TW201618224A - Substrate platform mechanism - Google Patents

Abstract

This invention relates to a substrate platform mechanism which at least comprises a base, a clamping base provided on the base to selectively clamp the base, and a suction unit provided on the upper surface of the base and within the clamping range of the clamping base, wherein the suction unit has a suction disc with a top surface having suction force and with a diameter less than or equal to a quarter of the shortest diagonal or diameter of the substrate and not greater than 80 mm so that the suction disc can selectively suck the partial bottom of the substrate; furthermore, between the suction unit and the clamping base, there may be relative x-axis, y-axis and z-axis linear displacements, such that the substrate platform mechanism, due to the minimal area ratio of the suction disc relative to the substrate, can effectively overcome the substrate warpage problem. During the inspection operation, the image capture will not be interfered by focal distance error, and no repeated inspection is needed, thereby increasing the accuracy and efficiency of the inspection operation.

Description

Substrate stage mechanism

The invention belongs to a supporting technology of a thinned substrate, in particular to a substrate stage mechanism capable of overcoming the warpage of the substrate during operation, thereby improving the accuracy and stability of the operation and reducing the occurrence of the defect rate.

Pressing, in many thin substrates (such as wafers, solar panels, metal sheets, glass panels, etc.), warpage is a very difficult subject. In the case of semiconductor wafers, the production of conventional slab wafers has gradually evolved toward ultra-thin wafers, and the size of wafers is also increasing. Wafers include repeated high-temperature annealing and wafer thinning in various processes. It is prone to warpage as a result of finishing deposition such as compression and stretching.

Since every procedure in the semiconductor process is interlocking, the wafer may be damaged if there is a procedure error. Therefore, the correctness of the manufacturing process is indeed a very important project, and a minor mistake in one link may lead to significant losses. Therefore, after each process is completed, it is usually necessary to undergo specific inspections, such as whether the surface pattern is flawed, contaminated, whether the wafer is cracked or the like.

In general, when thinning wafers are surface-inspected, the thinned wafers are placed on a large platform and adsorbed by vacuum suction, but they are easily sag or self-contained due to the outer diameter of the wafer sheet. The warping deformation causes the adsorption to be uneven, so in the inspection operation, the image capturing will be repeated for detection due to the focal length error. Reducing work efficiency, and even causing misjudgment; in addition, when the wafer is warped, it is difficult to be effectively fixed on the stage, and it may be easy to peel off and positional deviation under rapid movement, resulting in an increase in the rate of rejection. Even when the vacuum suction is too large, the wafer may be broken due to unbearable. In other words, the warped wafer is not only susceptible to cracking, but also causes substantial manufacturing yield loss, and also hinders manufacturing precision in an automated environment, resulting in variations in the quality of the final product.

In view of the above, the inventors of the present invention have intensively discussed the problems faced by the prior thinned substrates in the process of fixing in the process, and actively seek solutions through the experience of the inventors for years of relevant development, and have been continuously researching. With the development, it has finally succeeded in creating a substrate stage mechanism to overcome the troubles and inconveniences caused by the excessive suction area.

Therefore, the main object of the present invention is to provide a substrate stage mechanism for thinning a substrate, which can effectively maintain the flatness of the substrate due to gravity or self-warpage deformation at the working position by using the effect of local adsorption, thereby reducing false positives.

However, another main object of the present invention is to provide a substrate carrier mechanism that can be stably adsorbed, thereby providing effective adsorption and for rapid movement to improve work efficiency.

Further, another main object of the present invention is to provide a substrate stage mechanism for avoiding repeated detection, which can ensure flatness during detection and improve the accuracy of detection thereof to avoid repeated operations.

To this end, the present invention mainly implements the above objects and effects through the following technical means for carrying a substrate, including at least: a pedestal; a clamping seat is disposed on the upper surface of the pedestal, and the clamping seat is configured to selectively clamp the substrate; and an adsorption unit having an upper surface disposed on the pedestal and the clamping seat The body of the clamping substrate is further provided with a vacuum suction cup of the mask, and the diameter of the suction cup is less than or equal to a quarter of the diameter or the shortest diagonal of the substrate, and is not more than 80 mm, for the suction cup The partial bottom of the substrate is selectively adsorbed, and the linear displacement of the X-axis, the Y-axis and the Z-axis may be provided between the adsorption unit and the holder.

Therefore, through the specific implementation of the foregoing technical means, the substrate stage mechanism of the present invention can effectively overcome the problem of substrate warpage because the ratio of the area of the suction cup to the substrate is extremely small, and the image capture is not caused by the inspection operation. The focal length error, so there is no need to repeat the test, which can improve the accuracy and efficiency of the inspection work. At the same time, since the suction unit of the adsorption unit only provides up and down displacement, the problem of substrate drop and positioning deviation caused by insufficient movement due to rapid movement is not caused, and the substrate is not broken due to excessive suction, so that the working efficiency can be improved. Yield, which increases its added value and increases its economic efficiency.

The following is a description of the preferred embodiments of the present invention, and the detailed description of the present invention will be described in detail with reference to the accompanying drawings. .

(10) ‧ ‧ pedestal

(11)‧‧‧First rail set

(12)‧‧‧ Slider

(13)‧‧‧First brake

(15)‧‧‧ top board

(16)‧‧‧Second rail set

(17)‧‧‧ Slider

(18)‧‧‧Second brakes

(19)‧‧‧Tongkong

(20)‧‧‧Clamping seat

(21) ‧‧‧ hole

(22)‧‧‧Claws

(23) ‧ ‧ guide slots

(30) ‧‧‧Adsorption unit

(31) ‧‧‧ Ontology

(35)‧‧‧Sucker

(50) ‧‧‧Substrate

First: A schematic view of the appearance of the substrate stage mechanism of the present invention.

Second drawing: exploded view of the substrate stage mechanism of the present invention for explaining each group The aspect of the pieces and their relative relationship.

Third: Schematic diagram of the appearance of the substrate stage mechanism of the present invention in actual use.

Fourth: Another schematic diagram of the operation of the substrate stage mechanism of the present invention in actual use.

The present invention is a substrate stage mechanism, with reference to the drawings illustrating specific embodiments of the invention and its components, all with respect to front and rear, left and right, top and bottom, upper and lower, and horizontal and vertical references, only It is intended to facilitate the description, not to limit the invention, and to limit its components to any position or spatial orientation. The drawings and the dimensions specified in the specification may be varied in accordance with the design and needs of the specific embodiments of the present invention without departing from the scope of the invention.

The brief structure of the substrate stage mechanism of the present invention is as shown in the first and second figures. The substrate stage mechanism can be applied to various thinned substrates (50), including but not limited to wafers, solar energy. a substrate, a glass plate, a metal sheet, or the like, and the substrate stage mechanism includes at least a base (10), a clamping seat (20) and an adsorption unit (30), wherein the adsorption unit (30) There may be a linear displacement relative to the X-axis, the Y-axis and the Z-axis between the clamping seat (20); wherein the adsorption unit (30) is disposed at the center of the upper surface of the base (10) and the upper surface of the base (10) A first rail group (11) (which may be selected from an X-axis or a Y-axis) is disposed on each of the two sides, and each of the first rail groups (11) is provided with at least one slider (12), and one of the first a rail group (11) has a first brake member (13) for driving the slider (12), and a slider (12) is disposed on each slider (12) of the first rail group (11) on both sides, and The top edge of the top surface of the top plate (15) is provided with a first The two rail groups (16) are selected from the Y-axis or the X-axis, and each of the second rail groups (16) is provided with at least one slider (17), and one of the second rail groups (16) has a second brake member (18) for driving the slider (17), and a through hole (19) for the suction unit (30) to pass through is formed in the center of the top plate (15), and the holder (20) is further provided. On each of the sliders (17) of the second rail group (16) on both sides, the clamping seat (20) can perform linear displacement of the X-axis or the Y-axis with respect to the adsorption unit (30) on the base (10); The holder (20) is formed with a hole (21) corresponding to the contour of the substrate (50), and the holder (20) is provided with at least two jaws (22) equidistant from the hole (21). The two jaws (22) are for selectively clamping or releasing the substrate (50) in the hole (21), and the top cover of the holder (20) has a guide for connecting the outside and the hole (21). a slot (23) for a suction-type robot arm (not shown) to enter and exit the hole (21) to transfer the substrate (50); thus, the adsorption unit (30) has a fixed base ( 10) The upper body (31), and the body (31) is provided with a mask vacuum suction cup (35), and the suction cup (35) can generate Z with respect to the body (31) The shaft is displaced, and the suction cup (35) is rotatable relative to the body (31), and the diameter of the suction cup (35) is less than or equal to a quarter of the diameter of the substrate (50) or the shortest diagonal, and is not more than 80 mm. Taking a 300 cm or 180 cm wafer substrate (50) as an example, the diameter of the chuck (35) is preferably 20 mm to 30 mm, so that the suction cup (35) of the adsorption unit (30) can only suck the portion of the substrate (50). Whereas, the group is further configured to form a substrate stage mechanism that reduces warpage during operation.

When the substrate stage mechanism of the present invention is applied to a wafer inspection machine (not shown), and if one of the above optical inspection systems (not shown) is used to perform surface inspection of the substrate (50) of the wafer, it is as shown in the first, third and fourth figures. The third and fourth figures are removed by the substrate (50) for convenient observation of the operating state of the substrate stage mechanism. The substrate (50) is transferred between the holes (21) of the holder (20) by a suction cup type mechanical arm, and the periphery of the suction cup (35) is fixed by the clamping jaws (22) to fix the substrate (50). On the clamping seat (20); then, using the first rail set (11) on the base (10) and the second rail set (16) on the top plate (15), the clamping seat (20) can be driven The substrate (50) is displaced from the adsorption unit (30) by the X-axis and the Y-axis, and when the substrate (50) is moved to the portion to be inspected, the suction plate (35) of the adsorption unit (30) is moved upward and adsorbed. a partial bottom surface of the substrate (50), and the clamping jaws (22) of the clamping seat (20) release the substrate (50), and then the suction cup (35) of the adsorption unit (30) transfers the substrate (50) to a predetermined The height is used for the local inspection of the substrate (50) by the optical inspection system of the wafer inspection machine; and when the detection of the portion is completed, the suction cup (35) of the adsorption unit (30) can be moved to the clamping height, and The clamping jaws (22) of the clamping seat (20) are further clamped around the circumference of the substrate (50), and the suction cups (35) of the adsorption unit (30) are lowered to a safe range, so that the above-mentioned use of the clamping seat is repeated. ) moving the substrate (50) to the X-axis and the Y-axis, The substrate to be completed (50) required for inspection of the surface.

Through the above description, the substrate stage mechanism of the present invention can effectively overcome the problem of warpage of the substrate (50) because the ratio of the area of the suction cup (35) to the substrate (50) is extremely small, so that in the inspection operation, the image capture is performed. There is no need to repeat the detection due to the focal length error, which can improve the accuracy and efficiency of the inspection operation. At the same time, since the suction unit (30) suction cup (35) only provides the Z-axis displacement of the upper and lower sides, the cause does not occur. The problem of rapid movement and insufficient adsorption force, the resulting substrate (50) falling and positioning deviation, does not cause the substrate (50) to be broken due to excessive suction, so that the working efficiency and yield can be improved.

In summary, it can be understood that the present invention is an innovative invention creation, in addition to effectively solving the problems faced by the practitioners, and greatly improving the efficiency, and the same or similar product creation is not seen in the same technical field. Or public use, and at the same time, it has the effect of improving the efficiency. Therefore, the present invention has met the requirements for "novelty" and "progressiveness" of the invention patent, and is the invention of the invention patent.

(10) ‧ ‧ pedestal

(11)‧‧‧First rail set

(12)‧‧‧ Slider

(15)‧‧‧ top board

(16)‧‧‧Second rail set

(17)‧‧‧ Slider

(20)‧‧‧Clamping seat

(21) ‧‧‧ hole

(22)‧‧‧Claws

(23) ‧ ‧ guide slots

(30) ‧‧‧Adsorption unit

(31) ‧‧‧ Ontology

(35)‧‧‧Sucker

Claims (7)

A substrate stage mechanism for carrying a substrate, comprising at least: a base; a clamping seat disposed on the upper surface of the base, wherein the clamping seat is for selectively clamping the substrate; and an adsorption unit The utility model has a body disposed on the upper surface of the base and sandwiching the base of the clamping base, and the body is provided with a vacuum suction cup of the mask, and the diameter of the suction cup is less than or equal to the diameter of the substrate or the shortest diagonal One quarter of the line, and not more than 80 mm, for the suction cup to selectively adsorb a partial bottom of the substrate, and further, the adsorption unit and the holder may have a linear displacement relative to the X-axis, the Y-axis and the Z-axis. The substrate stage mechanism of claim 1, wherein the suction cup of the adsorption unit is movable relative to the body to generate a Z-axis of upper and lower displacement. The substrate stage mechanism of claim 1, wherein the suction cup of the adsorption unit can generate a rotational motion relative to the body. The substrate stage mechanism according to claim 1 or 2 or 3, wherein the suction cup of the adsorption unit has a diameter of 20 mm to 30 mm. The substrate stage mechanism of claim 1 or 2 or 3, wherein the upper surface of the base is central, and a first rail group is disposed on both sides of the upper surface of the base, and each of the first rail groups The upper rail is provided with at least one slider, and one of the first rail groups has a first brake member that can drive the slider, and the other sliders of the first rail group on both sides are provided with a top plate, and the top plate has two top surfaces. The second edge group is divided into a second rail group, and each of the second rail groups is provided with at least one slider, and one of the second rail groups has a second brake member for driving the slider, and another central portion of the top plate is formed for The through hole that the adsorption unit passes through, and the clamping seat is disposed on both sides The sliders of the second rail group enable linear displacement of the X-axis or the Y-axis with respect to the adsorption unit on the base. The substrate stage mechanism of claim 1, wherein the holder is formed with a hole corresponding to the contour of the substrate in the center, and the holder is provided with at least two jaws equidistantly from the hole. The two jaws are used to selectively clamp or release the substrate in the aperture. The substrate stage mechanism according to claim 1 or 6, wherein the clamping top mask has a guiding groove connecting the outer portion and the material hole for feeding and receiving a suction cup type mechanical arm to transfer the substrate .