publication number
- CN110648953A CN110648953A CN201911007677.7A CN201911007677A CN110648953A CN 110648953 A CN110648953 A CN 110648953A CN 201911007677 A CN201911007677 A CN 201911007677A CN 110648953 A CN110648953 A CN 110648953A
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- China
- Prior art keywords
- wafer
- base
- platform
- translation mechanism
- loading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer mounting device, which comprises: the wafer platform is arranged along the vertical direction and is arranged on the first translation mechanism, and the first translation mechanism drives the wafer platform to perform XY motion in the vertical plane; get brilliant device, it includes: the crystal taking arm is driven by the pivoting mechanism to pivot 90 degrees in a plane vertical to the table top; the chip mounting table is provided with a working surface for fixing the substrate, the chip mounting table is arranged along the horizontal direction, the chip mounting table is arranged on the second translation mechanism, and the second translation mechanism drives the chip mounting table to carry out XY motion in the horizontal plane; and the cam mechanism comprises a cam, and the cam is respectively arranged at the crystal taking position and the chip mounting position. According to the invention, the wafer table is vertically arranged, and the crystal taking and mounting actions can be completed by one crystal taking arm, so that the error caused by crystal taking by the joint force of a plurality of arms is overcome, the wafer mounting efficiency is improved, and the wafer mounting requirements of modern industrial production are fully met.
Description
Technical Field
The invention relates to the technical field of wafer mounting, in particular to a wafer mounting device for vertically supplying wafers.
Background
Wafer-loading equipment is a key equipment in a semiconductor packaging production line, and has a very wide application in wafer packaging. With the progress of technology, the chip mounting precision of the chip mounting machine is developing towards the submicron level, and the micro-assembly technology in the industry is supported. However, the conventional wafer loading equipment is generally horizontally arranged, and in order to supply wafers, a plurality of transfer arms are generally required to be arranged to supply wafers, so that the precision and the productivity of the equipment are reduced. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The invention aims to provide wafer mounting equipment to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a wafer mounting apparatus, comprising:
the wafer platform is provided with a platform surface for fixing wafers, the wafer platform is arranged along the vertical direction, the wafer platform is arranged on the first translation mechanism, and the first translation mechanism drives the wafer platform to carry out XY motion in the vertical plane;
get brilliant device, it includes: the crystal taking arm is driven by the pivoting mechanism to pivot by 90 degrees in a plane vertical to the table top;
the wafer loading platform is provided with a working surface for fixing the substrate, the wafer loading platform is arranged along the horizontal direction, the wafer loading platform is arranged on a second translation mechanism, and the second translation mechanism drives the wafer loading platform to carry out XY motion in the horizontal plane;
and the cam mechanism comprises a cam, and the cam is respectively arranged at the crystal taking position and the chip mounting position.
As an improvement of the wafer loading equipment, the wafer platform is provided with vacuum suction holes, the vacuum suction holes are uniformly distributed on the table board, and the distance between every two adjacent vacuum suction holes is smaller than the minimum size of one wafer.
As an improvement of the wafer mounting apparatus of the present invention, the first translation mechanism includes: the first base, supply first base along the gliding first guide rail of X direction, set up in second base on the first base, supply the second base along the gliding setting in of Y direction in second guide rail on the first base, first translation mechanism sets up on the support that a vertical direction set up.
As an improvement of the wafer loading equipment, the pivoting mechanism is a rotating motor, and one end of the crystal taking arm is in transmission connection with the rotating motor.
As an improvement of the wafer loading equipment, the loading platform is also provided with a pressing plate, and the pressing plate presses the peripheral edge of the substrate to be loaded.
As an improvement of the wafer mounting apparatus of the present invention, the second translation mechanism includes: the third base, supply the third base along the gliding third guide rail of X direction, set up in fourth base on the third base, supply the gliding setting in of Y direction of fourth base in fourth guide rail on the third base, the second translation mechanism sets up on the support that a horizontal direction set up.
As an improvement of the wafer loading equipment, the wafer taking position and the wafer loading position are fixed positions, and the cam is driven by a motor to drive the wafer taking arm to take and load wafers.
As an improvement of the wafer mounting device, the wafer mounting device further comprises a glue dipping table, the glue dipping table is located at the upstream of the wafer mounting table, a conveying arm is arranged between the glue dipping table and the wafer mounting table, and a glue dipping groove is formed in the glue dipping table.
As an improvement of the wafer loading device, visual detection devices are further arranged at the wafer taking position and the loading position.
Compared with the prior art, the invention has the beneficial effects that: according to the wafer loading equipment, the wafer table is vertically arranged, and the wafer taking arm can completely take the wafer and load the wafer, so that the error caused by the fact that a plurality of arms are connected to take the wafer is overcome, the wafer loading efficiency is improved, and the wafer loading requirement of modern industrial production is fully met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a front view of an embodiment of a wafer loading apparatus of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the present invention provides a wafer mounting apparatus for assembling a wafer and a substrate in an integrated circuit. Specifically, the wafer mounting apparatus includes: the wafer taking device comprises a wafer platform 1, a wafer taking device 2, a wafer loading platform 3 and a cam mechanism 4.
The wafer table 1 is used for providing wafers to be assembled, wherein the wafers are from a wafer with a larger size, and the wafers are pre-cut to form a plurality of wafers with a smaller size. The wafer platform 1 is provided with a platform surface for fixing wafers, and the wafer platform 1 is arranged along the vertical direction. Therefore, the crystal taking and mounting actions can be conveniently finished through one crystal taking arm.
Meanwhile, in order to keep the wafer fixed, vacuum suction holes are formed in the wafer table 1 and are uniformly distributed on the table top, and the distance between every two adjacent vacuum suction holes is smaller than the minimum size of one wafer. In this way, each wafer is initially adsorbed on the wafer table 1.
In order to supply different wafers to a wafer taking arm for taking crystals from the wafer table 1, the wafer table 1 is arranged on a first translation mechanism 5, and the first translation mechanism 5 drives the wafer table 1 to perform XY motion in a vertical plane. In this way, the wafer table 1 is driven by the first translation mechanism 5 to send the wafers at different positions to the wafer taking position for taking the wafers.
In one embodiment, the first translation mechanism 5 comprises: the first base 51, the first guide rail 52 that supplies the first base 51 to slide along the X direction, set up in second base 53 on the first base 51, supply second base 53 along the gliding setting in the Y direction of Y direction in second guide rail 54 on the first base 51, first translation mechanism 5 sets up on the support that a vertical direction set up. Therefore, the first base 51 moves to the X-direction coordinate of the taking-out position along the first guide rail 52, and then the second base 53 moves to the Y-direction coordinate of the taking-out position along the second guide rail 54, thereby completing the wafer supply.
The crystal taking device 2 is used for picking up the wafer provided by the wafer platform 1 and completing wafer loading of the wafer. The crystal taking device 2 comprises: a crystal taking arm 21 and a pivoting mechanism 22, wherein the crystal taking arm 21 is driven by the pivoting mechanism 22 to pivot by 90 degrees in a plane vertical to the table top, and a suction nozzle is arranged at the end part of the corresponding crystal taking arm 21. Therefore, the wafer taking arm 21 is initially horizontally arranged, and after the wafer is sucked by the suction nozzle, the wafer is pivoted to a vertical state for loading. In one embodiment, the pivoting mechanism 22 is a rotating motor, and one end of the crystal taking arm 21 is in transmission connection with the rotating motor.
The loading table 3 is used for providing a platform for loading, a substrate to be loaded is fixed on the platform, and the wafer taking arm 21 packages the wafer on the platform to the corresponding position of the substrate. Specifically, the mounting table 3 has a work surface for fixing a substrate, and the mounting table 3 is disposed in a horizontal direction. Correspondingly, the loading table 3 is further provided with a pressing plate, the pressing plate presses the peripheral edge of the substrate to be loaded, the pressing plate is approximately of a rectangular structure and is driven by a servo motor to move up and down. The piece loading platform 3 is arranged on a second translation mechanism 6, and the second translation mechanism 6 drives the piece loading platform 3 to move in an XY manner in a horizontal plane. Accordingly, the mounting table 3 feeds different mounting positions of the substrate to the lower side of the pick-up arm 21 by the second translation mechanism 6 to perform mounting.
In one embodiment, the second translation mechanism 6 comprises: the third base 61, a third guide rail 62 for the third base 61 to slide along the X direction, a fourth base 63 disposed on the third base 61, and a fourth guide rail 64 for the fourth base 63 to slide along the Y direction and disposed on the third base 61, wherein the second translation mechanism 6 is disposed on a support disposed in the horizontal direction. Therefore, the third base 61 moves to the X-direction coordinate of the mounting position along the third guide rail 62, and then the fourth base 63 moves to the Y-direction coordinate of the mounting position along the fourth guide rail 64 to wait for the wafer mounting by the wafer picking arm 21.
The cam mechanism 4 is respectively arranged at a crystal taking position and a chip mounting position, wherein the cam mechanism 4 comprises a cam. In order to meet the precision requirement, the crystal taking position and the wafer mounting position are fixed positions, and the cam is driven by a motor to drive the crystal taking arm 21 to take crystals and mount wafers. Correspondingly, the crystal taking arm 21 is provided with a plane which can be abutted against the cam, so that the crystal taking arm 21 performs crystal taking and chip mounting actions at the corresponding position under the action of the cam.
In addition, in order to satisfy the demand of loading, wafer loading equipment is still including being stained with gluey platform 7, be stained with gluey platform 7 and be located the upper reaches of loading platform 3, be stained with gluey platform 7 and be provided with transfer arm 8 between the loading platform 3, be stained with and be provided with gluey groove on the gluey platform 7. Thus, the substrate on which the adhesive is applied at the adhesive applying stage 7 is transferred to the mounting stage 3 via the transfer arm 8 to be mounted.
The crystal taking position and the wafer mounting position are further provided with a visual detection device 9, in one embodiment, the visual detection device 9 can be an industrial camera, so that the corresponding translation mechanisms 5 and 6 can perform correction compensation according to the detection result of the visual detection device 9, and the crystal taking and wafer mounting precision is further ensured.
In conclusion, the wafer loading equipment provided by the invention has the advantages that the wafer table is vertically arranged, and the wafer taking arm can completely take the wafer and load the wafer, so that the error caused by the connection force of a plurality of arms during the wafer taking is overcome, the wafer loading efficiency is improved, and the wafer loading requirement of modern industrial production is fully met.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A wafer mounting apparatus, comprising:
the wafer platform is provided with a platform surface for fixing wafers, the wafer platform is arranged along the vertical direction, the wafer platform is arranged on the first translation mechanism, and the first translation mechanism drives the wafer platform to carry out XY motion in the vertical plane;
get brilliant device, it includes: the crystal taking arm is driven by the pivoting mechanism to pivot by 90 degrees in a plane vertical to the table top;
the wafer loading platform is provided with a working surface for fixing the substrate, the wafer loading platform is arranged along the horizontal direction, the wafer loading platform is arranged on a second translation mechanism, and the second translation mechanism drives the wafer loading platform to carry out XY motion in the horizontal plane;
and the cam mechanism comprises a cam, and the cam is respectively arranged at the crystal taking position and the chip mounting position.
2. The wafer loading apparatus as recited in claim 1, wherein the wafer table is provided with vacuum suction holes, the vacuum suction holes are uniformly arranged on the table top, and a distance between adjacent vacuum suction holes is smaller than a minimum dimension of one wafer.
3. The wafer loading apparatus as set forth in claim 1, wherein the first translation mechanism comprises: the first base, supply first base along the gliding first guide rail of X direction, set up in second base on the first base, supply the second base along the gliding setting in of Y direction in second guide rail on the first base, first translation mechanism sets up on the support that a vertical direction set up.
4. The wafer loading device as recited in claim 1, wherein the pivot mechanism is a rotating motor, and one end of the pick-up arm is drivingly connected to the rotating motor.
5. The wafer loading apparatus as claimed in claim 1, wherein a pressing plate is further disposed on the loading stage, and the pressing plate presses the peripheral edge of the substrate to be loaded.
6. The wafer loading apparatus as set forth in claim 1, wherein the second translation mechanism comprises: the third base, supply the third base along the gliding third guide rail of X direction, set up in fourth base on the third base, supply the gliding setting in of Y direction of fourth base in fourth guide rail on the third base, the second translation mechanism sets up on the support that a horizontal direction set up.
7. The wafer loading device as claimed in claim 1, wherein the wafer taking position and the loading position are fixed positions, and the cam is driven by a motor to drive the wafer taking arm to take wafers and load the wafers.
8. The wafer loading device as claimed in claim 1, further comprising a glue dipping table located upstream of the loading table, wherein a transfer arm is disposed between the glue dipping table and the loading table, and a glue dipping groove is disposed on the glue dipping table.
9. The wafer loading device as recited in claim 1, wherein visual inspection means are further provided at the wafer picking position and the loading position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911007677.7A CN110648953A (en) | 2019-10-22 | 2019-10-22 | Wafer loading equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911007677.7A CN110648953A (en) | 2019-10-22 | 2019-10-22 | Wafer loading equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110648953A true CN110648953A (en) | 2020-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911007677.7A Pending CN110648953A (en) | 2019-10-22 | 2019-10-22 | Wafer loading equipment |
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| Country | Link |
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| CN (1) | CN110648953A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022048023A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾科瑞思智能装备股份有限公司 | Vertical automatic wafer loading/unloading device |
-
2019
- 2019-10-22 CN CN201911007677.7A patent/CN110648953A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022048023A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾科瑞思智能装备股份有限公司 | Vertical automatic wafer loading/unloading device |
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