CN212967646U

CN212967646U - Vertical automatic wafer loading and unloading device

Info

Publication number: CN212967646U
Application number: CN202021901485.9U
Authority: CN
Inventors: 王敕; 尚明伟; 郭平
Original assignee: Suzhou Accuracy Assembly Automation Co Ltd
Current assignee: Suzhou Accuracy Assembly Automation Co Ltd
Priority date: 2020-09-03
Filing date: 2020-09-03
Publication date: 2021-04-13
Anticipated expiration: 2030-09-03

Abstract

The utility model provides a wafer device about vertical automation, it includes: the device comprises a feeding mechanism, an XY mechanism and a turnover mechanism; feed mechanism includes: the platform is driven by the lifting structure to lift; XY mechanism drive tilting mechanism carries out translation motion in one side of feed mechanism, and it includes: the device comprises a first base, a first guide rail, a second base and a second guide rail, wherein the first guide rail is used for enabling the first base to slide along the X direction; tilting mechanism includes: the second transmission motor drives the overturning platform to pivot; the overturning platform is provided with at least two feeding troughs which are arranged side by side. The utility model discloses a wafer device about vertical automation is through adopting a tilting mechanism, and it is at first receiving the wafer that the level was placed, then with its upset to vertical state to be convenient for the wafer with vertical mode go up unloading, overcome the unable problem that the location snatchs of traditional material loading formula wafer slope.

Description

Vertical automatic wafer loading and unloading device

Technical Field

The utility model relates to a go up unloading technical field on the wafer, especially relate to a wafer device about vertical automation.

Background

Wafer mounting equipment is a key equipment in a semiconductor packaging production line, and has a very wide application in wafer packaging. With the progress of technology, the chip mounting precision of the chip mounting machine is developing towards the submicron level, and the micro-assembly technology in the industry is supported. However, the conventional wafer mounting apparatus is generally horizontally disposed, and in order to supply wafers, a plurality of transfer arms are required to be disposed to receive the wafers, which results in a certain reduction in the accuracy and productivity of the apparatus.

Based on the above problem, there is the equipment that adopts the vertical placement of wafer among the prior art to carry out the mounting. Through placing the wafer vertically, a get brilliant arm can get brilliant and the piece action in order to be complete, and it has overcome the error that brings when a plurality of arms joint force got the brilliant.

However, the conventional wafer loading and unloading method is not suitable for the wafer loading device for vertical loading. This is because, for example, in order to accommodate vertical loading of the wafers, the magazine on which the wafers are placed is also placed vertically. Each wafer therein will generate a certain inclination due to its own gravity, which results in that the wafer cannot be positioned and grabbed. Therefore, it is necessary to provide a further solution to the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a vertical automatic wafer device from top to bottom to overcome the not enough that exists among the prior art.

In order to solve the technical problem, the technical scheme of the utility model is that:

a vertical automatic wafer loading and unloading device, comprising: the device comprises a feeding mechanism, an XY mechanism, a turnover mechanism, a first mechanical clamping jaw and a second mechanical clamping jaw;

the feed mechanism includes: the platform is driven by the lifting structure to lift;

the XY mechanism drives the turnover mechanism to perform translational motion on one side of the feeding mechanism, and the XY mechanism comprises: the device comprises a first base, a first guide rail, a second base and a second guide rail, wherein the first guide rail is used for enabling the first base to slide along the X direction;

the turnover mechanism comprises: the second transmission motor drives the overturning platform to pivot; the overturning platform is provided with at least two feeding troughs which are arranged side by side;

the first mechanical clamping jaw reciprocates in the X direction between the feeding mechanism and the turnover mechanism, and the second mechanical clamping jaw is located at the downstream of the turnover mechanism and reciprocates in the X direction relative to the turnover mechanism.

As the utility model discloses an improvement of wafer device about vertical automation, elevation structure includes: the first transmission motor drives the first lead screw which is pivoted and arranged in the vertical direction, and the platform is driven by the first lead screw to lift.

As the utility model discloses an improvement of wafer device about vertical automation, first base is followed by the drive of second lead screw first guide rail slides, the second base is followed by the drive of third lead screw the second guide rail slides.

As the utility model discloses an improvement of wafer device about vertical automation, the roll-over table includes the body, its one side edge with second drive motor is connected, body both sides border position still is provided with the anchor clamps of relative setting.

As the utility model discloses a vertical automatic improvement of wafer device from top to bottom is formed with on the anchor clamps of arbitrary side two at least last silos that set up side by side.

As the utility model discloses a vertical automatic improvement of wafer device from top to bottom, the anchor clamps of both sides are driven by a cylinder, and the anchor clamps of both sides are by the cylinder drive or the back of the body motion in opposite directions that correspond.

As the utility model discloses a vertical automatic improvement of wafer device from top to bottom, the roll-over table is in the horizontality when being located the material loading position, the roll-over table is in vertical state when being located the unloading position.

As the utility model discloses a vertical automatic improvement of wafer device from top to bottom, the roll-over table be located the unloading position by XY mechanism drive along Y direction switch each go up the silo with second mechanical clamping jaw sets up relatively.

As an improvement of the vertical automatic upper and lower wafer device of the present invention, the vertical automatic upper and lower wafer device further comprises a material box on the platform suitable for accommodating wafers.

As the utility model discloses a vertical automatic improvement of wafer device from top to bottom, the edge all around of wafer is connected with and is convenient for the frame of first mechanical clamping jaw and the centre gripping of second mechanical clamping jaw.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a wafer device about vertical automation is through adopting a tilting mechanism, and it is at first receiving the wafer that the level was placed, then with its upset to vertical state to be convenient for the wafer with vertical mode go up unloading, overcome the unable problem that the location snatchs of traditional material loading formula wafer slope.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of an embodiment of a vertical automatic wafer loading and unloading apparatus of the present invention;

FIG. 2 is a schematic exploded view of an XY mechanism in an embodiment of the vertical automatic wafer loading and unloading apparatus of the present invention;

FIG. 3 is a front view of a middle turning mechanism in an embodiment of the vertical automatic wafer loading and unloading apparatus of the present invention;

fig. 4 is a side view of the flipping table of fig. 3.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, an embodiment of the present invention provides a vertical automatic wafer loading and unloading device, which includes: the device comprises a feeding mechanism 1, an XY mechanism 2, a turnover mechanism 3, a first mechanical clamping jaw and a second mechanical clamping jaw.

The feeding mechanism 1 is used for lifting the material box with the plurality of wafers to a required feeding height.

Specifically, the feed mechanism 1 includes: platform 11 and elevating system 12, platform 11 is driven by elevating system 12 and is gone up and down. Wherein, in order to facilitate the placement of the material box, the platform 11 is further provided with a positioning block and other structures. Meanwhile, the wafer is protected to facilitate turnover in consideration of low strength of the wafer. The edge of the periphery of the wafer is connected with a frame which is convenient for the first mechanical clamping jaw and the second mechanical clamping jaw to clamp. In one embodiment, the lifting structure 12 includes: the first transmission motor 121 drives the first screw rod 122 which is pivoted and arranged in the vertical direction, and the platform 11 is driven by the first screw rod 122 to lift. To facilitate the control of the height of the lift, the first driving motor 121 may employ a servo motor.

The XY mechanism 2 is located at one side of the feeding mechanism 1, and is used for driving the turnover mechanism 3 to move in a plane, so that the turnover mechanism 3 moves from a feeding position to a discharging position.

Specifically, XY mechanism 2 drives tilting mechanism 3 and carries out translation motion in one side of feed mechanism 1, and it includes: the first base 21, the first guide rail 22 for the first base 21 to slide along the X direction, the second base 23 disposed on the first base 21, and the second guide rail 24 disposed on the first base 21 for the second base 23 to slide along the Y direction. The first base 21 is driven by a second lead screw 25 to slide along a first guide rail 22, the second base 23 is driven by a third lead screw 26 to slide along a second guide rail 24, and the second lead screw 25 and the third lead screw 26 are respectively driven by a servo motor to pivot. In this way, the turnover mechanism 3 can move freely in a plane along with the second base 23 under the driving of the second lead screw 25 and the third lead screw 26.

The turnover mechanism 3 serves as a transfer mechanism, receives the horizontally placed wafer, and then turns the wafer to be in a vertical state, so that the wafer can be conveniently loaded and unloaded in a vertical mode.

Specifically, the turnover mechanism 3 includes: a turnover table 31 and a second transmission motor 32 for driving the turnover table 31 to pivot. Wherein, the flipping table 31 has at least two loading troughs 311 arranged side by side, and the loading troughs 311 are suitable for inserting the wafer with the frame. The at least two loading slots 311 are provided in order that one loading slot 311 is used for recovering the wafer subjected to loading while the remaining loading slots 311 are used for supplying a new wafer to the wafer loading apparatus 100.

Therefore, under the driving of the second transmission motor 32, the turnover table 31 can be in a horizontal state at the loading position, so that the wafers from the material box can be conveniently received; meanwhile, the overturning platform 31 can be in a vertical state when in a discharging position, so that the wafer vertically placed in the overturning platform 31 can be conveniently sent into the wafer assembling equipment, and the requirement of vertical wafer loading is met.

Meanwhile, in order to realize that one feeding groove 311 recovers the wafer subjected to loading during blanking, and the other feeding grooves 311 provide new wafers to the wafer loading device 100, when the turnover table 31 is located at the blanking position, the feeding grooves 311 are switched to be opposite to the second mechanical clamping jaws along the Y direction by being driven by the XY mechanism 2. This facilitates the second mechanical gripper to grip the loaded wafer and push it into the loading chute 311, and then grip a new wafer and blend it into the wafer assembly apparatus.

In one embodiment, the flipping table 31 comprises a body, one side edge of which is connected to the second driving motor 32, and two opposite clamps 312 are disposed at two side edges of the body. Wherein, be formed with two at least feeding groove 311 that set up side by side on the anchor clamps 312 of arbitrary side, and the silo on each anchor clamps 312 sets up relatively. Meanwhile, in order to be able to accommodate clamping of wafers of different sizes, the clamps 312 on both sides are designed to be movable. Specifically, the clamps 312 on both sides are driven by a cylinder 33, so that the clamps 312 on both sides can move toward or away from each other under the driving of the cylinder 33. In this way, the distance between the two clamps 312 can be adjusted according to the size of the wafer.

The first mechanical clamping jaw reciprocates between the feeding mechanism 1 and the turnover mechanism 3 in the X direction so as to send the wafer in the material box into the turnover mechanism 3; the second mechanical clamping jaw is located at the downstream of the turnover mechanism 3 and reciprocates in the X direction relative to the turnover mechanism 3 so as to send the wafer which is subjected to wafer loading into the turnover mechanism 3 and send a new wafer in the turnover mechanism 3 into the wafer loading equipment. In this embodiment, the first mechanical clamping jaw and the second mechanical clamping jaw may adopt existing clamping jaw products, and those skilled in the art may select an appropriate clamping jaw product to combine with the technical solution of this embodiment according to actual needs.

To sum up, the utility model discloses a vertical automatic wafer device from top to bottom is through adopting a tilting mechanism, and it is at first receiving the wafer that the level was placed, then with its upset to vertical state to be convenient for the wafer with vertical mode go up unloading, overcome the unable problem that the location snatchs of traditional material loading mode wafer slope.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a vertical automatic wafer device from top to bottom which characterized in that, vertical automatic wafer device from top to bottom includes: the device comprises a feeding mechanism, an XY mechanism, a turnover mechanism, a first mechanical clamping jaw and a second mechanical clamping jaw;

2. The vertical automated wafer loading and unloading apparatus according to claim 1, wherein the lifting structure comprises: the platform is driven by the first lead screw to lift.

3. The vertical automatic wafer loading and unloading device according to claim 1, wherein the first base is driven by a second lead screw to slide along the first guide rail, and the second base is driven by a third lead screw to slide along the second guide rail.

4. The vertical automatic wafer loading and unloading device as claimed in claim 1, wherein the flipping table comprises a body, one side edge of the flipping table is connected to the second transmission motor, and opposite clamps are disposed at two side edges of the body.

5. The vertical automatic wafer loading and unloading device according to claim 4, wherein the at least two loading slots are formed in the jig on either side.

6. The vertical automatic wafer loading and unloading device according to claim 4, wherein the clamps at both sides are driven by a cylinder, and the clamps at both sides are driven by the corresponding cylinders to move toward or away from each other.

7. The vertical automatic wafer loading and unloading device as claimed in claim 1, wherein the flipping table is in a horizontal state when in the loading position and in a vertical state when in the unloading position.

8. The vertical automatic wafer loading and unloading device according to claim 7, wherein the turning table is driven by the XY mechanism to switch the arrangement of the loading slots and the second mechanical gripper in the Y direction when the turning table is at the unloading position.

9. The vertical robotic wafer loading and unloading device of claim 1, further comprising a magazine on the platform adapted to receive wafers.

10. The vertical robotic wafer loading and unloading device of claim 9, wherein a peripheral edge of the wafer is coupled to a frame for facilitating gripping by the first and second mechanical jaws.