JP4088948B2 - Semiconductor testing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor testing apparatus that can easily cope with a wide variety of semiconductor tests, can reduce production costs, and can easily cope with a short delivery time even when a measuring device is changed.
[0002]
[Prior art]
FIG. 7 is a diagram illustrating the configuration of a conventional example that has been generally used. FIG. 8 is a diagram illustrating the configuration of a main part in a state in which a device is supplied from an IC handler to a test head. FIG. 7 is a side view of FIG. 7, and FIG. 10 is an operation explanatory diagram of FIG.
[0003]
In the figure, reference numeral 1 denotes an IC handler motor, 2 a slider, and 3 a contact head.
A device A to be tested is attached to the tip of the contact head 3.
[0004]
A docking block 7 provided with positioning pins 6 is attached to the handler base plate 5.
The docking block 7 is provided with a test socket mounting portion 71.
[0005]
The test socket 8 is positioned by a test socket positioning pin 9 provided on the docking block 7 and fixed to the docking block 7 by a test socket mounting screw 11.
[0006]
In the above configuration, as shown in FIG. 10, the docking block 7 to which the test socket 8 is attached is attached to and detached from the handler base plate 5.
[0007]
[Problems to be solved by the invention]
However, in such a device,
Since the test socket 8 and the docking block 7 are designed and configured one-on-one, it is necessary to change the docking block 7 every time the device type is changed.
In the semiconductor inspection process, many types are often inspected with the same equipment.
[0008]
As the number of types increases, the types of test sockets 8 increase correspondingly. In the case of a variety of types, it is necessary to prepare a plurality of docking blocks 7 for one handler.
For example, when the docking block 7 is integrally cut out of an aluminum material, it takes a long time because of its complicated shape.
[0009]
On the other hand, in semiconductor manufacturing, the time required for inspection directly affects the cost.
Therefore, we want to perform setup change in a short time.
We also want to reduce the price of replacement units for each product type.
[0010]
We want to make the replacement unit smaller and better fit.
Moreover, since the test socket 8 has a lifetime and must be replaced, for example, several tens of thousands of times, it is desired to replace it easily.
[0011]
An object of the present invention is to solve the above-mentioned problems, a semiconductor that can easily cope with a wide variety of semiconductor tests, can reduce production costs, and can easily cope with a short delivery time even when a measuring device is changed. It is to provide a testing device.
[0012]
[Means for Solving the Problems]
In order to achieve such an object, according to the present invention, in the semiconductor testing device of claim 1,
In a semiconductor testing apparatus having a docking block whose one surface is attached to a handler base plate and a test socket attached to the docking block, the docking plate to which the test socket is attached and the docking plate are inserted and fitted together A docking block having a plate-like docking base having a fitting hole; and a docking base positioning pin fixed to the docking base and inserted into a guide hole provided in each of the handler base plate and the docking plate. It is characterized by that.
[0013]
According to claim 2 of the present invention, in the semiconductor testing device according to claim 1,
A step portion provided in the fitting hole, and a docking plate provided such that a peripheral portion is in contact with the step portion and the upper surface of the test socket is maintained at a predetermined height with respect to the contact head of the IC handler. It is characterized by that.
[0014]
In claim 3 of the present invention, in the semiconductor testing device according to claim 1 or claim 2,
A positioning pin is provided which is fixed to the docking base and is inserted into a guide hole provided in each of a handler base plate of the IC handler and the docking plate.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory view showing the structure of an essential part of one embodiment of the present invention, FIG. 2 is an explanatory view of parts of FIG. 1, FIG. 3 is a side sectional view of FIG. 4 is a side sectional view, and FIG. 6 is an explanatory view of the operation of FIG.
[0016]
In the figure, the same symbol structure as in FIG. 7 represents the same function.
Only the differences from FIG. 7 will be described below.
The docking block 21 has a docking plate 22 and a docking base 23.
[0017]
A test socket 8 is attached to the docking plate 22.
A specific configuration of the docking plate 22 is shown in FIGS.
[0018]
The docking base 23 has a fitting hole 231 into which the docking plate 22 is inserted and fitted, and has a plate shape.
A specific configuration of the docking base 23 is shown in FIGS.
[0019]
In this case, the step portion 232 is provided in the fitting hole 231.
The docking plate 22 is provided so that the peripheral edge thereof is in contact with the stepped portion 232 and the upper surface of the test socket 8 is maintained at a predetermined height with respect to the contact head 3 of the IC handler.
[0020]
The positioning pins 233 of the docking base are fixed to the docking base 23 and inserted into guide holes provided in the handler base plate 5 and the docking plate 22 of the IC handler, respectively.
[0021]
In the above configuration, as shown in FIG. 6, the docking plate 22 to which the test socket 8 is attached is attached to and detached from the docking base 23 attached to the handler base plate 5.
[0022]
As a result,
(1) Since only the docking plate 22 needs to be replaced for a variety of semiconductor tests, a semiconductor testing apparatus that can easily cope with a variety of semiconductor tests and can reduce production costs can be obtained.
[0023]
(2) Since only the docking plate 22 needs to be replaced, the setup change and the like can be performed in a short time, so that a semiconductor testing apparatus capable of reducing the production cost can be obtained.
[0024]
(3) Since only the docking plate 22 needs to be replaced, the price of the replacement unit for each type of semiconductor can be reduced, and a semiconductor testing apparatus capable of reducing production costs can be obtained.
[0025]
(4) Since only the docking plate 22 needs to be replaced, the replacement unit can be miniaturized and a semiconductor testing device with improved storage can be obtained.
[0026]
(5) When the test socket 8 is replaced, it is only necessary to detach it from the docking plate 22, so that a semiconductor testing apparatus that can be easily replaced and that can reduce the production cost can be obtained.
[0027]
Also,
(6) Since the upper surface of the test socket 8 is provided so as to maintain a predetermined height with respect to the contact head 3 of the IC handler, the device lead and the test socket 8 can be accurately aligned, and reliability is improved. A high semiconductor testing device can be obtained.
[0028]
(7) Since the positioning pins 233 are fixed to the docking base 23 and inserted into the guide holes provided in the handler base plate 5 and the docking plate 22 of the IC handler, the docking base 23 and the handler base plate 5 are docked. A semiconductor testing apparatus that can be positioned with the plate 22 at the same time and has good assembly accuracy is obtained.
[0029]
The above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention. Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.
[0030]
【The invention's effect】
As described above, according to the first aspect of the present invention, the following effects can be obtained.
Since the docking block is divided into the docking plate and the docking base and the docking plate can be exchanged in various ways, the following effects can be obtained.
[0031]
(1) Since only a docking plate needs to be replaced for a variety of semiconductor tests, a semiconductor testing apparatus that can easily cope with a variety of semiconductor tests and reduce production costs can be obtained.
[0032]
(2) Since only the docking plate needs to be replaced, the setup change and the like can be performed in a short time, so that a semiconductor testing apparatus capable of reducing the production cost can be obtained.
(3) Since only the docking plate needs to be replaced, the price of the replacement unit for each type of semiconductor can be reduced, and a semiconductor testing apparatus capable of reducing production costs can be obtained.
[0033]
(4) Since only the docking plate needs to be replaced, the replacement unit can be miniaturized and a semiconductor testing apparatus with improved storage can be obtained.
(5) When the test socket is replaced, the semiconductor testing apparatus can be easily replaced and the production cost can be reduced because it can be removed from the docking plate.
[0034]
According to claim 2 of the present invention, there are the following effects.
Since the upper surface of the test socket is provided so as to maintain a predetermined height with respect to the contact head of the IC handler, it is possible to accurately match the device lead and the test socket, and a highly reliable semiconductor testing apparatus can get.
[0036]
Therefore, according to the present invention, it is possible to realize a semiconductor testing apparatus that can easily cope with various types of semiconductor tests, can reduce production costs, and can easily cope with a short delivery time even when a measuring device is changed. I can do it.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a main part configuration of an embodiment of the present invention.
FIG. 2 is an explanatory diagram of components of FIG. 1;
FIG. 3 is a side view of FIG. 2;
FIG. 4 is an explanatory diagram of components of FIG. 1;
FIG. 5 is a side view of FIG. 4;
6 is an operation explanatory diagram of FIG. 1. FIG.
FIG. 7 is an explanatory diagram of a main part configuration of a conventional example generally used conventionally.
FIG. 8 is an explanatory diagram of components of FIG. 7;
FIG. 9 is a side view of FIG. 7;
10 is an operation explanatory diagram of FIG. 7. FIG.
[Explanation of symbols]
1 IC Handler Motor 2 Slider 3 Contact Head 5 Handler Base Plate 8 Test Socket 9 Test Socket Positioning Pin 11 Test Socket Mounting Screw 21 Docking Block 22 Docking Plate 23 Docking Base 231 Fitting Hole 232 Stepped Part 233 Docking Base Positioning Pin A Device

Claims (2)

In a semiconductor testing apparatus comprising a docking block whose one surface is attached to a handler base plate, and a test socket attached to the docking block,
A docking block having a docking plate to which the test socket is attached and a plate-like docking base having a fitting hole to which the docking plate is inserted and fitted;
A semiconductor testing device comprising: a docking base positioning pin fixed to the docking base and inserted into a guide hole provided in each of the handler base plate and the docking plate. A step provided in the fitting hole;
2. The semiconductor according to claim 1, further comprising a docking plate provided so that a peripheral edge is in contact with the stepped portion and an upper surface of the test socket is maintained at a predetermined height with respect to a contact head of the IC handler. Testing device.

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