JP3281180B2 - IC socket structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket structure for repeatedly mounting and removing a multi-pin BGA (Ball Grid Array) package type device or the like in a semiconductor test apparatus.

[0002]

2. Description of the Related Art A BGA package is a device (DU).
T) An IC package in which 50 lead wires are terminals of hemispherical solder balls. Number of pins is 100-3
There are 00 pins and the pin interval is 1.27 mm or 1.
0 mm and the like. In the IC test apparatus, various electric tests are performed on the DUT 50 to perform a characteristic measurement / quality inspection. For this,
The DUT 50 is mounted on an IC socket to perform an electrical test, and is removed from the IC socket after the test. In the IC test apparatus, in order to inspect a large number of DUTs 50, the IC socket is frequently attached and detached. For this reason, DU
Contact between the terminal T50 and the terminal of the IC socket gradually causes a contact failure, or the contact pressure is reduced, and the contact becomes unstable.

An example of the structure of a contact portion of an IC socket used for testing a BGA package type device of the prior art will be described below with reference to FIGS. The configuration of the test head unit is the same as that of the device holding mechanism 68 shown in FIG.
, An IC socket, and a contact board 70 shown in FIG.
It consists of:

[0004] The IC socket includes a socket housing 62.
And a plurality of contact pins 64. This I
The C socket is mounted on the contact board 70,
The DUT 50 is pressed from above by a pressing mechanism to provide electrical contact. As the contact pin 64, a leaf spring-shaped pin is used, and the upper terminal portion of the pin is the pin 5 of the DUT.
An electrical connection is formed by pressurized contact with the hemispherical surface of one solder bump, and a lower terminal portion of the contact pin 64 is electrically connected to a terminal pattern 72 on the surface of the contact board 70 by pressurized contact. Has formed. The contact pin 64 as a whole has a central portion curved in a U-shape, and has a spring property for holding an electrical contact pressure between the upper and lower portions. The contact pins 64 are integrated with the socket housing 62. Each of these pins is connected to pin 5 of the DUT.
1 and are arranged in a grid at positions corresponding to 1, and are in contact with the corresponding terminal patterns 72 immediately below each pin to form an electrical connection, and are connected from the lower part of the contact board 70 to the device test apparatus 80 side.

[0005] The device pressing mechanism 68 ensures that all the contact pins 64 of the DUT mounted on the IC socket are in contact with each other, and has a pressing mechanism by hand or air pressure from above the DUT. This pressing pressure is pressed with a considerably strong pressing pressure in order to securely contact all the pins of the semispherical terminal of the pin 51. For this reason, the spring force of the IC socket is easily set. Therefore, some of the contact pins 64 cause poor contact or unstable contact. IC in this state
Sockets are replaced immediately. In addition, it may be replaced every time it is used a certain number of times or for a certain period, and it is a consumable item.

[0006]

SUMMARY OF THE INVENTION As described above, I
Since the IC socket for electrically testing the DUT 50 with the C test apparatus is repeatedly attached and detached, even if one contact pin 64 has a contact failure or a contact that becomes unstable,
The entire expensive IC socket had to be replaced. Further, since the number of pins, the arrangement, and the pitch of the DUT 50 are various, it is necessary to separately prepare an IC socket corresponding to the number, and there is a problem that the versatility is not obtained.

[0007] Therefore, the problem to be solved by the present invention is to provide a structure in which the IC socket is divided so that a defective pin can be replaced in units of divided contact blocks, and that the versatility can be applied to various DUTs. It is intended to have an IC socket structure.

[0008]

FIG. 1 shows a first solution according to the present invention. In order to solve the above problem, in the configuration of the present invention, a block housing 20 having a plurality of block grooves 22 for mounting a contact block 30 is provided, and a plurality of contact pins 32 are formed at a pitch corresponding to the pitch of the device 50. This is a configuration means in which the contact blocks 30 arranged and accommodated in one row are provided. As a result, the contact block 30 is divided and can be removed, thereby realizing a structure in which only the defective contact block 30 can be easily replaced.

FIGS. 1 and 2 show a second solution according to the present invention. In order to solve the above problem, in the configuration of the present invention, a block housing 20 having a plurality of block grooves 22 for mounting a contact block 30b is formed.
And a conductive film 3 having a narrow pitch parallel conductor pattern formed on the surface of a core material 36 which is a rubber-like elastic body.
8 is a configuration means for providing a contact block 30b around which the contact block 8 is wound. As a result, the contact block 30b is divided and can be removed, so that only the defective contact block 30b can be easily replaced and the same contact block 30b can be used regardless of the pitch between the pins of the DUT 50. Structure.

[0010] Further, there is a constitutional means for providing a package holder 10 for positioning and guiding the pins 51 of the device 50 directly below the contact pins 32 of the contact block 30 in the block housing 20. The package holder 10 and the block housing 20 are separated so that the DUT 50
If only the package holder 10 side is made to correspond to the outer dimensions of the DUT 50,
In some cases, the UT 50 can be mounted, and the block housing 20 is shared.

[0011]

The package holder 10 having the divided structure may have a different device outer shape for each product type or manufacturer even if the number of pins / pin arrangement / pin interval is the same. In this case, only the package holder 10 needs to be changed. Other parts have roles that can be commonly used. The block housing 20 having the divided structure has a role of being exchangeable in units of the contact block 30 when a contact failure or contact instability of the contact pin 32 occurs. The contact block 30 having the divided structure has the same number of pins or less than one DUT 5 in one row.
If it is 0, there is an action that can be used in common. By using the package holder 10 divided into three parts, the block housing 20 and the contact block 30 in combination, a highly versatile IC socket structure that can easily cope with various package external shapes / number of pins / pin arrangement / pin intervals of the DUT 50 is provided. Become. In the case of the contact block 30b using the conductive elastomer, since the same contact block 30b can be used regardless of the pitch of the DUT 50, a highly versatile contact block structure can be obtained.

[0012]

【Example】

(Embodiment 1) The embodiment of the present invention is an example of a structure in which a leaf spring is used for a pin. This will be described with reference to FIG. The configuration of the IC socket is package holder 1.
0, a block housing 20, and a contact block 30.

The package holder 10 has a guide structure for correctly positioning the DUT immediately below the corresponding contact pin 32, and the guide is formed by a square package guide 14. Even when the external shape of the device has the same number of pins / pin arrangement / pin interval, it may be different for each product type or manufacturer. For this reason, a divisional structure is used to accommodate these different external shapes. The housing mounting hole 12 of the package holder 10 has a structure in which the block housing 20 is inserted from below and mounted, sandwiched between the contact boards 70, and then pressed and fixed by square screws.

The block housing 20 includes a plurality of block grooves 22, a boss 24, and a block retainer 26. The block groove 22 is formed in the contact block 30.
Is a groove for mounting. The number of block grooves, the groove length and the arrangement pitch of the plurality of block grooves 22 correspond to the number of block grooves in N rows corresponding to the number N of pins in the x direction and the number M of pins in the y direction for each type of DUT 50. And the pitch P of the block groove 22 corresponding to the pin interval.
The boss 24 is a projection surface for positioning the height of the DUT when the DUT is pressed from above, and functions as a stopper of the DUT. Although the figure has four rectangular parallelepiped shapes, it may be provided in a plurality of places in a columnar shape, a triangular prism shape, or the like.
This prevents the contact pin 32 from being deformed due to excessive pressing force. Block holder 2
Numeral 6 denotes a side to be held down when the package holder 10 is mounted and fixed.

The contact block 30 is a structure in which a plurality of contact pins 32 are arranged and accommodated in one row. Each contact pin 32 is a leaf-spring-like pin as in the related art, and is integrated with the contact block 30, and corresponds to M or more contact pins 32 corresponding to the number M of pins in the y direction. Installed at intervals.

By adopting the three-part structure as described above, a versatile combination of IC sockets as shown in the following example can be realized. As a first example, there is a 120-pin DUT (A) with N = 15 rows and M = 8 pins, where N =
Assume that there is a 180-pin DUT (B) with 15 rows and M = 12 pins. The block housing 20 common to these two types of DUTs uses block housings 20 of block grooves 22 corresponding to 12 pins in N = 15 rows, and 15 contact blocks 30 having 12 pins are used.
After that, the package holders 10 corresponding to the external shapes of the two types of DUTs may be separately prepared. That is, in this example, the block housing 20 and the contact block 30 can be used as completely common components.

As a second example, an example is shown in which both the N rows and the M pins are different. For example, there is a 120-pin DUT (A) with N = 15 rows and M = 8 pins, and N = 20 rows with M
Suppose there is a DUT (D) with 220 pins = 12 pins. A block housing 20 common to these two types of DUTs has a block groove 22 corresponding to 12 pins in N = 20 rows.
Of the contact block 30 and 20 contact blocks 30 each having 12 pins. After that, the package holders 10 corresponding to the external shapes of the two types of DUTs may be separately prepared. Thus, DUTs of the same pitch
Indicates that in most cases, the block housing 20 and the contact block 30 can be shared.

(Embodiment 2) The embodiment of the present invention is an example in which the structure of the contact pin used in the contact block 30 is a contact block 30b using a conductive elastomer (Elastomer). This will be described with reference to FIG. The structures of the package holder 10 and the block housing 20 are the same as those in the first embodiment.

The contact block 30b has a conductive elastomer structure and includes a core material 36 and a conductive film 38. The core member 36 is a columnar rubber-like elastic body. The conductive film 38 is formed by winding a thin flexible polyimide film around the core material 36 so as to make one round, and on the surface of the film, a number of narrow-pitch parallel gold-plated copper patterns are formed by looping the core material 36 in an annular shape. Has formed. This is mounted in the block groove 22 of the block housing 20 shown in FIG. At this time, the block housing 20 uses a structure made of an insulating material such as a resin in order to prevent the contacts of the contact block 30b from being short-circuited. Here, the contact is an annular conductive pattern that makes electrical contact.

An example of the dimensions of the contacts 39 as individual annular patterns is, for example, a conductor width of 0.08 mm, a pitch between the contacts of 0.18 mm, and an insulated independent parallel arrangement. I have. Since a large number of the contacts 39 are formed at a narrow pitch in this manner, the same contact block 30b can be used regardless of the pitch between pins on the DUT 50 side. That is, even if the pitch of the pins 51 and the pitch of the contacts 39 are different, there are a plurality of contacts 39 immediately below the pins 51, and at least one of the contacts 39 is surely connected to the DUT 50. Contact with the pin.

In the first and second embodiments, the case where the DUT 50 has the terminal shape of the pins 51 or the pin arrangement in which the DUT 50 is arranged in the form of a lattice has been described. And can be similarly applied.

By forming the narrow pitch contact 39 described above, the contact block 30b can be shared for DUTs of different pitches. For example, in the case of a DUT (E) in which the pitch between the pins of the device is 1.27 mm,
Assuming that M = 20 pins in the case of a DUT (F) of 0 mm, 1.27 mm × 20 =
A contact block 30b of 25.4 mm is used. D
On the UT (F) side, the extra part may be left unused. As can be seen from this description example, the length of the contact block 30b can be used for all DUTs 50 if one type corresponding to the maximum number of pins of the DUT 50 is prepared, and can be shared. ing.

[0023]

Since the present invention is configured as described above, it has the following effects. By making the contact block 30 detachable, if contact failure or contact instability of one contact pin 32 occurs, only one contact block 30 at the pin position needs to be replaced. Therefore, there is no need to replace the entire expensive IC socket, and the cost of replacement parts can be reduced. In addition, by making the IC socket into a three-part structure, by combining various parts, the number of pins and the outer shape of various DUTs can be reduced.
There is an advantage that it can be dealt with with a minimum product configuration. For example, the same number of pins / pin arrangement / pin interval can be met by replacing only the package holder 10 corresponding to the package outer shape. In addition, even when the number M of pins in the y direction is different, the block housing 20 and the contact block 30 can be used as they are. In addition to this, even when the number N of pins in the x direction is different, it can be dealt with by exchanging only the package holder 10. As described above, common use of components is possible, and a highly versatile IC socket structure can be obtained. There is no need to prepare an IC socket individually for each product type, and there is a great merit that the applicable range is widened. At the same time, there is an effect that the number of products in the stocked stock of IC sockets can be greatly reduced.

In the case of the contact block 30b using a conductive elastomer, since the contact structure is such that a film is wound on one core member 36, there is an advantage that a uniform contact with no variation in height is formed. There is. As a result,
There is no step at the time of contacting the DUT 50, and the advantage is obtained that a stable contact can be realized by applying the same contact pressure. Further, since a large number of contacts are formed at a narrow pitch, the same contact block 30b can be used regardless of the pitch between the pins of the solder bumps of the DUT 50, and there is an advantage that the contacts can be shared. In addition, since the structure is simple, it can be manufactured at low cost and the cost of parts can be reduced.

[0025]

[Brief description of the drawings]

FIG. 1 is a structural view of an IC socket divided into three parts, a package holder 10, a block housing 20, and a contact block 30, according to the present invention.

FIG. 2 is a structural diagram of a contact block 30b when a conductive elastomer according to the present invention is used.

FIG. 3 is a schematic view of a BGA package and an IC socket used for testing a conventional device.

FIG. 4 is an example of a cross-sectional structure diagram of a conventional IC socket and a contact board 70 when a leaf spring is used for a pin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Package holder 12 Housing mounting hole 14 Package guide 20 Block housing 22 Block groove 24 Boss 26 Block presser 30, 30b Contact block 32 Contact pin 36 Core material 38 Conductive film 39 Contact 50 Device (DUT) 51 Pin 62 Socket housing 64 Contact Pin 68 Device holding mechanism 70 Contact board 72 Terminal pattern 80 Device test equipment

Claims (3)

(57) [Claims] In an IC socket structure for performing various electrical tests by repeatedly attaching and detaching a device under test (50), IC pins of the device under test (50) are arranged in the x and y directions.
In the x direction, the number of pins is N, and the other is the number of pins.
When the number of pins M is arranged in the y direction, a plurality of block grooves (22) for mounting the first contact blocks (30) are formed, and the x direction of the device (50) is formed.
Block housing (2) corresponding to the number of pins in the y direction.
0) and at least the pins corresponding to the pitch of the device (50)
Predetermined multi one column type contact pins (32) comprising a number M
Apply several pieces and move the contact pin (32)
A first contact block arranged in columns (30), comprises a least number of pins of the device (50) / pinout
Versatile IC Soke that can support various combinations of
And can be replaced in contact block units
Structure that, IC socket structure that is characterized by that. 2. A of the IC socket to the various electrical test by detaching repeated a device under test (50) structure, to form a plurality of blocks grooves (22) for mounting a second contact block (30b), the device X of (50)
Block housing corresponding to the number of pins in the direction y (2
0) and a conductive film (3) in which parallel conductive patterns having a narrow pitch are formed on the surface of a core material (36) which is a rubber-like elastic body.
8) and wound between the pins on the device under test (50) side.
The second, which allows the same narrow pitch to be applied regardless of the pitch
And a contact block (30b) having the above-mentioned structure, and having various numbers of pins / pin arrangement / pin intervals.
A versatile IC socket that can handle combinations
And can be replaced in contact block units
An IC socket structure. 3. The IC socket structure according to claim 1, wherein the pins (51) of the device (50) are connected to the first contact block (30) or the second contact block (3).
0b) for positioning and guiding directly below the contact pin (32) , and corresponding to the external shape of a different device.
The contact block (30) has a split structure that can be separated.
Comprises a package holder (10) that, the package outline
An IC socket structure characterized by realizing a versatile IC socket capable of supporting various combinations of the above .