TWM604488U - Automatic bonding and releasing device - Google Patents
Automatic bonding and releasing device Download PDFInfo
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- TWM604488U TWM604488U TW109205565U TW109205565U TWM604488U TW M604488 U TWM604488 U TW M604488U TW 109205565 U TW109205565 U TW 109205565U TW 109205565 U TW109205565 U TW 109205565U TW M604488 U TWM604488 U TW M604488U
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Abstract
本創作涉及一種自動粘脫設備,該粘脫設備包含有一供吸附一無線靜電載盤之載板靜電生成組,以及一供吸附一薄化基板之基板移載組,而該基板移載組可相對該載板靜電生成組線性位移,使得該基板移載組可帶動薄化基板壓合於該載板靜電生成組之無線靜電載盤表面,藉此,可作動該載板靜電生成組使無線靜電載盤生成靜電電力場,以粘合該薄化基板,而能提升粘合效率,且可大幅降低粘合失敗率,並減少生裂損或破片的發生。 This creation relates to an automatic sticking and releasing device. The sticking and releasing device includes a carrier plate electrostatic generation group for adsorbing a wireless electrostatic carrier plate, and a substrate transfer group for adsorbing a thinned substrate, and the substrate transfer group can Linear displacement relative to the static electricity generation group of the carrier board, so that the substrate transfer group can drive the thinned substrate to be pressed and pressed onto the surface of the wireless static electricity carrier plate of the static electricity generation group of the carrier board. The electrostatic carrier plate generates an electrostatic electric field to bond the thinned substrate, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments.
Description
本創作係隸屬一種靜電吸盤之自動粘合技術,具體而言係指一種自動粘脫設備,藉以能使靜電吸盤與薄化基板如晶圓可進行自動化的粘合與解離工作,可提高工作效率,且減少粘合失敗及發生基板破損之現象,從而提高薄化基板的製程自動化。 This creation is a kind of automatic bonding technology of electrostatic chuck. Specifically, it refers to an automatic bonding equipment, which can make the electrostatic chuck and thin substrate such as wafer can be automatically bonded and dissociated, which can improve work efficiency , And reduce adhesion failure and substrate damage, thereby improving the automation of the thinning of the substrate.
按,近年來受到半導體製程的微細化發展,如存儲器和功率器件,它們的微型化朝著更小的尺寸、更高的性能以及更低的成本方向發展,而為了讓晶片面積變的更小,半導體業界採行的設計方案是將原本晶片水平部署的晶片設計,改換成垂直向的堆疊方式進行,亦即所謂的3D IC堆疊封裝。由於3D IC堆疊封裝係以垂直向進行堆疊,需利用矽穿孔〔Through-Silicon Via;TSV〕技術將IC封裝內的各功能晶片進行物理電氣連結,因此矽晶圓之厚度會被壓縮在100微米以下。另外近來智慧型手機的照相品質足以媲美專業單眼相機,而智慧型手機相機鏡頭的成像品質大幅提升的關鍵之一,在於手機相機鏡頭導入超薄的藍玻璃濾光片,可吸收多餘的紅外光,還原物體的真實顏色。 According to, in recent years, due to the miniaturization of semiconductor manufacturing processes, such as memory and power devices, their miniaturization is moving towards smaller size, higher performance and lower cost, and in order to make the chip area smaller , The design scheme adopted by the semiconductor industry is to change the original chip design with horizontal chip deployment to a vertical stacking method, which is the so-called 3D IC stacked package. Since the 3D IC stack package is stacked in a vertical direction, it is necessary to use Through-Silicon Via (TSV) technology to physically and electrically connect the functional chips in the IC package, so the thickness of the silicon wafer will be compressed to 100 microns the following. In addition, the camera quality of smartphones is comparable to that of professional single-lens cameras recently. One of the keys to the significant improvement in the imaging quality of smartphone camera lenses is the introduction of ultra-thin blue glass filters into the camera lens of smartphones to absorb excess infrared light. , Restore the true color of the object.
而這些薄化基板不論是3D IC的薄化晶圓或鏡頭的超薄濾光片,當其厚度小於200μm、100μm或甚至小於50μm,且表面積越大時如半導製程的8吋、12吋或以上時。薄化基板會變得非常柔軟有彈性,進而產生翹曲的現象。然不論是矽晶圓或玻璃片等薄化基板在製作上,需經抛光研磨、清淨、多層鍍膜、蝕刻及切割。由於超薄基板在製程中會因翹曲產生不平整及應力,會造成如鍍膜時厚度不均的製程不良問題,甚至於薄化基板也因翹曲問題在檢測時無法有效對焦而產生檢出錯誤或延緩檢測時間,而直接影響到不良品的檢出,再者薄化基板在運送與組裝過程也存在有儲存量少、易碎及脆弱等問題,故薄化基板的翹曲問題對製程可靠度產生重大不良影響,而造成提高製程成本及不良率的問題。 Whether these thinned substrates are thinned wafers for 3D ICs or ultra-thin filters for lenses, when the thickness is less than 200μm, 100μm or even less than 50μm, and the surface area is larger, such as 8-inch, 12-inch semi-conductive process Or above. Thinned substrates will become very soft and elastic, which will cause warping. However, the production of thinned substrates such as silicon wafers or glass sheets requires polishing, grinding, cleaning, multilayer coating, etching and cutting. Since the ultra-thin substrate will produce unevenness and stress due to warping during the manufacturing process, it will cause process defects such as uneven thickness during coating, and even thinned substrates will be detected due to the warpage problem and the ineffective focus during inspection Errors or delays in the inspection time directly affect the detection of defective products. Moreover, the thinned substrates have problems such as low storage, fragility and fragility during the transportation and assembly process. Therefore, the warpage of the thinned substrates affects the manufacturing process. Reliability has a major adverse effect, which leads to problems of increasing process costs and defect rates.
為了使薄化基板能保持平整來進入製程,目前薄化基板係採行暫時接合製程〔Temporary bonding〕,來強化薄化基板的張度,而暫時接合製程主要係利用多層聚合物之接合材料將薄化基板可逆地安裝到一載體上,但在進行製程後又需進行剝離,如此在接合與剝離之間都必須保持薄化基板本身的良率,同時接合後使用的接合材料,亦必須因應接合材料、被接合材料的熱膨脹係數〔CTE〕不匹配,維持薄化晶圓的內部應力,同時維持晶圓正面/背面的表面平滑,以及製程環境中對於接合材料的酸、鹼問題,這些都是進行暫時接合製程所面臨的問題。 In order to keep the thinned substrate flat and enter the process, the current thinned substrate adopts a temporary bonding process [Temporary bonding] to strengthen the tension of the thinned substrate, and the temporary bonding process mainly uses the bonding material of multilayer polymer The thinned substrate is reversibly mounted on a carrier, but it needs to be peeled off after the process. In this way, the yield of the thinned substrate itself must be maintained between bonding and peeling, and the bonding material used after bonding must also be adapted The thermal expansion coefficient [CTE] of the bonding material and the material to be bonded are not matched, maintaining the internal stress of the thinned wafer, while maintaining the smooth surface of the front/back surface of the wafer, and the acid and alkali problems of the bonding material in the process environment. It is a problem faced by the temporary bonding process.
而目前最新的改善方式是使用無線靜電載盤 〔E-Chuck或Supporter〕來粘合薄化基板後,供薄化基板進行製程作業。然而目前無線靜電載盤在粘合薄化基板時係採手動方式進行,該手動粘脫設備係於一靜電力生成座一側樞設有一可選擇性蓋合之基板載座,使用上係由工作人員先將該薄化基板放置於該靜電力生成座上,然後將上方的基板載座以手動方式旋轉方式向下蓋合於該靜電力生成座上,以利用該基板載座吸附該薄化基板,之後工作人員再將該無線靜電載盤置於該靜電力生成器上,且再次將基板載座旋轉蓋合,使該薄化基板壓合於該無線靜電載盤相對表面上,最後啟動導電令該無線靜電載盤相對薄化基板產生靜止的電力場,使得該薄化基板能被粘合於該無線靜電載盤上。且在解離該無線靜電載盤與該薄化基板時,則反向操作,將粘合有薄化基板的無線靜電載盤置入該靜電力生成座上,然後蓋合基板載座於薄化基板上方,當該靜電力生成座啟動解離而釋放該無線靜電載盤的電力場後,上方的基板載座可吸附薄化基板後向上掀起,進而分離該無線靜電載盤與該薄化基板。 The latest improvement is to use a wireless electrostatic carrier [E-Chuck or Supporter] After bonding the thinned substrates, the thinned substrates can be processed. However, at present, the wireless electrostatic carrier is performed manually when bonding thinned substrates. The manual sticking-off device is pivoted on one side of an electrostatic force generating seat with a substrate carrier that can be selectively covered. The worker first places the thinned substrate on the electrostatic force generating seat, and then manually rotates the upper substrate carrier downward to cover the electrostatic force generating seat, so as to use the substrate carrier to adsorb the thin film. After that, the staff puts the wireless electrostatic carrier on the electrostatic force generator, and rotates and covers the substrate carrier again, so that the thinned substrate is pressed on the opposite surface of the wireless electrostatic carrier, and finally The activation of conduction causes the wireless electrostatic carrier to generate a static electric field relative to the thinned substrate, so that the thinned substrate can be adhered to the wireless electrostatic carrier. And when the wireless electrostatic carrier plate and the thinned substrate are dissociated, the reverse operation is performed, and the wireless electrostatic carrier plate bonded with the thinned substrate is placed on the electrostatic force generating seat, and then the substrate carrier is covered on the thinned substrate Above the substrate, when the electrostatic force generating seat starts to dissociate to release the electric field of the wireless electrostatic carrier, the upper substrate carrier can adsorb the thinned substrate and lift it upward to separate the wireless electrostatic carrier from the thinned substrate.
但這樣的手動操作方式,不僅速度極慢,同時由於人員環境操作下該無線靜電載盤與該薄化基板的相對粘合表面無法確保其潔淨與乾燥,造成其粘合失敗的現象,而需重新進行粘合作業,且甚至可能因錯位、滑移或壓合不均勻而發生裂損或破片的問題,故其粘合效率極差。再者,由於手動操作係以人力方式進行,其難以讓該無線靜電載盤與該薄化基板在粘合時被準確對位,對於微細化高精度要求的半導體製程而言,其難以被直 接應用於高精度製程上,而只能用於傳輸、儲存等對於精度要求不高的場合。 However, this manual operation method is not only extremely slow, but also due to the fact that the relative bonding surface of the wireless electrostatic carrier and the thinned substrate cannot ensure that they are clean and dry under the operation of the personnel environment, which causes the phenomenon of bonding failure. Re-adhesive work, and may even cause cracks or fragments due to misalignment, slippage or uneven pressing, so the adhesion efficiency is extremely poor. Furthermore, since the manual operation is performed manually, it is difficult to accurately align the wireless electrostatic carrier plate and the thinned substrate during bonding. For the semiconductor manufacturing process that requires miniaturization and high precision, it is difficult to be directly aligned. It is applied to high-precision manufacturing process, but can only be used for transmission, storage and other occasions that do not require high precision.
換言之,由於現有無線靜電載盤係以手動方式粘合薄化基板,而不僅存在效率差、失敗率高的問題,甚至可能發生裂損或破片,同時也無法應付高精度的製程需求,而如何解決前述的問題係業界所期待者,亦為本創作所欲解決的技術課題。 In other words, because the existing wireless electrostatic carrier is manually bonded and thinned substrates, it not only has the problems of poor efficiency and high failure rate, but may even cause cracks or fragments, and it cannot meet the high-precision process requirements. Solving the aforementioned problems is what the industry expects, and it is also a technical problem that this creation wants to solve.
緣是,本創作人乃針對現有無線靜電載盤在粘合薄化基板時所面臨的問題深入探討,並藉由近年來技術發展的需求,經不斷努力的改良與試作,終於成功開發出一種自動粘脫設備,藉以克服現有手動操作所造成的缺點與不便。 The reason is that this creator has made in-depth discussions on the problems faced by the existing wireless electrostatic carrier discs when bonding thin substrates. Based on the needs of technological development in recent years, after continuous efforts to improve and trial, finally successfully developed a Automatic sticking-off equipment to overcome the shortcomings and inconveniences caused by the existing manual operation.
因此,本創作之主要目的係在提供一種自動粘脫設備,其可以提升粘合效率,且可大幅降低粘合失敗率,並減少生裂損或破片的發生。 Therefore, the main purpose of this creation is to provide an automatic bonding and releasing device, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments.
再者,本創作之另一主要目的係在提供一種自動粘脫設備,其能快速、且準確的自動粘合無線靜電載盤與薄化基板,使無線靜電載盤能粘合薄化基板能應用於後續製程中,可大幅提高薄化基板的製程良率,而能降低成本及增加利潤。 Furthermore, another main purpose of this creation is to provide an automatic bonding and releasing device that can quickly and accurately automatically bond the wireless electrostatic carrier to the thinned substrate, so that the wireless electrostatic carrier can bond the thinned substrate. When applied to subsequent processes, the process yield of thinned substrates can be greatly improved, and costs can be reduced and profits can be increased.
基於此,本創作主要係透過下列的技術手段,來具體實現前述之目的及功效:係用於一無線靜電載盤與一薄化基板的粘合或解離,其該無線靜電載盤底面具有導電生成靜電電力場之導極,該粘脫設備包含有; Based on this, this creation is mainly through the following technical means to specifically achieve the aforementioned objectives and effects: It is used for bonding or dissociating a wireless electrostatic carrier plate and a thinned substrate, and the bottom surface of the wireless electrostatic carrier plate is conductive. The conductive pole that generates the electrostatic electric field, the sticking and detaching equipment includes;
一框架; A frame
一載板靜電生成組,其設於該框架上,該載板靜電生成組具有一供無線靜電載盤平置之工作平面,該工作平面上分設有系列對應無線靜電載盤底面之吸附件,且該工作平面上具有二或二倍數對應接觸無線靜電載盤底導極之導極,以作動生成或釋放該無線靜電載盤之靜電電力場,又該工作平面上具有一導柱組,該導柱組包含至少二個限制載盤橫向位置之固定導柱及至少一可橫向推動載盤與固定導柱嚙合之活動導柱,使得無線靜電載盤或薄化基板可定位於工作平面之一正確位置; A carrier electrostatic generation group, which is set on the frame, the carrier electrostatic generation group has a working plane for the wireless electrostatic carrier plate to be flat, and a series of adsorption parts corresponding to the bottom surface of the wireless electrostatic carrier plate are arranged on the working plane , And the working plane has two or two multiples corresponding to the conductor contacting the bottom conductor of the wireless electrostatic carrier to generate or release the electrostatic electric field of the wireless electrostatic carrier, and the working plane has a guide post group, The guide post set includes at least two fixed guide posts that limit the lateral position of the carrier and at least one movable guide post that can push the carrier laterally to engage with the fixed guide post, so that the wireless electrostatic carrier or the thinned substrate can be positioned on the working plane A correct position;
一基板移載組,其設於該框架上且與該載板靜電生成組相對,又該基板移載組與該載板靜電生成組可相對移動,使得該基板移載組可吸附一具正確位置之薄化基板; A substrate transfer group, which is arranged on the frame and is opposite to the carrier static electricity generation group, and the substrate transfer group and the carrier static electricity generation group can move relatively, so that the substrate transfer group can absorb a correct Thinned substrate in position;
藉此,當該基板移載組可帶動薄化基板與無線靜電載盤壓合後,可作動該載板靜電生成組使無線靜電載盤生成靜電電力場,以粘合該薄化基板。 Thereby, when the substrate transfer group can drive the thinned substrate and the wireless electrostatic carrier to be pressed together, the carrier electrostatic generating group can be actuated to make the wireless electrostatic carrier generate an electrostatic power field to bond the thinned substrate.
藉此,透過上述技術手段的具體實現,本創作可以提升粘合效率,且可大幅降低粘合失敗率,並減少生裂損或破片的發生,使無線靜電載盤能粘合薄化基板能應用於後續製程中,可大幅提高薄化基板的製程良率,而能降低成本及增加利潤,以提高其附加價值,進一步可提高其經濟效益。 In this way, through the specific realization of the above technical means, this creation can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments, so that the wireless electrostatic carrier can bond thin substrates. When applied in subsequent processes, the process yield of thinned substrates can be greatly improved, while costs can be reduced and profits can be increased, so as to increase its added value and further improve its economic benefits.
為使 貴審查委員能進一步了解本創作的構成、特徵及其他目的,以下乃舉若干較佳之實施例,並配合圖式詳細說 明如后,同時讓熟悉該項技術領域者能夠具體實施。 In order to enable your reviewer to further understand the composition, features and other purposes of this creation, the following are some preferred embodiments, together with the detailed description of the drawings After clearing this up, at the same time let those familiar with the technical field be able to implement it.
50:粘脫設備 50: Adhesion equipment
51:下框架 51: lower frame
52:上框架 52: upper frame
60:載板靜電生成組 60: Carrier board electrostatic generation group
61:主框板 61: main frame board
62:頂料件 62: ejector
620:檢知元件 620: detection component
63:導極 63: Lead
64:吸附件 64: adsorption parts
65:側翼板 65: side flap
66:導柱 66: guide post
660:固定導柱 660: fixed guide post
661:斜導面 661: inclined guide surface
665:活動導柱 665: movable guide post
666:斜導面 666: inclined guide surface
67:觸動檢知組 67: Touch the detection group
670:觸動凸柱 670: Touch the boss
675:導正凸柱 675: Guiding convex column
68:光學檢知組 68: Optical Inspection Group
680:光電元件 680: Optoelectronics
69:吹氣單元 69: blowing unit
690:噴射氣嘴 690: Jet nozzle
70:驅動件 70: drive
80:基板移載組 80: substrate transfer group
81:框座 81: frame seat
810:檢知元件 810: detection component
82:升降機構 82: Lifting mechanism
83:吸附件 83: Adsorption parts
830:表面吸附件 830: Surface adsorption parts
835:邊緣吸附件 835: Edge suction parts
85:光學檢知組 85: Optical Inspection Group
850:光電元件 850: Optoelectronics
86:防落件 86: Anti-dropping parts
第一圖:本創作自動粘脫設備的外觀示意圖。 The first picture: the appearance diagram of this creative automatic sticking and releasing equipment.
第二圖:本創作自動粘脫設備的側視平面示意圖。 Figure 2: A schematic diagram of the side plan view of the automatic sticking-off device of this creation.
第三圖:本創作自動粘脫設備中載盤靜電生成組的外觀示意圖。 Figure 3: A schematic diagram of the appearance of the electrostatic generation group of the carrier plate in this creative automatic sticking device.
第四圖:本創作自動粘脫設備中載盤靜電生成組的俯視平面示意圖。 Figure 4: The top plan view of the electrostatic generation group of the carrier plate in the automatic sticking and detaching device of this creation.
第五圖:本創作自動粘脫設備中基板移載組的外觀示意圖。 Figure 5: Schematic diagram of the appearance of the substrate transfer group in the automatic bonding equipment of this creation.
第六圖:本創作自動粘脫設備中基板移載組的局部仰視平面示意圖。 Figure 6: The partial bottom plan view of the substrate transfer group in the automatic bonding equipment of this creation.
第七圖:本創作自動粘脫設備中載盤靜電生成組於頂料時的側視動作示意圖。 Figure 7: A schematic diagram of the side view action of the static electricity generation group of the carrier plate in the ejecting material in the automatic sticking-off device of this creation.
第八圖:本創作自動粘脫設備中載盤靜電生成組於導正時的側視動作示意圖。 Figure 8: A schematic diagram of the side view movement of the electrostatic generation group of the carrier plate in the automatic sticking-off device of this authoring during alignment.
第九圖:本創作自動粘脫設備中載盤靜電生成組於導正時的俯視動作示意圖。 Figure 9: A schematic diagram of the top view movement of the electrostatic generation group of the carrier plate in the automatic sticking and detachment device of the present creation during alignment.
第十圖:本創作自動粘脫設備中載盤靜電生成組於導正時的俯視局部動作示意圖。 Figure 10: The top view of the partial movement of the electrostatic generation group of the carrier plate in the automatic sticking-off device of this creation during alignment.
第十一圖:本創作自動粘脫設備中載盤靜電生成組於解離時的局部側視動作示意圖。 Figure 11: A schematic diagram of the partial side view action of the electrostatic generation group of the carrier plate in the automatic sticking and detachment device of this creation when it dissociates.
本創作係一種自動粘脫設備,隨附圖例示本創作之具體實施例及其構件中,所有關於前與後、左與右、頂部與底部、上部與下部、以及水平與垂直的參考,僅用於方便進行描述,並非限制本創作,亦非將其構件限制於任何位置或空間方向。圖式與說明書中所指定的尺寸,當可在不離開本創作之申請專利範圍內,根據本創作之具體實施例的設計與需求而進行變化。 This creation is an automatic sticking-off device. The attached drawings illustrate the specific embodiments and components of this creation. All references to front and back, left and right, top and bottom, top and bottom, and horizontal and vertical are only It is used to facilitate the description, not to limit the creation, nor to restrict its components to any position or spatial direction. The drawings and the size specified in the specification can be changed according to the design and requirements of the specific embodiment of the creation without departing from the scope of the patent application of the creation.
本創作用於無線靜電吸盤之自動粘合系統,則係如第一、二圖所示,係用於使一無線靜電載盤(100)與一薄化基板(200)之自動粘合與粘合後之自動解離,其中該薄化基板(200)可以是半導體晶圓或玻璃片或塑膠片,該粘脫設備(50)包含有可相對位移之一供吸附無線靜電載盤(100)之載板靜電生成組(60)及一供吸附薄化基板(200)之基板移載組(80),其中該粘脫設備(50)具有可固設於機體(10)之框架,該框架包含有一下框架(51)及一上框架(52),其中該載板靜電生成組(60)係設於該下框架(51)頂部,而該基板移載組(80)係利用一升降機構(82)設於該上框架(52)對應該載板靜電生成組(60)的上方,使得該基板移載組(80)可帶動薄化基板(200)相對應壓合於該載板靜電生成組(60)頂面之無線靜電載盤(100)表面; This creation is used for the automatic bonding system of the wireless electrostatic chuck, as shown in the first and second figures, which is used to automatically bond and adhere a wireless electrostatic carrier (100) and a thinned substrate (200). Automatically dissociate after combining, wherein the thinned substrate (200) can be a semiconductor wafer or glass sheet or plastic sheet, and the adhesion and release device (50) includes a movable one for adsorbing the wireless electrostatic carrier (100) The carrier board electrostatic generation group (60) and a substrate transfer group (80) for adsorbing and thinning the substrate (200), wherein the adhesion and release device (50) has a frame that can be fixed to the body (10), and the frame includes There are a lower frame (51) and an upper frame (52), wherein the carrier plate static electricity generation group (60) is arranged on the top of the lower frame (51), and the substrate transfer group (80) uses a lifting mechanism ( 82) is located above the upper frame (52) corresponding to the carrier plate static electricity generation group (60), so that the substrate transfer group (80) can drive the thinned substrate (200) to correspond to the carrier plate static electricity generation The surface of the wireless electrostatic carrier plate (100) on the top surface of the group (60);
而前述之載板靜電生成組(60)係如第三、四圖所示,其具有一主框板(61)及樞設於該主框板(61)兩側邊緣之 側翼板(65),且該主框板(61)與兩側之側翼板(65)具有供無線靜電載盤(100)平置之工作平面,且該工作平面之主框板(61)上設有一檢知元件(610),供檢知該無線靜電載盤(100)或薄化基板(200)是否存在,另該主框板(61)內設有一頂料件(62),該頂料件(62)可於工作平面及一較高之接料平面間位移〔如第七、八圖所示〕,可便於傳輸裝置(20)如機械手臂之夾爪穿入放置或取走無線靜電載盤(100)或薄化基板(200),該頂料件(62)可以是由至少三根可同步升降之頂桿所構成、又或由一可升降之頂板所構成,又兩側側翼板(65)於異於主框板(61)的外側底緣中央與下框架(51)間設有一伸縮缸(70),供選擇性作動側翼板(65)外側緣向下傾斜兩側之側翼板(65)的相異外側緣可被選擇性向下作動傾斜〔如第十一圖所示〕,供用於帶動該無線靜電載盤(100)與粘合的薄化基板(200)由外緣相對剝離,再者該主框板(61)與該側翼板(65)上分設有系列對應無線靜電載盤(100)底面之吸附件(64)〔如真空吸盤〕,供選擇性將無線靜電載盤(100)固定於主框板(61)與側翼板(65)之工作平面上,且該主框板(61)上具有二或二之倍數的導極(63),供對應無線靜電載盤(100)之底面正負導極(105),以提供電力使無線靜電載盤(100)表面可相對薄化基板(200)生成或解離靜電電力場,用於讓無線靜電載盤(100)可與薄化基板(200)相互粘合或解離,又兩側之側翼板(65)上具有一導位組(66),該導位組(66)包含有圍繞於無線靜電載盤(100) 外周緣之至少二個固定導柱(660)及至少一個活動導柱(665),本創作係以二個固定導柱(660)及二個活動導柱(665)為主要實施例,其中該等活動導柱(665)可將無線靜電載盤(100)推向該等固定導柱(660)之水平正確位置定位〔如第九圖所示〕,再者該等固定導柱(660)與該等活動導柱(665)頂端周緣形成有一斜導緣(661、666),讓該頂料件(62)下降時該無線靜電載盤(100)或薄化基板(200)可導引至工作平面之正確範圍內,再者該載板靜電生成組(60)於對應無線靜電載盤(100)外周緣處分設有一觸動檢知組(67)及一光學檢知組(68),其中該觸動檢知組(67)包含有可伸縮且圍繞於無線靜電載盤(100)外周緣之至少二根觸動凸柱(670)及至少一根可前後移動之導正凸柱(675),其中該導正凸柱(675)可對應該無線靜電載盤(100)或薄化基板(200)之定位缺口(101、201),使該導正凸柱(675)能利用該無線靜電載盤(100)或薄化基板(200)之定位切口(101、201)令其以軸線為中心旋轉導正〔如第十圖所示〕,且進一步用以當無線靜電載盤(100)或薄化基板(200)未擺正而碰觸任何一根觸動凸柱(670)時可觸發警報,至於該光學檢知組(68)包含有至少三個圍繞於無線靜電載盤(100)外周緣之光電元件(680),用以當無線靜電載盤(100)或薄化基板(200)未擺正而遮蔽任何一光電元件(680)時可觸發警報,以確保無線靜電載盤(100)及薄化基板(200)準確對位,另如第九圖所示,該載板靜電生成組(60)於下框架對應兩側側翼板 (65)處分別設有一吹氣單元(69),該吹氣單元(69)具有一對應無線靜電載盤(100)外周緣向軸心方向沿伸之噴射氣嘴(690)〔如第十一圖所示〕,用於當無線靜電載盤(100)於啟動解離且被兩側側翼板(65)帶動與薄化基板(200)剝離時,可吹入高速氣體令無線靜電載盤(100)與薄化基板(200)能被有效的分離; The aforementioned carrier board static electricity generation group (60) is shown in the third and fourth figures. It has a main frame plate (61) and pivoted on both sides of the main frame plate (61). The side wing board (65), and the main frame board (61) and the side wing boards (65) on both sides have a working plane for the wireless electrostatic carrier (100) to be flat, and the main frame board (61) of the working plane A detecting element (610) is provided for detecting the presence of the wireless electrostatic carrier plate (100) or the thinned substrate (200). In addition, the main frame plate (61) is provided with a top material (62), the top The material (62) can be displaced between the working plane and a higher receiving plane (as shown in Figures 7 and 8), which can facilitate the transmission device (20) such as the gripper of a robot arm to penetrate and place or take it away. Electrostatic carrier (100) or thinned substrate (200), the ejector (62) can be composed of at least three jacks that can be raised and lowered synchronously, or a top plate that can be raised and lowered, and has side wings on both sides A telescopic cylinder (70) is provided between the center of the outer bottom edge of the plate (65), which is different from the main frame plate (61) and the lower frame (51), to selectively actuate the outer edge of the side wing plate (65) to tilt down on both sides. The different outer edges of the side wing plate (65) can be selectively actuated and tilted downwards (as shown in Figure 11) for driving the wireless electrostatic carrier plate (100) and the bonded thinned substrate (200) from the outside The edges are relatively peeled off, and the main frame plate (61) and the side wing plate (65) are separately provided with a series of suction parts (64) corresponding to the bottom surface of the wireless electrostatic carrier plate (100) (such as a vacuum suction cup) for selective mounting The wireless electrostatic carrier plate (100) is fixed on the working plane of the main frame plate (61) and the side wing plate (65), and the main frame plate (61) has two or a multiple of two conductive poles (63) for corresponding The bottom surface of the wireless electrostatic carrier (100) has positive and negative conductors (105) to provide power so that the surface of the wireless electrostatic carrier (100) can generate or dissociate the electrostatic electric field with respect to the thinner substrate (200) for the wireless electrostatic carrier (100) can be bonded or dissociated with the thinned substrate (200), and there is a guide group (66) on the side wing plates (65) on both sides, and the guide group (66) contains the surrounding wireless electrostatic carrier Disk (100) At least two fixed guide pillars (660) and at least one movable guide pillar (665) on the outer periphery. This creation is based on two fixed guide pillars (660) and two movable guide pillars (665) as the main embodiment. The movable guide posts (665) can push the wireless electrostatic carrier plate (100) to the correct horizontal position of the fixed guide posts (660) (as shown in figure 9), and the fixed guide posts (660) An oblique guide edge (661, 666) is formed with the top periphery of the movable guide posts (665), so that the wireless electrostatic carrier plate (100) or the thinned substrate (200) can be guided when the ejector (62) is lowered Within the correct range of the working plane, the carrier electrostatic generation group (60) is provided with a touch detection group (67) and an optical detection group (68) at the outer periphery of the corresponding wireless electrostatic carrier plate (100). The touch detection group (67) includes at least two touch protruding pillars (670) and at least one guide protruding pillar (675) that can be moved forwards and backwards, which is retractable and surrounds the outer periphery of the wireless electrostatic carrier (100) , Wherein the guiding protrusion (675) can correspond to the positioning notch (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200), so that the guiding protrusion (675) can use the wireless electrostatic The positioning cuts (101, 201) of the carrier plate (100) or the thinned substrate (200) make it rotate and guide the axis as the center (as shown in the tenth figure), and are further used as a wireless electrostatic carrier plate (100) Or when the thinned substrate (200) is not squared and touches any of the touching protrusions (670), an alarm can be triggered. As for the optical detection group (68), there are at least three surrounding wireless electrostatic carrier plates (100) The photoelectric element (680) on the outer periphery is used to trigger an alarm when the wireless electrostatic carrier (100) or thinned substrate (200) is not aligned and shields any photoelectric element (680) to ensure the wireless electrostatic carrier ( 100) and the thinned substrate (200) are accurately aligned, and as shown in the ninth figure, the static electricity generation group (60) of the carrier board is placed on the side wing boards on both sides of the lower frame. (65) are respectively provided with a blowing unit (69), the blowing unit (69) has a corresponding wireless electrostatic carrier (100) outer periphery to the axial direction of the jet nozzle (690) (such as the eleventh) As shown in the figure], when the wireless electrostatic carrier (100) is dissociated at startup and is driven by the side flaps (65) on both sides to peel off the thinned substrate (200), high-speed gas can be blown into the wireless electrostatic carrier (100) ) And the thinned substrate (200) can be effectively separated;
又前述之基板移載組(80)係如第五、六圖所示,其係由一可選擇性吸附薄化基板(200)之框座(81)所構成,該框座(81)可被升降機構(82)上下線性作動,供帶動薄化基板(200)相對下方無線靜電載盤(100)選擇性壓合,又該框座(81)表面設有一檢知元件(810),供檢知該薄化基板(200)是否存在,且該框座(81)具有一吸附表面,該框座(81)之吸附表面有複數吸附件(83),其可包含對應薄化基板(200)範圍內之表面吸附件(830)或薄化基板(200)鄰近邊緣之邊緣吸附件(835),其中表面吸附件(830)可以是伯努利定律〔Bernoulli〕之吸附技術,以降低對薄化基板(200)在吸附過程中可能造成的損傷,再者該基板移載組(80)於對應薄化基板(200)外周緣處設有一光學檢知組(85),該光學檢知組(85)包含有至少三個圍繞於薄化基板(200)外周緣之光電元件(850),用以當薄化基板(200)未擺正而遮蔽任何一光電元件(850)時可觸發警報,以確保薄化基板(200)準確對位。另根據某些實施例,該基板移載組(80)周緣可設有可選擇性伸縮之防落件(86), 其伸出時所圍範圍小於薄化基板(200)外徑,用於當薄化基板(200)進入基板移載組(80)吸附表面時,可伸出防落件(86),以避免薄化基板(200)因未有效吸附而掉落,其可以確認薄化基板(200)被基板移載組(80)有效吸附後縮回。根據某些實施例,該基板移載組(80)可以是能相對載板靜電生成組(60)夾取薄化基板(200)之機械手臂; The aforementioned substrate transfer group (80) is shown in Figures 5 and 6, which is composed of a frame (81) that can selectively adsorb the thinned substrate (200), and the frame (81) can The lifting mechanism (82) is linearly actuated up and down to drive the thinned substrate (200) to be selectively pressed against the wireless electrostatic carrier plate (100) underneath, and the surface of the frame seat (81) is provided with a detecting element (810) for It is detected whether the thinned substrate (200) exists, and the frame (81) has an adsorption surface. The adsorption surface of the frame (81) has a plurality of adsorption elements (83), which may include a corresponding thinned substrate (200). ) Within the range of the surface adsorption member (830) or the edge adsorption member (835) adjacent to the edge of the thinned substrate (200), where the surface adsorption member (830) can be the adsorption technology of Bernoulli’s law [Bernoulli] to reduce the The thinned substrate (200) may be damaged during the adsorption process, and the substrate transfer group (80) is provided with an optical detection group (85) at the outer periphery of the corresponding thinned substrate (200). The optical detection The group (85) includes at least three photoelectric elements (850) around the outer periphery of the thinned substrate (200), which can be triggered when the thinned substrate (200) is not aligned and shields any photoelectric element (850) Alarm to ensure accurate alignment of the thinned substrate (200). According to some embodiments, the peripheral edge of the substrate transfer group (80) may be provided with an anti-dropping member (86) that can be selectively retracted. When it extends, the surrounding area is smaller than the outer diameter of the thinned substrate (200), which is used to extend the anti-dropping piece (86) when the thinned substrate (200) enters the adsorption surface of the substrate transfer group (80) to avoid The thinned substrate (200) is dropped due to ineffective adsorption, which can confirm that the thinned substrate (200) is effectively adsorbed by the substrate transfer group (80) and then retracted. According to some embodiments, the substrate transfer group (80) may be a robotic arm that can grip the thinned substrate (200) relative to the carrier static electricity generation group (60);
藉此,組構成一可讓無線靜電載盤(100)與薄化基板(200)能自動粘合與自動解離之自動粘合系統者。 In this way, the assembly constitutes an automatic bonding system that enables the wireless electrostatic carrier (100) and the thinned substrate (200) to be automatically bonded and automatically dissociated.
其實際操作時,係如第一、二、三及四圖所示,該傳輸裝置(20)將無線靜電載盤(100)置於該載板靜電生成組(60)之主框板(61)與側翼板(65)的工作平面上〔如第七、八圖所示〕,且利用其觸動檢知組(67)及光學檢知組(68)確保該無線靜電載盤(100)被以指定方位準確定位後〔如第九、八圖所示〕,該載板靜電生成組(60)可利用吸附件(64)固定該無線靜電載盤(100),另如第五、六圖所示,該傳輸裝置(20)將薄化基板(200)置於該基板移載組(80)的底面上,且利用其觸動檢知組(84)及光學檢知組(85)確保該薄化基板(200)被以指定方位準確定位後,該基板移載組(80)可利用吸附件(83)固定該薄化基板(200),且使該無線靜電載盤(100)與該薄化基板(200)以同一指定方位相對; In its actual operation, as shown in Figures 1, 2, 3 and 4, the transmission device (20) places the wireless electrostatic carrier (100) on the main frame (61) of the carrier electrostatic generation group (60). ) And the side wing plate (65) on the working plane (as shown in Figures 7 and 8), and use its touch detection group (67) and optical detection group (68) to ensure that the wireless electrostatic carrier (100) is After accurate positioning in the specified position (as shown in the ninth and eighth pictures), the carrier plate static electricity generation group (60) can use the adsorption member (64) to fix the wireless electrostatic carrier plate (100), as shown in the fifth and sixth pictures As shown, the transmission device (20) places the thinned substrate (200) on the bottom surface of the substrate transfer group (80), and uses its touch detection group (84) and optical detection group (85) to ensure the After the thinned substrate (200) is accurately positioned in a specified position, the substrate transfer group (80) can fix the thinned substrate (200) by the suction member (83), and make the wireless electrostatic carrier (100) and the The thinned substrates (200) face each other in the same designated orientation;
當無線靜電載盤(100)與薄化基板(200)被以同一指定方位固定在相對表面後,如第七~十圖所示,將該基板移 載組(80)帶動薄化基板(200)相對該載板靜電生成組(60)之無線靜電載盤(100)線性位移,使得該薄化基板(200)可以同一指定方位貼合於該無線靜電載盤(100)表面,且兩者外周緣完全重疊,在完成該無線靜電載盤(100)與該薄化基板(200)之貼合後,該載板靜電生成組(60)可電氣導通對該無線靜電載盤(100),使該無線靜電載盤(100)可相對該薄化基板(200)生成一靜電電力場,而完成該無線靜電載盤(100)以靜電粘合該薄化基板(200)之工作。 After the wireless electrostatic carrier (100) and the thinned substrate (200) are fixed on the opposite surface in the same designated orientation, move the substrate as shown in the seventh to tenth pictures. The carrier group (80) drives the thinned substrate (200) to linearly shift relative to the wireless electrostatic carrier plate (100) of the carrier electrostatic generating group (60), so that the thinned substrate (200) can be attached to the wireless carrier in the same designated orientation. The surface of the electrostatic carrier (100) and the outer peripheries of the two are completely overlapped. After the wireless electrostatic carrier (100) and the thinned substrate (200) are bonded together, the carrier electrostatic generation group (60) can be electrically The wireless electrostatic carrier (100) is turned on so that the wireless electrostatic carrier (100) can generate an electrostatic electric field relative to the thinned substrate (200), and the wireless electrostatic carrier (100) is completed to electrostatically bond the The work of thinning the substrate (200).
再者,該粘合的薄化基板(200)與無線靜電載盤(100)也能被解離,其係將該粘合有薄化基板(200)之無線靜電載盤(100)置入該載板靜電生成組(60)中吸附固定,並將該基板移載組(80)線性位移吸附固定於該薄化基板(200)異於無線靜電載盤(100)的一側表面,接著令該載板靜電生成組(60)釋放該無線靜電載盤(100)之靜電電力場,使該無線靜電載盤(100)之靜電被釋放,進而使該薄化基板(200)能被解離,並由該基板移載組(80)反向位移帶動該薄化基板(200)與該無線靜電載盤(100)相對分離,最後再利用相對之傳輸裝置(20)將該無線靜電載盤(100)與該薄化基板(200)分別置入相對應的載盤出入料埠(18)及基板出入料埠(16)中。而根據某些實施例,如第十一圖示,該無線靜電載盤(100)在靜電釋放後,可將該無線靜電載盤(100)外周緣向下作動,令該無線靜電載盤(100)外周緣可相對該薄化基板(200)預先剝離生 成一開口,並透過一噴氣單元(69)之噴射氣嘴(690)將高速氣體由無線靜電載盤(100)外周緣吹入,使得該無線靜電載盤(100)與該薄化基板(200)能被有效分離。 Furthermore, the bonded thinned substrate (200) and the wireless electrostatic carrier (100) can also be dissociated, and the wireless electrostatic carrier (100) bonded with the thinned substrate (200) is placed in the The carrier plate electrostatic generation group (60) is adsorbed and fixed, and the substrate transfer group (80) is fixed by linear displacement suction and fixed on the thinned substrate (200) on a side surface different from the wireless electrostatic carrier plate (100), and then make The carrier plate static electricity generation group (60) releases the electrostatic power field of the wireless electrostatic carrier plate (100), so that the static electricity of the wireless electrostatic carrier plate (100) is discharged, and then the thinned substrate (200) can be dissociated, And the reverse displacement of the substrate transfer group (80) drives the thinned substrate (200) to be relatively separated from the wireless electrostatic carrier (100), and finally the wireless electrostatic carrier (100) is used by the opposite transmission device (20). 100) The thinned substrate (200) is respectively placed in the corresponding tray inlet and outlet ports (18) and the substrate inlet and outlet ports (16). According to some embodiments, as shown in the eleventh figure, after the electrostatic discharge of the wireless electrostatic carrier (100), the outer peripheral edge of the wireless electrostatic carrier (100) can be moved downward to make the wireless electrostatic carrier ( 100) The outer periphery of the thinned substrate (200) can be peeled off in advance. Into an opening, and blow high-speed gas from the outer periphery of the wireless electrostatic carrier (100) through the jet nozzle (690) of a jet unit (69), so that the wireless electrostatic carrier (100) and the thinned substrate (200) ) Can be effectively separated.
而由上述可知,本創作之自動粘脫設備可以提升粘合效率,且可大幅降低粘合失敗率,並減少生裂損或破片的發生,其可供應付高精度的製程需求,以滿足薄化基板之自動化製作的需求,使無線靜電載盤能粘合薄化基板能應用於後續製程中,可大幅提高薄化基板的製程良率,而能降低成本及增加利潤。 From the above, it can be seen that the automatic bonding and release equipment of this invention can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments. It can meet the needs of high-precision manufacturing processes to meet the thin The demand for automated production of thinned substrates enables wireless electrostatic carrier disks to bond thinned substrates and can be used in subsequent manufacturing processes, which can greatly increase the process yield of thinned substrates, thereby reducing costs and increasing profits.
綜上所述,可以理解到本創作為一創意極佳之新型創作,除了有效解決習式者所面臨的問題,更大幅增進功效,且在相同的技術領域中未見相同或近似的產品創作或公開使用,同時具有功效的增進,故本創作已符合新型專利有關「新穎性」與「進步性」的要件,乃依法提出申請新型專利。 In summary, it can be understood that this creation is a new type of creation with excellent creativity. In addition to effectively solving the problems faced by habitants, it also greatly improves the efficiency. There is no identical or similar product creation in the same technical field. Or it can be used publicly, and at the same time it has enhanced efficacy. Therefore, this creation has met the "novelty" and "progressive" requirements of a new model patent, and an application for a new model patent is filed according to law.
50:粘脫設備 50: Adhesion equipment
51:下框架 51: lower frame
52:上框架 52: upper frame
60:載板靜電生成組 60: Carrier board electrostatic generation group
61:主框板 61: main frame board
65:側翼板 65: side flap
66:導柱 66: guide post
660:固定導柱 660: fixed guide post
665:活動導柱 665: movable guide post
690:噴射氣嘴 690: Jet nozzle
70:驅動件 70: drive
80:基板移載組 80: substrate transfer group
81:框座 81: frame seat
82::升降機構 82:: Lifting mechanism
Claims (10)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI765260B (en) * | 2020-05-08 | 2022-05-21 | 特銓股份有限公司 | Automatic debonding equipment |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI765260B (en) * | 2020-05-08 | 2022-05-21 | 特銓股份有限公司 | Automatic debonding equipment |
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