CN210443534U

CN210443534U - Wafer loading equipment

Info

Publication number: CN210443534U
Application number: CN201921777105.2U
Authority: CN
Inventors: 不公告发明人
Original assignee: Suzhou Accuracy Assembly Automation Co Ltd
Current assignee: Suzhou Accuracy Assembly Automation Co Ltd
Priority date: 2019-10-22
Filing date: 2019-10-22
Publication date: 2020-05-01
Anticipated expiration: 2029-10-22

Abstract

The utility model provides a wafer mounting equipment, it includes: the wafer platform is arranged along the vertical direction and is arranged on the first translation mechanism, and the first translation mechanism drives the wafer platform to perform XY motion in the vertical plane; get brilliant device, it includes: the crystal taking arm is driven by the pivoting mechanism to pivot 90 degrees in a plane vertical to the table top; the chip mounting table is provided with a working surface for fixing the substrate, the chip mounting table is arranged along the horizontal direction, the chip mounting table is arranged on the second translation mechanism, and the second translation mechanism drives the chip mounting table to carry out XY motion in the horizontal plane; and the cam mechanism comprises a cam, and the cam is respectively arranged at the crystal taking position and the chip mounting position. The utility model discloses a with the vertical setting of wafer platform, one gets brilliant arm and can wholly get brilliant and mounting action, and it has overcome the error that brings when a plurality of arm joint strength are got brilliant, has still improved the efficiency of mounting simultaneously.

Description

Wafer loading equipment

Technical Field

The utility model relates to a wafer dress chip technical field especially relates to a wafer dress chip equipment of vertical confession piece.

Background

Wafer-loading equipment is a key equipment in a semiconductor packaging production line, and has a very wide application in wafer packaging. With the progress of technology, the chip mounting precision of the chip mounting machine is developing towards the submicron level, and the micro-assembly technology in the industry is supported. However, the conventional wafer loading equipment is generally horizontally arranged, and in order to supply wafers, a plurality of transfer arms are generally required to be arranged to supply wafers, so that the precision and the productivity of the equipment are reduced. Therefore, it is necessary to provide a further solution to the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a wafer piece equipment to overcome the not enough that exists among the prior art.

In order to solve the technical problem, the technical scheme of the utility model is that:

a wafer mounting apparatus, comprising:

the wafer platform is provided with a platform surface for fixing wafers, the wafer platform is arranged along the vertical direction, the wafer platform is arranged on the first translation mechanism, and the first translation mechanism drives the wafer platform to carry out XY motion in the vertical plane;

get brilliant device, it includes: the crystal taking arm is driven by the pivoting mechanism to pivot by 90 degrees in a plane vertical to the table top;

the wafer loading platform is provided with a working surface for fixing the substrate, the wafer loading platform is arranged along the horizontal direction, the wafer loading platform is arranged on a second translation mechanism, and the second translation mechanism drives the wafer loading platform to carry out XY motion in the horizontal plane;

and the cam mechanism comprises a cam, and the cam is respectively arranged at the crystal taking position and the chip mounting position.

As the utility model discloses an improvement of wafer dress piece equipment, the vacuum suction hole has been seted up on the wafer platform, the vacuum suction hole evenly arrange in on the mesa, interval between the adjacent vacuum suction hole is less than the minimum dimension of a wafer.

As an improvement of the wafer mounting apparatus of the present invention, the first translation mechanism includes: the first base, supply first base along the gliding first guide rail of X direction, set up in second base on the first base, supply the second base along the gliding setting in of Y direction in second guide rail on the first base, first translation mechanism sets up on the support that a vertical direction set up.

As the improvement of the wafer loading device of the utility model, the pivoting mechanism is a rotating motor, and one end of the crystal taking arm is connected with the rotating motor in a transmission way.

As the improvement of the wafer loading equipment of the utility model, the loading bench is also provided with a pressing plate, and the pressing plate presses the edge around the substrate to be loaded.

As an improvement of the wafer mounting apparatus of the present invention, the second translation mechanism includes: the third base, supply the third base along the gliding third guide rail of X direction, set up in fourth base on the third base, supply the gliding setting in of Y direction of fourth base in fourth guide rail on the third base, the second translation mechanism sets up on the support that a horizontal direction set up.

As the utility model discloses an improvement of wafer dress piece equipment, it is fixed position to get brilliant position and dress piece position, the cam is driven by motor drive get the brilliant arm and get brilliant and dress piece.

As the utility model discloses an improvement of wafer mounting equipment, wafer mounting equipment is still including being stained with gluey platform, be stained with gluey platform and be located the upper reaches of dress piece platform, be stained with gluey platform and be provided with the transfer arm between the dress piece platform, be stained with gluey bench and be provided with and be stained with gluey groove.

As the improvement of the wafer loading device of the utility model, the wafer taking position and the wafer loading position are also provided with a visual detection device.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a wafer dress piece equipment is through with the vertical setting of wafer platform, and one gets the wafer arm and can wholly get the brilliant and the dress piece action, and it has overcome the error that brings when a plurality of arm joint powers are got the brilliant, has still improved the efficiency of dress piece simultaneously, has fully satisfied the dress piece demand of modern industrial production.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a front view of a wafer mounting apparatus according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, the present invention provides a wafer mounting apparatus for assembling a wafer and a substrate in an integrated circuit. Specifically, the wafer mounting apparatus includes: the wafer taking device comprises a wafer platform 1, a wafer taking device 2, a wafer loading platform 3 and a cam mechanism 4.

The wafer table 1 is used for providing wafers to be assembled, wherein the wafers are from a wafer with a larger size, and the wafers are pre-cut to form a plurality of wafers with a smaller size. The wafer platform 1 is provided with a platform surface for fixing wafers, and the wafer platform 1 is arranged along the vertical direction. Therefore, the crystal taking and mounting actions can be conveniently finished through one crystal taking arm.

Meanwhile, in order to keep the wafer fixed, vacuum suction holes are formed in the wafer table 1 and are uniformly distributed on the table top, and the distance between every two adjacent vacuum suction holes is smaller than the minimum size of one wafer. In this way, each wafer is initially adsorbed on the wafer table 1.

In order to supply different wafers to a wafer taking arm for taking crystals from the wafer table 1, the wafer table 1 is arranged on a first translation mechanism 5, and the first translation mechanism 5 drives the wafer table 1 to perform XY motion in a vertical plane. In this way, the wafer table 1 is driven by the first translation mechanism 5 to send the wafers at different positions to the wafer taking position for taking the wafers.

In one embodiment, the first translation mechanism 5 comprises: the first base 51, the first guide rail 52 that supplies the first base 51 to slide along the X direction, set up in second base 53 on the first base 51, supply second base 53 along the gliding setting in the Y direction of Y direction in second guide rail 54 on the first base 51, first translation mechanism 5 sets up on the support that a vertical direction set up. Therefore, the first base 51 moves to the X-direction coordinate of the taking-out position along the first guide rail 52, and then the second base 53 moves to the Y-direction coordinate of the taking-out position along the second guide rail 54, thereby completing the wafer supply.

The crystal taking device 2 is used for picking up the wafer provided by the wafer platform 1 and completing wafer loading of the wafer. The crystal taking device 2 comprises: a crystal taking arm 21 and a pivoting mechanism 22, wherein the crystal taking arm 21 is driven by the pivoting mechanism 22 to pivot by 90 degrees in a plane vertical to the table top, and a suction nozzle is arranged at the end part of the corresponding crystal taking arm 21. Therefore, the wafer taking arm 21 is initially horizontally arranged, and after the wafer is sucked by the suction nozzle, the wafer is pivoted to a vertical state for loading. In one embodiment, the pivoting mechanism 22 is a rotating motor, and one end of the crystal taking arm 21 is in transmission connection with the rotating motor.

The loading table 3 is used for providing a platform for loading, a substrate to be loaded is fixed on the platform, and the wafer taking arm 21 packages the wafer on the platform to the corresponding position of the substrate. Specifically, the mounting table 3 has a work surface for fixing a substrate, and the mounting table 3 is disposed in a horizontal direction. Correspondingly, the loading table 3 is further provided with a pressing plate, the pressing plate presses the peripheral edge of the substrate to be loaded, the pressing plate is approximately of a rectangular structure and is driven by a servo motor to move up and down. The piece loading platform 3 is arranged on a second translation mechanism 6, and the second translation mechanism 6 drives the piece loading platform 3 to move in an XY manner in a horizontal plane. Accordingly, the mounting table 3 feeds different mounting positions of the substrate to the lower side of the pick-up arm 21 by the second translation mechanism 6 to perform mounting.

In one embodiment, the second translation mechanism 6 comprises: the third base 61, a third guide rail 62 for the third base 61 to slide along the X direction, a fourth base 63 disposed on the third base 61, and a fourth guide rail 64 for the fourth base 63 to slide along the Y direction and disposed on the third base 61, wherein the second translation mechanism 6 is disposed on a support disposed in the horizontal direction. Therefore, the third base 61 moves to the X-direction coordinate of the mounting position along the third guide rail 62, and then the fourth base 63 moves to the Y-direction coordinate of the mounting position along the fourth guide rail 64 to wait for the wafer mounting by the wafer picking arm 21.

The cam mechanism 4 is respectively arranged at a crystal taking position and a chip mounting position, wherein the cam mechanism 4 comprises a cam. In order to meet the precision requirement, the crystal taking position and the wafer mounting position are fixed positions, and the cam is driven by a motor to drive the crystal taking arm 21 to take crystals and mount wafers. Correspondingly, the crystal taking arm 21 is provided with a plane which can be abutted against the cam, so that the crystal taking arm 21 performs crystal taking and chip mounting actions at the corresponding position under the action of the cam.

In addition, in order to satisfy the demand of loading, wafer loading equipment is still including being stained with gluey platform 7, be stained with gluey platform 7 and be located the upper reaches of loading platform 3, be stained with gluey platform 7 and be provided with transfer arm 8 between the loading platform 3, be stained with and be provided with gluey groove on the gluey platform 7. Thus, the substrate on which the adhesive is applied at the adhesive applying stage 7 is transferred to the mounting stage 3 via the transfer arm 8 to be mounted.

The crystal taking position and the wafer mounting position are further provided with a visual detection device 9, in one embodiment, the visual detection device 9 can be an industrial camera, so that the corresponding translation mechanisms 5 and 6 can perform correction compensation according to the detection result of the visual detection device 9, and the crystal taking and wafer mounting precision is further ensured.

To sum up, the utility model discloses a wafer dress piece equipment is through with the vertical setting of wafer platform, and one gets the wafer arm and can wholly get the brilliant and the dress piece action, and it has overcome the error that brings when a plurality of arm joint powers are got the brilliant, has still improved the efficiency of dress piece simultaneously, has fully satisfied the dress piece demand of modern industrial production.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A wafer mounting apparatus, comprising:

2. The wafer loading apparatus as recited in claim 1, wherein the wafer table is provided with vacuum suction holes, the vacuum suction holes are uniformly arranged on the table top, and a distance between adjacent vacuum suction holes is smaller than a minimum dimension of one wafer.

3. The wafer loading apparatus as set forth in claim 1, wherein the first translation mechanism comprises: the first base, supply first base along the gliding first guide rail of X direction, set up in second base on the first base, supply the second base along the gliding setting in of Y direction in second guide rail on the first base, first translation mechanism sets up on the support that a vertical direction set up.

4. The wafer loading device as recited in claim 1, wherein the pivot mechanism is a rotating motor, and one end of the pick-up arm is drivingly connected to the rotating motor.

5. The wafer loading apparatus as claimed in claim 1, wherein a pressing plate is further disposed on the loading stage, and the pressing plate presses the peripheral edge of the substrate to be loaded.

6. The wafer loading apparatus as set forth in claim 1, wherein the second translation mechanism comprises: the third base, supply the third base along the gliding third guide rail of X direction, set up in fourth base on the third base, supply the gliding setting in of Y direction of fourth base in fourth guide rail on the third base, the second translation mechanism sets up on the support that a horizontal direction set up.

7. The wafer loading device as claimed in claim 1, wherein the wafer taking position and the loading position are fixed positions, and the cam is driven by a motor to drive the wafer taking arm to take wafers and load the wafers.

8. The wafer loading device as claimed in claim 1, further comprising a glue dipping table located upstream of the loading table, wherein a transfer arm is disposed between the glue dipping table and the loading table, and a glue dipping groove is disposed on the glue dipping table.

9. The wafer loading device as recited in claim 1, wherein visual inspection means are further provided at the wafer picking position and the loading position.