CN212780904U

CN212780904U - Manual wafer test jig

Info

Publication number: CN212780904U
Application number: CN202021217368.0U
Authority: CN
Inventors: 荣国青; 门蒙; 张健星
Original assignee: Suzhou Huiken Electronic Technology Co ltd
Current assignee: San Gongjing Precision Technology Suzhou Co ltd
Priority date: 2020-06-28
Filing date: 2020-06-28
Publication date: 2021-03-23
Anticipated expiration: 2030-06-28

Abstract

The utility model discloses a manual type tool for wafer test, including main frame, installation piece, the installation piece is fixed on the main frame, the main frame side is equipped with holds in the palm the handle, the below of installation piece is connected with down the apron, the top of installation piece is connected with the upper cover plate, installation piece, lower apron and upper cover plate run through there is the matched with probe hole. The utility model has the advantages that: adopt a plurality of installation blocks to encircle the installation of main frame, the installation of the probe of being convenient for, and probe cartridge has good protection effect to the probe in the installation block, adopts a plurality of reference columns location simultaneously, can guarantee that the skew can not appear in the test procedure in the wafer, reduces the mistake rate of slaughtering of wafer test, and simple structure is understandable, the manufacturing of being convenient for, and installation, connection, location are accurate, the convenience of taking.

Description

Manual wafer test jig

Technical Field

The utility model relates to a wafer test technical field specifically is a tool is used in manual type wafer test.

Background

The wafer is the most basic semiconductor material for making the IC, and the quality of the wafer will directly determine the quality of the finished IC. Due to different process levels, wafers may generate three defects, namely redundancy, crystal defects and mechanical damage at the production stage. Therefore, the efficient and accurate detection equipment can provide guarantee for high-reliability wafer materials. With the rapid improvement of the chip manufacturing technology, the challenges of wafer inspection are increasing, and the cost proportion of the test is also obviously increased. The wafer test is to perform a probe test on each die on the chip, and a probe (probe) made of gold wire into fine hair is mounted on the test head to contact with a contact (pad) on the die to test the electrical characteristics of the die, so that the unqualified die is marked with a mark, and then when the chip is cut into independent dies according to the unit of the die, the unqualified die marked with the mark is eliminated, and the next process is not performed, so as to avoid waste. The wafer testing jig is used for installing and fixing the probes, and then the wafer is connected with the testing machine through the probes for detection. However, because the probe is thin, when the conventional wafer test jig is used for testing, the probe is often broken because the wafer test jig does not protect the probe in place, and the probe fixing piece is fixed by adopting a welding mode, so that the production is complicated, the probe is inconvenient to install, and when the probe fixing piece is damaged and needs to be replaced, the probe fixing piece needs to be detached for replacement and maintenance, so that the probe is not easy to repair.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a manual type wafer test is with tool to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a manual type tool for wafer test, includes main frame, installation piece, the installation piece is fixed on the main frame, the main frame side is equipped with the die-pin handle, the below of installation piece is connected with the lower cover plate, the top of installation piece is connected with the upper cover plate, installation piece, lower cover plate and upper cover plate run through there is the matched with probe hole.

Preferably, the main frame is designed to have a circular ring structure, the outer ring of the main frame is provided with a first notch, and the inner ring of the main frame is provided with a second notch.

Preferably, the number of the second notches is three, the second notches are arranged annularly, and the three second notches are correspondingly connected with a first positioning column support, a second positioning column support and a third positioning column support.

Further preferably, the first notches are multiple and uniformly arranged on the outer ring of the main frame.

Further preferably, the first positioning column support, the second positioning column support and the third positioning column support are all in a T-shaped structural design and are correspondingly connected with a first positioning column, a second positioning column and a third positioning column, the first positioning column and the second positioning column are in a cylindrical structural design, and the third positioning column is in a square structural design.

More preferably, the mounting blocks are uniformly mounted on the main frame.

Preferably, the support handles are of a structure with a concave middle surface, and the two support handles are symmetrically arranged on the side edges of the main frame.

Preferably, the probe holes are uniformly arrayed along the same axis.

Advantageous effects

The utility model discloses a tool is used in manual type wafer test adopts a plurality of installation pieces to encircle the installation of main frame, the installation of the probe of being convenient for, and the probe cartridge has good protection effect in the installation piece to the probe, adopts a plurality of reference columns location simultaneously, can guarantee that the skew can not appear in the test process in the wafer, reduces the mistake of wafer test and slaughters the rate, and simple structure is understandable, is convenient for manufacture, and installation, connection, location are accurate, the convenience of taking.

Drawings

Fig. 1 is an exploded view of a manual wafer testing jig according to an embodiment of the present invention;

fig. 2 is a bottom axial view of a manual wafer test fixture according to an embodiment of the present invention;

fig. 3 is a front view of a manual wafer testing jig according to an embodiment of the present invention.

Reference numerals

1-a main frame, 11-a first notch, 12-a second notch, 13-a support handle, 131-a positioning pin, 2-an installation block, 21-a lower cover plate, 22-an upper cover plate, 23-a probe hole, 3-a first positioning column support, 31-a first positioning column, 4-a second positioning column support, 41-a second positioning column, 5-a third positioning column support and 51-a third positioning column.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1 to 3, a manual wafer testing jig includes a main frame 1 and an installation block 2, the installation block 2 is fixed on the main frame 1, a support handle 13 is disposed on a side of the main frame 1, a lower cover plate 21 is connected below the installation block 2, an upper cover plate 22 is connected above the installation block 2, and a probe hole 23 is disposed through the installation block 2, the lower cover plate 21 and the upper cover plate 22.

In this embodiment, the wafer testing jig is a connection jig for a wafer and a PCB detection board. The wafer is placed above the upper cover plate 22, the wafer testing jig is placed above the PCB detection plate, a probe is inserted into the probe hole 23, the wafer is connected with the PCB detection plate through the probe, and then the wafer is subjected to grain probing.

Preferably, the main frame 1 is designed to have a circular ring structure, the shape of the main frame is the same as that of the wafer, so that the wafer can be conveniently placed, the outer ring of the main frame 1 is provided with a first notch 11 for connecting the rotating arm and facilitating the position adjustment of the wafer test fixture, and the inner ring of the main frame 1 is provided with a second notch 12 for installing the positioning column support.

Preferably, there are three second recesses 12 arranged in a ring, the three second recesses 12 are correspondingly connected with a first positioning column support 3, a second positioning column support 4 and a third positioning column support 5, each positioning column support is installed at a gap between two installation blocks 2, and the surface areas of the lower cover plate 21 and the upper cover plate 22 are both larger than the surface areas of the installation blocks 2. When the two upper cover plates 22 are aligned, there is a gap between the two mounting blocks 2.

Preferably, the first recesses 11 are multiple and uniformly arranged on the outer ring of the main frame 1, so as to facilitate the rotation of the main frame 1.

Preferably, the first positioning column support 3, the second positioning column support 4, and the third positioning column support 5 are all in a T-shaped structural design, and are correspondingly connected with the first positioning column 31, the second positioning column 41, and the third positioning column 51, the first positioning column 31 and the second positioning column 41 are in a cylindrical structural design, and the third positioning column 51 is in a square structural design. The three positioning columns are used for realizing accurate positioning of the wafer, and the first positioning column 31, the second positioning column 41 and the third positioning column 51 are different in shape, so that the direction positioning of the wafer is realized, the wafer is guaranteed to be placed correctly, the wafer is fixed stably, and the wafer is guaranteed not to deviate during testing.

Preferably, the installation blocks 2 are uniformly installed on the main frame 1, and the installation blocks 2 are distributed on the whole circular ring of the main frame 1, so that multi-point detection of the wafer can be realized.

Preferably, the support handle 13 adopts a concave structure in the middle of the lower surface, and the two support handles 13 are symmetrically arranged on the side edge of the main frame 1, so that an operator can conveniently and manually carry the wafer test fixture, and the wafer test fixture is convenient to take.

Preferably, the probe holes 23 are a plurality of and are uniformly arrayed along the same axis, so that each crystal grain of the wafer can be probed, the probes are wrapped in the probe holes 23, copper of the probes is not exposed, and the test is mistakenly cut.

The mounting block 2 can also be arranged in a hollow manner, the lower cover plate 21 is matched with the probe hole 23 on the upper cover plate 22, and the probe is inserted from the upper cover plate 22, passes through the mounting block 2 and then penetrates out of the lower cover plate 21, so that the mounting of the probe is realized.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.

Claims

1. The utility model provides a manual type wafer test jig which characterized in that: including main frame (1), installation piece (2) are fixed on main frame (1), main frame (1) side is equipped with holds in the palm handle (13), the below of installation piece (2) is connected with down apron (21), the top of installation piece (2) is connected with upper cover plate (22), installation piece (2), apron (21) and upper cover plate (22) run through matched with probe hole (23) down.

2. The jig for testing wafers of claim 1, wherein: the main frame (1) is designed to be of a circular ring type structure, a first notch (11) is formed in the outer ring of the main frame, and a second notch (12) is formed in the inner ring of the main frame.

3. The jig for testing wafers of claim 2, wherein: the number of the second notches (12) is three, the second notches are arranged in an annular mode, and the three second notches (12) are correspondingly connected with a first positioning column support (3), a second positioning column support (4) and a third positioning column support (5).

4. The jig for testing wafers of claim 2, wherein: the first notches (11) are multiple and uniformly arranged on the outer ring of the main frame (1).

5. The jig for testing wafers of claim 3, wherein: first reference column support (3), second reference column support (4), third reference column support (5) all are T type structural design, and correspond and be connected with first reference column (31), second reference column (41), third reference column (51), first reference column (31) and second reference column (41) are cylinder type structural design, third reference column (51) are square structural design.

6. The jig for testing wafers of claim 1, wherein: the installation blocks (2) are uniformly installed on the main frame (1).

7. The jig for testing wafers of claim 1, wherein: the support handles (13) adopt a concave structure in the middle of the lower surface, and the two support handles (13) are symmetrically arranged on the side edge of the main frame (1).

8. The jig for testing wafers of claim 1, wherein: the probe holes (23) are a plurality of and are uniformly arrayed along the same axis.