TWM604488U - Automatic bonding and releasing device - Google Patents

Abstract

This creation relates to an automatic sticking and releasing device. The sticking and releasing device includes a carrier plate electrostatic generation group for adsorbing a wireless electrostatic carrier plate, and a substrate transfer group for adsorbing a thinned substrate, and the substrate transfer group can Linear displacement relative to the static electricity generation group of the carrier board, so that the substrate transfer group can drive the thinned substrate to be pressed and pressed onto the surface of the wireless static electricity carrier plate of the static electricity generation group of the carrier board. The electrostatic carrier plate generates an electrostatic electric field to bond the thinned substrate, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments.

Description

Automatic sticking equipment

This creation is a kind of automatic bonding technology of electrostatic chuck. Specifically, it refers to an automatic bonding equipment, which can make the electrostatic chuck and thin substrate such as wafer can be automatically bonded and dissociated, which can improve work efficiency , And reduce adhesion failure and substrate damage, thereby improving the automation of the thinning of the substrate.

According to, in recent years, due to the miniaturization of semiconductor manufacturing processes, such as memory and power devices, their miniaturization is moving towards smaller size, higher performance and lower cost, and in order to make the chip area smaller , The design scheme adopted by the semiconductor industry is to change the original chip design with horizontal chip deployment to a vertical stacking method, which is the so-called 3D IC stacked package. Since the 3D IC stack package is stacked in a vertical direction, it is necessary to use Through-Silicon Via (TSV) technology to physically and electrically connect the functional chips in the IC package, so the thickness of the silicon wafer will be compressed to 100 microns the following. In addition, the camera quality of smartphones is comparable to that of professional single-lens cameras recently. One of the keys to the significant improvement in the imaging quality of smartphone camera lenses is the introduction of ultra-thin blue glass filters into the camera lens of smartphones to absorb excess infrared light. , Restore the true color of the object.

Whether these thinned substrates are thinned wafers for 3D ICs or ultra-thin filters for lenses, when the thickness is less than 200μm, 100μm or even less than 50μm, and the surface area is larger, such as 8-inch, 12-inch semi-conductive process Or above. Thinned substrates will become very soft and elastic, which will cause warping. However, the production of thinned substrates such as silicon wafers or glass sheets requires polishing, grinding, cleaning, multilayer coating, etching and cutting. Since the ultra-thin substrate will produce unevenness and stress due to warping during the manufacturing process, it will cause process defects such as uneven thickness during coating, and even thinned substrates will be detected due to the warpage problem and the ineffective focus during inspection Errors or delays in the inspection time directly affect the detection of defective products. Moreover, the thinned substrates have problems such as low storage, fragility and fragility during the transportation and assembly process. Therefore, the warpage of the thinned substrates affects the manufacturing process. Reliability has a major adverse effect, which leads to problems of increasing process costs and defect rates.

In order to keep the thinned substrate flat and enter the process, the current thinned substrate adopts a temporary bonding process [Temporary bonding] to strengthen the tension of the thinned substrate, and the temporary bonding process mainly uses the bonding material of multilayer polymer The thinned substrate is reversibly mounted on a carrier, but it needs to be peeled off after the process. In this way, the yield of the thinned substrate itself must be maintained between bonding and peeling, and the bonding material used after bonding must also be adapted The thermal expansion coefficient [CTE] of the bonding material and the material to be bonded are not matched, maintaining the internal stress of the thinned wafer, while maintaining the smooth surface of the front/back surface of the wafer, and the acid and alkali problems of the bonding material in the process environment. It is a problem faced by the temporary bonding process.

The latest improvement is to use a wireless electrostatic carrier [E-Chuck or Supporter] After bonding the thinned substrates, the thinned substrates can be processed. However, at present, the wireless electrostatic carrier is performed manually when bonding thinned substrates. The manual sticking-off device is pivoted on one side of an electrostatic force generating seat with a substrate carrier that can be selectively covered. The worker first places the thinned substrate on the electrostatic force generating seat, and then manually rotates the upper substrate carrier downward to cover the electrostatic force generating seat, so as to use the substrate carrier to adsorb the thin film. After that, the staff puts the wireless electrostatic carrier on the electrostatic force generator, and rotates and covers the substrate carrier again, so that the thinned substrate is pressed on the opposite surface of the wireless electrostatic carrier, and finally The activation of conduction causes the wireless electrostatic carrier to generate a static electric field relative to the thinned substrate, so that the thinned substrate can be adhered to the wireless electrostatic carrier. And when the wireless electrostatic carrier plate and the thinned substrate are dissociated, the reverse operation is performed, and the wireless electrostatic carrier plate bonded with the thinned substrate is placed on the electrostatic force generating seat, and then the substrate carrier is covered on the thinned substrate Above the substrate, when the electrostatic force generating seat starts to dissociate to release the electric field of the wireless electrostatic carrier, the upper substrate carrier can adsorb the thinned substrate and lift it upward to separate the wireless electrostatic carrier from the thinned substrate.

However, this manual operation method is not only extremely slow, but also due to the fact that the relative bonding surface of the wireless electrostatic carrier and the thinned substrate cannot ensure that they are clean and dry under the operation of the personnel environment, which causes the phenomenon of bonding failure. Re-adhesive work, and may even cause cracks or fragments due to misalignment, slippage or uneven pressing, so the adhesion efficiency is extremely poor. Furthermore, since the manual operation is performed manually, it is difficult to accurately align the wireless electrostatic carrier plate and the thinned substrate during bonding. For the semiconductor manufacturing process that requires miniaturization and high precision, it is difficult to be directly aligned. It is applied to high-precision manufacturing process, but can only be used for transmission, storage and other occasions that do not require high precision.

In other words, because the existing wireless electrostatic carrier is manually bonded and thinned substrates, it not only has the problems of poor efficiency and high failure rate, but may even cause cracks or fragments, and it cannot meet the high-precision process requirements. Solving the aforementioned problems is what the industry expects, and it is also a technical problem that this creation wants to solve.

The reason is that this creator has made in-depth discussions on the problems faced by the existing wireless electrostatic carrier discs when bonding thin substrates. Based on the needs of technological development in recent years, after continuous efforts to improve and trial, finally successfully developed a Automatic sticking-off equipment to overcome the shortcomings and inconveniences caused by the existing manual operation.

Therefore, the main purpose of this creation is to provide an automatic bonding and releasing device, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments.

Furthermore, another main purpose of this creation is to provide an automatic bonding and releasing device that can quickly and accurately automatically bond the wireless electrostatic carrier to the thinned substrate, so that the wireless electrostatic carrier can bond the thinned substrate. When applied to subsequent processes, the process yield of thinned substrates can be greatly improved, and costs can be reduced and profits can be increased.

Based on this, this creation is mainly through the following technical means to specifically achieve the aforementioned objectives and effects: It is used for bonding or dissociating a wireless electrostatic carrier plate and a thinned substrate, and the bottom surface of the wireless electrostatic carrier plate is conductive. The conductive pole that generates the electrostatic electric field, the sticking and detaching equipment includes;

A frame

A carrier electrostatic generation group, which is set on the frame, the carrier electrostatic generation group has a working plane for the wireless electrostatic carrier plate to be flat, and a series of adsorption parts corresponding to the bottom surface of the wireless electrostatic carrier plate are arranged on the working plane , And the working plane has two or two multiples corresponding to the conductor contacting the bottom conductor of the wireless electrostatic carrier to generate or release the electrostatic electric field of the wireless electrostatic carrier, and the working plane has a guide post group, The guide post set includes at least two fixed guide posts that limit the lateral position of the carrier and at least one movable guide post that can push the carrier laterally to engage with the fixed guide post, so that the wireless electrostatic carrier or the thinned substrate can be positioned on the working plane A correct position;

A substrate transfer group, which is arranged on the frame and is opposite to the carrier static electricity generation group, and the substrate transfer group and the carrier static electricity generation group can move relatively, so that the substrate transfer group can absorb a correct Thinned substrate in position;

Thereby, when the substrate transfer group can drive the thinned substrate and the wireless electrostatic carrier to be pressed together, the carrier electrostatic generating group can be actuated to make the wireless electrostatic carrier generate an electrostatic power field to bond the thinned substrate.

In this way, through the specific realization of the above technical means, this creation can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments, so that the wireless electrostatic carrier can bond thin substrates. When applied in subsequent processes, the process yield of thinned substrates can be greatly improved, while costs can be reduced and profits can be increased, so as to increase its added value and further improve its economic benefits.

In order to enable your reviewer to further understand the composition, features and other purposes of this creation, the following are some preferred embodiments, together with the detailed description of the drawings After clearing this up, at the same time let those familiar with the technical field be able to implement it.

50: Adhesion equipment

51: lower frame

52: upper frame

60: Carrier board electrostatic generation group

61: main frame board

62: ejector

620: detection component

63: Lead

64: adsorption parts

65: side flap

66: guide post

660: fixed guide post

661: inclined guide surface

665: movable guide post

666: inclined guide surface

67: Touch the detection group

670: Touch the boss

675: Guiding convex column

68: Optical Inspection Group

680: Optoelectronics

69: blowing unit

690: Jet nozzle

70: drive

80: substrate transfer group

81: frame seat

810: detection component

82: Lifting mechanism

83: Adsorption parts

830: Surface adsorption parts

835: Edge suction parts

85: Optical Inspection Group

850: Optoelectronics

86: Anti-dropping parts

The first picture: the appearance diagram of this creative automatic sticking and releasing equipment.

Figure 2: A schematic diagram of the side plan view of the automatic sticking-off device of this creation.

Figure 3: A schematic diagram of the appearance of the electrostatic generation group of the carrier plate in this creative automatic sticking device.

Figure 4: The top plan view of the electrostatic generation group of the carrier plate in the automatic sticking and detaching device of this creation.

Figure 5: Schematic diagram of the appearance of the substrate transfer group in the automatic bonding equipment of this creation.

Figure 6: The partial bottom plan view of the substrate transfer group in the automatic bonding equipment of this creation.

Figure 7: A schematic diagram of the side view action of the static electricity generation group of the carrier plate in the ejecting material in the automatic sticking-off device of this creation.

Figure 8: A schematic diagram of the side view movement of the electrostatic generation group of the carrier plate in the automatic sticking-off device of this authoring during alignment.

Figure 9: A schematic diagram of the top view movement of the electrostatic generation group of the carrier plate in the automatic sticking and detachment device of the present creation during alignment.

Figure 10: The top view of the partial movement of the electrostatic generation group of the carrier plate in the automatic sticking-off device of this creation during alignment.

Figure 11: A schematic diagram of the partial side view action of the electrostatic generation group of the carrier plate in the automatic sticking and detachment device of this creation when it dissociates.

This creation is an automatic sticking-off device. The attached drawings illustrate the specific embodiments and components of this creation. All references to front and back, left and right, top and bottom, top and bottom, and horizontal and vertical are only It is used to facilitate the description, not to limit the creation, nor to restrict its components to any position or spatial direction. The drawings and the size specified in the specification can be changed according to the design and requirements of the specific embodiment of the creation without departing from the scope of the patent application of the creation.

This creation is used for the automatic bonding system of the wireless electrostatic chuck, as shown in the first and second figures, which is used to automatically bond and adhere a wireless electrostatic carrier (100) and a thinned substrate (200). Automatically dissociate after combining, wherein the thinned substrate (200) can be a semiconductor wafer or glass sheet or plastic sheet, and the adhesion and release device (50) includes a movable one for adsorbing the wireless electrostatic carrier (100) The carrier board electrostatic generation group (60) and a substrate transfer group (80) for adsorbing and thinning the substrate (200), wherein the adhesion and release device (50) has a frame that can be fixed to the body (10), and the frame includes There are a lower frame (51) and an upper frame (52), wherein the carrier plate static electricity generation group (60) is arranged on the top of the lower frame (51), and the substrate transfer group (80) uses a lifting mechanism ( 82) is located above the upper frame (52) corresponding to the carrier plate static electricity generation group (60), so that the substrate transfer group (80) can drive the thinned substrate (200) to correspond to the carrier plate static electricity generation The surface of the wireless electrostatic carrier plate (100) on the top surface of the group (60);

The aforementioned carrier board static electricity generation group (60) is shown in the third and fourth figures. It has a main frame plate (61) and pivoted on both sides of the main frame plate (61). The side wing board (65), and the main frame board (61) and the side wing boards (65) on both sides have a working plane for the wireless electrostatic carrier (100) to be flat, and the main frame board (61) of the working plane A detecting element (610) is provided for detecting the presence of the wireless electrostatic carrier plate (100) or the thinned substrate (200). In addition, the main frame plate (61) is provided with a top material (62), the top The material (62) can be displaced between the working plane and a higher receiving plane (as shown in Figures 7 and 8), which can facilitate the transmission device (20) such as the gripper of a robot arm to penetrate and place or take it away. Electrostatic carrier (100) or thinned substrate (200), the ejector (62) can be composed of at least three jacks that can be raised and lowered synchronously, or a top plate that can be raised and lowered, and has side wings on both sides A telescopic cylinder (70) is provided between the center of the outer bottom edge of the plate (65), which is different from the main frame plate (61) and the lower frame (51), to selectively actuate the outer edge of the side wing plate (65) to tilt down on both sides. The different outer edges of the side wing plate (65) can be selectively actuated and tilted downwards (as shown in Figure 11) for driving the wireless electrostatic carrier plate (100) and the bonded thinned substrate (200) from the outside The edges are relatively peeled off, and the main frame plate (61) and the side wing plate (65) are separately provided with a series of suction parts (64) corresponding to the bottom surface of the wireless electrostatic carrier plate (100) (such as a vacuum suction cup) for selective mounting The wireless electrostatic carrier plate (100) is fixed on the working plane of the main frame plate (61) and the side wing plate (65), and the main frame plate (61) has two or a multiple of two conductive poles (63) for corresponding The bottom surface of the wireless electrostatic carrier (100) has positive and negative conductors (105) to provide power so that the surface of the wireless electrostatic carrier (100) can generate or dissociate the electrostatic electric field with respect to the thinner substrate (200) for the wireless electrostatic carrier (100) can be bonded or dissociated with the thinned substrate (200), and there is a guide group (66) on the side wing plates (65) on both sides, and the guide group (66) contains the surrounding wireless electrostatic carrier Disk (100) At least two fixed guide pillars (660) and at least one movable guide pillar (665) on the outer periphery. This creation is based on two fixed guide pillars (660) and two movable guide pillars (665) as the main embodiment. The movable guide posts (665) can push the wireless electrostatic carrier plate (100) to the correct horizontal position of the fixed guide posts (660) (as shown in figure 9), and the fixed guide posts (660) An oblique guide edge (661, 666) is formed with the top periphery of the movable guide posts (665), so that the wireless electrostatic carrier plate (100) or the thinned substrate (200) can be guided when the ejector (62) is lowered Within the correct range of the working plane, the carrier electrostatic generation group (60) is provided with a touch detection group (67) and an optical detection group (68) at the outer periphery of the corresponding wireless electrostatic carrier plate (100). The touch detection group (67) includes at least two touch protruding pillars (670) and at least one guide protruding pillar (675) that can be moved forwards and backwards, which is retractable and surrounds the outer periphery of the wireless electrostatic carrier (100) , Wherein the guiding protrusion (675) can correspond to the positioning notch (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200), so that the guiding protrusion (675) can use the wireless electrostatic The positioning cuts (101, 201) of the carrier plate (100) or the thinned substrate (200) make it rotate and guide the axis as the center (as shown in the tenth figure), and are further used as a wireless electrostatic carrier plate (100) Or when the thinned substrate (200) is not squared and touches any of the touching protrusions (670), an alarm can be triggered. As for the optical detection group (68), there are at least three surrounding wireless electrostatic carrier plates (100) The photoelectric element (680) on the outer periphery is used to trigger an alarm when the wireless electrostatic carrier (100) or thinned substrate (200) is not aligned and shields any photoelectric element (680) to ensure the wireless electrostatic carrier ( 100) and the thinned substrate (200) are accurately aligned, and as shown in the ninth figure, the static electricity generation group (60) of the carrier board is placed on the side wing boards on both sides of the lower frame. (65) are respectively provided with a blowing unit (69), the blowing unit (69) has a corresponding wireless electrostatic carrier (100) outer periphery to the axial direction of the jet nozzle (690) (such as the eleventh) As shown in the figure], when the wireless electrostatic carrier (100) is dissociated at startup and is driven by the side flaps (65) on both sides to peel off the thinned substrate (200), high-speed gas can be blown into the wireless electrostatic carrier (100) ) And the thinned substrate (200) can be effectively separated;

The aforementioned substrate transfer group (80) is shown in Figures 5 and 6, which is composed of a frame (81) that can selectively adsorb the thinned substrate (200), and the frame (81) can The lifting mechanism (82) is linearly actuated up and down to drive the thinned substrate (200) to be selectively pressed against the wireless electrostatic carrier plate (100) underneath, and the surface of the frame seat (81) is provided with a detecting element (810) for It is detected whether the thinned substrate (200) exists, and the frame (81) has an adsorption surface. The adsorption surface of the frame (81) has a plurality of adsorption elements (83), which may include a corresponding thinned substrate (200). ) Within the range of the surface adsorption member (830) or the edge adsorption member (835) adjacent to the edge of the thinned substrate (200), where the surface adsorption member (830) can be the adsorption technology of Bernoulli’s law [Bernoulli] to reduce the The thinned substrate (200) may be damaged during the adsorption process, and the substrate transfer group (80) is provided with an optical detection group (85) at the outer periphery of the corresponding thinned substrate (200). The optical detection The group (85) includes at least three photoelectric elements (850) around the outer periphery of the thinned substrate (200), which can be triggered when the thinned substrate (200) is not aligned and shields any photoelectric element (850) Alarm to ensure accurate alignment of the thinned substrate (200). According to some embodiments, the peripheral edge of the substrate transfer group (80) may be provided with an anti-dropping member (86) that can be selectively retracted. When it extends, the surrounding area is smaller than the outer diameter of the thinned substrate (200), which is used to extend the anti-dropping piece (86) when the thinned substrate (200) enters the adsorption surface of the substrate transfer group (80) to avoid The thinned substrate (200) is dropped due to ineffective adsorption, which can confirm that the thinned substrate (200) is effectively adsorbed by the substrate transfer group (80) and then retracted. According to some embodiments, the substrate transfer group (80) may be a robotic arm that can grip the thinned substrate (200) relative to the carrier static electricity generation group (60);

In this way, the assembly constitutes an automatic bonding system that enables the wireless electrostatic carrier (100) and the thinned substrate (200) to be automatically bonded and automatically dissociated.

In its actual operation, as shown in Figures 1, 2, 3 and 4, the transmission device (20) places the wireless electrostatic carrier (100) on the main frame (61) of the carrier electrostatic generation group (60). ) And the side wing plate (65) on the working plane (as shown in Figures 7 and 8), and use its touch detection group (67) and optical detection group (68) to ensure that the wireless electrostatic carrier (100) is After accurate positioning in the specified position (as shown in the ninth and eighth pictures), the carrier plate static electricity generation group (60) can use the adsorption member (64) to fix the wireless electrostatic carrier plate (100), as shown in the fifth and sixth pictures As shown, the transmission device (20) places the thinned substrate (200) on the bottom surface of the substrate transfer group (80), and uses its touch detection group (84) and optical detection group (85) to ensure the After the thinned substrate (200) is accurately positioned in a specified position, the substrate transfer group (80) can fix the thinned substrate (200) by the suction member (83), and make the wireless electrostatic carrier (100) and the The thinned substrates (200) face each other in the same designated orientation;

After the wireless electrostatic carrier (100) and the thinned substrate (200) are fixed on the opposite surface in the same designated orientation, move the substrate as shown in the seventh to tenth pictures. The carrier group (80) drives the thinned substrate (200) to linearly shift relative to the wireless electrostatic carrier plate (100) of the carrier electrostatic generating group (60), so that the thinned substrate (200) can be attached to the wireless carrier in the same designated orientation. The surface of the electrostatic carrier (100) and the outer peripheries of the two are completely overlapped. After the wireless electrostatic carrier (100) and the thinned substrate (200) are bonded together, the carrier electrostatic generation group (60) can be electrically The wireless electrostatic carrier (100) is turned on so that the wireless electrostatic carrier (100) can generate an electrostatic electric field relative to the thinned substrate (200), and the wireless electrostatic carrier (100) is completed to electrostatically bond the The work of thinning the substrate (200).

Furthermore, the bonded thinned substrate (200) and the wireless electrostatic carrier (100) can also be dissociated, and the wireless electrostatic carrier (100) bonded with the thinned substrate (200) is placed in the The carrier plate electrostatic generation group (60) is adsorbed and fixed, and the substrate transfer group (80) is fixed by linear displacement suction and fixed on the thinned substrate (200) on a side surface different from the wireless electrostatic carrier plate (100), and then make The carrier plate static electricity generation group (60) releases the electrostatic power field of the wireless electrostatic carrier plate (100), so that the static electricity of the wireless electrostatic carrier plate (100) is discharged, and then the thinned substrate (200) can be dissociated, And the reverse displacement of the substrate transfer group (80) drives the thinned substrate (200) to be relatively separated from the wireless electrostatic carrier (100), and finally the wireless electrostatic carrier (100) is used by the opposite transmission device (20). 100) The thinned substrate (200) is respectively placed in the corresponding tray inlet and outlet ports (18) and the substrate inlet and outlet ports (16). According to some embodiments, as shown in the eleventh figure, after the electrostatic discharge of the wireless electrostatic carrier (100), the outer peripheral edge of the wireless electrostatic carrier (100) can be moved downward to make the wireless electrostatic carrier ( 100) The outer periphery of the thinned substrate (200) can be peeled off in advance. Into an opening, and blow high-speed gas from the outer periphery of the wireless electrostatic carrier (100) through the jet nozzle (690) of a jet unit (69), so that the wireless electrostatic carrier (100) and the thinned substrate (200) ) Can be effectively separated.

From the above, it can be seen that the automatic bonding and release equipment of this invention can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments. It can meet the needs of high-precision manufacturing processes to meet the thin The demand for automated production of thinned substrates enables wireless electrostatic carrier disks to bond thinned substrates and can be used in subsequent manufacturing processes, which can greatly increase the process yield of thinned substrates, thereby reducing costs and increasing profits.

In summary, it can be understood that this creation is a new type of creation with excellent creativity. In addition to effectively solving the problems faced by habitants, it also greatly improves the efficiency. There is no identical or similar product creation in the same technical field. Or it can be used publicly, and at the same time it has enhanced efficacy. Therefore, this creation has met the "novelty" and "progressive" requirements of a new model patent, and an application for a new model patent is filed according to law.

50: Adhesion equipment

51: lower frame

52: upper frame

60: Carrier board electrostatic generation group

61: main frame board

65: side flap

66: guide post

660: fixed guide post

665: movable guide post

690: Jet nozzle

70: drive

80: substrate transfer group

81: frame seat

82:: Lifting mechanism

Claims (10)

An automatic sticking and releasing device for bonding or dissociating a wireless electrostatic carrier plate and a thinned substrate. The bottom surface of the wireless electrostatic carrier plate has a conductive electrode that generates an electrostatic electric field. The sticking and releasing device includes: A frame A carrier electrostatic generation group, which is set on the frame, the carrier electrostatic generation group has a working plane for the wireless electrostatic carrier plate to be flat, and a series of adsorption parts corresponding to the bottom surface of the wireless electrostatic carrier plate are arranged on the working plane , And the working plane has two or two multiples corresponding to the conductor contacting the bottom conductor of the wireless electrostatic carrier to generate or release the electrostatic electric field of the wireless electrostatic carrier, and the working plane has a guide post group, The guide post set includes at least two fixed guide posts that limit the lateral position of the carrier and at least one movable guide post that can push the carrier laterally to engage with the fixed guide post, so that the wireless electrostatic carrier or the thinned substrate can be positioned on the working plane A correct position; A substrate transfer group, which is arranged on the frame and is opposite to the carrier static electricity generation group, and the substrate transfer group and the carrier static electricity generation group can move relatively, so that the substrate transfer group can absorb a correct Thinned substrate in position; Thereby, when the substrate transfer group can drive the thinned substrate and the wireless electrostatic carrier to be pressed together, the carrier electrostatic generating group can be actuated to make the wireless electrostatic carrier generate an electrostatic power field to bond the thinned substrate. Such as the automatic sticking-off device described in claim 1, wherein the working plane is formed by a main frame plate and pivoted on both sides of the main frame plate It is composed of side wing plates of the edge, and the side wing plates on both sides are different from the main frame plate at one end and can be selectively displaced downward. For example, the automatic sticking-off equipment described in claim 2 of the scope of patent application, in which the main frame plate is provided with a selective lifter that can be moved between the working plane and a higher receiving plane. . For example, the automatic sticking and detaching device described in claim 1 of the scope of patent application, wherein the fixed guide pillars of the guide pillars and the movable guide pillars form an oblique guide edge at the top edge, so that the wireless electrostatic carrier plate can be guided when the carrier board is lowered To the correct position of the working plane. For example, the automatic sticking-off device described in claim 1 of the scope of patent application, wherein the carrier plate electrostatic generation group is provided with a touch detection group at the outer periphery of the corresponding wireless electrostatic carrier plate, and the touch detection group includes a retractable and surrounding At least two touch protruding pillars on the outer periphery of the wireless electrostatic carrier and at least one guide protruding post that can move back and forth, wherein the guide protruding pillar can use the positioning cut of the wireless electrostatic carrier or the thinned substrate to make it The axis is the center rotation guide. For example, the automatic sticking and releasing device described in claim 1 or 5 of the scope of patent application, wherein the electrostatic generation group of the carrier is provided with an optical detection group at the outer periphery of the corresponding wireless electrostatic carrier, and the optical detection group includes at least three The photoelectric element surrounding the outer periphery of the wireless electrostatic carrier is used to trigger an alarm when the wireless electrostatic carrier is not aligned and shields any photoelectric element. For example, the automatic sticking and releasing device described in claim 2 of the scope of patent application, wherein the static electricity generation group of the carrier board is provided with a corresponding side wing board An air blowing unit, which has a jet nozzle corresponding to the outer periphery of the wireless electrostatic carrier plate extending in the axial direction, for blowing high-speed gas so that the wireless electrostatic carrier plate and the thinned substrate can be effectively separated. As described in claim 1 of the scope of patent application, the substrate transfer group has a frame base, and the frame base has a plurality of adsorbents on the surface, which may include surface adsorbents in the range of the corresponding thinned substrate or Thinning the edge adsorption member near the edge of the substrate, wherein the surface adsorption member can be the adsorption technology of Bernoulli's law. For example, the automatic adhesion and release equipment described in claim 1 or 8, wherein the substrate transfer group is provided with an optical detection group at the outer periphery of the corresponding thinned substrate, and the optical detection group includes at least three surrounding The photoelectric element on the outer periphery of the thinned substrate is used to trigger an alarm when the thinned substrate is not squared and shields any photoelectric element. For example, the automatic sticking-off device described in claim 1 of the scope of patent application, wherein the peripheral edge of the substrate transfer group can be provided with a selectively retractable anti-dropping member, and the range when it extends is smaller than the outer diameter of the thinned substrate, which is used for When the thinned substrate enters the adsorption surface of the substrate transfer group, the anti-dropping piece can be extended to prevent the thinned substrate from falling due to ineffective adsorption, and the attachment can confirm that the thinned substrate is effectively adsorbed by the substrate transfer group Retract afterwards.

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