WO2022048023A1 - Vertical automatic wafer loading/unloading device - Google Patents

Vertical automatic wafer loading/unloading device Download PDF

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Publication number
WO2022048023A1
WO2022048023A1 PCT/CN2020/129361 CN2020129361W WO2022048023A1 WO 2022048023 A1 WO2022048023 A1 WO 2022048023A1 CN 2020129361 W CN2020129361 W CN 2020129361W WO 2022048023 A1 WO2022048023 A1 WO 2022048023A1
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Prior art keywords
unloading device
wafer loading
base
automatic wafer
vertical automatic
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PCT/CN2020/129361
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French (fr)
Chinese (zh)
Inventor
王敕
尚明伟
郭平
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苏州艾科瑞思智能装备股份有限公司
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Publication of WO2022048023A1 publication Critical patent/WO2022048023A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the invention relates to the technical field of wafer loading and unloading, in particular to a vertical automatic wafer loading and unloading device.
  • Wafer loading equipment is the key equipment in the semiconductor packaging production line, which has a very wide range of applications in wafer packaging. With the advancement of technology, the loading accuracy of the chip loader is developing towards the sub-micron level, which in turn supports the so-called micro-assembly technology in the industry.
  • the existing wafer loading equipment is usually set horizontally. In order to realize wafer feeding, it is usually necessary to set up multiple transfer arms to relay wafer feeding, which leads to a certain decrease in equipment precision and productivity.
  • the present invention aims to provide a vertical automatic wafer loading and unloading device to overcome the deficiencies in the prior art.
  • the technical scheme of the present invention is:
  • a vertical automatic wafer loading and unloading device comprising: a feeding mechanism, an XY mechanism, a turning mechanism, a first mechanical gripper and a second mechanical gripper;
  • the feeding mechanism includes: a platform and a lifting structure, and the platform is driven by the lifting structure to lift;
  • the XY mechanism drives the turning mechanism to perform translational movement on one side of the feeding mechanism, which includes: a first base, a first guide rail for the first base to slide along the X direction, and a first guide rail arranged on the first base. a second base on the base, a second guide rail provided on the first base for the second base to slide along the Y direction;
  • the turning mechanism comprises: a turning table and a second transmission motor for driving the turning table to pivot; the turning table is provided with at least two feeding troughs arranged side by side;
  • the first mechanical gripper reciprocates in the X direction between the feeding mechanism and the flipping mechanism, and the second mechanical gripper is located downstream of the flipping mechanism and moves in the X direction relative to the flipping mechanism. Reciprocating motion.
  • the lifting structure includes: a first screw rod arranged in a vertical direction driven and pivoted by the first transmission motor, and the platform is driven by the first screw rod.
  • the first base is driven by a second screw to slide along the first guide rail
  • the second base is driven by a third screw to slide along the second Slide the rails.
  • the turning table includes a body, one edge of which is connected to the second transmission motor, and oppositely arranged clamps are provided at the edges of the body on both sides.
  • the at least two feeding troughs arranged side by side are formed on the clamps on either side.
  • the clamps on both sides are driven by a cylinder, and the clamps on both sides are driven by corresponding cylinders to move toward or away from each other.
  • the turning table is in a horizontal state when it is at the loading position, and is in a vertical state when it is at the unloading position.
  • the XY mechanism is driven to switch each feeding chute and the second mechanical gripper to be opposite to the second mechanical gripper along the Y direction.
  • the vertical automatic wafer loading and unloading device further includes a material box on the platform suitable for accommodating wafers.
  • the peripheral edge of the wafer is connected with a frame which is convenient for the first mechanical gripper and the second mechanical gripper to be clamped.
  • the beneficial effects of the present invention are: the vertical automatic wafer loading and unloading device of the present invention adopts a turning mechanism, which first receives the wafers placed horizontally, and then turns them to a vertical state, thereby facilitating the operation of the wafers.
  • the wafers are loaded and unloaded vertically, which overcomes the problem that the wafers cannot be positioned and grasped due to tilting in the traditional loading method.
  • FIG. 1 is a front view of an embodiment of a vertical automatic wafer loading and unloading device according to the present invention
  • FIG. 2 is a perspective exploded schematic diagram of an XY mechanism in an embodiment of the vertical automatic wafer loading and unloading device of the present invention
  • FIG. 3 is a front view of a turning mechanism in an embodiment of the vertical automatic wafer loading and unloading device of the present invention
  • FIG. 4 is a side view of the inversion table of FIG. 3 .
  • an embodiment of the present invention provides a vertical automatic wafer loading and unloading device, which includes: a feeding mechanism 1 , an XY mechanism 2 , a turning mechanism 3 , a first mechanical gripper and a second mechanical gripper claw.
  • the loading mechanism 1 is used to lift the magazine on which several wafers are placed to a required loading height.
  • the feeding mechanism 1 includes: a platform 11 and a lifting structure 12 , and the platform 11 is driven by the lifting structure 12 to lift and lower.
  • the platform 11 is also provided with structures such as positioning blocks.
  • the peripheral edge of the wafer is connected with a frame which is convenient for the first mechanical clamping jaw and the second mechanical clamping jaw to be clamped.
  • the lifting structure 12 includes: a first screw rod 122 arranged in a vertical direction driven and pivoted by the first transmission motor 121 , and the platform 11 is driven by the first screw rod 122 to lift and lower.
  • the first transmission motor 121 may use a servo motor.
  • the XY mechanism 2 is located on one side of the feeding mechanism 1, and is used to drive the turning mechanism 3 to move in the plane, so that the turning mechanism 3 moves from the feeding position to the feeding position.
  • the XY mechanism 2 drives the turning mechanism 3 to perform translational movement on one side of the feeding mechanism 1, which includes: a first base 21, a first guide rail 22 for the first base 21 to slide along the X direction, and a first base 22 provided on the first base
  • the first base 21 is driven by the second screw rod 25 to slide along the first guide rail 22, the second base 23 is driven by the third screw rod 26 to slide along the second guide rail 24, the second screw rod 25 and the third screw rod
  • the levers 26 are respectively driven to pivot by servo motors. In this way, driven by the second screw 25 and the third screw 26 , the turning mechanism 3 can move freely in a plane along with the second base 23 .
  • the inversion mechanism 3 is used as a transfer mechanism, which receives the wafers placed horizontally, and then inverts them to a vertical state, so as to facilitate the vertical loading and unloading of the wafers.
  • the turning mechanism 3 includes: a turning table 31 and a second transmission motor 32 that drives the turning table 31 to pivot.
  • the inversion table 31 has at least two feeding troughs 311 arranged side by side, and the function of the feeding troughs 311 is to be suitable for inserting wafers with a frame.
  • the purpose of providing at least two feeding troughs 311 is that one feeding trough 311 is used to recover the loaded wafers during feeding, and the remaining feeding troughs 311 are used to provide new wafers to the wafer loading equipment 100.
  • the turning table 31 can be in a horizontal state when it is in the feeding position, so that it is convenient to receive the wafers from the magazine; In this way, the vertically placed wafers in the turning table 31 are conveniently fed into the wafer assembly equipment, so as to meet the requirement of vertical wafer loading.
  • the XY mechanism is used. 2. Drive to switch the feeding troughs 311 along the Y direction to be opposite to the second mechanical gripper. In this way, it is convenient for the second mechanical gripper to clamp the loaded wafer and push it into the feeding chute 311, and then clamp the new wafer and integrate it into the wafer assembly equipment.
  • the turning table 31 includes a main body, one edge of which is connected to the second transmission motor 32, and oppositely disposed clamps 312 are provided at the edges of the two sides of the main body.
  • at least two feeding troughs 311 arranged side by side are formed on the clamps 312 on either side, and the feeding troughs on each clamp 312 are arranged opposite to each other.
  • the clamps 312 on both sides are designed to be movable. Specifically, the clamps 312 on both sides are driven by an air cylinder 33 , so that the clamps 312 on both sides can approach or move away from each other under the driving of the air cylinder 33 . In this way, the distance between the two clamps 312 can be adjusted correspondingly according to the size of the wafer.
  • the first mechanical gripper reciprocates in the X direction between the feeding mechanism 1 and the flipping mechanism 3 to feed the wafers in the magazine into the flipping mechanism 3; the second mechanical gripper is located downstream of the flipping mechanism 3 , and reciprocate relative to the inversion mechanism 3 in the X direction, so as to send the loaded wafers into the inversion mechanism 3, and at the same time send the new wafers in the inversion mechanism 3 into the wafer loading equipment.
  • the first mechanical gripper and the second mechanical gripper can use existing gripper products, and those skilled in the art can select a suitable gripper product to incorporate into the technical solution of this embodiment according to actual needs .
  • the vertical automatic wafer loading and unloading device of the present invention adopts a turning mechanism, which firstly receives the wafers placed horizontally, and then turns them to the vertical state, thereby facilitating the vertical loading and unloading of the wafers. , which overcomes the problem that the wafer cannot be positioned and grasped due to the tilting of the wafer in the traditional feeding method.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a vertical automatic wafer loading/unloading device, comprising: a loading mechanism, an XY mechanism, and a flipping mechanism. The loading mechanism comprises: a platform and a lifting/lowering structure; the platform is driven by the lifting/lowering structure to move up and down; the XY mechanism drives the flipping mechanism to perform translational movement on one side of the loading mechanism and comprises: a first base, first guide rails allowing the first base to slide in an X direction, a second base provided on the first base, and second guide rails allowing the second base to slide in a Y direction; the flipping mechanism comprises: a flipping platform and a second transmission motor driving the flipping platform to pivot; and the flipping platform is provided with at least two loading slots side by side. The vertical automatic wafer loading/unloading device of the present invention employs an flipping mechanism which first receives wafers placed horizontally and then flips over to a vertical state to facilitate the loading/unloading of the wafers in a vertical manner, thereby overcoming the problem that the wafers cannot be positioned and gripped when the wafers are tilted in traditional loading methods.

Description

立式自动上下晶圆装置Vertical automatic wafer loading and unloading device 技术领域technical field
本发明涉晶圆上下料技术领域，尤其涉及一种立式自动上下晶圆装置。The invention relates to the technical field of wafer loading and unloading, in particular to a vertical automatic wafer loading and unloading device.
背景技术Background technique
晶圆装片设备是半导体封装生产线中的关键设备，其在晶圆封装中具有非常广泛的应用。随着技术的进步，装片机的装片精度正向着亚微米级发展，进而支撑起了目前业内所称的微组装技术。然而，现有的晶圆装片设备通常水平设置，为了实现供片，通常需要设置多个传送臂接力供片，如此导致设备精度和产能都有一定的下降。Wafer loading equipment is the key equipment in the semiconductor packaging production line, which has a very wide range of applications in wafer packaging. With the advancement of technology, the loading accuracy of the chip loader is developing towards the sub-micron level, which in turn supports the so-called micro-assembly technology in the industry. However, the existing wafer loading equipment is usually set horizontally. In order to realize wafer feeding, it is usually necessary to set up multiple transfer arms to relay wafer feeding, which leads to a certain decrease in equipment precision and productivity.
基于上述问题，现有技术中有采用将晶圆竖直放置，以便于进行装片的设备。通过将晶圆竖直放置，一个取晶臂即可完整取晶和装片动作，其克服了多个臂接力取晶时带来的误差。Based on the above problems, in the prior art, there is a device for placing wafers vertically to facilitate wafer loading. By placing the wafer vertically, a single crystal extraction arm can complete the crystal extraction and wafer loading operations, which overcomes the error caused when multiple arms are connected to extract crystals.
然而，传统的晶圆上下料方式并不适用于竖直装片的装片设备。这是因为，如为了适应晶圆的竖直装片，也将放置晶圆的料盒竖直放置。其中的各晶圆由于自身重力作用会产生一定的倾斜，导致无法对晶圆定位抓取。因此，针对上述问题，有必要提出进一步地解决方案。However, traditional wafer loading and unloading methods are not suitable for vertical wafer loading equipment. This is because, for example, in order to accommodate vertical loading of wafers, the magazines in which the wafers are placed are also placed vertically. Each of the wafers will be inclined to a certain extent due to its own gravity, so that the wafer cannot be positioned and grasped. Therefore, it is necessary to propose further solutions for the above problems.
发明内容SUMMARY OF THE INVENTION
本发明旨在提供一种立式自动上下晶圆装置，以克服现有技术中存在的不足。The present invention aims to provide a vertical automatic wafer loading and unloading device to overcome the deficiencies in the prior art.
为解决上述技术问题，本发明的技术方案是：For solving the above-mentioned technical problems, the technical scheme of the present invention is:
一种立式自动上下晶圆装置，其包括：上料机构、XY机构、翻转机构、第一机械夹爪以及第二机械夹爪；A vertical automatic wafer loading and unloading device, comprising: a feeding mechanism, an XY mechanism, a turning mechanism, a first mechanical gripper and a second mechanical gripper;
所述上料机构包括：平台以及升降结构，所述平台由所述升降结构带动进 行升降；The feeding mechanism includes: a platform and a lifting structure, and the platform is driven by the lifting structure to lift;
所述XY机构驱动所述翻转机构于所述上料机构的一侧进行平移运动，其包括：第一底座、供所述第一底座沿X方向滑动的第一导轨、设置于所述第一底座上的第二底座、供所述第二底座沿Y方向滑动的设置于所述第一底座上的第二导轨；The XY mechanism drives the turning mechanism to perform translational movement on one side of the feeding mechanism, which includes: a first base, a first guide rail for the first base to slide along the X direction, and a first guide rail arranged on the first base. a second base on the base, a second guide rail provided on the first base for the second base to slide along the Y direction;
所述翻转机构包括：翻转台、驱动所述翻转台枢转的第二传动电机；所述翻转台上具有至少两个并排设置的上料槽；The turning mechanism comprises: a turning table and a second transmission motor for driving the turning table to pivot; the turning table is provided with at least two feeding troughs arranged side by side;
所述第一机械夹爪于所述上料机构和翻转机构之间在X方向进行往复运动，所述第二机械夹爪位于所述翻转机构的下游，并相对所述翻转机构在X方向进行往复运动。The first mechanical gripper reciprocates in the X direction between the feeding mechanism and the flipping mechanism, and the second mechanical gripper is located downstream of the flipping mechanism and moves in the X direction relative to the flipping mechanism. Reciprocating motion.
作为本发明的立式自动上下晶圆装置的改进，所述升降结构包括：由所述第一传动电机驱动枢转的竖直方向布置的第一丝杆，所述平台由所述第一丝杆驱动进行升降。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the lifting structure includes: a first screw rod arranged in a vertical direction driven and pivoted by the first transmission motor, and the platform is driven by the first screw rod. Rod drive for raising and lowering.
作为本发明的立式自动上下晶圆装置的改进，所述第一底座由第二丝杆驱动沿所述第一导轨进行滑动，所述第二底座由第三丝杆驱动沿所述第二导轨进行滑动。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the first base is driven by a second screw to slide along the first guide rail, and the second base is driven by a third screw to slide along the second Slide the rails.
作为本发明的立式自动上下晶圆装置的改进，所述翻转台包括本体，其一侧边缘与所述第二传动电机相连接，所述本体两侧边缘位置还设置有相对设置的夹具。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the turning table includes a body, one edge of which is connected to the second transmission motor, and oppositely arranged clamps are provided at the edges of the body on both sides.
作为本发明的立式自动上下晶圆装置的改进，任一侧的夹具上形成有所述至少两个并排设置的上料槽。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the at least two feeding troughs arranged side by side are formed on the clamps on either side.
作为本发明的立式自动上下晶圆装置的改进，两侧的夹具均由一气缸驱动，两侧的夹具由对应的气缸驱动相向或者相背运动。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the clamps on both sides are driven by a cylinder, and the clamps on both sides are driven by corresponding cylinders to move toward or away from each other.
作为本发明的立式自动上下晶圆装置的改进，所述翻转台位于上料位置时处于水平状态，所述翻转台位于下料位置时处于竖直状态。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the turning table is in a horizontal state when it is at the loading position, and is in a vertical state when it is at the unloading position.
作为本发明的立式自动上下晶圆装置的改进，所述翻转台位于下料位置时由所述XY机构驱动沿Y方向切换各上料槽与所述第二机械夹爪相对设置。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, when the turning table is at the unloading position, the XY mechanism is driven to switch each feeding chute and the second mechanical gripper to be opposite to the second mechanical gripper along the Y direction.
作为本发明的立式自动上下晶圆装置的改进，所述立式自动上下晶圆装置还包括位于所述平台上的适于收容晶圆的料盒。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the vertical automatic wafer loading and unloading device further includes a material box on the platform suitable for accommodating wafers.
作为本发明的立式自动上下晶圆装置的改进，所述晶圆的四周边缘连接有便于所述第一机械夹爪和第二机械夹爪夹持的边框。As an improvement of the vertical automatic wafer loading and unloading device of the present invention, the peripheral edge of the wafer is connected with a frame which is convenient for the first mechanical gripper and the second mechanical gripper to be clamped.
与现有技术相比，本发明的有益效果是：本发明的立式自动上下晶圆装置通过采用一翻转机构，其首先接收水平放置的晶圆，然后将其翻转至竖直状态，从而便于晶圆以竖直方式进行上下料，克服了传统上料方式晶圆倾斜无法定位抓取的问题。Compared with the prior art, the beneficial effects of the present invention are: the vertical automatic wafer loading and unloading device of the present invention adopts a turning mechanism, which first receives the wafers placed horizontally, and then turns them to a vertical state, thereby facilitating the operation of the wafers. The wafers are loaded and unloaded vertically, which overcomes the problem that the wafers cannot be positioned and grasped due to tilting in the traditional loading method.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明中记载的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1为本发明立式自动上下晶圆装置一实施例的主视图；1 is a front view of an embodiment of a vertical automatic wafer loading and unloading device according to the present invention;
图2为本发明立式自动上下晶圆装置一实施例中XY机构的立体分解示意图；2 is a perspective exploded schematic diagram of an XY mechanism in an embodiment of the vertical automatic wafer loading and unloading device of the present invention;
图3为本发明立式自动上下晶圆装置一实施例中中翻转机构的主视图；3 is a front view of a turning mechanism in an embodiment of the vertical automatic wafer loading and unloading device of the present invention;
图4为图3中翻转台的侧视图。FIG. 4 is a side view of the inversion table of FIG. 3 .
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
如图1～4所示，本发明一实施例提供一种立式自动上下晶圆装置，其包括：上料机构1、XY机构2、翻转机构3、第一机械夹爪以及第二机械夹爪。As shown in FIGS. 1 to 4 , an embodiment of the present invention provides a vertical automatic wafer loading and unloading device, which includes: a feeding mechanism 1 , an XY mechanism 2 , a turning mechanism 3 , a first mechanical gripper and a second mechanical gripper claw.
上料机构1用于将放置有若干晶圆的料盒提升至需求的上料高度。The loading mechanism 1 is used to lift the magazine on which several wafers are placed to a required loading height.
具体地，上料机构1包括：平台11以及升降结构12，平台11由升降结构12带动进行升降。其中，为了便于料盒的放置，平台11上还设置有定位块等结构。同时，考虑到晶圆自身强度较低，为了对其进行保护以便于周转。晶圆的四周边缘连接有便于第一机械夹爪和第二机械夹爪夹持的边框。一个实施方式中，升降结构12包括：由第一传动电机121驱动枢转的竖直方向布置的第一丝杆122，平台11由第一丝杆122驱动进行升降。为了便于对升降的高度进行控制，第一传动电机121可采用伺服电机。Specifically, the feeding mechanism 1 includes: a platform 11 and a lifting structure 12 , and the platform 11 is driven by the lifting structure 12 to lift and lower. Among them, in order to facilitate the placement of the material box, the platform 11 is also provided with structures such as positioning blocks. At the same time, considering the low strength of the wafer itself, in order to protect it for easy turnover. The peripheral edge of the wafer is connected with a frame which is convenient for the first mechanical clamping jaw and the second mechanical clamping jaw to be clamped. In one embodiment, the lifting structure 12 includes: a first screw rod 122 arranged in a vertical direction driven and pivoted by the first transmission motor 121 , and the platform 11 is driven by the first screw rod 122 to lift and lower. In order to facilitate the control of the height of the lift, the first transmission motor 121 may use a servo motor.
XY机构2位于上料机构1的一侧，其用于带动翻转机构3在平面内进行移动，以使得翻转机构3由上料位置移动到下料位置。The XY mechanism 2 is located on one side of the feeding mechanism 1, and is used to drive the turning mechanism 3 to move in the plane, so that the turning mechanism 3 moves from the feeding position to the feeding position.
具体地，XY机构2驱动翻转机构3于上料机构1的一侧进行平移运动，其包括：第一底座21、供第一底座21沿X方向滑动的第一导轨22、设置于第一底座21上的第二底座23、供第二底座23沿Y方向滑动的设置于第一底座21上的第二导轨24。其中，第一底座21由第二丝杆25驱动沿第一导轨22进行滑动，第二底座23由第三丝杆26驱动沿第二导轨24进行滑动，上述第二丝杆25和第三丝杆26分别由伺服电机驱动进行枢转。如此，在第二丝杆25和第三丝杆26的带动下，翻转机构3可随第二底座23在平面内进行自由运动。Specifically, the XY mechanism 2 drives the turning mechanism 3 to perform translational movement on one side of the feeding mechanism 1, which includes: a first base 21, a first guide rail 22 for the first base 21 to slide along the X direction, and a first base 22 provided on the first base The second base 23 on the 21 and the second guide rail 24 provided on the first base 21 for the second base 23 to slide along the Y direction. The first base 21 is driven by the second screw rod 25 to slide along the first guide rail 22, the second base 23 is driven by the third screw rod 26 to slide along the second guide rail 24, the second screw rod 25 and the third screw rod The levers 26 are respectively driven to pivot by servo motors. In this way, driven by the second screw 25 and the third screw 26 , the turning mechanism 3 can move freely in a plane along with the second base 23 .
翻转机构3作为一中转机构，其接收水平放置的晶圆，然后将其翻转至竖直状态，从而便于晶圆以竖直方式进行上下料。The inversion mechanism 3 is used as a transfer mechanism, which receives the wafers placed horizontally, and then inverts them to a vertical state, so as to facilitate the vertical loading and unloading of the wafers.
具体地，翻转机构3包括：翻转台31、驱动翻转台31枢转的第二传动电机32。其中，翻转台31上具有至少两个并排设置的上料槽311，该上料槽311的作用为适于带有边框的晶圆的插入。设置至少两个上料槽311的目的在于，一个上料槽311用于上料时将装片完成的晶圆回收，而其余上料槽311用于提供新的晶圆给晶圆装片设备100。Specifically, the turning mechanism 3 includes: a turning table 31 and a second transmission motor 32 that drives the turning table 31 to pivot. The inversion table 31 has at least two feeding troughs 311 arranged side by side, and the function of the feeding troughs 311 is to be suitable for inserting wafers with a frame. The purpose of providing at least two feeding troughs 311 is that one feeding trough 311 is used to recover the loaded wafers during feeding, and the remaining feeding troughs 311 are used to provide new wafers to the wafer loading equipment 100.
从而，在第二传动电机32的带动下，翻转台31在上料位置时能够处于水平状态，如此便于接收来自料盒的晶圆；同时，翻转台31在下料位置时能够处于竖直状态，如此便于将翻转台31中竖直放置的晶圆送入到晶圆装配设备中，以满足竖直装片的需求。Therefore, driven by the second transmission motor 32, the turning table 31 can be in a horizontal state when it is in the feeding position, so that it is convenient to receive the wafers from the magazine; In this way, the vertically placed wafers in the turning table 31 are conveniently fed into the wafer assembly equipment, so as to meet the requirement of vertical wafer loading.
同时为了在下料时，实现一个上料槽311回收完成装片的晶圆，而其余上料槽311提供新的晶圆给晶圆装片设备100，翻转台31位于下料位置时由XY机构2驱动沿Y方向切换各上料槽311与第二机械夹爪相对设置。如此便于第二机械夹爪夹持完成装片的晶圆并推入到上料槽311中，然后夹持新的晶圆融入到晶圆装配设备中。At the same time, in order to realize that one feeding chute 311 recovers the wafers that have been loaded during unloading, and the other feeding chute 311 provides new wafers to the wafer loading device 100 , when the turning table 31 is located at the unloading position, the XY mechanism is used. 2. Drive to switch the feeding troughs 311 along the Y direction to be opposite to the second mechanical gripper. In this way, it is convenient for the second mechanical gripper to clamp the loaded wafer and push it into the feeding chute 311, and then clamp the new wafer and integrate it into the wafer assembly equipment.
一个实施方式中，翻转台31包括本体，其一侧边缘与第二传动电机32相连接，本体两侧边缘位置还设置有相对设置的夹具312。其中，任一侧的夹具312上形成有至少两个并排设置的上料槽311，且各夹具312上的料槽相对设置。同时，为了能够适应不同尺寸的晶圆的夹装，两侧的夹具312被设计为活动式的。具体而言，两侧的夹具312均由一气缸33驱动，如此，在气缸33的驱动下，两侧的夹具312可相互靠近或者远离。如此，能够根据晶圆的尺寸对应调节两个夹具312之间的间距。In one embodiment, the turning table 31 includes a main body, one edge of which is connected to the second transmission motor 32, and oppositely disposed clamps 312 are provided at the edges of the two sides of the main body. Wherein, at least two feeding troughs 311 arranged side by side are formed on the clamps 312 on either side, and the feeding troughs on each clamp 312 are arranged opposite to each other. At the same time, in order to adapt to the clamping of wafers of different sizes, the clamps 312 on both sides are designed to be movable. Specifically, the clamps 312 on both sides are driven by an air cylinder 33 , so that the clamps 312 on both sides can approach or move away from each other under the driving of the air cylinder 33 . In this way, the distance between the two clamps 312 can be adjusted correspondingly according to the size of the wafer.
第一机械夹爪于上料机构1和翻转机构3之间在X方向进行往复运动，以将料盒中的晶圆送入到翻转机构3中；第二机械夹爪位于翻转机构3的下游，并相对翻转机构3在X方向进行往复运动，以将完成装片的晶圆送入到翻转机构3中，同时将翻转机构3中新的晶圆送入到装片设备中。本实施例中，第一机械夹爪和第二机械夹爪可采用现有的夹爪产品，本领域技术人员可根据实际的需求，选择合适的夹爪产品结合到本实施例的技术方案中。The first mechanical gripper reciprocates in the X direction between the feeding mechanism 1 and the flipping mechanism 3 to feed the wafers in the magazine into the flipping mechanism 3; the second mechanical gripper is located downstream of the flipping mechanism 3 , and reciprocate relative to the inversion mechanism 3 in the X direction, so as to send the loaded wafers into the inversion mechanism 3, and at the same time send the new wafers in the inversion mechanism 3 into the wafer loading equipment. In this embodiment, the first mechanical gripper and the second mechanical gripper can use existing gripper products, and those skilled in the art can select a suitable gripper product to incorporate into the technical solution of this embodiment according to actual needs .
综上所述，本发明的立式自动上下晶圆装置通过采用一翻转机构，其首先接收水平放置的晶圆，然后将其翻转至竖直状态，从而便于晶圆以竖直方式进行上下料，克服了传统上料方式晶圆倾斜无法定位抓取的问题。To sum up, the vertical automatic wafer loading and unloading device of the present invention adopts a turning mechanism, which firstly receives the wafers placed horizontally, and then turns them to the vertical state, thereby facilitating the vertical loading and unloading of the wafers. , which overcomes the problem that the wafer cannot be positioned and grasped due to the tilting of the wafer in the traditional feeding method.
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the equivalents of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described in terms of embodiments, not each embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (10)

  1. 一种立式自动上下晶圆装置，其特征在于，所述立式自动上下晶圆装置包括：上料机构、XY机构、翻转机构、第一机械夹爪以及第二机械夹爪；A vertical automatic wafer loading and unloading device, characterized in that the vertical automatic wafer loading and unloading device comprises: a feeding mechanism, an XY mechanism, a turning mechanism, a first mechanical gripper and a second mechanical gripper;
    所述上料机构包括：平台以及升降结构，所述平台由所述升降结构带动进行升降；The feeding mechanism includes: a platform and a lifting structure, and the platform is driven by the lifting structure to lift;
    所述XY机构驱动所述翻转机构于所述上料机构的一侧进行平移运动，其包括：第一底座、供所述第一底座沿X方向滑动的第一导轨、设置于所述第一底座上的第二底座、供所述第二底座沿Y方向滑动的设置于所述第一底座上的第二导轨；The XY mechanism drives the turning mechanism to perform translational movement on one side of the feeding mechanism, which includes: a first base, a first guide rail for the first base to slide along the X direction, and a first guide rail arranged on the first base. a second base on the base, a second guide rail provided on the first base for the second base to slide along the Y direction;
    所述翻转机构包括：翻转台、驱动所述翻转台枢转的第二传动电机；所述翻转台上具有至少两个并排设置的上料槽；The turning mechanism comprises: a turning table and a second transmission motor for driving the turning table to pivot; the turning table is provided with at least two feeding troughs arranged side by side;
    所述第一机械夹爪于所述上料机构和翻转机构之间在X方向进行往复运动，所述第二机械夹爪位于所述翻转机构的下游，并相对所述翻转机构在X方向进行往复运动。The first mechanical gripper reciprocates in the X direction between the feeding mechanism and the flipping mechanism, and the second mechanical gripper is located downstream of the flipping mechanism and moves in the X direction relative to the flipping mechanism. Reciprocating motion.
  2. 根据权利要求1所述的立式自动上下晶圆装置，其特征在于，所述升降结构包括：由所述第一传动电机驱动枢转的竖直方向布置的第一丝杆，所述平台由所述第一丝杆驱动进行升降。The vertical automatic wafer loading and unloading device according to claim 1, wherein the lifting structure comprises: a first screw rod arranged in a vertical direction driven and pivoted by the first transmission motor; The first lead screw is driven to move up and down.
  3. 根据权利要求1所述的立式自动上下晶圆装置，其特征在于，所述第一底座由第二丝杆驱动沿所述第一导轨进行滑动，所述第二底座由第三丝杆驱动沿所述第二导轨进行滑动。The vertical automatic wafer loading and unloading device according to claim 1, wherein the first base is driven by a second screw to slide along the first guide rail, and the second base is driven by a third screw sliding along the second rail.
  4. 根据权利要求1所述的立式自动上下晶圆装置，其特征在于，所述翻转台包括本体，其一侧边缘与所述第二传动电机相连接，所述本体两侧边缘位置还设置有相对设置的夹具。The vertical automatic wafer loading and unloading device according to claim 1, wherein the turning table comprises a main body, one edge of which is connected to the second transmission motor, and the two edges of the main body are further provided with Relatively set fixtures.
  5. 根据权利要求4所述的立式自动上下晶圆装置，其特征在于，任一侧的 夹具上形成有所述至少两个并排设置的上料槽。The vertical automatic wafer loading and unloading device according to claim 4, wherein the at least two feeding troughs arranged side by side are formed on the clamps on either side.
  6. 根据权利要求4所述的立式自动上下晶圆装置，其特征在于，两侧的夹具均由一气缸驱动，两侧的夹具由对应的气缸驱动相向或者相背运动。The vertical automatic wafer loading and unloading device according to claim 4, wherein the clamps on both sides are driven by a cylinder, and the clamps on both sides are driven by corresponding cylinders to move toward or away from each other.
  7. 根据权利要求1所述的立式自动上下晶圆装置，其特征在于，所述翻转台位于上料位置时处于水平状态，所述翻转台位于下料位置时处于竖直状态。The vertical automatic wafer loading and unloading device according to claim 1, wherein the turning table is in a horizontal state when it is located at the feeding position, and is in a vertical state when the turning table is in the unloading position.
  8. 根据权利要求7所述的立式自动上下晶圆装置，其特征在于，所述翻转台位于下料位置时由所述XY机构驱动沿Y方向切换各上料槽与所述第二机械夹爪相对设置。The vertical automatic wafer loading and unloading device according to claim 7, wherein when the turning table is located at the unloading position, the XY mechanism is driven to switch each loading chute and the second mechanical gripper along the Y direction. Relative settings.
  9. 根据权利要求1所述的立式自动上下晶圆装置，其特征在于，所述立式自动上下晶圆装置还包括位于所述平台上的适于收容晶圆的料盒。The vertical automatic wafer loading and unloading device according to claim 1, wherein the vertical automatic wafer loading and unloading device further comprises a material box on the platform suitable for accommodating wafers.
  10. 根据权利要求9所述的立式自动上下晶圆装置，其特征在于，所述晶圆的四周边缘连接有便于所述第一机械夹爪和第二机械夹爪夹持的边框。The vertical automatic wafer loading and unloading device according to claim 9, wherein the peripheral edge of the wafer is connected with a frame that facilitates the clamping of the first mechanical gripper and the second mechanical gripper.
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CN111933563A (en) * 2020-09-03 2020-11-13 苏州艾科瑞思智能装备股份有限公司 Vertical automatic wafer loading and unloading device

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Publication number Priority date Publication date Assignee Title
CN114743912A (en) * 2022-04-22 2022-07-12 南京中安半导体设备有限责任公司 Wafer loading device and wafer detection equipment

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