CN213459689U - Wafer cleaning equipment and positioning jig - Google Patents
Wafer cleaning equipment and positioning jig Download PDFInfo
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- CN213459689U CN213459689U CN202120682638.3U CN202120682638U CN213459689U CN 213459689 U CN213459689 U CN 213459689U CN 202120682638 U CN202120682638 U CN 202120682638U CN 213459689 U CN213459689 U CN 213459689U
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application discloses wafer cleaning equipment and positioning jig. The wafer cleaning apparatus includes: the positioning base comprises a rotatable clamp, and the clamp is used for fixing the wafer; the positioning jig comprises a positioning surface arranged in parallel to the horizontal plane, a plurality of concentric circles and a scale mark taking the circle centers of the plurality of concentric circles as the reference are arranged on the positioning surface, and the circle center is positioned on the rotation central line of the jig; the cleaning device is arranged opposite to the positioning base and comprises a movable cleaning nozzle, the cleaning nozzle can drop liquid drops towards the positioning surface, and the position of the cleaning nozzle is adjusted through the deviation between the coordinate position shown by the liquid drops and the circle center, so that the liquid drops fall on the circle center. This application is through setting up a plurality of concentric circles and using the centre of a circle of a plurality of concentric circles as the scale mark of benchmark on positioning jig's locating surface, can quantitative acquisition wash nozzle and rotatable anchor clamps's positional deviation, improves wash nozzle's location accuracy.
Description
Technical Field
The application belongs to the technical field of semiconductors, especially relates to a wafer cleaning equipment and positioning jig.
Background
In the semiconductor manufacturing industry, after a wafer is subjected to Chemical Mechanical Polishing (CMP), the wafer needs to be cleaned, usually, a cleaning solution is continuously dropped on the rotating wafer, but the cleaning solution is often not dropped on the center of the wafer, so that the surface of the wafer is cleaned unevenly or incompletely.
SUMMERY OF THE UTILITY MODEL
The purpose of this application aims at providing a wafer cleaning equipment and positioning jig, and this positioning jig can assist the dripping position of adjustment washing liquid on the wafer.
In a first aspect, an embodiment of the present application provides a wafer cleaning apparatus, including: the positioning base comprises a rotatable clamp, and the clamp is used for fixing the wafer; the positioning jig comprises a positioning surface arranged in parallel to the horizontal plane, a plurality of concentric circles and a scale mark taking the circle centers of the plurality of concentric circles as the reference are arranged on the positioning surface, and the circle center is positioned on the rotation central line of the jig; and the cleaning device is arranged opposite to the positioning base and comprises a movable cleaning nozzle, the cleaning nozzle can drop liquid drops towards the positioning surface, and the position of the cleaning nozzle is adjusted through the deviation between the coordinate position shown by the scale marks of the liquid drops on the positioning surface and the circle center, so that the liquid drops fall on the circle center.
According to an aspect of the embodiment of the application, the scale marks of the positioning jig comprise a first scale mark and a second scale mark, the first scale mark passes through the circle center and extends along the first direction, and the second scale mark is distributed at intervals along the circumferential direction of the plurality of concentric circles.
According to an aspect of the embodiment of the application, the scale marks of the positioning jig comprise a first scale mark and a third scale mark, the first scale mark passes through the circle center and extends along the first direction, the third scale mark passes through the circle center and extends along the second direction, and the first direction and the second direction are intersected.
According to an aspect of an embodiment of the present application, the first direction and the second direction are arranged at right angles.
According to an aspect of an embodiment of the present application, the first direction is a horizontal direction or a vertical direction within the positioning plane.
According to an aspect of the embodiment of the present application, the plurality of concentric circles on the positioning surface are equally spaced along the radial direction of the positioning surface.
According to an aspect of the embodiment of the application, the scale mark of the positioning jig comprises a plurality of scale marks, and the distance between two adjacent scale marks is in millimeter level or micron level setting.
According to an aspect of the embodiment of the application, the positioning jig has a plate-shaped structure, and the shape of the positioning jig is circular or regular polygon.
According to an aspect of an embodiment of the present application, the cleaning device further includes a cleaning tray through which the cleaning nozzle is disposed.
In a second aspect, the embodiment of the application provides a positioning fixture, which comprises a positioning surface parallel to the horizontal plane, wherein the positioning surface is provided with a plurality of concentric circles and scale marks taking the circle centers of the plurality of concentric circles as the reference.
According to wafer cleaning equipment and positioning jig that this application embodiment provided, wafer cleaning equipment includes location base, positioning jig and belt cleaning device, and positioning jig detachably is fixed in on the rotatable anchor clamps of location base 1, and belt cleaning device's washing nozzle is equipped with a plurality of concentric circles and uses the centre of a circle of a plurality of concentric circles as the scale mark of benchmark with the relative positioning surface that sets up this positioning jig of location base. After the positioning jig is fixed on the fixture, the cleaning nozzle is used for dripping the cleaning liquid to the positioning jig to obtain the falling point of the cleaning liquid on the positioning jig. According to the concentric circles and the scale marks on the positioning surface, the deviation amount of the cleaning nozzle relative to the rotation center of the clamp is obtained quantitatively, so that the relative position between the clamp and the cleaning nozzle is adjusted, the cleaning liquid flowing out of the cleaning nozzle can drip on the center of the wafer, the uniformity and the thoroughness of cleaning the surface of the wafer are ensured, and the qualified rate of wafer production is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating a cleaning liquid drop falling on a wafer according to the related art;
FIG. 2 is a schematic view of a wafer cleaning apparatus according to an embodiment of the present application;
fig. 3 is a schematic top view of a positioning fixture according to an embodiment of the present application;
FIG. 4 is a schematic view of the positioning fixture shown in FIG. 3 acquiring a coordinate position of a droplet;
FIG. 5 is a schematic view illustrating an assembly effect of the positioning fixture and the fixture shown in FIG. 3;
fig. 6 is a schematic top view of a positioning fixture according to another alternative embodiment of the present application;
FIG. 7 is a schematic view of the positioning fixture shown in FIG. 6 acquiring a coordinate position of a droplet;
fig. 8 is a schematic diagram illustrating a comparison between defect rates of a wafer cleaning apparatus using related art and the wafer cleaning apparatus according to an embodiment of the present application.
Description of reference numerals:
1. a positioning base; 11. a rotating mechanism; 12. a clamp; 121. a clamping jaw;
2. positioning a jig; 21. concentric circles; 22. scale lines; 221. a first scale mark; 222. a second scale mark; 223. a third scale line; 23. positioning the surface;
3. a cleaning device; 31. cleaning the nozzle; 32. an adjustment mechanism; 33. a cleaning liquid supply device; 331. a first pipeline; 332. a second pipeline; 333. a first source of cleaning fluid; 334. a second source of cleaning solution; 34. cleaning the disc;
4. cleaning fluid;
5. a wafer;
x, a first direction; y, second direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The following description is given with the directional terms as they are used in the drawings and not intended to limit the specific structure of the present application. In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
Fig. 1 is a schematic view illustrating a cleaning liquid drop falling on a wafer according to the related art.
In semiconductor processing, a surface of a wafer is polished by Chemical Mechanical Polishing (CMP), and then impurities remaining on the surface of the wafer are cleaned. As shown in fig. 1, before cleaning the wafer 5, the wafer 5 is fixed on a jig, and the cleaning nozzle is moved to above the wafer 5. The cleaning nozzle continuously drops the cleaning liquid 4 toward the wafer 5, and the wafer 5 is rotated by the rotating jig, thereby cleaning the wafer 5. If the dropping position of the cleaning liquid deviates from the center of the wafer 5, uneven or incomplete cleaning of the surface of the wafer 5 is likely to result. In the related art, it is generally determined by naked eyes whether the cleaning liquid dropped from the cleaning nozzle is located at the center of the wafer 5, and the position of the cleaning nozzle is adjusted according to the offset of the cleaning liquid. Due to inaccurate judgment by naked eyes and low efficiency, more time is needed to adjust the position of the cleaning nozzle back and forth, so that the wafer is not cleaned completely, and the cleaning efficiency of the wafer is reduced.
In view of the above, the embodiment of the present application provides a wafer cleaning apparatus and a positioning jig, which can realize positioning of a cleaning nozzle, so that a cleaning solution 4 can be dropped at the center of a wafer 5, thereby improving the cleaning effect of cleaning the wafer 5.
Fig. 2 is a schematic view of a wafer cleaning apparatus according to an embodiment of the present application, and fig. 3 is a schematic view of a top structure of a positioning fixture according to an embodiment of the present application.
Referring to fig. 2 and 3, an embodiment of the present application provides a wafer cleaning apparatus, including a positioning base 1, a positioning fixture 2, and a cleaning device 3.
The positioning base 1 includes a rotatable clamp 12, and the clamp 12 is used for fixing the wafer 5. The positioning base 1 serves as a mounting and positioning carrier for the wafer 5. The positioning base 1 further comprises a rotating mechanism 11, and the rotating mechanism 11 drives the wafer 5 to rotate through the clamp 12.
The positioning jig 2 is detachably fixed on the fixture 12, the positioning jig 2 comprises a positioning surface 23 arranged parallel to the horizontal plane, a plurality of concentric circles 21 and a scale mark 22 using the circle center O of the plurality of concentric circles 21 as a reference are arranged on the positioning surface 23, and the circle center O is located on the rotation center line of the fixture 12.
The cleaning device 3 is arranged opposite to the positioning base 1, the cleaning device 3 comprises a movable cleaning nozzle 31, the cleaning nozzle 31 can drop liquid drops towards the positioning surface 23, and the position of the cleaning nozzle is adjusted through the deviation between the coordinate position shown by the scale marks 22 of the liquid drops on the positioning surface 23 and the circle center O, so that the liquid drops fall on the circle center O.
Optionally, the cleaning device 3 further includes an adjusting mechanism 32, and the cleaning device 3 adjusts the position of the cleaning nozzle 31 relative to the positioning base 1 through the adjusting mechanism 32. The adjustment mechanism 32 may have three degrees of freedom, for example two translational degrees of freedom in the horizontal and vertical directions within the positioning surface 23 and a translational degree of freedom in the vertical direction perpendicular to the plane of the positioning surface 23; alternatively, there is a translational degree of freedom in a certain direction within the positioning surface 23, a translational degree of freedom in a vertical direction perpendicular to the plane of the positioning surface 23, and a rotational degree of freedom about an axis in the vertical direction. The translational degree of freedom in the vertical direction perpendicular to the plane of the positioning surface 23 is used for enabling the cleaning nozzle 31 to approach the positioning surface 23 or to be away from the positioning surface 23, and the other two degrees of freedom are used for adjusting the position of the cleaning nozzle 31 relative to the positioning surface 23.
Since the positioning surface 23 of the positioning jig 2 is provided with the plurality of concentric circles 21 and the scale lines 22 based on the centers O of the plurality of concentric circles 21, the specific coordinate position of the cleaning liquid 4 on the positioning surface 23 can be obtained quantitatively, and the position of the cleaning nozzle 31 relative to the jig 12 is adjusted according to the coordinate position, so that the liquid drops finally drop on the center O of the positioning surface 23, thereby completing the position adjustment of the cleaning nozzle 31.
After the position of the cleaning nozzle 31 is adjusted, the positioning jig 2 is detached from the clamp 12, and the wafer 5 is fixed on the clamp 12, because the relative position between the cleaning nozzle 31 and the clamp 12 is adjusted by the positioning jig 2, and the center of the wafer 5 is aligned with the rotation center of the clamp 12, the cleaning liquid 4 dropped by the positioning nozzle can be ensured to drop on the center of the wafer 5. When the wafer 5 is driven by the rotating mechanism 11 to rotate by the clamp 12, the cleaning liquid 4 can be uniformly coated on the whole surface of the wafer 5, so that the cleaning cleanness and uniformity of the wafer 5 are improved.
In some embodiments, the gripper 12 comprises at least three gripping jaws 121 circumferentially equispaced about itself. Each jaw 121 is capable of moving in a radial direction of the chuck 12 to move synchronously away from or close to the rotation centerline of the chuck 12 so that the center of the positioning jig 2 or the center of the wafer 5 is also located on the rotation centerline of the chuck 12. Therefore, the position of the cleaning nozzle 31 is adjusted according to the deviation between the coordinate position of the liquid drop dripped by the cleaning nozzle 31 on the positioning surface 23 of the positioning jig 2 and the circle center O, that is, the position of the cleaning nozzle 31 is adjusted by the adjusting mechanism 32, so that the cleaning liquid 4 dripped by the cleaning nozzle 31 can be dripped on the circle center O of the positioning surface 23, that is, the cleaning nozzle 31 is moved to the rotation center line of the clamp 12, and the cleaning liquid 4 can be dripped on the center of the wafer 5 when the wafer is cleaned.
In some embodiments, the cleaning device 3 further comprises a cleaning liquid supply device 33, the cleaning liquid supply device 33 being configured to provide the cleaning liquid 4 to the cleaning device 3. The cleaning solution supply device 33 includes a first pipe 331, a second pipe 332, a first cleaning solution source 333, and a second cleaning solution source 334. One end of the first pipe 331 communicates with the cleaning nozzle 31, and the other end communicates with the first cleaning liquid source 333. One end of the second pipe 332 communicates with the cleaning nozzle 31, and the other end communicates with the second cleaning liquid source 334. Illustratively, the cleaning solution 4 may be deionized water mixed with hot nitrogen gas, the first cleaning solution source 333 being a nitrogen gas source, and the second cleaning solution source 334 being a deionized water source. The hot nitrogen gas and the deionized water are mixed in the cleaning nozzle 31 and dropped together on the wafer 5 for cleaning the wafer 5.
The embodiment of the application provides a wafer cleaning equipment, including location base 1, positioning jig 2 and belt cleaning device 3, on positioning jig 2 detachably was fixed in the rotatable anchor clamps 12 of location base 1, belt cleaning device 3's washing nozzle 31 set up with location base 1 is relative. The positioning surface 23 of the positioning jig 2 is provided with a plurality of concentric circles 21 and scale marks 22 with respect to the center O of the plurality of concentric circles 21. After the positioning jig 2 is fixed to the jig 12 of the positioning base 1, the cleaning nozzle 31 is caused to drip the cleaning liquid 4 toward the positioning jig 2, and a drop point of the cleaning liquid 4 on the positioning jig 2 is obtained. According to the concentric circles 21 and the scale marks 22 on the positioning surface 23, the deviation amount of the cleaning nozzle 31 relative to the rotation center line of the clamp 12 is obtained quantitatively, so that the relative position between the clamp 12 and the cleaning nozzle 31 is adjusted, the cleaning liquid 4 flowing out of the cleaning nozzle 31 can be dripped on the center of the wafer 5, the uniformity and the thoroughness of surface cleaning of the wafer 5 are ensured, and the yield of production of the wafer 5 is improved.
Further, the cleaning device 3 further includes a cleaning disk 34, and the cleaning nozzle 31 is disposed through the cleaning disk 34.
The cleaning disc 34 may be made of a transparent material such as polycarbonate PC or glass. In the process of positioning the cleaning nozzle 31, the drop position of the liquid drop on the positioning jig 2 can be observed through the transparent cleaning disc 34 to obtain the deviation between the coordinate position of the liquid drop on the positioning surface 23 and the circle center O, and then the position of the cleaning nozzle 31 is adjusted through the adjusting mechanism 32.
In addition, the adjusting mechanism 32 is also used for adjusting the height dimension of the cleaning nozzle 31 along the direction perpendicular to the positioning jig 2. When cleaning the wafer 5, the cleaning disk 34 is brought close to the surface of the wafer 5, the cleaning nozzle 31 is provided so as to penetrate the cleaning disk 34, and the liquid drops dropped from the cleaning nozzle 31 form a liquid film between the cleaning disk 34 and the positioning surface 23 of the positioning jig 2. As the clamp 12 drives the wafer 5 to rotate, the liquid film spreads outwards from the center O of the circle on the whole surface of the wafer 5 in an annular shape, so that the cleaning liquid can be uniformly spread on the whole surface of the wafer 5, and the cleaning effect of the wafer is improved. After the positioning of the cleaning nozzle 31 is completed, the adjusting mechanism 32 drives the cleaning nozzle 31 to be away from the positioning fixture 2 along the direction (vertical direction) perpendicular to the positioning surface 23, so that the positioning fixture 2 can be conveniently taken down from the fixture 12, and meanwhile, the wafer 5 can be conveniently fixed on the fixture 12. After the wafer 5 is fixed to the jig 12, the adjustment mechanism 32 drives the cleaning nozzle 31 to approach the wafer 5, thereby cleaning the wafer 5.
The specific structure of the positioning jig 2 is described in further detail below with reference to the accompanying drawings.
In some embodiments, the plurality of concentric circles 21 on the locating surface 23 are equally spaced radially therefrom. The plurality of concentric circles 21 are equally distributed along the radial direction thereof, so that the distance between two adjacent concentric circles 21 can be easily determined, and when a droplet of the cleaning solution is dropped between the two concentric circles 21, the coordinate position of the droplet can be estimated without detailed scale line values.
In some embodiments, the scale marks 22 of the positioning fixture 2 include a plurality of scale marks, and the distance between two adjacent scale marks is set in a millimeter or micrometer scale. If the positioning accuracy of the wafer cleaning equipment is high, the distance between two adjacent scale marks is set to be in a micron scale, for example, 1 μm. If the positioning accuracy requirement of the wafer cleaning equipment is low, the distance between two adjacent scale marks is set to be in millimeter level, for example, 1mm, so that the positioning accuracy of the cleaning nozzle 31 is improved.
Fig. 4 is a schematic view of a scene in which the positioning jig 2 shown in fig. 3 acquires the coordinate position of the droplet.
In some embodiments, as shown in fig. 4, the graduation lines 22 of the positioning fixture 2 include a first graduation line 221 and a second graduation line 222, the first graduation line 221 passes through the center O and extends along the first direction X, and the second graduation line 222 is spaced along the circumferential direction of the concentric circles 21.
Optionally, the first direction X is a horizontal direction within the positioning surface 23. Optionally, the first direction X is a vertical direction within the positioning surface 23. The first direction X will be described as an example of a horizontal direction in the positioning surface 23.
As shown in fig. 3 and 4, the graduation marks 22 of the positioning jig 2 include a first graduation mark 221 and a second graduation mark 222. The first graduation mark 221 passes through the center O and extends along the first direction X, and the first graduation mark 221 can quantitatively display the radial deviation distance L0 from any position on the positioning surface 23 to the center O of the concentric circle 21. When a droplet of the cleaning liquid lands on a certain point on the positioning surface 23, the landing point of the droplet is converted into a certain point on the first scale mark 221 by the concentric circle 21, and the radial distance L0 from the certain point on the positioning surface 23 to the center O of the concentric circle 21 is quantitatively obtained. The second scale lines 222 are distributed at intervals along the circumferential direction of the concentric circles 21, and the second scale lines 222 can quantitatively display the circumferential angle θ between the connection line between any position on the positioning surface 23 and the center O of the concentric circle 21 and the first direction X. According to the drop point of the liquid drop on the positioning surface 23, a connection line between the drop point and the center O of the concentric circle 21 can be obtained, and since the second scale lines 222 are arranged at intervals along the circumferential direction of the concentric circle 21, the included angle between the connection line and the first scale line 221 is the circumferential angle θ between the connection line and the first direction X. After the radial distance L0 and the circumferential angle θ are obtained, the coordinate position of the liquid drop on the positioning surface 23 can be determined according to the radial distance L0 and the circumferential angle θ, and then the position of the cleaning nozzle 31 can be adjusted by the adjusting mechanism 32, so that the cleaning nozzle 31 can move to the rotation center line of the fixture 12, and the positioning of the cleaning nozzle 31 is realized.
For example, if a certain droplet is dropped onto the positioning jig 2 at a drop point corresponding to the second scale mark with a circumferential angle θ of +30 ° and a radial distance L0 of 5mm, the positional coordinates of the drop point on the positioning surface 23 are (4.33, 2.5). If the adjusting mechanism 32 has the translational degrees of freedom in three directions as described above, the adjusting mechanism 32 may move the cleaning nozzle 31 toward the center O along the first direction X by L1 being 4.33mm, and then move the cleaning nozzle 31 toward the center O along the second direction Y by L2 being 2.5mm, or first move the cleaning nozzle 31 toward the center O along the second direction Y by L2 being 2.5mm, and then move the first direction X of the cleaning nozzle 31 toward the center O by L1 being 4.33mm, that is, the cleaning nozzle 31 may be moved to a position directly above the center O, so as to position the cleaning nozzle 31. If the adjusting mechanism 32 has the two-directional translational degree of freedom and the rotational degree of freedom about one axis as described above, the adjusting mechanism 32 may first rotate the cleaning nozzle 31 about the axis in the vertical direction by +30 °, and then move the cleaning nozzle 31 toward the center O by a radial distance L0 of 5mm, that is, move the cleaning nozzle 31 directly above the center O, thereby positioning the cleaning nozzle 31.
Fig. 5 is a schematic view illustrating an assembly effect of the positioning jig and the fixture shown in fig. 3.
Referring to fig. 5, the positioning jig 2 is optionally a plate-shaped structure, and is circular or regular polygonal in shape. Considering that the clamping jaws 121 of the clamp 12 can synchronously approach or depart from the rotation center line of the clamp 12, when the positioning jig 2 is clamped by the clamping jaws 121, the center of the positioning jig 2 is positioned on the rotation center line of the clamp 12. At this time, the center O of the concentric circle 21 coincides with the center of the positioning jig 2, that is, the positioning jig 2 has a rotational symmetric structure, so that the processing difficulty of the positioning jig 2 can be reduced. For example, when the positioning jig 2 is circular, the clamp 12 can clamp any position of the positioning jig 2; when the positioning fixture 2 is a regular polygon, the regular polygon may be, for example, a square, a regular hexagon, etc., the number of sides of the regular polygon should be an integral multiple of the number of the clamping jaws 121, and the clamping jaws 121 clamp the sides of the regular polygon. For example, referring to fig. 5, the number of the clamping jaws 121 is 3, the positioning jig 2 is a regular hexagon, the number of the sides is 2 times of the number of the clamping jaws 121, and the clamping jaws 121 clamp the sides of the positioning jig 2.
Considering that the positioning fixture 2 is a plate-shaped structure, the edge of the plate-shaped structure may scratch the wafer 5, and may also cause potential safety hazards to other articles or operators, in the embodiment of the present application, the edge of the plate-shaped structure is provided with a chamfer.
Fig. 6 is a schematic top view of a positioning fixture 2 according to another alternative embodiment of the present application, and fig. 7 is a schematic view of a scene where the positioning fixture 2 shown in fig. 6 acquires a coordinate position of a droplet.
As shown in fig. 6 and 7, another alternative embodiment of the present application further provides a positioning fixture 2, which is similar to the structure shown in fig. 3 to 5, except that the scale marks 22 are arranged in a different manner.
Specifically, the scale marks 22 of the positioning fixture 2 include a first scale mark 221 and a third scale mark 223, the first scale mark 221 passes through the circle center O and extends along the first direction X, the third scale mark 223 passes through the circle center O and extends along the second direction, and the first direction X intersects with the second direction.
Optionally, the first direction X and the second direction Y are arranged at a right angle, and at this time, the coordinate system formed by the first scale mark 221 and the third scale mark 223 is a rectangular plane coordinate system. The coordinates of a point on the positioning surface 23 can be more easily obtained than in the case of a non-rectangular coordinate system. Further, considering that the adjustment mechanism 32 of the cleaning nozzle 31 generally moves the cleaning nozzle 31 in a form of multiple degrees of freedom orthogonal to each other, when the first direction X and the second direction Y are perpendicular to each other, the coordinate of a certain point on the positioning surface 23 is more easily converted into the movement amount of the adjustment mechanism 32.
Referring to fig. 6 and 7, the first scale line 221 and the third scale line 223 form a coordinate system in the positioning surface 23, and the center O of the concentric circle 21 is the origin of the coordinate system. The position of any point in the positioning surface 23 can be converted into coordinates relative to the first direction X and the second direction Y. The first deviation L1 of the point relative to the origin along the first direction X and the second deviation L2 of the point relative to the origin along the second direction Y can be obtained quantitatively according to the coordinates. After the first deviation amount L1 in the first direction X and the second deviation amount L2 in the second direction Y are obtained, it is only necessary to drive the cleaning nozzle 31 to move by a distance L1 in the first direction X and a distance L2 in the second direction Y by the adjusting mechanism 32 according to L1 and L2, so that the cleaning nozzle 31 can be moved to the rotation center line of the jig 12, and the cleaning nozzle 31 can be positioned. For example, when a certain droplet is dropped on the positioning surface 23 of the positioning jig 2, the coordinates (3, 4) of the drop point on the positioning surface 23 are obtained by the first scale line 221 and the third scale line 223 directly according to the drop point of the droplet, and the first deviation amount L1 in the first direction X is 3mm and the second deviation amount L2 in the second direction Y is 4mm, the cleaning nozzle 31 is moved by 3mm in the first direction X toward the center O of the concentric circle 21 and by 4mm in the second direction X toward the center O of the concentric circle 21, and the cleaning nozzle 31 can be positioned above the center O of the concentric circle 21, that is, the cleaning nozzle 31 is positioned on the rotation center line of the jig 12.
It should be noted that the positioning fixture 2 may include the first scale mark 221, the second scale mark 222, and the third scale mark 223 at the same time. When the position of the cleaning nozzle 31 is adjusted, the first graduation mark 221 and the second graduation mark or the first graduation mark 221 and the third graduation mark 223 can be matched. Further, the first direction X may be any direction within the positioning surface 23. Preferably, in order to simplify calculation of the amount of positional movement of the cleaning nozzle 31 by the adjustment mechanism 32, the first direction X is a horizontal direction or a vertical direction within the positioning surface 23.
The following describes a method of using the wafer cleaning apparatus according to the above embodiment of the present application.
When the wafer cleaning device of the embodiment of the present application is used, the positioning process of the cleaning nozzle 31 and the cleaning process of the wafer 5 are included.
The cleaning nozzle 31 positioning process includes:
step S1.1, fixing the positioning jig 2 through the clamp 12, and moving the cleaning nozzle 31 to the upper part of the positioning jig 2;
s1.2, enabling the cleaning nozzle 31 to drip the cleaning liquid 4, and recording the drop point of the cleaning liquid 4 on the positioning jig 2;
step S1.3, obtaining the moving amount of the cleaning nozzle 31 in the first direction X and the second direction Y according to the deviation between the coordinate position shown by the scale mark 22 of the drop point on the positioning surface 23 and the circle center O;
step S1.4, moving the cleaning nozzle 31 through the adjusting mechanism 32 according to the moving amount of the cleaning nozzle 31 in the first direction X and the second direction Y, so that the clear nozzle 31 is positioned on the rotation central line of the clamp 12;
step S1.5, the cleaning nozzle 31 is moved away from the positioning jig 2 in the direction up to the positioning surface 23 by the adjusting mechanism 32, and the positioning jig 2 is removed from the jig 12.
The above steps S1.1 to S1.4 are repeated at least once, so that the cleaning liquid 4 drops on the circle center O, and the positioning process of the cleaning nozzle 31 on the positioning surface 23 is completed. At this time, the cleaning nozzle 31 is located on the rotation center line of the jig 12.
The cleaning process of the wafer 5 includes:
s2.1, fixing the wafer 5 to be cleaned on a clamp 12;
s2.2, moving the cleaning spray head 31 downwards to be close to the wafer 5 through the adjusting mechanism;
step S2.3, starting the cleaning device 3 to enable the cleaning nozzle 31 to continuously trickle the cleaning liquid 4;
step S2.4, the chuck 12 is rotated to clean the wafer 5.
Because the cleaning liquid 4 is dripped at the center of the wafer 5, the surface of the whole wafer 5 can be cleaned fully and uniformly, and the wafer cleaning equipment provided by the embodiment of the application has a good cleaning effect.
Fig. 8 is a schematic diagram illustrating a comparison between defect rates of a wafer cleaning apparatus using related art and the wafer cleaning apparatus according to an embodiment of the present application.
The wafer cleaning apparatus according to the embodiment of the present application is used to continuously clean the wafers 5, and every 100 ten thousand wafers 5 are used as a group. Cleaning of each completed group of wafers 5And washing, wherein the group of wafers 5 is detected once, and the number of the wafers 5 with defects is recorded to obtain the defect rate of the wafers 5. Referring to fig. 8, the first 7 groups all use the related art of the present application to clean the wafer 5, and the cleaning nozzle 31 is positioned first and then the wafer 5 is cleaned by using the wafer cleaning apparatus of the embodiment of the present application from group 8. The first 7 groups of wafers 5 had an average defect rate of 13.85 wafers/106Sheet (13.85ea/M), the 8 th to 12 th groups of wafers 5 have an average defect rate of 9.2 sheets/10 after using the examples of the present application6The total defect rate of the sheet (9.2ea/M) was reduced by about 33%. The wafer cleaning equipment provided by the embodiment of the application obviously reduces the defect rate of the wafer 5 by improving the cleaning effect of the wafer 5.
Therefore, the embodiment of the present application provides a wafer cleaning apparatus, and the positioning surface 23 of the positioning fixture 2 is provided with the plurality of concentric circles 21 and the scale marks 22 based on the circle center O of the plurality of concentric circles 21, so as to improve the cleaning effect of the wafer 5. The wafer cleaning equipment in the embodiment of the application can also obtain the offset of the circle center O of the cleaning nozzle 31 relative to the concentric circle 21 more accurately and quantitatively by combining the first scale mark 221 and the second scale mark 222 or combining the first scale mark 221 and the third scale mark 223, so that the positioning precision of the cleaning nozzle 31 can be further improved, and finally, the cleaning effect of the wafer 5 is further improved.
While the application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the application. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.
Claims (10)
1. A wafer cleaning apparatus, comprising:
the positioning base comprises a rotatable clamp, and the clamp is used for fixing the wafer;
the positioning jig comprises a positioning surface which is arranged in parallel to a horizontal plane, a plurality of concentric circles and scale marks which take the centers of the plurality of concentric circles as the reference are arranged on the positioning surface, and the centers of the circles are positioned on the rotation central line of the jig; and
the cleaning device is arranged opposite to the positioning base and comprises a movable cleaning nozzle, the cleaning nozzle can drop liquid drops towards the positioning surface, and the position of the cleaning nozzle is adjusted through the deviation between the coordinate position shown by the scale mark of the liquid drops on the positioning surface and the circle center, so that the liquid drops fall on the circle center.
2. The wafer cleaning apparatus according to claim 1, wherein the graduation marks of the positioning jig include a first graduation mark and a second graduation mark, the first graduation mark passes through the center of the circle and extends along a first direction, and the second graduation mark is spaced apart along a circumferential direction of the plurality of concentric circles.
3. The wafer cleaning apparatus according to claim 1, wherein the graduation marks of the positioning fixture include a first graduation mark and a third graduation mark, the first graduation mark passes through the circle center and extends along a first direction, the third graduation mark passes through the circle center and extends along a second direction, and the first direction and the second direction are intersected.
4. The wafer cleaning apparatus according to claim 3, wherein the first direction and the second direction are arranged at right angles.
5. The wafer cleaning apparatus according to any one of claims 2 to 4, wherein the first direction is a horizontal direction or a vertical direction within the positioning plane.
6. The wafer cleaning apparatus according to claim 1, wherein the plurality of concentric circles on the positioning surface are equally spaced along a radial direction thereof.
7. The wafer cleaning apparatus according to claim 1, wherein the graduation line of the positioning fixture comprises a plurality of graduation marks, and a distance between two adjacent graduation marks is set in millimeter or micron level.
8. The wafer cleaning apparatus according to claim 1, wherein the positioning fixture has a plate-like structure and is circular or regular polygonal in shape.
9. The wafer cleaning apparatus according to claim 1, wherein the cleaning device further comprises a cleaning disk through which the cleaning nozzle is disposed.
10. The positioning jig is characterized by comprising a positioning surface arranged in parallel to a horizontal plane, wherein a plurality of concentric circles and scale marks taking the centers of the plurality of concentric circles as the reference are arranged on the positioning surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120682638.3U CN213459689U (en) | 2021-04-02 | 2021-04-02 | Wafer cleaning equipment and positioning jig |
| PCT/CN2021/086377 WO2022205496A1 (en) | 2021-04-02 | 2021-04-12 | Wafer washing apparatus and positioning jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120682638.3U CN213459689U (en) | 2021-04-02 | 2021-04-02 | Wafer cleaning equipment and positioning jig |
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| Publication Number | Publication Date |
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| CN213459689U true CN213459689U (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120682638.3U Active CN213459689U (en) | 2021-04-02 | 2021-04-02 | Wafer cleaning equipment and positioning jig |
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| Country | Link |
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| CN (1) | CN213459689U (en) |
| WO (1) | WO2022205496A1 (en) |
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| CN116190294B (en) * | 2023-04-24 | 2023-07-25 | 上海果纳半导体技术有限公司 | Crown block teaching method |
| CN116540503B (en) * | 2023-07-03 | 2023-10-24 | 之江实验室 | Fixing device for laser direct writing sample and working method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202702036U (en) * | 2012-07-13 | 2013-01-30 | 中芯国际集成电路制造(上海)有限公司 | Locating auxiliary tool for grinding fluid supply arm |
| US10128103B2 (en) * | 2014-02-26 | 2018-11-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and process for wafer cleaning |
| JP2015211137A (en) * | 2014-04-25 | 2015-11-24 | キヤノン株式会社 | Manufacturing method of semiconductor device and cleaning processing system |
| CN209471932U (en) * | 2019-03-27 | 2019-10-08 | 中国电子科技集团公司第五十五研究所 | A kind of objective table for sic wafer test |
| CN110281155B (en) * | 2019-08-01 | 2022-01-14 | 西安奕斯伟材料科技有限公司 | Calibration tool |
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| WO2022205496A1 (en) | 2022-10-06 |
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