CN216648259U - Guide rail structure for semiconductor packaging machine convenient to debug - Google Patents
Guide rail structure for semiconductor packaging machine convenient to debug Download PDFInfo
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- CN216648259U CN216648259U CN202220027753.1U CN202220027753U CN216648259U CN 216648259 U CN216648259 U CN 216648259U CN 202220027753 U CN202220027753 U CN 202220027753U CN 216648259 U CN216648259 U CN 216648259U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000002146 bilateral effect Effects 0.000 claims description 4
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- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 11
- 230000009471 action Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- -1 gold tin copper aluminum Chemical compound 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Abstract
The utility model is suitable for the technical field of semiconductor packaging, and provides a guide rail structure for a semiconductor packaging machine, which is convenient to debug and comprises a support with a concave structure, wherein an electric linear guide rail is installed at the top of the support, a fixed plate is fixedly connected to the top of a sliding block of the electric linear guide rail, a supporting plate parallel to the fixed plate is arranged right above the fixed plate, a clamping tool for clamping a substrate is fixedly connected to the top of the supporting plate, and a lifting assembly for enabling the supporting plate to move up and down is arranged on the fixed plate. According to the utility model, the supporting plate is enabled to move up and down under the action of the lifting assembly, and the clamping tool can correspondingly lift along with the movement of the supporting plate, so that the height position of the substrate transmitted by the electric linear guide rail can be changed, the device can be conveniently matched with equipment used in different processes, and the device can be compatible with models of different products and can quickly adjust the heights of the clamping tool and the substrate.
Description
Technical Field
The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a guide rail structure for a semiconductor packaging machine, which is convenient to debug.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips after scribing process, then the cut chips are pasted on the corresponding small island of the substrate (lead frame) frame by glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by utilizing superfine metal (gold tin copper aluminum) wires or conductive resin to form the required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out the processes of inspection, testing, packaging and the like, and finally warehousing and shipping.
When using the packaging machine to carry out the encapsulation of semiconductor, can drive the frock that the clamping has the base plate through electronic linear guide and carry out the change of position to can carry out the processing of different processes on the base plate, and the specification of semiconductor product differs, then need the staff to carry out the corresponding adjustment of height to the frock according to the base plate when the semiconductor product of the required base plate thickness difference of processing, this accommodation process can occupy more process time, influence machining efficiency, it is very necessary to design the convenient for semiconductor packaging machine guide rail structure of debugging to solve this kind of problem consequently.
SUMMERY OF THE UTILITY MODEL
The utility model provides a guide rail structure for a semiconductor packaging machine, which is convenient to debug and aims to solve the problems in the background technology.
The utility model is realized in such a way that the guide rail structure for the semiconductor packaging machine is convenient to debug, and comprises a support with a concave structure, wherein an electric linear guide rail is installed at the top of the support, a fixed plate is fixedly connected to the top of a sliding block of the electric linear guide rail, a supporting plate parallel to the fixed plate is arranged right above the fixed plate, a clamping tool for clamping a substrate is fixedly connected to the top of the supporting plate, and a lifting assembly for enabling the supporting plate to move up and down is arranged on the fixed plate.
Preferably, the lifting assembly comprises two first movable rods which are bilaterally symmetrical and are rotatably connected to one side of the top of the fixed plate, and a first rotating shaft which is vertical to the first moving rod is rotatably connected between the two first moving rods through a bearing, one side of the bottom of the supporting plate is rotationally connected with two movable rods which are bilaterally symmetrical and are rotationally sleeved on two sides of the rotating shaft I through bearings, an X-shaped structure is formed between the first movable rod and the second movable rod, one side of the first movable rod, which is far away from the fixed plate, is connected to the bottom of the supporting plate in a sliding manner along the length direction of the supporting plate, one side of the second movable rod, which is far away from the support plate, is connected to the top of the fixed plate in a sliding manner along the length direction of the fixed plate, a pushing assembly used for pushing the first rotating shaft to move up and down is arranged on the fixed plate, the supporting plate can be driven to correspondingly lift on the fixing plate, and the effect of changing the height positions of the clamping tool and the substrate is achieved.
Preferably, promote the subassembly and include two fixed connection fixed block at fixed plate top one side and bilateral symmetry, two rotate through the bearing between the fixed block and be horizontal axial axis two, just rotate on the axis of rotation two and install electric putter, electric putter's the terminal rotation of piston rod is connected in axis of rotation one, can promote axis of rotation one when electric putter's piston rod stretches out and draws back and carry out corresponding reciprocating.
Preferably, the fixed plate top all sets up two bilateral symmetry's spout with backup pad bottom along its length direction, one side of first movable rod and second movable rod all rotates and is connected with the sliding block of slip grafting in corresponding the spout to make one side of first movable rod and second movable rod slide on fixed plate and backup pad respectively, such design can be more reasonable.
Preferably, the two sides of the electric linear guide rail are fixedly connected with column blocks, the two column blocks are inserted into the two sides of the support through bearings respectively, one side of the support is fixedly provided with a motor with an upward output shaft, the tail end of the output shaft of the motor is fixedly connected with a driving bevel gear, one side of the column block, which is far away from the electric linear guide rail, is fixedly connected with a driven bevel gear meshed with the driving bevel gear, so that the purpose of driving the column blocks and the electric linear guide rail to rotate is achieved, the placing angle of the clamping tool and the substrate can be changed, and the position of the substrate can be changed through the process of further matching processing.
Preferably, one side fixedly connected with safety cover of support, just motor, drive bevel gear and driven bevel gear all are located the safety cover to play dirt-proof effect, and can avoid staff's hand to stir into and cause the accident on rotatory drive bevel gear or the driven bevel gear.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the supporting plate is enabled to move up and down under the action of the lifting assembly, and the clamping tool can correspondingly lift along with the movement of the supporting plate, so that the height position of the substrate transmitted by the electric linear guide rail can be changed, the device can be conveniently matched with equipment used in different processes, the device can be compatible with models of different products to quickly adjust the heights of the clamping tool and the substrate, and the efficiency of semiconductor packaging production is improved.
2. According to the utility model, the column block and the electric linear guide rail can be driven to rotate through the rotation of the output shaft of the motor, so that the placing angles of the clamping tool and the substrate can be changed, and the position of the substrate can be further changed in cooperation with the processing procedure.
3. According to the utility model, through the arrangement of the protective cover, a dustproof effect can be achieved on the motor, and accidents caused by the fact that hands of workers are stirred into the rotating driving bevel gear or the rotating driven bevel gear can be avoided.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic plan view of the present invention;
FIG. 3 is a schematic cross-sectional view taken along the line A-A of the present invention;
FIG. 4 is a schematic perspective view of the present invention;
FIG. 5 is a disassembled view of the protective cover structure of the present invention;
in the figure: 1. a support; 2. an electric linear guide rail; 3. a fixing plate; 4. a support plate; 5. clamping the tool; 6. a first movable rod; 61. a second movable rod; 7. a chute; 8. a slider; 9. rotating a first shaft; 10. an electric push rod; 11. a fixed block; 12. a second rotating shaft; 13. a columnar block; 14. a motor; 15. a drive bevel gear; 16. a driven bevel gear; 17. a protective cover.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1-5, the present invention provides a guide rail structure for a semiconductor packaging machine, which is convenient for debugging: comprises a bracket 1 with a concave structure, an electric linear guide rail 2 is arranged at the top of the bracket 1, a fixed plate 3 is fixedly connected at the top of a slide block of the electric linear guide rail 2, a supporting plate 4 parallel to the fixed plate 3 is arranged right above the fixed plate 3, a clamping tool 5 for clamping a substrate is fixedly connected at the top of the supporting plate 4, and a lifting component for enabling the supporting plate 4 to move up and down is arranged on the fixed plate 3, so that the supporting plate 4 can move up and down under the action of the lifting component, the clamping tool 5 can correspondingly lift along with the movement of the supporting plate 4, the height position of the substrate transmitted by the electric linear guide rail 2 can be changed, the device can conveniently match with equipment used in different processes, and can be compatible with different products to quickly adjust the heights of the clamping tool 5 and the substrate, the efficiency of semiconductor package production is improved.
Specifically, in order to enable the supporting plate 4 to move up and down on the fixing plate 3, in some embodiments, it is provided that the lifting assembly comprises two first movable rods 6 which are bilaterally symmetrical and are rotatably connected to one side of the top of the fixing plate 3, a first rotating shaft 9 which is perpendicular to the two first movable rods 6 is rotatably connected between the two first movable rods 6 through bearings, two second movable rods 61 which are bilaterally symmetrical and are rotatably sleeved on two sides of the first rotating shaft 9 through bearings are rotatably connected to one side of the bottom of the supporting plate 4, an X-shaped structure is formed between each corresponding first movable rod 6 and each corresponding second movable rod 61, one side of each first movable rod 6, which is far away from the fixing plate 3, is slidably connected to the bottom of the supporting plate 4 along the length direction of the supporting plate 4, one side of each second movable rod 61, which is far away from the supporting plate 4, is slidably connected to the top of the fixing plate 3 along the length direction of the fixing plate 3, and the fixing plate 3 is provided with a pushing assembly for pushing the first rotating shaft 9 to move up and down, can drive two movable rods 6 and two movable rods 61 when axis of rotation 9 reciprocates and carry out corresponding rotation to make the contained angle between one movable rod 6 and the two movable rods 61 change, in order to drive backup pad 4 and carry out corresponding lift on fixed plate 3, reach the effect that the tight frock 5 of change clamp and base plate high position.
In some embodiments, in order to enable the first rotating shaft 9 to move up and down, it is proposed that the pushing assembly includes two fixed blocks 11 which are fixedly connected to one side of the top of the fixed plate 3 and are bilaterally symmetrical, a second rotating shaft 12 which is in a horizontal axial direction is rotatably connected between the two fixed blocks 11 through a bearing, an electric push rod 10 is rotatably installed on the second rotating shaft 12, and the end of a piston rod of the electric push rod 10 is rotatably connected to the first rotating shaft 9, so that when the piston rod of the electric push rod 10 stretches out and draws back, the first rotating shaft 9 can be pushed to move up and down correspondingly.
Referring to fig. 3, the top of the fixed plate 3 and the bottom of the supporting plate 4 are both provided with two bilaterally symmetrical sliding grooves 7 along the length direction thereof, and one sides of the first movable rod 6 and the second movable rod 61 are both rotatably connected with sliding blocks 8 inserted into the corresponding sliding grooves 7 in a sliding manner, so that one sides of the first movable rod 6 and the second movable rod 61 can respectively slide on the fixed plate 3 and the supporting plate 4, and the design is more reasonable.
Preferably, referring to fig. 3 and 5, the electric linear guide 2 is fixedly connected with column blocks 13 at both sides, and the two column blocks 13 are respectively inserted into the two sides of the bracket 1 through bearings, one side of the bracket 1 is fixedly provided with a motor 14 with an upward output shaft, the tail end of the output shaft of the motor 14 is fixedly connected with a driving bevel gear 15, one side of one of the columnar blocks 13 far away from the electric linear guide rail 2 is fixedly connected with a driven bevel gear 16 meshed with the driving bevel gear 15, when an output shaft of the motor 14 rotates, the driven bevel gear 16 can drive the driving bevel gear 15 to rotate, the driving bevel gear 15 can drive the driven bevel gear 16 to rotate through the matching of teeth, so as to realize the purpose of driving the column block 13 and the electric linear guide rail 2 to rotate, therefore, the placing angles of the clamping tool 5 and the substrate can be changed, and the position of the substrate can be further changed in cooperation with the processing procedure.
And in addition, one side fixedly connected with safety cover 17 of support 1, and motor 14, drive bevel gear 15 and driven bevel gear 16 all are located safety cover 17 to play dustproof effect, and can avoid staff's hand to stir into and cause the accident on rotatory drive bevel gear 15 or the driven bevel gear 16.
In the device, all electric devices and drivers matched with the electric devices are arranged, and all driving parts, namely power elements, the electric devices and adaptive power supplies, are connected through leads by a person skilled in the art, and specific connecting means refer to the above expression that the electric devices are electrically connected in sequence, and detailed connecting means thereof are well known in the art.
The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the utility model, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a debug convenient guide rail structure for semiconductor packaging machine, is including support (1) that is concave type structure, its characterized in that: electronic linear guide (2) are installed at the top of support (1), slider top fixedly connected with fixed plate (3) of electronic linear guide (2), just be provided with backup pad (4) rather than parallel directly over fixed plate (3), the top fixedly connected with of backup pad (4) is used for the tight frock of clamp (5) of clamping base plate, be provided with on fixed plate (3) and be used for making backup pad (4) carry out the lifting unit who reciprocates.
2. The guide rail structure for a semiconductor packaging machine convenient to debug as claimed in claim 1, wherein: the lifting component comprises two movable rods (6) which are bilaterally symmetrical and are rotatably connected to one side of the top of the fixed plate (3), and a first rotating shaft (9) which is vertical to the first moving rod (6) is rotatably connected between the two first moving rods through a bearing, one side of the bottom of the supporting plate (4) is rotationally connected with two movable rods (61) which are bilaterally symmetrical and are rotationally sleeved on two sides of the rotating shaft I (9) through bearings, and an X-shaped structure is formed between the corresponding first movable rod (6) and the corresponding second movable rod (61), one side of the first movable rod (6) far away from the fixed plate (3) is connected to the bottom of the support plate (4) in a sliding manner along the length direction of the support plate (4), one side of the second movable rod (61) far away from the support plate (4) is connected to the top of the fixed plate (3) in a sliding manner along the length direction of the fixed plate (3), and a pushing assembly for pushing the first rotating shaft (9) to move up and down is arranged on the fixed plate (3).
3. The guide rail structure for a semiconductor packaging machine convenient to debug as claimed in claim 2, wherein: promote the subassembly and include two fixed connection fixed block (11) of fixed plate (3) top one side and bilateral symmetry, two rotate through the bearing between fixed block (11) and be horizontal axial axis two (12), just rotate on axis of rotation two (12) and install electric putter (10), the terminal rotation of piston rod of electric putter (10) is connected on axis of rotation (9).
4. The guide rail structure for a semiconductor packaging machine convenient to debug as claimed in claim 2, wherein: fixed plate (3) top and backup pad (4) bottom all set up two bilateral symmetry's spout (7) along its length direction, one side of movable rod (6) and movable rod two (61) all rotates and is connected with sliding block (8) of slip grafting in corresponding spout (7).
5. The guide rail structure for a semiconductor packaging machine convenient to debug as claimed in claim 1, wherein: the equal fixedly connected with post type piece (13) in both sides of electronic linear guide (2), and two post type piece (13) are respectively through bearing interlude in support (1) both sides, one side fixed mounting of support (1) has output shaft motor (14) up, the terminal fixedly connected with drive bevel gear (15) of output shaft of motor (14), one of them one side fixedly connected with that electronic linear guide (2) was kept away from in post type piece (13) and driven bevel gear (16) with drive bevel gear (15) engaged with.
6. The guide rail structure for a semiconductor packaging machine convenient to debug as claimed in claim 5, wherein: one side fixedly connected with safety cover (17) of support (1), just motor (14), drive bevel gear (15) and driven bevel gear (16) all are located safety cover (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220027753.1U CN216648259U (en) | 2022-01-07 | 2022-01-07 | Guide rail structure for semiconductor packaging machine convenient to debug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220027753.1U CN216648259U (en) | 2022-01-07 | 2022-01-07 | Guide rail structure for semiconductor packaging machine convenient to debug |
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| Publication Number | Publication Date |
|---|---|
| CN216648259U true CN216648259U (en) | 2022-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220027753.1U Active CN216648259U (en) | 2022-01-07 | 2022-01-07 | Guide rail structure for semiconductor packaging machine convenient to debug |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115424958A (en) * | 2022-09-16 | 2022-12-02 | 浙江嘉辰半导体有限公司 | Double-sided heat dissipation semiconductor packaging structure and process thereof |
| CN118588616A (en) * | 2024-06-18 | 2024-09-03 | 昆山麦普恩精密组件有限公司 | A transmission device for semiconductor processing equipment |
-
2022
- 2022-01-07 CN CN202220027753.1U patent/CN216648259U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115424958A (en) * | 2022-09-16 | 2022-12-02 | 浙江嘉辰半导体有限公司 | Double-sided heat dissipation semiconductor packaging structure and process thereof |
| CN115424958B (en) * | 2022-09-16 | 2023-06-23 | 浙江嘉辰半导体有限公司 | A double-sided heat dissipation semiconductor packaging structure and its process |
| CN118588616A (en) * | 2024-06-18 | 2024-09-03 | 昆山麦普恩精密组件有限公司 | A transmission device for semiconductor processing equipment |
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